e.MMC 4.41 I/F
Preliminary Data Sheet
80-36-03433
February 2010
SanDisk Corporation
Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035
Phone (408) 801-1000 • Fax (408) 801-8657
www.sandisk.com
80-36-03433 SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
REVISION HISTORY
Doc. No Revision Date Description Reference
80-36-03433 1.0 25-Feb-10 Preliminary
SanDisk® Corpo ration general policy does not recommend the use of its products in life support applications where in a failure
or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk
products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Disclaimer
of Liability.”
This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no
responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the
furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in
a retrievable manner or translated into any language or computer language, in any form or by any means, electronic,
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Corporation.
All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.
SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation. Product names mentioned herein are for
identification purposes only and may be trademarks and/or registered trademarks of their respective companies.
© 2009 SanDisk Corporation. All rights reserved.
SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465;
5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents
awarded and pending.
80-36-03433. August 2009 Printed in U.S.A
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Table of Contents
SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
© 2010 SanDisk Corporation 80-36-03433
TABLE OF CONTENTS
1. Introduction...........................................................................................................................5
1.1. General Description........................................................................................................5
1.2. Plug-and-Play Integration...............................................................................................5
1.3. Feature Overview...........................................................................................................6
1.4. Functional Description....................................................................................................7
1.5. Technology Independence.............................................................................................7
1.6. Defect and Error Management.......................................................................................7
1.7. MMC bus and Power Lines............................................................................................8
1.7.1. Bus operating conditions .................................................................................................8
2. e.MMC4.41 Features Overview.............................................................................................9
2.1. Boot................................................................................................................................9
2.2. Automatic Sleep Mode...................................................................................................9
2.3. Sleep (CMD5).................................................................................................................9
2.4. Reliable Write.................................................................................................................9
2.5. Secure Erase .................................................................................................................9
2.6. Secure Trim..................................................................................................................10
2.7. Trim..............................................................................................................................10
2.8. Partition management..................................................................................................10
2.9. Enhanced Write Protection...........................................................................................11
2.10. High Priority Interrupt (HPI)..........................................................................................11
2.11. Background Operations................................................................................................11
2.12. H/W Reset....................................................................................................................11
2.13. DDR I/F ........................................................................................................................11
3. Product Specifications.......................................................................................................12
3.1. Typical Power Requirements .......................................................................................12
3.2. Operating Conditions....................................................................................................12
3.2.1. Operating and Storage Temperature Specifications.....................................................12
3.2.2. Moisture Sensitivity........................................................................................................12
3.3. System Performance....................................................................................................12
3.4. Physical Specifications.................................................................................................14
4. Interface Description ..........................................................................................................17
4.1. MMC I/F Ball Array.......................................................................................................17
4.2. Pins and Signal Description .........................................................................................19
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SanDisk iNAND e.MMC 4.41 I/F - Data Sheet
© 2010 SanDisk Corporation 80-36-03433
4.3. iNAND Registers..........................................................................................................20
4.3.1. OCR Register.................................................................................................................20
4.3.2. CID Register..................................................................................................................20
4.3.3. DSR Register.................................................................................................................20
4.3.4. CSD Register.................................................................................................................21
4.3.5. EXT_CSD Register........................................................................................................22
5. Power Delivery and Capacitor Specifications..................................................................25
5.1. SanDisk iNAND Power Domains..................................................................................25
5.2. Capacitor Connection Guidelines.................................................................................25
5.2.1. VDDi Connections .........................................................................................................25
5.2.2. VCC and VCCQ Connections........................................................................................25
6. Marking ................................................................................................................................27
7. Ordering Information..........................................................................................................28
How to Contact Us....................................................................................................................29
80-36-03433 Introduction
SanDisk iNAND e.MMC 4.41 I/F - data Sheet
1. INTRODUCTION
1.1. General Description
iNAND is an Embedded Flash Drive (EFD) designed for mobile handsets and consumer electronic
devices. iNAND is a hybrid device combining an embedded thin flash controller and standard MLC
NAND flash memory, with an industry standard e.MMC 4.411 interface.
Empowered with a new e.MMC4.41 feature set such as Boot and RPMB partitions, HPI,
Background Operations and HW Reset the iNAND e.MMC is the optimal device for reliable code
and data storage.
Designed specifically for mobile multimedia applications, iNAND is the most mature on board
SD/MMC device since 2005, providing mass storage of up to 32GB in JEDEC compatible form
factors, with low power consumption and high performance - an ideal solution for multimedia
handsets of 2.5G, 3G, 3.5G and 4G.
In addition to the high reliability and high system performance offered by the current iNAND
family of products, iNAND offers plug-and-play integration and support for multiple NAND
technology transitions, as well as features such as advanced power management scheme.
iNAND uses advanced Multi-Level Cell (MLC) NAND flash technology, enhanced by SanDisk’s
embedded flash management software running as firmware on the flash controller.
iNAND architecture and embedded firmware fully emulates a hard disk to the host processor,
enabling read/write operations that are identical to a standard, sector-based hard drive. In addition,
SanDisk firmware employs patented methods, such as virtual mapping, dynamic and static wear-
leveling, and automatic block management to ensure high data reliability and maximize flash life
expectancy.
