TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors IR Receiver Modules for Remote Control Systems FEATURES * Very low supply current * Photo detector and preamplifier in one package * Compatible also with short burst dataformats * Supply voltage: 2.5 V to 5.5 V * Improved immunity against ambient light * Capable of side or top view * Low profile 2.35 mm * Insensitive to supply voltage ripple and noise * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION DESIGN SUPPORT TOOLS click logo to get started The TSOP753..W, TSOP755..W series are a miniaturized receiver module for infrared remote control systems. Two PIN diodes and a preamplifier are assembled on a leadframe, the epoxy package contains an IR filter. Models Available The TSOP753..W..series is optimized to suppress almost all spurious pulses from energy saving lamps like CFLs. AGC3 may also suppress some data signals if continuously transmitted. MECHANICAL DATA Pinning: 1, 4 = GND, 2 = VS, 3 = OUT The TSOP755..W series contain a very robust AGC5. This series should only be used for critically noisy environments. ORDERING CODE This component has not been qualified according to automotive specifications. Taping: TSOP75...WTT - top view taped TSOP75...WTR - side view taped PARTS TABLE NOISY ENVIRONMENTS AND SHORT BURSTS (AGC3) VERY NOISY ENVIRONMENTS AND SHORT BURSTS (AGC5) 30 kHz TSOP75330W TSOP75530W 33 kHz TSOP75333W TSOP75533W 36 kHz TSOP75336W (1) TSOP75536W 38 kHz TSOP75338W (2)(3)(4)(5) TSOP75538W 40 kHz TSOP75340W TSOP75540W 56 kHz TSOP75356W TSOP75556W AGC Carrier frequency Package Heimdall no lens Pinning 1, 4 = GND, 2 = VS, 3 = OUT Dimensions (mm) 6.8 W x 3.0 H x 2.35 D Mounting SMD Application Best choice for Rev. 1.9, 04-Jun-2018 Remote control (1) MCIR (2) Mitsubishi 1 (3) RECS-80 Code (4) r-map (5) XMP-1, XMP-2 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors BLOCK DIAGRAM APPLICATION CIRCUIT 17170-11 2 3 Input Band pass AGC IR receiver VS OUT Demodulator C OUT 1, 4 PIN + VS C1 Circuit 30 k R1 Transmitter with TSALxxxx VS VO GND GND GND Control circuit R1 and C1 recommended to reduce supply ripple for VS < 2.8 V 20445-1 ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage Supply current Output voltage Output current Junction temperature Storage temperature range Operating temperature range Power consumption TEST CONDITION SYMBOL VS IS VO IO Tj Tstg Tamb Ptot Tamb 85 C VALUE -0.3 to +6 3 -0.3 to (VS + 0.3) 5 100 -25 to +85 -25 to +85 10 UNIT V mA V mA C C C mW Note * Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) PARAMETER Supply voltage TEST CONDITION Ev = 0, VS = 3.3 V Ev = 40 klx, sunlight Ev = 0, test signal see Fig. 1, IR diode TSAL6200, IF = 50 mA IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see Fig. 1 Pulse width tolerance: tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 tpi - 5/fo < tpo < tpi + 6/fo, test signal see Fig. 1 Angle of half transmission distance Supply current Transmission distance Output voltage low Minimum irradiance Maximum irradiance Directivity SYMBOL VS ISD ISH MIN. 2.5 0.27 - TYP. 0.35 0.45 MAX. 5.5 0.45 - UNIT V mA mA d - 16 - m VOSL - - 100 mV Ee min. - 0.25 0.5 mW/m2 Ee max. 1/2 30 - 75 - W/m2 deg TYPICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) 0.40 Optical Test Signal (IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = f0, t = 10 ms) tpo - Output Pulse Width (ms) Ee t tpi *) T *) tpi 6/f0 is recommended for optimal function Output Signal VO 1) 2) VOH VOL 14337 3/f0 < td < 9/f0 tpi - 4/f0 < tpo < tpi + 6/f0 0.35 0.30 0.25 0.20 0.15 Input burst length 0.10 0.05 0 0.1 td 1) tpo 2) t 20760 Fig. 1 - Output Active Low Rev. 1.9, 04-Jun-2018 Output pulse width = 950 nm, optical test signal, Fig. 1 1 10 100 1000 10 000 Ee - Irradiance (mW/m) Fig. 2 - Pulse Length and Sensitivity in Dark Ambient 2 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Optical Test Signal 600 s Ee min. - Threshold Irradiance (mW/m) Ee Vishay Semiconductors t 600 s t = 60 ms 94 8134 Output Signal, (see Fig. 4) VO VOH VOL t on Ee min. - Threshold Irradiance (mW/m2) Ton, Toff - Output Pulse Width (ms) 0.6 Toff 0.4 0.3 = 950 nm, Optical Test Signal, Fig. 3 0.1 0 21584 1 10 102 103 104 105 Ee - Irradiance (mW/m) Wavelength of Ambient Illumination: = 950 nm 1.5 1 0.5 0.1 1 10 100 Ee - Ambient DC Irradiance (W/m) 3.0 