© Semiconductor Components Industries, LLC, 2012
July, 2012 Rev. 7
1Publication Order Number:
MC74LCX125/D
MC74LCX125
Low-Voltage CMOS
Quad Buffer
With 5 VTolerant Inputs and Outputs
(3State, NonInverting)
The MC74LCX125 is a high performance, noninverting quad
buffer operating from a 2.3 to 3.6 V supply. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
performance. A VI specification of 5.5 V allows MC74LCX125 inputs
to be safely driven from 5.0 V devices. The MC74LCX125 is suitable
for memory address driving and all TTL level bus oriented transceiver
applications.
Current drive capability is 24 mA at the outputs. The Output Enable
(OEn) inputs, when HIGH, disable the outputs by placing them in a
HIGH Z condition.
Features
Designed for 2.3 to 3.6 V VCC Operation
5.0 V Tolerant Interface Capability With 5.0 V TTL Logic
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current in all Three Logic States (10 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds 500 mA
ESD Performance: Human Body Model >2000 V
Machine Model >200 V
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MARKING
DIAGRAMS
TSSOP14
DT SUFFIX
CASE 948G
14
1
SOIC14
D SUFFIX
CASE 751A
14
1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
LCX125G
AWLYWW
1
14
LCX
125
ALYWG
G
1
14
A = Assembly Location
L, WL = Wafer Lot
Y, YY = Year
W, WW = Work Week
G or G= PbFree Package
(Note: Microdot may be in either location)
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2
Figure 1. Pinout: 14Lead (Top View)
1314 12 11 10 9 8
21 34567
VCC OE3D3 O3OE2D2 O2
OE0D0 O0OE1 D1 O1 GND
PIN NAMES
Function
Output Enable Inputs
Data Inputs
3State Outputs
Pins
OEn
Dn
On
H = High Voltage Level
L = Low Voltage Level
Z = High Impedance State
X = High or Low Voltage Level and Transitions Are
Acceptable; for ICC reasons, DO NOT FLOAT Inputs
OEn Dn On
L
L
H
L
H
X
L
H
Z
INPUTS OUTPUTS
TRUTH TABLE
D0 2O0
3
OE
0
1
D1 5O1
6
OE
1
4
D2 9O2
8
OE
2
10
D3 12 O3
11
OE
3
13
Figure 2. Logic Diagram
MAXIMUM RATINGS
Symbol Parameter Value Condition Units
VCC DC Supply Voltage 0.5 to +7.0 V
VIDC Input Voltage 0.5 VI +7.0 V
VODC Output Voltage 0.5 VO +7.0 Output in 3State V
0.5 VO VCC + 0.5 Output in HIGH or LOW State. (Note 1) V
IIK DC Input Diode Current 50 VI < GND mA
IOK DC Output Diode Current 50 VO < GND mA
+50 VO > VCC mA
IODC Output Source/Sink Current ±50 mA
ICC DC Supply Current Per Supply Pin ±100 mA
IGND DC Ground Current Per Ground Pin ±100 mA
TSTG Storage Temperature Range 65 to +150 °C
MSL Moisture Sensitivity Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
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RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Units
