IRC Advanced Film Division
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
QSOP Series Issue February 2005
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Surface Mount QSOP
Resistor Networks
Reliable, no internal cavity
High resistor density - .025” lead spacing
Standard JEDEC 16, 20, and 24 pin packages
Ultra-stable TaNSil® resistors on silicon substrates
Standard Sn/Pb and Pb-free terminations available
QSOP Series
IRC’s TaNSil® QSOP resistor networks are the perfect solution for high volume applications that demand a
small wiring board footprint. The .025” lead spacing provides higher lead density, increased component count,
lower resistor cost, and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking, low cost
and miniature package. Excellent performance in harsh, humid environments is a trademark of IRC’s self-pas-
sivating TaNSil® resistor film.
The QSOP series is ideally suited for the latest surface mount assembly techniques and each lead can be
100% visually inspected. The compliant gull wing leads relieve thermal expansion and contraction stresses
created by soldering and temperature excursions.
For applications requiring high performance resistor networks in a low cost, surface mount package, specify
IRC QSOP resistor networks.
Electrical Data Environmental Data
Resistance Range 10250K
Absolute Tolerance To ±0.1%
Ratio Tolerance to R1 To ±0.05%
Absolute TCR To ±25ppm/°C
Tracking TCR To ±5ppm/°C
Element Power Rating @ 70°C
Isolated Schematic
Bussed Schematic
100mW
50mW
Package Power Rating @ 70°C 16-Pin 750mW
20-Pin 1.0W
24-Pin 1.0W
Rated Operating Voltage
(not to exceed Power X Resistance) 100 Volts
Operating Temperature -55°C to +125°C
Noise <-30dB
Test Per
MIL-PRF-83401
Typical
Delta R
Max
Delta R
Thermal Shock ±0.02% ±0.1%
Power
Conditioning ±0.03% ±0.1%
High Temperature
Exposure ±0.03% ±0.05%
Short-time
Overload ±0.02% ±0.05%
Low Temperature
Storage ±0.03% ±0.05%
Life ±0.05% ±0.1%
________________
QSOP Series Issue February 2005
IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Manufacturing Capability Data
Surface Mount QSOP
Resistor Networks
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)
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052
52-01 JGF GF 05 52-01 JGF GF 002
05-62 JGFD GFDC 01 05-62 JGF GFD 001
002-15 JGFDC GFDC 5 001-15 JGFD GFDC 05
K052-102 JGFDCB GFDCBA 5 002-101 JGFD GFDCB 52
005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
001
05-62 JGFD GFDC 01 05-62 JGF GFD 001
002-15 JGFDC GFDC 5 001-15 JGFD GFDC 05
K052-102 JGFDCB GFBA 5 002-101 JGFD GFDCB 52
005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
05
05-62 JGFD GFDC 01 001-15 JGFD GFDC 05
002-15 JGFDC GFDC 5 002-101 JGFD GFDCB 52
K052-102 JGFDCB GFBA 5 005-102 JGFDCB GFDCB 02
K001-105 JGFDCB GFDCBA 5
52
002-15 JGFDC GFDC 5 005-102 JGFDCB GFDCB 02
K052-102 JGFDCB GFBA 5 K001-105 JGFDCB GFDCBA 5
IRC Advanced Film Division
QSOP Series Issue February 2005
• Corpus Christi Texas 78411 USA
© IRC Advanced Film Division
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Ordering Data
Prefix GUS - QS8 A - 01 - 1002 - F B
Style
QS8 = 16-pin Network
QS0 = 20-pin Network
QSC = 24-pin Network
Schematic and Termination
A = Isolated network w/ standard Sn/Pb terminations
ALF= Isolated network w/ Pb-free terminations
B = Bussed network w/ standard Sn/Pb terminations
BLF= Bussed network w/ Pb-free terminations
Absolute TCR Code
00 = ±250ppm/°C; 01 = ±100ppm/°C
02 = ±50ppm/°C; 03 = ±25ppm/°C
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10K, 50R1 = 50.1
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%; D = ±0.5%
C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (optional)
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Specify tubes or tape & reel.
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
Surface Mount QSOP
Resistor Networks
Power Derating Data
25° 70° 125°
100
50
10
% Of Rated Power
Temperature in °C
Physical Data
N
0.025" Typ
L
1
0.236" ±.008"
0.154" ±.003"
0.064" ±.003"
0.006" ±.002"
0.010" ±.002"
N
N
Schematic A
Isolated
Schematic B
Bussed
Note: N = number of pins (16, 20, 24)
R1
1 2 3
R1
1 2 3
SNIPFO# "L"NOISNEMID
61 "400.0±"391.0
02 "400.0±"143.0
42 "400.0±"143.0
Note: All dimesions exclude mold flash and
end flash which shall not exceed 0.006” per side.
