VOUT
RON/SD
FB
VIN
SW
RTN
BST
L1
C2
R1
R2
C4
C3
C1
SHUTDOWN RCL
VCC
D1
RON
RCL
9.5 - 95V
Input
LM5009
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Folder
Sample &
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Technical
Documents
Tools &
Software
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LM5009
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LM5009 Wide Input, 100-V,150-mA, Step-Down Switching Regulator
1 Features 3 Description
The LM5009 step-down switching regulator features
1• Integrated N-Channel MOSFET all of the functions needed to implement a low-cost,
• 150-mA Output Current Capability efficient, buck bias regulator. This device is capable
• Ultra-Fast Transient Response of driving a 150-mA load current from a 9.5-V to 95-V
input source. The switching frequency can exceed
• No Loop Compensation Required 600 kHz, depending on the input and output voltages.
• VIN Feed-Forward Provides Constant Operating The output voltage can be set from 2.5 V to 85 V.
Frequency This high-voltage regulator contains an N-channel
• Switching Frequency Can Exceed 600 kHz buck switch and an internal startup regulator. The
device is easy to implement and is provided in 8-pin
• Highly Efficient Operation VSSOP and thermally-enhanced, 8-pin WSON
• 2% Accurate 2.5-V Feedback From packages. The LM5009 is a well-suited alternative to
–40°C to +125°C a high-voltage monolithic or discrete linear solution
• Internal Startup Regulator where the power loss becomes unacceptable. The
regulator operation is based on a control scheme
• Intelligent Current Limit Protection using an on-time inversely proportional to VIN. This
• External Shutdown Control feature allows the operating frequency to remain
• Thermal Shutdown relatively constant over load and input voltage
• 8-Pin VSSOP and Thermally-Enhanced 8-Pin variations. The control scheme requires no loop
compensation, resulting in an ultrafast transient
WSON Packages response. An intelligent current limit is implemented
with forced off-time that is inversely proportional to
2 Applications VOUT. This scheme ensures short-circuit protection
• Heat Sink Eliminator for Classic Linear Regulator and provides minimum foldback. Other features
Applications include thermal shutdown, VCC undervoltage lockout,
gate drive undervoltage lockout, and maximum duty
• 12-V, 24-V, 36-V, and 48-V Rectified AC Systems cycle limiter.
• 42-V Automotive
• Non-Isolated AC Mains Charge-Coupled Supplies Device Information(1)
• LED Current Source PART NUMBER PACKAGE BODY SIZE (NOM)
VSSOP (8) 3.00 mm × 3.00 mm
LM5009 WSON (8) 4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 10
1 Features.................................................................. 18 Application and Implementation ........................ 11
2 Applications ........................................................... 18.1 Application Information............................................ 11
3 Description............................................................. 18.2 Typical Application.................................................. 11
4 Revision History..................................................... 28.3 Do's and Don'ts....................................................... 16
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 16
6 Specifications......................................................... 410 Layout................................................................... 17
6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 17
6.2 ESD Ratings.............................................................. 410.2 Layout Example .................................................... 17
6.3 Recommended Operating Conditions....................... 411 Device and Documentation Support................. 18
6.4 Thermal Information.................................................. 411.1 Documentation Support ........................................ 18
6.5 Electrical Characteristics........................................... 511.2 Community Resources.......................................... 18
6.6 Typical Characteristics.............................................. 611.3 Trademarks........................................................... 18
7 Detailed Description.............................................. 711.4 Electrostatic Discharge Caution............................ 18
7.1 Overview................................................................... 711.5 Glossary................................................................ 18
7.2 Functional Block Diagram......................................... 712 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................... 7Information........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (February 2013) to Revision H Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision F (February 2013) to Revision G Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 16
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1
2
3
4 5
6
7
8
SW
BST
RCL
FB
RTN
RON/SD
VCC
VIN
LM5009
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SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
5 Pin Configuration and Functions
DGK, NGU Packages
8-Pin VSSOP, WSON
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
Boost pin. An external capacitor is required between the BST and SW pins. A 0.022-µF
BST 2 I ceramic capacitor is recommended. An internal diode charges the capacitor from VCC.
Exposed pad (WSON package only). Exposed metal pad on the underside of the device.
EP — — Connecting this pad to the PC board ground plane is recommended to aid in heat
dissipation.
Feedback input from regulated output. This pin is connected to the inverting input of the
FB 5 I internal regulation comparator. The regulation threshold is 2.5 V.
Current limit off-time set pin. A resistor between this pin and RTN sets the off-time when
RCL 3 I current limit is detected. The off-time is preset to 35 µs if FB = 0 V.