2.5 f = f0 f = 30 kHz f = 10 kHz f = 100 Hz 2.0 1.5 1.0 0.5 0 1 10 100 1000 VS RMS - AC Voltage on DC Supply Voltage (mV) Fig. 4 - Output Pulse Diagram Fig. 7 - Sensitivity vs. Supply Voltage Disturbances 1.2 1.0 0.9 1.0 Max. Envelope Duty Cycle Ee min./Ee - Relative Responsivity 2 Fig. 6 - Sensitivity in Bright Ambient Ton 0.1 2.5 21585 0.8 0.2 10 W/m = 8.2 kLx (Daylight, T = 5900 K) 3 0 0.01 Fig. 3 - Output Function 0.5 Correlation with Ambient Light Sources: 3.5 10 W/m = 1.4 kLx (Std. illum. A, T = 2855 K) t t off 0.7 4 0.8 0.6 0.4 f = f0 5 % f(3 dB) = f0/10 0.2 f = 38 kHz, Ee = 2 mW/m 0.8 0.7 0.6 0.5 0.4 0.3 TSOP753..W 0.2 0.1 0.0 TSOP755..W 0 0.7 16925 0.9 1.1 0 1.3 22183-1 f/f0 - Relative Frequency Fig. 5 - Frequency Dependence of Responsivity Rev. 1.9, 04-Jun-2018 20 40 60 80 100 120 Burst Length (number of cycles/burst) Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length 3 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W Vishay Semiconductors 0.6 0 d rel - Relative Transmission Distance Ee min. - Threshold Irradiance (mW/m2) www.vishay.com 0.5 0.4 0.3 0.2 0.1 0 -30 -10 10 30 50 70 40 0.9 50 0.8 60 70 0.7 80 0.6 21580 0.4 0.2 0 Fig. 12 - Vertical Directivity 0.60 1.0 0.9 Ee min. - Sensitivity (mW/m2) S () rel - Relative Spectral Sensitivity 30 1.0 Fig. 9 - Sensitivity vs. Ambient Temperature 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 750 0.50 0.40 0.30 0.20 0.10 0.00 800 850 900 950 1000 1050 1100 1150 1 - Wavelength (nm) 21425 0 10 2 3 4 5 VS - Supply Voltage (V) Fig. 10 - Relative Spectral Sensitivity vs. Wavelength d rel - Relative Transmission Distance 20 90 Tamb - Ambient Temperature (C) 21581 10 20 Fig. 13 - Sensitivity vs. Supply Voltage 30 40 1.0 50 0.9 60 0.8 70 80 0.7 0.6 0.4 0.2 0 Fig. 11 - Horizontal Directivity Rev. 1.9, 04-Jun-2018 4 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors SUITABLE DATA FORMAT Axis Title The TSOP753..W, TSOP755..W series are designed to suppress spurious output pulses due to noise or disturbance signals. Data and disturbance signals can be distinguished by the devices according to carrier frequency, burst length and envelope duty cycle. The data signal should be close to the band-pass center frequency (e.g. 38 kHz) and fulfill the conditions in the table below. 10000 7 When a data signal is applied to the TSOP753..W, TSOP755..W in the presence of a disturbance signal, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. Some examples of disturbance signals which are suppressed are: 5 1000 1st line 2nd line 2nd line IR Signal Amplitude 6 4 3 100 2 1 10 0 * DC light (e.g. from tungsten bulb or sunlight) 0 * Continuous signals at any frequency 5 15 20 Time (ms) 16920 * Strongly or weakly modulated pattern from fluorescent lamps with electronic ballasts (see Fig. 14 or Fig. 15) 10 Fig. 14 - IR Disturbance from Fluorescent Lamp With Low Modulation Axis Title 10000 40 1000 0 1st line 2nd line 2nd line IR Signal Amplitude 20 -20 100 -40 10 -60 0 5 10 15 20 Time (ms) 16921 Fig. 15 - IR Disturbance from Fluorescent Lamp With High Modulation TSOP753..W TSOP755..W Minimum burst length 6 cycles/burst 6 cycles/burst After each burst of length a minimum gap time is required of 6 to 35 cycles 10 cycles 6 to 24 cycles 10 cycles 35 cycles 24 cycles > 4 x burst length > 25 ms 2000 2000 For bursts greater than a minimum gap time in the data stream is needed of Maximum number of continuous short bursts/second MCIR code Preferred Yes RCMM code Preferred Yes XMP-1, XMP-2, code Suppression of interference from fluorescent lamps Preferred Yes Mild and complex disturbance patterns are suppressed (example: signal pattern of Fig. 14 and Fig. 15) Critical disturbance patterns are suppressed, e.g. highly dimmed LCDs Note * For data formats with long bursts please see the datasheet for TSOP752..W, TSOP754..W Rev. 1.9, 04-Jun-2018 5 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 6.8 6.6 0.1 Center of sensitive area (3.25) Mold residue 2.35 (1.8) 1.2 0.2 3 0.8 Mold residue (0.635) (1) 1.27 (3 x) 0.5 0.1 (4 x) technical drawings according to DIN specifications 3 x 1.27 = 3.81 Marking area 2.05 Not indicated tolerances 0.15 (1.5) Tool separation line (2.2) Proposed pad layout from component side (for reference only) 3 x 1.27 = 3.81 Pick and place area 1.8 1.27 Drawing-No.: 6.550-5300.01-4 