1N5811US+JANTX - MICROSEMI - searchdatasheet.com

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

VOIDLESS - HERMETICALLY- SEALED

ULTRAFAST RECOVERY GLASS RECTIFIERS

Qualified per MIL-PRF-19500/477

T4-LDS-0168 Rev. 2 (111089) Page 1 of 7

DEVICES LEVELS

Leaded 1N5807 1N5809 1N5811 JAN

Surface Mount 1N5807US 1N5809US 1N5811US JANTX

1N5807URS 1N5809URS 1N5811URS JANTXV

JANS

DESCRIPTION

B-Body

Leaded Package

B-Body

Surface Mount

MELF PACKAGE

This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-19500/477 and

is ideal for high-reliability applications where a failure cannot be tolerated. These industry-

recognized 6.0 Amp rated rectifiers for working peak reverse voltages from 50 to 150 volts are

hermetically sealed with voidless-glass construction using an internal “Category I” metallurgical

bond. These devices are available in both leaded and surface mount MELF package

configurations. Microsemi also offers numerous other rectifier products to meet higher and

lower current ratings with various recovery time speed requirements including standard, fast and

ultrafast device types in both through-hole and surface mount packages.

IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com

FEATURES

 Popular JEDEC registered 1N5807, 1N5809, 1N5811

 Voidless hermetically sealed glass package

 Extremely robust construction

 Internal “Category I” Metallurgical bonds

 JAN, JANTX, JANTXV, and JANS available per MIL-PRF-19500/477

 Surface mount versions available in a square end-cap MELF configuration with “US”

suffix

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 2 of 7

APPLICATIONS / BENEFITS

 Ultrafast recovery 6 Amp rectifier series 50 to 150V

 Military Space and other high-reliability applications

 Switching power supplies or other applications requiring extremely fast switching & low forward loss

 High forward surge current capability

 Low thermal resistance

 Controlled avalanche with peak reverse power capability

 Inherently radiation hard as described in Microsemi MicroNote 050

MAXIMUM RATINGS

 Junction Temperature: -65oC to +175oC

 Storage Temperature: -65oC to +175oC

 Average Rectified Forward Current (IO): 6 A @ TL = 75ºC at 3/8 inch lead length (see note 1)

 Thermal Resistance: 22 ºC/W junction to lead (L=.375 in)

 Thermal Impedance: 1.5 ºC/W @ 10 ms heating time

 Forward Surge Current (8.3 ms half sine) 125 Amps

 Capacitance: 60 pF at 10 volts, f = 1 MHz

 Solder temperature: 260ºC for 10 s (maximum)

MECHANICAL AND PACKAGING

 CASE: Hermetically sealed voidless hard glass with Tungsten slugs

 TERMINATIONS: Axial-leads are Tin/Lead (Sn/Pb) over Ni plate over Copper.

 MARKING: Body painted and part number, etc.

 POLARITY: Cathode indicated by band

 Tape & Reel option: Standard per EIA-296

 Weight: 750 mg

 See package dimensions on last page

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 3 of 7

ELECTRICAL CHARACTERISTICS @ TA = 25°C

TYPE

WORKING

PEAK

REVERSE

VOLTAGE

VRWM

BREAKDOWN

VOLTAGE

(MIN.)

@ 100A

VBR

AVERAGE

RECTIFIED

CURRENT

IO1

@TL=75ºC

(Note 1)

AVERAGE

RECTIFIED

CURRENT

IO2

@TA=-65ºC

Note 2

MAXIMUM

FORWARD

VOLTAGE

@ 4A

(8.3 ms pulse)

VF

REVERSE

CURRENT

(MAX)

@ VRWM

IR

SURGE

CURRENT

(MAX)

IFSM

(NOTE 3)

REVERSE

RECOVERY

TIME (MAX)

(NOTE 4)

trr

VOLTS VOLTS AMPS VOLTS A AMPS ns

25oC 125oC 25oC 125oC

1N5807, US, URS 50 60 6.0 3.0 0.875 0.800 5 525 125 30

1N5809, US, URS 100 110 6.0 3.0 0.875 0.800 5 525 125 30

1N5811, US, URS 150 160 6.0 3.0 0.875 0.800 5 525 125 30

NOTE 1: Leaded: Rated at TL = 75ºC at 3/8 inch lead length. Derate at 60 mA/ºC for TL above 75ºC.