On-time set pin. A resistor between this pin and VIN sets the switch on-time as a function of
RON/SD 6 I VIN. The minimum recommended on-time is 250 ns at the maximum input voltage. This pin
can be used for remote shutdown.
RTN 4 — Ground pin. Ground for the entire circuit.
Switching output. Power switching output. Connect to the inductor, recirculating diode, and
SW 1 O bootstrap capacitor.
Output from the internal high-voltage startup regulator. Regulated at 7.0 V. If an auxiliary
voltage is available to raise the voltage on this pin above the regulation set point (7 V), the
internal series pass regulator shuts down, reducing the device power dissipation. Do not
VCC 7 O exceed 14 V. This voltage provides gate drive power for the internal buck switch. An internal
diode is provided between this pin and the BST pin. A local 0.1-µF decoupling capacitor is
required.
VIN 8 I Input voltage. Recommended operating range: 9.5 V to 95 V.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN to RTN –0.3 100 V
BST to RTN –0.3 114 V
SW to RTN (steady-state) –1 V
BST to VCC 100 V
BST to SW 14 V
VCC to RTN 14 V
All other inputs to RTN –0.3 7 V
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Line voltage 9.5 95 V
Operating junction temperature –40 125 °C
(1) Operating ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions,
see the Electrical Characteristics.
6.4 Thermal Information LM5009
THERMAL METRIC(1) DGK (VSSOP) NGU (WSON) UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 157.7 42.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.2 41.5 °C/W
RθJB Junction-to-board thermal resistance 77.9 20.1 °C/W
ψJT Junction-to-top characterization parameter 4.5 0.4 °C/W
ψJB Junction-to-board characterization parameter 76.5 20.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
Typical limits are for TJ= 25°C only, and all maximum and minimum limits apply over the junction temperature (TJ) range of
–40°C to +125°C. Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values
represent the most likely parametric norm at TJ= 25°C, and are provided for reference purposes only. Unless otherwise
stated, the following conditions apply: VIN = 48 V and RON = 200 kΩ.(1).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC SUPPLY
VCC reg VCC regulator output 6.6 7 7.4 V
VCC current limit(2) 9.5 mA
VCC undervoltage lockout voltage 6.3 V
(VCC increasing)
VCC undervoltage hysteresis 200 mV
VCC UVLO delay (filter) 100-mV overdrive 10 µs
IIN operating current Non-switching, FB = 3 V 485 675 µA
IIN shutdown current RON/SD = 0 V 76 150 µA
SWITCH CHARACTERISTICS
Buck switch Rds(on) ITEST = 200 mA(3) 2.0 4.4 Ω
Gate drive UVLO VBST −VSW rising 3.4 4.5 5.5 V
Gate drive UVLO hysteresis 430 mV
CURRENT LIMIT
Current limit threshold 0.25 0.31 0.37 A
Current limit response time Iswitch overdrive = 0.1-A time to switch off 400 ns
OFF time generator (test 1) FB = 0 V, RCL = 100 kΩ35 µs
OFF time generator (test 2) FB = 2.3 V, RCL = 100 kΩ2.56 µs
ON TIME GENERATOR
TON - 1 VIN = 10 V, RON = 200 kΩ2.15 2.77 3.5 µs
TON - 2 VIN = 95 V, RON = 200 kΩ200 300 420 ns
Remote shutdown threshold Rising 0.4 0.7 1.05 V
Remote shutdown hysteresis 35 mV
MINIMUM OFF TIME
Minimum off timer FB = 0 V 300 ns
REGULATION AND OV COMPARATORS
FB reference threshold Internal reference, trip point for switch on 2.445 2.5 2.550 V
FB overvoltage threshold Trip point for switch off 2.875 V
FB bias current 1 nA
THERMAL SHUTDOWN
Tsd Thermal shutdown temperature 165 °C
Thermal shutdown hysteresis 25 °C
(1) All electrical characteristics having room temperature limits are tested during production with TA= TJ= 25°C. All hot and cold limits are
specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
(2) The VCC output is intended as a self bias for the internal gate drive power and control circuits. Device thermal limitations limit external
loading.
(3) For devices procured in the WSON-8 package, the Rds(on) limits are specified by design characterization data only.
