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Product Brief: AMD Embedded G-Series APU Platform
Features and Benefits
A flexible platform that in one package oers many choices
for power eciency, visual experience with high resolution,
and fully connected Internet experience with maximum multi-
media capability. Delivering unprecedented high definition
visual experience while still maintaining a low power design.
• DirectX® 11 support lets you enjoy awesome
graphics performance, stunning 3D visual eects
and dynamic interactivity.
• Advanced discrete-level GPU with OpenGL 4.0 and
OpenCL™ 1.1 support in an integrated device provides
support to build the designs of tomorrow, today
• Unprecedented graphics performance/per watt thru
advanced graphics and hardware acceleration delivering
over 3X performance per watt of previous generation2.
• Selective models, T56N and T40N, have additional boost
capability enabled by AMD Turbo CORE technology
without additional power draw.
• Enabling Innovative Small Form Factor Designs -
Smaller foot print and low power solution reduces
overall system costs.
• The integration of the APU reduces the foot print of a
traditional three-chip platform to two chips, the APU
and its companion controller hub. This simplifies the
design, requiring fewer board layers and a smaller power
supply, thereby driving down system costs.
• Reduced Costs over the Product Life Cycle - A single,
scalable platform design that allows OEMs to reduce
development costs, optimize solutions and increase
product stability.
• A single APU architecture with an array of performance
options, the AMD Embedded G-Series platform lets
OEMs utilize a single board design to enable solutions
that span from entry level to high end. The commonality
of the scalable platform design across multiple product
variants can help reduce development costs, simplify the
supply chain and reduce operational complexity.
• AMD’s embedded lifecycle, with planned availability
of at least 5 years, helps to ensure a long life for an
OEM design.
Key Architecture Benefits
APU Features
• High speed device interconnect
• High performance integrated x86 core(s)
• Integrated cutting edge graphics processor
• High-bandwidth, low-latency integrated
memory controller
• Low-latency platform interface
x86 Core Architecture
• Single or dual x86 Processor
• Advanced Branch Prediction
• Out-of-Order Instruction Execution
- Full OOO Instruction Execution
- Full OOO Load/Store Engine
• High Performance Floating Point
• AMD64 64-bit ISA
• SSE1,2,3, SSSE3 ISA, SSE4A, MMX™
• Secure Advanced Virtualization
GPU Core Architecture
• Dedicated graphics memory controller
- High eciency ring bus memory controller
- Direct connection to memory
• 2D Acceleration
- Highly-optimized 128-bit engine, capable of processing
multiple pixels per clock
• 3D Acceleration
- Full DirectX® 11 support, including full speed 32-bit
floating point per component operations
- Shader Model 5
- OpenCL™ 1.1 support
- OpenGL 4.0 support
• Motion Video Acceleration
- Dedicated hardware (UVD 3) for H.264, VC-1
and MPEG2 decode
- HD HQV and SD HQV support: noise removal, detail
enhancement, color enhancement, cadence detection,
sharpness, and advanced de-interlacing
- Super up-conversion for SD to HD resolutions