TinyLogic UHS Inverter, Open Drain Output NC7SZ05 Description The NC7SZ05 is a single inverter with open drain output stage from ON Semiconductor's Ultra-High Speed series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC operating range. The inputs and output are high-impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V, independent of VCC when in the high-impedance state. www.onsemi.com MARKING DIAGRAMS Pin 1 Features * * * * * * * * * * * C6KK XYZ SIP6 1.45x1.0 CASE 127EB Ultra-High Speed: tPD =1.9 ns (Typical) into 50 pF at 5 V VCC Open Drain Output for OR Tied Applications High Output Drive: 24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Matches Performance of LCX Operated at 3.3 V VCC Power Down High-Impedance Inputs / Outputs Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Implemented Ultra-Small MicroPakTM Packages Space-Saving SC-74A and SC-88A Packages These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant UDFN6 1.0X1.0, 0.35P CASE 517DP C6KK XYZ Pin 1 SC-74A CASE 318BQ 7Z05 MG G SC-88A CASE 419A-02 Z05 MG G IEEC / IEC A 1 Y C6, 7Z05, Z05 KK XY Z XX M G Figure 1. Logic Symbol = Specific Device Code = 2-Digit Lot Run Traceability Code = 2-Digit Date Code Format = Assembly Plant Code = Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 1997 January, 2021 - Rev. 3 1 Publication Order Number: NC7SZ05/D NC7SZ05 Pin Configurations NC 1 5 NC 1 VCC A 2 A 2 GND 3 4 Y GND 3 Figure 2. SC-88A and SC-74A (Top View) 6 VCC 5 NC 4 Y Figure 3. MicroPak (Top Through View) PIN DEFINITIONS FUNCTION TABLE Pin # SC-88A / SC74-A Pin # MicroPak Name Description 1 1, 5 NC No Connect 2 2 A 3 3 GND Ground 4 4 Y Output 5 6 VCC Input Inputs Output A Y L *H H L H = HIGH Logic Level L = LOW Logic Level *H = High Impedance Output State, Open Drain Supply Voltage www.onsemi.com 2 NC7SZ05 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage -0.5 6.5 V VIN DC Input Voltage -0.5 6.5 V DC Output Voltage -0.5 6.5 V VOUT Parameter IIK DC Input Diode Current VIN < 0 V - -50 mA IOK DC Output Diode Current VOUT < 0 V - -50 mA IOUT DC Output Current - 50 mA DC VCC or Ground Current - 50 mA -65 +150 C ICC or IGND TSTG Storage Temperature Range TJ Junction Temperature Under Bias - +150 C TL Junction Lead Temperature (Soldering, 10 Seconds) - +260 C PD Power Dissipation in Still Air SC-74A - 390 mW SC-88A - 332 MicroPak-6 - 812 MicroPak2TM-6 - 812 Human Body Model, JEDEC: JESD22-A114 - 4000 Charge Device Model, JEDEC: JESD22-C101 - 2000 ESD V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT Parameter Min Max Unit Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.50 5.50 Input Voltage 0 5.5 V Output Voltage 0 5.5 V -40 +85 C VCC at 1.8 V, 2.5 V 0.2 V 0 20 ns/V VCC at 3.3 V 0.3 V 0 10 VCC at 5.0 V 0.5 V 0 5 SC-74A - 320 SC-88A - 377 MicroPak-6 - 154 MicroPak2-6 - 154 TA Operating Temperature tr, tf Input Rise and Fall Times qJA Thermal Resistance Conditions C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7SZ05 DC ELECTICAL CHARACTERISTICS TA = +25C Symbol VIH VIL Parameter HIGH Level Input Voltage LOW Level Input Voltage TA = -40 to +85C Min Typ Max Min Max Unit 1.65 to 1.95 0.65 VCC - - 0.65 VCC - V 2.30 to 5.50 0.70 VCC - - 0.70 VCC - 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC 2.30 to 5.50 - - 0.30 VCC - 0.30 VCC VCC (V) Conditions V ILKG HIGH Level Output Leakage 1.65 to 5.50 Current