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89 10 11 12 13 14
EXTERNALLY APPLIED VCC (V)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
ICC INPUT CURRENT (mA)
FS = 1.2 MHz
FS = 725 kHz
FS = 180 kHz
FS = 400 kHz
0 2 4 6 8 10
0
1
2
3
4
5
6
7
8
VCC (V)
ICC (mA, External Load)
VIN = 9.5V
10V
VIN t 15V
0 0.5 1.0 1.5 2.0 2.5
0
5
10
15
20
25
30
35
CURRENT LIMIT OFF TIME (Ps)
VFB (V)
300k
RCL = 500k
100k
50k
1.2 MHz
725 kHz
400 kHz
VIN (V)
6.5
VCC (V)
9.0 9.5 10.0 10.5 11.0
6.6
6.7
6.8
6.9
7.0
7.1 FS = 180 kHz
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
www.ti.com
6.6 Typical Characteristics
Figure 2. VCC vs VIN and FS
Figure 1. On-Time vs VIN and RON
Figure 3. Current Limit Off-Time vs Figure 4. VCC vs
VFB and RCL ICC and VIN
Figure 5. ICC Current vs
Applied VCC Voltage
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FB
VIN
VCC
SW
RTN
ON TIMER
DRIVER
VIN
BST
LEVEL
SHIFT
SD/
RON
2.5V
THERMAL
SHUTDOWN
0.31A
BUCK
SWITCH
CURRENT
SENSE
COMPLETE
RCL START
RCL
COMPLETE
START
Ron
L1
C4
9.5V - 95V
Input
C3
LM5009
UVLO
FB
UVLO
REGULATION
COMPARATOR
OVER-VOLTAGE
COMPARATOR
2.875V
SD
SD
COMPLETE
START
MINIMUM
OFF-TIMER
8
6
5
3
4
1
2
7
7V SERIES
REGULATOR
CURRENT LIMIT
OFF TIMER
SHUTDOWN
D1
Q
CLR
Q
SET
S
R
+
-
+
-
+
-
C1
RON
RCL
R2
R3
VOUT2
VOUT1
R1
C5
C2
LM5009
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SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
7 Detailed Description
7.1 Overview
The LM5009 step-down switching regulator features all the functions needed to implement a low-cost, efficient,
buck bias power converter. This high-voltage regulator contains a 100-V N-channel buck switch, is easy to
implement, and is provided in VSSOP-8 and thermally-enhanced, WSON-8 packages. The regulator is based on
a control scheme using an on-time inversely proportional to VIN. The control scheme requires no loop
compensation. Current limit is implemented with forced off-time that is inversely proportional to VOUT. This
scheme ensures short-circuit protection and provides minimum foldback. The functional block diagram of the
LM5009 is shown in the Functional Block Diagram section.
The LM5009 can be applied in numerous applications to efficiently regulate down higher voltages. This regulator
is well-suited for 48-V telecom and 42-V automotive power bus ranges. Additional features include: thermal
shutdown, VCC undervoltage lockout, gate drive undervoltage lockout, maximum duty cycle limit timer, and the
intelligent current limit off timer.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Control Circuit Overview
The LM5009 is a buck dc-dc regulator that uses a control scheme where the on-time varies inversely with line
voltage (VIN). Control is based on a comparator and the on-time one-shot, with the output voltage feedback (FB)
compared to an internal reference (2.5 V). If the FB level is below the reference, then the buck switch is turned
on for a fixed time determined by the line voltage and a programming resistor (RON). Following the on period, the
switch remains off for at least the minimum off-timer period of 300 ns. If FB is still below the reference at that
time, then the switch turns on again for another on-time period. This cycle continues until regulation is achieved,
at which time the off-time increases based on the required duty cycle.
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FB
SW
L1
C2
R1
R2
VOUT2
R3
LM5009
F = VOUT
1.25 x 10-10 x RON
F = VOUT2 x L x 1.28 x 1020
RL x (RON)2
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
www.ti.com
Feature Description (continued)
The LM5009 operates in discontinuous conduction mode at light load currents, and continuous conduction mode
at heavy load current. In discontinuous conduction mode, current through the output inductor starts at zero and
ramps up to a peak during the on-time, then ramps back to zero before the end of the off-time. The next on-time
period starts when the voltage at FB falls below the internal reference—until then, the inductor current remains
zero. In this mode the operating frequency is lower than in continuous conduction mode, and varies with load
current. Therefore, at light loads the conversion efficiency is maintained because the switching losses reduce
with the reduction in load and frequency. The discontinuous operating frequency can be calculated as by
Equation 1:
where
• RL= the load resistance (1)
In continuous conduction mode, current flows continuously through the inductor and never ramps down to zero.