QF008: IRC Lead Free Product Availability and Material Declaration Sheets
Index
Worksheet
Number Product
Family Product Description
1 PFC W0 603 LF Pre cis io n Thin Film Chip Resistor
2 PFC W0805LF
Pre cis io n Thin Film Chip Resistor
3 PFC W1206LF
Pre cis io n Thin Film Chip Resistor
4 LRC LR1206LF Thick Film Cur rent Sense Resistor
5 LRC LR2010LF Thick Film Cur rent Sense Resistor
6 LRC LR2512LF Thick Film Cur rent Sense Resistor
7 LRC LRF3 W LF 3 Wat t Cur r ent Se nse Re sistor
8 SCW SC3L F 3 Wa tt Chip Resis t or
9 LRZ LRZ1206LF
Ultr a Low Resist ance Jum per Res istor
10 LRZ LRZ2010LF
Ultr a Low Resist ance Jum per Res istor
11 LRZ LRZ2512 L F Ultr a Low Re s ist anc e Jumper Res istor
12 SON N999LF Flat Precision Resistor Array
13 WCR W CR0 60 3LF General Pur pose Thick Film Re s ist or
14 WCR WCR0805LF
General Pur pose Thick Film Resist or
15 WCR WCR1206LF
General Pur pose Thick Film Resist or
16 WCR WCR1210LF
General Pur pose Thick Film Resist or
17 WCR WCR2010LF
General Pur pose Thick Film Resist or
18 WCR WCR2512LF
General Pur pose Thick Film Resist or
19 QSC QSCXL F 24 Lead QSOP Network
20 QS0 QS0XLF 20 Lead QSOP Net wor k
21 QS8 QS8XLF 16 Lead QSOP Net wor k
22 SS 4 SS4X LF 8 Lead Nar r ow S O IC Netw or k
23 SS7 QS7XLF 14 Le ad Nar row SOIC Networks
24 SS8 SS8XLF 16 Lead Narrow S OIC Network
25 SL0 SL0XLF 20 Lead Wide SOIC Networ k
26 SL8 SL8XLF 16 Lead Wide SOIC Networ k
27 SLC SLCXLF 24 Lead Wide SO IC Netw ork
28 PWC PWC0805LF
Pulse W ithst a ndin g Chi p
29 PWC PWC1206LF Pulse Withstanding Chip
30 PWC PWC2010LF
Pulse W ithst a ndin g Chi p
31 PWC PWC2512LF
Pulse W ithst a ndin g Chi p
32 PCF PCF0603LF Precis io n Nichr om e Ch ip Res is t or
33 PCF PCF0805LF Pr ec is io n Nic hr om e Ch ip Resis t or
34 PCF PCF1206LF Pr ec is io n Nic hr om e Ch ip Resis t or
35 PCF PCF1210LF Pr ec is io n Nic hr om e Ch ip Resis t or
36 WCA WCA0804LF
T hick Film Resistor Arra y
37 WCA WCC0804LF
T hick Film Resistor Arra y
38 SOT SOT23LF
3 Lead Resis t or Net w or k
39 SOT SOT143LF
4 Lead Resis t or Net w or k
Rev: April 10, 2006
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Part Number Weight (mg) Rev Date:
LRC-LR2512LF-XX-XXXX-
Y
LRC-LRF2512LF-XX-XXXX-Y 54.985 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 78.19% 43.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 41.458 75.399%
78.190% Magnesium oxide 1309-48-4 1.19% 0.512 0.930%
Silicon Dioxide 14808-60-7 2.38% 1.023 1.861%
100.00% 42.993 78.190% 78.19%
Thick Film 17.11% 9.408 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 4.613 8.390%
8.634% Copper Oxide 1317-39-1 2.83% 0.134 0.244%
100.00% 4.748 8.634%
Resistor Copper 7440-50-8 42.64% 0.658 1.20%
2.807% Nickel 7440-02-0 39.36% 0.607 1.10%
Silicon Dioxide 14808-60-7 3.60% 0.056 0.10%
Barium Oxide 7440-39-3 9.38% 0.145 0.26%
Copper Alloy Titanium Dioxide 13463-67-7 0.72% 0.011 0.02%
Aluminum Oxide 1344-28-1 0.72% 0.011 0.02%
Boric Acid , Anhygrous 10043-35-3 3.58% 0.055 0.10%
100.00% 1.543 2.807%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 1.154 2.099%
