BAW101... Silicon Switching Diode * Electrically insulated high-voltage medium-speed diodes * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BAW101 " ! , , Type Package Configuration Marking BAW101 SOT143 parallel JPs Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 300 Peak reverse voltage VRM 300 Forward current IF 250 Peak forward current IFM 500 Peak forward current IFM 500 mA Surge forward current, t = 1 s IFS 4.5 A Non-repetitive peak surge forward current IFSM - Total power dissipation Ptot 350 mW Junction temperature Tj 150 C Storage temperature Tstg Value Unit V mA TS 35C 1Pb-containing -65 ... 150 package may be available upon special request 1 2007-04-20 BAW101... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS 330 K/W BAW101 Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. DC Characteristics 300 V Breakdown voltage V(BR) I(BR) = 100 A Reverse current IR A VR = 250 V - - 0.15 VR = 250 V, TA = 150 C - - 50 VF - - 1.3 CT - 6 - pF trr - 1 - s Forward voltage V IF = 100 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Test circuit for reverse recovery time D.U.T. F Pulse generator: tp = 10s, D = 0.05, tr = 0.6ns, Ri = 50 Oscillograph Oscillograph: R = 50, tr = 0.35ns, C 1pF EHN00019 1For calculation of RthJA please refer to Application Note Thermal Resistance 2 2007-04-20 BAW101... Reverse current IR = (TA) Forward Voltage VF = (TA) IF = Parameter VR = 250V R 10 5 nA BAW 101 EHB00104 1 V max. 10 4 0.9 VF 5 100mA 0.85 typ. 10 3 0.8 5 0.75 10mA 10 2 0.7 5 0.65 10 1 0 50 100 C 0.6 -40 -20 150 0 20 40 60 80 TA TA Forward current IF = (VF) Forward current IF = (T S) TA = 25C BAW101 10 0 EHB00103 300 A mA 10 -1 200 IF F BAW 101 100 120 C 150 5 150 10-2 100 5 50 10-3 0 1.0 V 0 0 2.0 15 30 45 60 75 90 105 120 C 150 TS VF 3 2007-04-20 Package SOT143 BAW101... 2 0.1 MAX. 10 MAX. 1 1 0.1 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 A 5 0...8 0.2 M A 0.25 M B 1.7 0.08...0.1 1.3 0.1 3 2.4 0.15 4 B 10 MAX. 2.9 0.1 1.9 0.15 MIN. Package Outline Foot Print 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 Marking Layout (Example) RF s 56 Manufacturer Pin 1 2005, June Date code (YM) BFP181 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2.6 8 4 Pin 1 3.15 1.15 4 2007-04-20 BAW101... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 5 2007-04-20