In this mode, the operating frequency is greater than the discontinuous mode frequency and remains relatively
constant with load and line variations. The approximate continuous mode operating frequency can be calculated
by Equation 2:
(2)
The output voltage (VOUT) is programmed by two external resistors; see the Functional Block Diagram section.
The regulation point is calculated by Equation 3:
VOUT = 2.5 × (R1 + R2) / R2 (3)
This regulator regulates the output voltage based on ripple voltage at the feedback input, requiring a minimum
amount of equivalent series resistance (ESR) for the output capacitor C2. A minimum of 25 mV of ripple voltage
at the feedback pin (FB) is required for the LM5009. In cases where the capacitor ESR is too small, additional
series resistance may be required (see R3 in the Functional Block Diagram section).
For applications where lower output voltage ripple is required, the output can be taken directly from a low-ESR
output capacitor, as shown in Figure 6. However, R3 slightly degrades the load regulation.
Figure 6. Low Ripple Output Configuration
7.3.2 High Voltage Startup Regulator
The LM5009 contains an internal high voltage startup regulator. The input pin (VIN) can be connected directly to
line voltages up to 95 V, with transient capability to 100 V. The regulator is internally current limited at 9.5 mA.
Upon power-up, the regulator sources current into the external capacitor at VCC (C3). When the voltage on the
VCC pin reaches the undervoltage lockout threshold of 6.3 V, the buck switch is enabled.
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FB
SW
L1
C2
VOUT1
R3
LM5009
BST
VCC
C4
D2
D1 R1
R2
C3
LM5009
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SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
Feature Description (continued)
In applications involving a high value for VIN, where power dissipation in the VCC regulator is a concern, an
auxiliary voltage can be diode connected to the VCC pin. Setting the voltage between 8 V and 14 V shuts off the
internal regulator, reducing internal power dissipation, as shown in Figure 7. The current required into the VCC
pin is illustrated in the Typical Characteristics section.
Figure 7. Self-Biased Configuration
7.3.3 Regulation Comparator
The feedback voltage at FB is compared to an internal 2.5-V reference. In normal operation (the output voltage is
regulated), an on-time period is initiated when the voltage at FB falls below 2.5 V. The buck switch stays on for
the programmed on-time, causing the FB voltage to rise above 2.5 V. After the on-time period, the buck switch
stays off until the FB voltage again falls below 2.5 V. During start-up, the FB voltage is below 2.5 V at the end of
each on-time, resulting in the minimum off-time. Bias current at the FB pin is less than 5 nA over temperature.
7.3.4 Overvoltage Comparator
The feedback voltage at FB is compared to an internal 2.875-V reference. If the voltage at FB rises above 2.875
V, then the on-time pulse is immediately terminated. This condition can occur if the input voltage, or the output
load, changes suddenly. The buck switch does not turn on again until the voltage at FB falls below 2.5 V.
7.3.5 On-Time Generator
The on-time for the LM5009 is determined by the RON resistor, and is inversely proportional to the input voltage
(VIN), resulting in a nearly constant frequency because VIN is varied over its range. The on-time equation is
shown in Equation 4:
TON = 1.25 × 10–10 × RON / VIN (4)
Select RON for a minimum on-time (at maximum VIN) greater than 250 ns, for proper current limit operation. This
requirement limits the maximum frequency for each application, depending on VIN and VOUT.
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STOP
RUN
RON LM5009
RON/SD
VIN
Input
Voltage
TOFF = VFB
(6.35 x 10-6 x RCL)
0.285 +
10-5
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
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Feature Description (continued)
7.3.6 Current Limit
The LM5009 contains an intelligent current limit off timer. If the current in the buck switch exceeds 0.31 A, then
the present cycle is immediately terminated and a non-resettable off timer is initiated. The length of off-time is
controlled by an external resistor (RCL) and the FB voltage. When FB = 0 V, a maximum off-time is required and
the time is preset to 35 µs. This condition occurs when the output is shorted and during the initial part of start-up.
This amount of time ensures safe short-circuit operation up to the maximum input voltage of 95 V. In cases of
overload where the FB voltage is above 0 V (not a short-circuit) the current limit off-time is less than 35 µs.
Reducing the off-time during less severe overloads reduces the amount of foldback, recovery time, and start-up
time. The off-time is calculated from Equation 5:
(5)
The current limit sensing circuit is blanked for the first 50 ns to 70 ns of each on-time so it is not falsely tripped by
the current surge that occurs at turn-on. The current surge is required by the recirculating diode (D1) for its turn-
off recovery.