Surface mount: Rated at TEC = 75°C. Derate at 60 mA/ºC for TEC above 75ºC.

NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance

from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175ºC

NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals

NOTE 4: IF = 1.0 A, IRM = 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min

SYMBOLS & DEFINITIONS

Symbol Definition

VBR Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.

VRWM Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating

temperature range.

VF Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified

current.

IR Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and

temperature.

C Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage

trr

Reverse Recovery Time: Th e time interval between the instant the current passes through zero when

changing from the forward direction to the reverse direction and a specified recovery decay point after a

peak reverse current is reached.

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 4 of 7

GRAPHS

FIGURE 1

TYPICAL FORWARD CURRENT vs. FORWARD VOLTAGE

FIGURE 2

TYPICAL REVERSE CURRENT vs. VOLTAGE

FIGURE 3

OUTPUT CURRENT vs LEAD TEMPERATURE

FIGURE 4

FORWARD PULSE CURRENT vs. DURATION

FIGURE 6

MAXIMUM LEAD TEMP. vs. PD

FIGURE 7

MULTIPLE SURGE CURRENT vs. DURATION

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 5 of 7

PACKAGE DIMENSIONS

Dimensions

Ltr 1N5807, 1N5809, 1N5811 Notes

Inches Millimeters

Min Max Min Max

BD .115 .142 2.92 3.61 4

BL .130 .300 3.30 7.62 3

LD .036 .042 0.91 1.07 3

LL .900 1.30 22.86 33.02

NOTE:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. Dimension BL shall include the entire body including slugs and sections of the lead over which the diameter is

uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending

.050 inch (1.27 mm) onto the leads.

4. Dimension BD shall be measured at the largest diameter.

5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.

Lead Tolerance = + .002 -.003 in

*Includes sections of the lead or fillet over which the lead diameter is uncontrolled.

FIGURE 1. Physical Dimensions

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 6 of 7

PACKAGE DIMENSIONS

PAD LAYOUT

NOTE 1:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. Dimensions are pre-solder dip.

4. Minimum clearance of glass body to mounting surface on all orientations.

5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end tab.

6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie

within .020 inch (0.51 mm) of the mounting surface.

7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.

NOTE 2: This Package Outline has also previously been identified as “D-5B”

FIGURE 2A. Physical dimensions of US surface mount family

INCHES mm

A 0.288 7.32

B 0.070 1.78

C 0.155 3.94

Note: If mounting requires

adhesive separate from the

solder, an additional 0.080 inch

diameter contact may be placed

in the center between the pads as

an optional spot for cement.

Dimensions

Ltr 1N5807US,

1N5809US, 1N5811US Notes

Inches Millimeters

Min Max Min Max

BD .137 .148 3.84 3.76

BL .200 .225 5.08 5.72

ECT .019 .028 0.48 0.71

S .003 0.08

TECHNICAL DATA SHEET

6 Lake Street, Lawrence, MA 01841 Gort Road Bussiness Park, Ennis, Co. Clare, Ireland.

1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298

Website: http://www.microsemi.com

T4-LDS-0168 Rev. 2 (111089) Page 7 of 7

PACKAGE DIMENSIONS

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. Dimensions are pre-solder dip.

4. Minimum clearance of glass body to mounting surface on all orientations.

5. 5. Cathode marking to be either in color band, three dots spaced equally, or a color dot on the face of the end

tab.

6. Color dots will be .020 inch (0.51 mm) diameter minimum and those on the face of the end tab shall not lie

within .020 inch (0.51 mm) of the mounting surface.

7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.

8. One endcap shall be square and the other endcap shall be round.

FIGURE 2B. Physical dimensions of URS surface mount family.

Dimensions

Ltr 1N5802URS,

1N5804URS, 1N5806URS Notes

Inches Millimeters

Min Max Min Max 8

BD .091 .103 2.31 2.62

BL .168 .200 4.27 5.08

ECT .019 .028 0.48 0.71 8

S .003 0.08