VCC Supply Voltage
Operating
Data Retention Only
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
VIInput Voltage 0 5.5 V
VOOutput Voltage
HIGH or LOW State
3State
0
0
VCC
5.5
V
IOH HIGH Level Output Current
VCC = 3.0 V 3.6 V
VCC = 2.7 V 3.0 V
VCC = 2.3 V 2.7 V
24
12
8
mA
IOL LOW Level Output Current
VCC = 3.0 V 3.6 V
VCC = 2.7 V 3.0 V
VCC = 2.3 V 2.7 V
+24
+12
+8
mA
TAOperating FreeAir Temperature 40 +85 °C
Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V,
VCC = 3.0 V
0 10 ns/V
DC ELECTRICAL CHARACTERISTICS
TA = 40°C to +85°C
Symbol Characteristic Condition Min Max Units
VIH HIGH Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 1.7 V
2.7 V VCC 3.6 V 2.0
VIL LOW Level Input Voltage (Note 2) 2.3 V VCC 2.7 V 0.7 V
2.7 V VCC 3.6 V 0.8
VOH HIGH Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mAVCC 0.2 V
VCC = 2.3 V; IOH = 8 mA 1.8
VCC = 2.7 V; IOH = 12 mA 2.2
VCC = 3.0 V; IOH = 18 mA 2.4
VCC = 3.0 V; IOH = 24 mA 2.2
VOL LOW Level Output Voltage 2.3 V VCC 3.6 V; IOL = 100 mA0.2 V
VCC = 2.3 V; IOL= 8 mA 0.6
VCC = 2.7 V; IOL= 12 mA 0.4
VCC = 3.0 V; IOL = 16 mA 0.4
VCC = 3.0 V; IOL = 24 mA 0.55
IOZ 3State Output Current VCC = 3.6 V, VIN = VIH or VIL,
VOUT = 0 to 3.6 V
±5mA
IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA
IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5mA
ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA
DICC Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC 0.6 V 500 mA
2. These values of VI are used to test DC electrical characteristics only.
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AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W
Symbol Parameter Waveform
Limits
Units
TA = 40°C to +85°C
VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V
CL = 50 pF CL = 50 pF CL = 30 pF
Min Max Min Max Min Max
tPLH
tPHL
Propagation Delay Time
Input to Output
1 1.5
1.5
6.0
6.0
1.5
1.5
6.5
6.5
1.5
1.5
7.2
7.2
ns
tPZH
tPZL
Output Enable Time to
High and Low Level
2 1.5
1.5
7.0
7.0
1.5
1.5
8.0
8.0
1.5
1.5
9.1
9.1
ns
tPHZ
tPLZ
Output Disable Time From
High and Low Level
2 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
tOSHL
tOSLH
OutputtoOutput Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGHtoLOW (tOSHL) or LOWtoHIGH (tOSLH); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
TA = +25°C
Symbol Characteristic Condition Min Typ Max Units
VOLP Dynamic LOW Peak Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.8
0.6
V
VOLV Dynamic LOW Valley Voltage
(Note 4)
VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V
VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V
0.8
0.6
V
4. Number of outputs defined as “n”. Measured with “n1” outputs switching from HIGHtoLOW or LOWtoHIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF
COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF
CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF
ORDERING INFORMATION
Device Package Shipping
MC74LCX125DG SOIC14
(PbFree)
55 Units / Rail
MC74LCX125DR2G SOIC14
(PbFree)
2500 Tape & Reel
MC74LCX125DTG TSSOP14
(PbFree)
96 Units / Rail
MC74LCX125DTR2G TSSOP14
(PbFree)
2500 Tape & Reel
NLVLCX125DTR2G TSSOP14*
(PbFree)
2500 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified.
MC74LCX125
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5
WAVEFORM 1 PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC
0 V
VOH
VOL
Dn
On
tPHL
tPLH
WAVEFORM 2 OUTPUT ENABLE AND DISABLE TIMES
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC
0 V
0 V
OEn
On
tPZH
3.0 V
tPHZ
tPZL tPLZ
On
VmiVmi
Vmo Vmo
Figure 3. AC Waveforms
VCC
VOH 0.3 V
VOL + 0.3 V
GND
Symbol
VCC
3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V
Vmi 1.5 V 1.5 V VCC/2
Vmo 1.5 V 1.5 V VCC/2
VmiVmi
Vmo
Vmo
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
CL= 50 pF at VCC = 3.3 ±0.3 V or equivalent (includes jig and probe capacitance)
CL= 30 pF at VCC = 2.5 ±0.2 V or equivalent (includes jig and probe capacitance)
RL= R1 = 500 W or equivalent
RT= ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
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PACKAGE DIMENSIONS
SOIC14 NB
CASE 751A03
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14 8
71
M
0.25 B M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D8.55 8.75 0.337 0.344
E3.80 4.00 0.150 0.157
A1.35 1.75 0.054 0.068
b0.35 0.49 0.014 0.019
L0.40 1.25 0.016 0.049
e1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M0 7 0 7
H5.80 6.20 0.228 0.244
h0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
PACKAGE DIMENSIONS
TSSOP14
CASE 948G01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
LU
SEATING
PLANE
0.10 (0.004)
T
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION NN
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
W
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
V
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
MC74LCX125/D
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