7.3.7 N-Channel Buck Switch and Driver
The LM5009 integrates an N-channel buck switch and associated floating high-voltage gate driver. The gate
driver circuit works in conjunction with an external bootstrap capacitor and an internal high-voltage diode. A
0.022‑µF ceramic capacitor (C4) connected between the BST pin and SW pin provides the voltage to the driver
during the on-time.
During each off-time, the SW pin is at approximately –1 V, and the bootstrap capacitor charges from VCC through
the internal diode. The minimum off timer ensures a minimum time for each cycle to recharge the bootstrap
capacitor.
An external re-circulating diode (D1) carries the inductor current after the internal buck switch turns off. This
diode must be of the ultra-fast or Schottky type to minimize turn-on losses and current overshoot.
7.3.8 Thermal Protection
Operate the LM5009 so that the junction temperature does not exceed 125°C during normal operation. An
internal thermal shutdown circuit is provided to protect the LM5009 in the event of a higher than normal junction
temperature. When activated, typically at 165°C, the controller is forced into a low-power reset state, disabling
the buck switch. This feature prevents catastrophic failures from accidental device overheating. When the
junction temperature reduces below 140°C (typical hysteresis = 25°C), the buck switch is enabled and normal
operation is resumed.
7.4 Device Functional Modes
The LM5009 can be remotely disabled by taking the RON/SD pin to ground, as shown in Figure 8. The voltage at
the RON/SD pin is between 1.7 V and 5 V, depending on VIN and the value of the RON resistor.
Figure 8. Shutdown Implementation
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VOUT
RON/SD
FB
VIN
SW
RTN
BST
L1
C2
R1
R2
C4
C3
C1
SHUTDOWN RCL
VCC
D1
RON
RCL
9.5 - 95V
Input
LM5009
LM5009
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SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM5009 is a non-synchronous buck regulator designed to operate over a wide input voltage range and
output current. Spreadsheet-based quick-start calculation tools and the on-line WEBENCH®software can be
used to create a buck design along with the bill of materials, estimated efficiency, and the complete solution cost.
8.2 Typical Application
A typical buck application circuit with the LM5009 is shown in Figure 9. The circuit can operate over a wide input
voltage range of 9.5 V to 95 V and provides a stable output of 10 V over the load current being varied from 50
mA to 200 mA. The resulting curves are shown in Figure 10 through Figure 13.
Figure 9. Typical Buck Application Circuit
8.2.1 Design Requirements
A typical buck application circuit with the LM5009 can be summarized by the operating conditions listed in
Table 1.
Table 1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input voltage range 9.5 V to 95 V
Output voltage 10 V
Load current range 50 mA to 200 mA
Nominal switching frequency 330 kHz
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L1 = VOUT1 x (VIN - VOUT1)
IOR x Fs x VIN
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8.2.2 Detailed Design Procedure
8.2.2.1 Output Resistor Divider Selection
R1 and R2: From the Functional Block Diagram section, VOUT1 can be determined to be equal to VFB × (R1 +
R2) / R2, and because VFB = 2.5 V, the ratio of R1 to R2 calculates as 3:1. Standard values of 3.01 kΩ(R1) and
1.00 kΩ(R2) are chosen. Other values can be used as long as the 3:1 ratio is maintained. The selected values,
however, provide a small amount of output loading (2.5 mA) in the event that the main load is disconnected and
allows the circuit to maintain regulation until the main load is reconnected.
8.2.2.2 Frequency Selection
Fsand RON:Unless the application requires a specific frequency, the choice of frequency is generally a
compromise because the size of L1 and C2, and the switching losses are affected. The maximum-allowed
frequency, based on a minimum on-time of 250 ns, is calculated by Equation 6:
FMAX = VOUT / (VINMAX × 250 ns) (6)
For this exercise, FMAX = 444 kHz. From Equation 2, RON calculates to 180 kΩ. A standard-value, 237-kΩresistor
is used to allow for tolerances in Equation 2, resulting in a nominal frequency of 337 kHz.