VIN = VIH or VIL, VOUT = VCC or GND - - 5 - 10 mA VOL LOW Level Output Voltage VIN = VIH or VIL, IOL = 100 mA - 0.00 0.10 - 0.10 V 1.65 1.80 IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current - 0.00 0.10 - 0.10 2.30 - 0.00 0.10 - 0.10 3.00 - 0.00 0.10 - 0.10 4.50 - 0.00 0.10 - 0.10 1.65 IOL = 4 mA - 0.80 0.24 - 0.24 2.30 IOL = 8 mA - 0.10 0.30 - 0.30 3.00 IOL = 16 mA - 0.15 0.40 - 0.40 3.00 IOL = 24 mA - 0.22 0.55 - 0.55 4.50 IOL = 32 mA - 0.22 0.55 - 0.55 0 VIN 5.5 V - - 1 - 10 mA VIN or VOUT = 5.5 V - - 1 - 10 mA VIN = 5.5 V, GND - - 2 - 20 mA 1.65 to 5.5 0 1.65 to 5.50 AC ELECTRICAL CHARACTERISTICS TA = +25C Symbol tPZL Parameter Propagation Delay (Figure 4, 5) TA = -40 to +85C VCC (V) Conditions Min Typ Max Min Max Unit 1.65 CL = 50 pF, RU = 500 W, RD = 500 W, VIN = 2 * VCC - 5.5 12.9 - 13.4 ns - 4.6 10.5 - 11.0 1.80 2.50 0.20 - 3.0 7.0 - 7.5 3.30 0.30 - 2.4 5.0 - 5.2 5.00 0.50 - 1.9 4.3 - 4.5 - 5.0 12.9 - 13.4 - 4.1 10.5 - 11.0 - 2.5 7.0 - 7.5 3.30 0.30 - 2.1 5.0 - 5.2 5.00 0.50 - 1.2 4.3 - 4.5 Input Capacitance 0.00 - 4.0 - - - pF COUT Output Capacitance 0.00 - 6.0 - - - pF CPD Power Dissipation Capacitance (Note 2) (Figure 6) 3.30 - 3.6 - - - pF 5.00 - 6.5 - - - tPLZ 1.65 1.80 2.50 0.20 CIN CL = 50 pF, RU = 500 W, RD = 500 W, VIN = 2 * VCC ns 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). www.onsemi.com 4 NC7SZ05 VI VCC RU INPUT OUTPUT CL RD Figure 4. AC Test Circuit Figure 5. AC Waveforms VCC A INPUT NOTE: 3. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 6. Test Circuit DEVICE ORDERING INFORMATION Top Mark Packages Shipping NC7SZ05M5X 7Z05 5-Lead SC-74A, 1.6mm 3000 / Tape & Reel NC7SZ05P5X Z05 5-Lead SC70, EIAJ SC-88A, 1.25 mm Wide 3000 / Tape & Reel NC7SZ05L6X C6 6-Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel NC7SZ05FHX C6 6-Lead, MicroPak2, 1 x 1 mm Body, 0.35 mm Pitch 5000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13590G SIP6 1.45X1.0 DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5 1 SCALE 2:1 5X DATE 18 JAN 2018 b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ GENERIC MARKING DIAGRAM* 0.95 PITCH XXX MG G XXX M G 2.40 = Specific Device Code = Date Code = Pb-Free Package (Note: Microdot may be in either location) 5X 1.00 *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot " G", may or may not be present. Some products may not follow the Generic Marking. 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON66279G SC-74A Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC-88A (SC-70-5/SOT-353) CASE 419A-02 ISSUE L SCALE 2:1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 -B- S 1 2 DATE 17 JAN 2013 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J GENERIC MARKING DIAGRAM* C K H XXXMG G SOLDER FOOTPRINT 0.50 0.0197 XXX = Specific Device Code M = Date Code G = Pb-Free Package 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "G", may or may not be present. Some products may not follow the Generic Marking. mm inches STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. SC-88A (SC-70-5/SOT-353) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 1.0X1.0, 0.35P CASE 517DP ISSUE O DOCUMENT NUMBER: DESCRIPTION: 98AON13593G UDFN6 1.0X1.0, 0.35P DATE 31 AUG 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. (c) Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. 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