GaAs-IR-Lumineszenzdiode in SMT-Gehause GaAs Infrared Emitter in SMT Package SFH 4211 Wesentliche Merkmale Features * GaAs-LED mit sehr hohem Wirkungsgrad * Gute Linearitat (Ie = f [IF]) bei hohen Stromen * Gleichstrom- (mit Modulation) oder Impulsbetrieb moglich * Hohe Zuverlassigkeit * Hohe Impulsbelastbarkeit * Oberflachenmontage geeignet * Gegurtet lieferbar * SFH 4211 Gehausegleich mit SFH 320 * Very highly efficient GaAs-LED * Good Linearity (Ie = f [IF]) at high currents * DC (with modulation) or pulsed operations are possible * High reliability * High pulse handling capability * Suitable for surface mounting (SMT) * Available on tape and reel * SFH 4211 same package as SFH 320 Anwendungen Applications * Miniaturlichtschranken fur Gleich- und Wechsellichtbetrieb, Lochstreifenleser * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme * IR-Freiraumubertragung * * * * * * * Typ Type SFH 4211 2001-02-22 Miniature photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission Bestellnummer Ordering Code Gehause Package Q62702-P1825 Kathodenkennzeichnung: abgesetzte Ecke cathode marking: bevelled edge TOPLED(R) 1 SFH 4211 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 100 mA Stostrom, = 10 s, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 160 mW 450 K/W 200 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 55 nm Abstrahlwinkel Half angle 60 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.3 x 0.3 mm 2001-02-22 2 SFH 4211 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, e von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr, tf 0.5 s Kapazitat, Capacitance VR = 0 V, f = 1 MHz Co 25 pF VF VF 1.3 ( 1.5) 1.9 ( 2.5) V V Sperrstrom, Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms e 20 mW Temperaturkoeffizient von Ie bzw. e, TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA 2001-02-22 3 SFH 4211 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie > 2.5 mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ. 45 mW/sr Radiation Characteristics Srel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 0.8 2001-02-22 0.6 0.4 0 20 40 60 80 100 4 120 SFH 4211 Relative Spectral Emission Irel = f () Single pulse, tp = 20 s OHR01938 100 10 2 A OHR01551 e e 100 mA % rel e = f (IF ) e 100 mA Radiant Intensity 80 Permissible Pulse Handling Capability IF = f (tp), duty cycle D = parameter, TA = 20 C 10 4 OHR00860 tp F mA 5 10 1 D= tp T D = 0.005 F T 0.01 60 0.02 10 0 10 3 40 5 0.1 0.05 0.2 10 -1 0.5 20 0 880 920 960 nm 1000 1060 Forward Current IF = f (VF), single pulse, tp = 20 s OHR01554 10 1 F 10 -2 10 -3 10 -2 10 -1 10 0 A F 10 1 Max. Permissible Forward Current IF = f (TA) OHR00883 120 I F mA A 100 10 0 80 RthjA = 450 K/W 10 -1 10 -2 60 40 20 10 -3 0 1 2001-02-22 2 3 4 5 6 V VF 8 0 0 20 40 60 80 100 C 120 TA 5 DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp SFH 4211 Mazeichnung Package Outlines 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 1.7 (0.067) 0.1 (0.004) (typ.) 0.5 (0.020) 3.7 (0.146) 3.3 (0.130) 41 1.1 (0.043) Cathode marking (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 0.9 (0.035) 0.7 (0.028) 0.18 (0.007) 0.12 (0.005) 0.6 (0.024) 0.4 (0.016) GPLY6724 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2001-02-22 6 SFH 4211 Lothinweise Soldering Conditions Bauform Types Tauch-, Schwall- und Schlepplotung Dip, Wave and Drag Soldering Lotbadtemperatur TOPLED(R) Maximal zulassige Lotzeit Abstand Lotstelle - Gehause Reflowlotung Reflow Soldering Lotzonentemperatur Maximale Durchlaufzeit Temperature Max. Perm. Distance of the Soldering Time between Soldering Bath Solder Joint and Case Temperature of Soldering Zone Max. Transit Time 260 C 245 C 10 s 10 s - Zusatzliche Informationen uber allgemeine Lotbedingungen erhalten Sie auf Anfrage. For additional information on general soldering conditions please contact us. Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-02-22 7