8.2.2.3 Inductor Selection
L1: The main parameter affected by the inductor is the output current ripple amplitude. The choice of inductor
value therefore depends on both the minimum and maximum load currents, keeping in mind that the maximum
ripple current occurs at maximum VIN.
a. Minimum load current: To maintain continuous conduction at minimum IO(100 mA), the ripple amplitude
(IOR) must be less than 200 mA peak-to-peak so the lower peak of the waveform does not reach zero. L1 is
calculated using Equation 7:
(7)
At VIN = 90 V, L1 (min) calculates to 132 µH. The next larger standard value (150 µH) is chosen and, with
this value, IOR calculates to 176 mA peak-to-peak at VIN = 90 V and 33 mA peak-to-peak at VIN = 12 V.
b. Maximum load current: At a load current of 150 mA, the peak of the ripple waveform must not reach the
minimum value of the LM5009 current limit threshold (250 mA). Therefore, the ripple amplitude must be less
than 200 mA peak-to-peak, which is already satisfied in Equation 7. With L1 = 150 µH, at maximum VIN and
IO, the peak of the ripple is 238 mA. Although L1 must carry this peak current without saturating or exceeding
its temperature rating, L1 must also be capable of carrying the maximum value of the LM5009 current limit
threshold (370 mA) without saturating because the current limit is reached during startup.
8.2.2.4 VCC and Bootstrap Capacitor
C3: The capacitor on the VCC output provides not only noise filtering and stability, but also prevents false
triggering of the VCC UVLO at the buck switch on and off transitions. For this reason, C3 must be no smaller than
0.1 µF.
C4: The recommended value is 0.022 µF for C4 because this value is appropriate in the majority of applications.
A high-quality ceramic capacitor, with low ESR is recommended because C4 supplies the surge current to
charge the buck switch gate at turn-on. A low ESR also ensures a quick recharge during each off-time. At
minimum VIN when the on-time is at maximum, C4 can possibly not fully recharge at start-up during each 300-ns
off-time. This failure to recharge results from the circuit being unable to complete the start-up and achieve output
regulation. This condition can occur when the frequency is intended to be low (for example, RON = 500 kΩ). In
this case, increase C4 to maintain sufficient voltage across the buck switch driver during each on-time.
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SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
8.2.2.5 Output Capacitor Selection
C2 and R3: When selecting the output filter capacitor C2, the items to consider are ripple voltage resulting from
the C2 ESR, ripple voltage resulting from the C2 capacitance, and the nature of the load.
a. ESR and R3: A low ESR for C2 is generally desirable to minimize power losses and heating within the
capacitor. However, this regulator requires a minimum amount of ripple voltage at the feedback input for
proper loop operation. For the LM5009, the minimum ripple required at pin 5 is 25 mV peak-to-peak,
requiring a minimum ripple at VOUT1 of 100 mV. The minimum ESR required at VOUT1 is 3 Ωbecause the
minimum ripple current (at minimum VIN) is 33 mA peak-to-peak. R3 is inserted as illustrated in the
Functional Block Diagram section because quality capacitors for SMPS applications have considerably less
ESR. The value of R3, along with the ESR of C2, must result in at least a 25-mV peak-to-peak ripple at pin
5. Generally, R3 is 0.5 Ωto 5.0 Ω.
b. Nature of the load: The load can be connected to VOUT1 or VOUT2. VOUT1 provides good regulation, but with
a ripple voltage that ranges from 100 mV (at VIN = 12 V) to 580 mV (at VIN = 90 V). Alternatively, VOUT2
provides low ripple (3 mV to 13 mV) but lower regulation resulting from R3.
C2 generally must be no smaller than 3.3 µF. Typically, the value of C2 is 10 µF to 20 µF, with the optimum
value determined by the load. If the load current is fairly constant, a small value suffices for C2. If the load
current includes significant transients, a larger value is necessary. For each application, experimentation is
needed to determine the optimum values for R3 and C2.
c. Ripple reduction: The ripple amplitude at VOUT1 can be reduced by reducing R3 and by adding a capacitor
across R1 to transfer the ripple at VOUT1 directly to the FB pin without attenuation. The new value of R3 is
calculated by Equation 8:
R3 = 25 mV / IOR(min)
where
• IOR(min) is the minimum ripple current amplitude—33 mAp-p in this example (8)
The added capacitor value is calculated by Equation 9:
C = TON(max) / (R1 // R2)
where
• TON(max) is the maximum on-time (at minimum VIN) (9)
The selected capacitor must be larger than the value calculated in Equation 9.
8.2.2.6 Current Limit Off-Timer Setting
RCL:When a current limit condition is detected, the minimum off-time set by this resistor must be greater than the
maximum normal off-time that occurs at maximum VIN. Using Equation 4, the minimum on-time is 0.329 µs,
yielding a maximum off-time of 2.63 µs. This value is further increased by 82 ns (to 2.72 µs), resulting from a
±25% tolerance of the on-time. This value is then increased to allow for the response time of the current limit
detection loop (400 ns).
