SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DSingle Supply or Dual Supplies
DWide Range of Supply Voltage
...2 V to 28 V
DLow Supply-Current Drain Independent of
Supply Voltage . . . 0.8 mA Typ
DLow Input Bias Current . . . 25 nA Typ
DLow Input Offset Current ...3 nA Typ
DLow Input Offset Voltage ...3 mV Typ
DCommon-Mode Input Voltage Range
Includes Ground
DDifferential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±28 V
DLow Output Saturation Voltage
DOutput Compatible With TTL, MOS, and
CMOS
description/ordering information
This device consists of four independent voltage comparators that are designed to operate from a single power
supply over a wide range of voltages. Operation from dual supplies also is possible as long as the difference
between the two supplies is 2 V to 28 V and VCC is a least 1.5 V more positive than the input common-mode
voltage. Current drain is independent of the supply voltage. The outputs can be connected to other
open-collector outputs to achieve wired-AND relationships.
ORDERING INFORMATION
TAVIOmax
AT 25°CPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (N) Tube of 25 LM3302N LM3302N
−40°C to 85°C20 mV
SOIC (D)
Tube of 50 LM3302D
LM3302
−40 C to 85 C
20 mV
SOIC (D)
Reel of 2500 LM3302DR
LM3302
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
symbol (each comparator)
IN+
IN− OUT
Copyright 2003, Texas Instruments Incorporated
!" #$
# % &
## '($ # ) # "( "#
) "" $
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
2OUT
VCC
2IN−
2IN+
1IN−
1IN+
3OUT
4OUT
GND
4IN+
4IN−
3IN+
3IN−
D OR N PACKAGE
(TOP VIEW)
SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic
80-µA Current
Regulator
10 µA
60 µA
10 µA
IN+
GND
OUT
VCC
80 µA
Current values shown are nominal.
IN−
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 28 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±28 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) −0.3 V to 28 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO 28 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 4 and 5): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or N package 260°C. . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. There are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this
specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from the output to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
SLCS014A −OCTOBER 1977 −REVISED AUGUST 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS†TAMIN TYP MAX UNIT
VIO
Input offset voltage
VCC = 5 V to 28 V,
VIC = VICRmin,
25°C 3 20
mV
VIO Input offset voltage
VCC = 5 V to 28 V,
VO = 1.4 V
VIC = VICRmin,
−40°C to 85°C 40 mV
IIO
Input offset voltage
VO = 1.4 V
25°C 3 100
nA
IIO Input offset voltage VO = 1.4 V −40°C to 85°C 300 nA
IIB
Input bias current
25°C −25 −500
nA
IIB Input bias current −40°C to 85°C −1000 nA
VICR
Common-mode input
25°C0 to
VCC−1.5
V
VICR
Common-mode input
voltage range −40°C to 85°C0 to
VCC−2
V
Large-signal differential
VCC = 15 V,
VO = 1.4 V to 11.4 V,
AVD
Large-signal differential
voltage amplification
V
CC
= 15 V,
RL = 15 Ωto VCC
V
O
= 1.4 V to 11.4 V,
25
°
C
2
30
V/mV
AVD
voltage amplification
CC
R
L
= 15 Ω to V
CC
O
25°C
2
30
V/mV
IOH
High-level output current
VID = 1 V,
VOH = 5 V
25°C 0.1 nA
IOH High-level output current VID = 1 V, VOH = 5 V −40°C to 85°C1µA
VOL
Low-level output voltage
VID = −1 V,
IOL = 4 mA
25°C 150 500
mV
VOL Low-level output voltage VID = −1 V, IOL = 4 mA −40°C to 85°C700 mV
IOL Low-level output current VID = 1 V, VOL = 1.5 V 25°C 6 16 mA
ICC Supply current
(four comparators) VO = 2.5 V, No load 25°C 0.8 mA
†All characteristics are measured with zero common-mode input voltage unless otherwise specified.
switching characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time
RL = 5.1 kΩ to 5 V,
CL = 15 pF‡,
See Note 6
100-mV input step with 5-mV overdrive 1.3
µs
Response time
R
L
= 5.1 k
Ω
to 5 V,
C
L
= 15 pF‡,
See Note 6
TTL-level input step 0.3 µ
s
‡CL includes probe and jig capacitance.
NOTE 6: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LM3302D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM3302N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM3302NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Mar-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3302DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM3302DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3302DR SOIC D 14 2500 367.0 367.0 38.0
LM3302DR SOIC D 14 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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