Issue: 4; 13.09.11 0.8 22609 ASSEMBLY INSTRUCTIONS Reflow Soldering Manual Soldering * Reflow soldering must be done within 72 h while stored under a max. temperature of 30 C, 60 % RH after opening the dry pack envelope * Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 300 C * Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured * Handle products only after the temperature has cooled off * Finish soldering within 3 s * Handling after reflow should be done only after the work surface has been cooled off Rev. 1.9, 04-Jun-2018 6 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE Axis Title 300 10000 max. 260 C 255 C 240 C 2nd line Temperature (C) 250 245 C 217 C 1000 200 max. 20 s 150 max. 120 s max. 100 s 100 100 Max. ramp up 3 C/s 50 Max. ramp down 6 C/s Max. 2 cycles allowed 10 0 0 50 100 150 200 250 300 Time (s) 19800 3.6 0.3 TAPING VERSION TSOP..TR DIMENSIONS in millimeters 16 1.75 7.5 O 1.5 4 Direction of feed 8 2 O 1.5 technical drawings according to DIN specifications Drawing-No.: 9.700-5342.01-4 Issue: 2; 12.06.13 Rev. 1.9, 04-Jun-2018 7 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors 3 0.3 TAPING VERSION TSOP..TT DIMENSIONS in millimeters 16 1.75 7.5 O 1.5 4 Direction of feed 8 2 O 1.5 min. technical drawings according to DIN specifications Drawing-No.: 9.700-5341.01-4 Issue: 3; 06.10.15 Rev. 1.9, 04-Jun-2018 8 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors REEL DIMENSIONS in millimeters 16734 LEADER AND TRAILER DIMENSIONS in millimeters Trailer no devices Leader devices no devices End Start min. 200 min. 400 96 11818 COVER TAPE PEEL STRENGTH LABEL According to DIN EN 60286-3 Standard bar code labels for finished goods 0.1 N to 1.3 N The standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. The labels are on each packing unit and contain Vishay Semiconductor GmbH specific data. 300 10 mm/min. 165 to 180 peel angle Rev. 1.9, 04-Jun-2018 9 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods) PLAIN WRITING ABBREVIATION LENGTH Item-description - 18 Item-number INO 8 Selection-code SEL 3 BATCH 10 Data-code COD 3 (YWW) Plant-code PTC 2 Quantity QTY 8 Accepted by ACC - Packed by PCK - LOT-/serial-number Mixed code indicator Origin Long bar code top MIXED CODE - xxxxxxx+ Company logo Type Length Item-number N 8 Plant-code N 2 Sequence-number X 3 Quantity N 8 Total length - 21 Short bar code bottom Type Length Selection-code X 3 Data-code N 3 Batch-number X 10 Filter - 1 Total length - 17 DRY PACKING After more than 72 h under these conditions moisture content will be too high for reflow soldering. The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 C + 5 C / - 0 C and < 5 % RH (dry air / nitrogen) or 96 h at 60 C + 5 C and < 5 % RH for all device containers or 24 h at 125 C + 5 C not suitable for reel or tubes. Aluminum bag Label An EIA JEDEC(R) standard J-STD-020 level 4 label is included on all dry bags. Reel LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 15973 4 FINAL PACKING 1. Shelf life in sealed bag: 12 months at < 40 C and < 90 % relative humidity (RH) The sealed reel is packed into a cardboard box. 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 C) must be 2a. Mounted within 72 hours at factory condition of < 30 C/60 % RH or 2b. Stored at < 5 % RH RECOMMENDED METHOD OF STORAGE 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 C 5 C or 2a. or 2b. are not met. Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: 4. If baking is required, devices may be baked for: 192 hours at 40 C + 5 C/- 0 C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 C 5 C and < 5 % RH for all device containers or 24 hours at 125 C 5 C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) * Storage temperature 10 C to 30 C Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020 * Storage humidity 60 % RH max. Rev. 1.9, 04-Jun-2018 22522 EIA JEDEC standard J-STD-020 level 4 is included on all dry bags 10 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSOP753..W, TSOP755..W www.vishay.com Vishay Semiconductors BAR CODE PRODUCT LABEL (example) ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. Rev. 1.9, 04-Jun-2018 22178 11 Document Number: 82497 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. (c) 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2019 1 Document Number: 91000