The off-time determined by Equation 5 has a ±25% tolerance, as given by Equation 10:
tOFFCL(MIN) = (2.72 µs × 1.25) + 0.4 µs = 3.8 µs (10)
Using Equation 5, RCL calculates to 167 kΩ(at VFB = 2.5 V). The closest standard value is 169 kΩ.
Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM5009
C1 = I x tON
'V0.15A x 2.47 Ps
2.0V
== 0.185 PF
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
www.ti.com
8.2.2.7 Rectifier Diode Selection
D1: The important parameters are reverse recovery time and forward voltage. Reverse recovery time determines
how long the reverse current surge lasts each time that the buck switch is turned on. The forward voltage drop is
significant in the event that the output is short-circuited because only this diode voltage forces the inductor
current to reduce during the forced off-time. For this reason, a higher voltage is better, although higher voltages
affect efficiency. A good choice is an ultrafast or Schottky diode with a reverse recovery time of approximately 30
ns and a forward voltage drop of approximately 0.7 V. Other types of diodes can have a lower forward voltage
drop, but can also have longer recovery times or greater reverse leakage. The D1 reverse voltage rating must be
at least as great as the maximum VIN, and the D1 current rating must be greater than the maximum current limit
threshold (370 mA).
8.2.2.8 Input Capacitor Selection
C1: The purpose of this capacitor is to supply most of the switch current during the on-time and to limit the
voltage ripple at VIN, on the assumption that the voltage source feeding VIN has an output impedance greater
than zero. At maximum load current, when the buck switch turns on, the current into pin 8 suddenly increases to
the lower peak of the output current waveform, ramps up to the peak value, and then drops to zero at turn-off.
The average input current during this on-time is the load current (150 mA). For a worst-case calculation, C1 must
supply this average load current during the maximum on-time. To keep the input voltage ripple to less than 2 V
(for this exercise), C1 calculates to Equation 11:
(11)
Quality ceramic capacitors in this value have a low ESR that adds only a few millivolts to the ripple. The
capacitance is dominant in this case. To allow for the capacitor tolerance, temperature effects, and voltage
effects, a 1.0-µF, 100-V, X7R capacitor is used.
C5: This capacitor helps avoid supply voltage transients and ringing resulting from long lead inductance at VIN. A
low-ESR, 0.1-µF ceramic chip capacitor is recommended, located close to the LM5009.
14 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: LM5009
ff SW FB2 FB1
3L1,min
5
CF (R IIR )
25 mV
RI
t
u
t
'
u
t
u '
O
3REF L1,min
25 mV V
RV I
IN,min
IN,min O ON(@V )
A A (V V ) T
R C 25mV
u
t
GND
To FB
L1
COUT
RFB2
RFB1
VOUT
R3
GND
To FB
L1
COUT
RFB2
RFB1
VOUT
R3
Cff
COUT
VOUT
GND
RA
CB
CA
To FB
RFB2
RFB1
L1
LM5009
www.ti.com
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
8.2.2.9 Ripple Configuration
The LM5009 uses a constant-on-time (COT) control scheme where the on-time is terminated by a one-shot and
the off-time is terminated by the feedback voltage (VFB) falling below the reference voltage. Therefore, for stable
operation, the feedback voltage must decrease monotonically in phase with the inductor current during the off-
time. Furthermore, this change in feedback voltage (VFB) during off-time must be large enough to dominate any
noise present at the feedback node.
Table 2 presents three different methods for generating appropriate voltage ripple at the feedback node. Type 1
and type 2 ripple circuits couple the ripple from the output of the converter to the feedback node (FB). The output
voltage ripple has two components:
1. Capacitive ripple caused by the inductor current ripple charging or discharging the output capacitor.
2. Resistive ripple caused by the inductor current ripple flowing through the ESR of the output capacitor and
R3.
Table 2. Ripple Configuration
TYPE 1 TYPE 2 TYPE 3
Lowest cost Reduced ripple Minimum ripple
(12) (14)
(13)
The capacitive ripple is out of phase with the inductor current. As a result, the capacitive ripple does not
decrease monotonically during the off-time. The resistive ripple is in phase with the inductor current and
decreases monotonically during the off-time. The resistive ripple must exceed the capacitive ripple at output
(VOUT) for stable operation. If this condition is not satisfied, then unstable switching behavior is observed in COT
converters with multiple on-time bursts in close succession followed by a long off-time.
The type 3 ripple method uses a ripple injection circuit with RA, CA, and the switch node (SW) voltage to generate
a triangular ramp. This triangular ramp is then ac-coupled into the feedback node (FB) using the capacitor CB.