5.613% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.546 0.994%
Silane Diclorodimethly 68611-44-9 2.40% 0.074 0.135%
Molybdenum 7439-98-7 6.40% 0.198 0.359%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 1.114 2.026%
100.00% 3.086 5.613%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.011 0.020%
0.056% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.018 0.033%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.003%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.031 0.056%
9.408 17.110% 17.11%
Termination 4.70% 2.584 Sputter Titanium 7440-32-6 26.09% 0.023 0.041%
0.158% Palladium 7440-05-3 73.91% 0.064 0.117%
100.00% 0.087 0.158%
Plating Copper 7440-50-8 66.03% 1.649 2.999%
4.54% Nickel 7440-02-0 11.24% 0.281 0.510%
Tin 7440-31-5 22.73% 0.567 1.032%
100.00% 2.497 4.541%
2.584 4.699% 4.70%
54.985 100.00%
Substrate+Thick
film+Termination 100.00% 54.985 Total wt (mg) 54.985 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas
Part Number Weight (mg) Rev Date:
LRC-LRF3WLF-XX-XXXX-
Y
56.918 10-Apr-06
Break-up of component wt% wt(mg) Material/
Process Material
Classification Substance name CAS # Substance wt % Substance wt (mg) Substance wt % of
total part mass Initial Breakup
Component wt %
Substrate 75.47% 43.0 Ceramic Ceramic/ Glass Aluminum oxide 1344-28-1 96.43% 41.424 72.779%
75.473% Magnesium oxide 1309-48-4 1.19% 0.511 0.898%
Silicon Dioxide 14808-60-7 2.38% 1.022 1.796%
100.00% 42.958 75.473% 75.47%
Thick Film 16.53% 9.408 Conductor Metal Copper
Alloy Copper 7440-50-8 97.17% 4.613 8.105%
8.341% Copper Oxide 1317-39-1 2.83% 0.134 0.236%
100.00% 4.748 8.341%
Resistor Copper 7440-50-8 42.64% 0.658 1.16%
2.711% Nickel 7440-02-0 39.36% 0.607 1.07%
Silicon Dioxide 14808-60-7 3.60% 0.056 0.10%
Barium Oxide 7440-39-3 9.38% 0.145 0.25%
Copper Alloy Titanium Dioxide 13463-67-7 0.72% 0.011 0.02%
Aluminum Oxide 1344-28-1 0.72% 0.011 0.02%
Boric Acid , Anhygrous 10043-35-3 3.58% 0.055 0.10%
100.00% 1.543 2.711%
Epoxy Overcoat
(Organic) Thermoplastic Epoxy Resin 25068-38-6 37.40% 1.154 2.028%
5.423% Titanium Oxide (TiO2) 13463-67-7 17.70% 0.546 0.960%
Silane Diclorodimethly 68611-44-9 2.40% 0.074 0.130%
Molybdenum 7439-98-7 6.40% 0.198 0.347%
Cobalt-Zinc Aluminate
(CoAiSiO2) 68186-87-8 36.10% 1.114 1.958%
100.00% 3.086 5.423%
Marking Lacquer/Paint Silicon Resin 63148-62-9 35.90% 0.011 0.019%
0.054% Titanium Oxide (TiO2) 13463-67-7 59.10% 0.018 0.032%
Silane Diclorodimethly 68611-44-9 4.90% 0.002 0.003%
Dimethyl acid
Pyrophosphate 26644-00-8 0.10% 0.000 0.000%
100.00% 0.031 0.054%
9.408 16.529% 16.53%
Termination 8.00% 4.552 Sputter Titanium 7440-32-6 26.09% 0.040 0.071%
0.272% Palladium 7440-05-3 73.91% 0.115 0.201%
100.00% 0.155 0.272%
Plating Copper 7440-50-8 66.03% 2.903 5.101%
7.73% Nickel 7440-02-0 11.24% 0.494 0.868%
Tin 7440-31-5 22.73% 0.999 1.756%
100.00% 4.397 7.725%
4.552 7.997% 8.00%
56.918 100.00%
Substrate+Thick
film+Termination 100.00% 56.918 Total wt (mg) 56.918 100.00%
IRC Lead Free Product Material Declaration Sheets
TT Electronics IRC- Advance Film Division
Corpus Christi, Texas