This circuit is suited for applications where low output voltage ripple is imperative because this circuit does not
use the output voltage ripple. See application note AN-1481 Controlling Output Ripple and Achieving ESR
Independence in Constant On-Time (COT) Regulator Designs,SNVA166 for more details on each ripple
generation method.
Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM5009
0 20 40 60 80 100
230
250
270
290
310
330
LOAD CURRENT @ CURRENT LIMIT
ONSET (mA)
VIN (V)
LOAD CURRENT (mA)
VOUT (V)
50 100 150 200
9.4
9.6
9.8
10.0
10.2
10.4
Vin = 48V
0 20 40 60 80 100
50
60
70
80
90
100
EFFICIENCY (%)
VIN (V)
IOUT = 200 mA
IOUT = 100 mA
LOAD CURRENT (mA)
EFFICIENCY (%)
Vin = 12V
50 100 150 200
50
60
70
80
90
100
Vin = 90V
Vin = 48V
Vin = 30V
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
www.ti.com
8.2.3 Application Curves
Figure 10. Efficiency vs Load Current and VIN Figure 11. Efficiency vs VIN and Load Current
Figure 12. VOUT vs Load Current Figure 13. Current Limit vs VIN
8.3 Do's and Don'ts
A minimum load current of 1 mA is required to maintain proper operation. If the load current falls below that level,
the bootstrap capacitor can discharge during the long off-time and the circuit either shuts down or cycles on and
off at a low frequency. If the load current is expected to drop below 1 mA in the application, choose the feedback
resistors to be low enough in value to provide the minimum required current at nominal VOUT.
9 Power Supply Recommendations
The LM5009 is designed to operate with an input power supply capable of supplying a voltage range between
9 V and 95 V. The input power supply must be well-regulated and capable of supplying sufficient current to the
regulator during peak load operation. Also, like in all applications, the power-supply source impedance must be
small compared to the module input impedance to maintain the stability of the converter.
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Product Folder Links: LM5009
GND
CBST
RFB1
VLINE
SW
Cbyp
VOUT
LIND
RFB2
CB
RON
COUT
CIN
Via to Ground Plane
CVCC
CA
RA
SW
BST
RCL
RTN FB
RON
VCC
VIN
LM5009
GND
D1
Exp Thermal
Pad
LM5009
www.ti.com
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
10 Layout
10.1 Layout Guidelines
The LM5009 regulation and overvoltage comparators are very fast, and as such respond to short-duration noise
pulses. Layout considerations are therefore critical for optimum performance. The components at pins 1, 2, 3, 5,
and 6 must be as physically close as possible to the device, thereby minimizing noise pickup in the PC tracks.
The two major current loops conduct currents that switch very fast and, therefore, those loops must be as small
as possible to minimize conducted and radiated electromagnetic interference (EMI). The first loop is formed by
CIN, through the VIN to SW pins, LIND, COUT, and back to CIN. The second current loop is formed by D1, LIND, and
COUT.
If the internal dissipation of the LM5009 produces excessive junction temperatures during normal operation, good
use of the PC board ground plane can help considerably to dissipate heat. The exposed pad on the bottom of
the WSON-8 package can be soldered to a ground plane on the PC board, and that plane must extend out from
beneath the device to help dissipate heat. Additionally, the use of wide PC board traces, where possible, can
also help conduct heat away from the device. Judicious positioning of the PC board within the end product, along
with the use of any available air flow (forced or natural convection) can help reduce the junction temperatures.
10.2 Layout Example
Figure 14. LM5009 Buck Layout Example with the WSON Package
Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM5009
LM5009
SNVS402H –FEBRUARY 2006–REVISED OCTOBER 2015
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
Application note AN-1481 Controlling Output Ripple and Achieving ESR Independence in Constant On-Time
(COT) Regulator Designs,SNVA166
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: LM5009
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5009MM NRND VSSOP DGK 8 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 SLLB
LM5009MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SLLB
LM5009MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 SLLB
LM5009SDC/NOPB ACTIVE WSON NGU 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5009SD
LM5009SDCX/NOPB ACTIVE WSON NGU 8 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5009SD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM5009MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5009MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5009MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5009SDC/NOPB WSON NGU 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM5009SDCX/NOPB WSON NGU 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5009MM VSSOP DGK 8 1000 210.0 185.0 35.0
LM5009MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM5009MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM5009SDC/NOPB WSON NGU 8 1000 210.0 185.0 35.0
LM5009SDCX/NOPB WSON NGU 8 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
MECHANICAL DATA
NGU0008B
www.ti.com
SDC08B (Rev A)
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