SanDisk iNAND provides up to 32GB of memory for use in mass storage applications. In addition
to the mass-storage-specific flash memory chip, iNAND includes an intelligent controller, which
manages interface protocols, data storage and retrieval, error correction code (ECC) algorithms,
defect handling and diagnostics, power management and clock control.
Figure 1 shows a block diagram of the SanDisk iNAND with MMC Interface.
iNAND enables multimedia driven applications such as music, photo, video, TV, GPS, games,
email, office and other applications.
The breakthrough in performance and design makes iNAND the ideal solution for mobile handset
vendors, portable navigation and Automotive Infotainment vendors who require easy integration,
fast time to market and high-capacity.
1.2. Plug-and-Play Integration
iNAND optimized architecture eliminates the need for complicated software integration and testing
processes and enables a practically plug-and-play integration in the system. The replacement of one
iNAND device with another of a newer generation requires virtually no changes to the host. This
makes iNAND the perfect solution for platforms and reference designs, as it allows for the
1 Compatible to JESD84-A441
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Introduction
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
utilization of more advanced NAND Flash technology with minimal integration or qualification
efforts.
SanDisk iNAND is well-suited to meet the needs of small, low power, electronic devices. With
JEDEC form factors measuring 12mm x 16mm (169 balls), 14x18mm (169 balls) and 11.5x13mm
(169 balls) compatible with 0.5mm ball pitch, iNAND is fit for a wide variety of portable devices
such as multi-media mobile handsets, personal media players, GPS devices and Automotive
infotainment (car multimedia and car navigation).
To support this wide range of applications, iNAND is offered with an MMC/SD Interface.
The MMC interface allows for easy integration into any design, regardless of the host (chipset) type
used. All device and interface configuration data (such as ma ximum frequency and device
identification) are stored on the device.
Data In/Out
MMC Bus
Interface Single Chip
controller
Control
Flash
Memory
SanDisk iNAND
Figure 1 - SanDisk iNAND with MMC I/F Block Diagram
1.3. Feature Overview
SanDisk iNAND, with MMC interface, features include the following:
Memory controller and NAND flash
Complies with e.MMC Specification Ver. 4.412
Mechanical design complies with JEDED MO-276C Specification
Offered in three TFBGA packages of e.MMC 4.413
o 11.5mm x 13mm x 1.2mm (2GB)
o 12mm x 16mm x 1.2mm (4GB, 8GB, 16GB)
o 12mm x 18mm x 1.4mm (32GB)
Operating temperature range: –25C° to +85C°
Dual power system
Core voltage (VCC) 2.7-3.6v
2 Refer to JEDEC Standards No. JESD84-A441
3 Refer to JEDEC Standards No. JESD84-C441
© 2010 SanDisk Corporation 80-36-03433
80-36-03433
Introduction
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
I/O (VCCQ) voltage, either: 1.7-1.95v or 2.7-3.6v
: 1bit (default), 4bit, 8bit.
ult), 0-52 MHz (high-speed)
high performance and reliable
1.4. Functional Description elligent subsystem as shown in Figure 1. This intelligent
details of erasing and programming flash memory
ding a powerful ECC
To write or read a sector (or multiple sectors), the
host software involvement in the details of flash operations such as erase, program or
1.6. Defect and Error Management ct and error management system. If necessary,
Up to 32 GB of data storage.
Supports three data bus widths
Variable clock frequencies of 0-20 MHz, 0-26 MHz (defa
Up to 52 MB/sec bus transfer rate (using 8 parallel data lines at 52 MHz)
Correction of memory field errors
Designed for portable and stationary applications that require
data storage
SanDisk iNAND contains a high-level, int
(microprocessor) subsystem provides many capabilities not found in other types of storage devices.
These capabilities include:
Host independence from
Sophisticated system for managing defects
Sophisticated system for error recovery inclu
Power management for low power operation
1.5. Technology Independence
SanDisk iNAND uses 512 bytes as sector size.
host software simply issues a read or write command to the card. The command contains the
address and number of sectors to write or read. The host software then waits for the command to
complete.
There is no
read. This is extremely important since flash devices are becoming increasingly complex with
current advanced NAND MLC processes. Because iNAND uses an intelligent on-board controller,
host system software will not need to be updated as new flash memory evolves. In other words,
systems that support iNAND technology today will be able to access future SanDisk devices built
with new flash technology without having to update or change the host software.
The SanDisk iNAND contains a sophisticated defe
iNAND will rewrite data from a defective sector to a good sector. This is completely transparent to
the host and does not consume any user data space. In the extremely rare case that a read error does
occur, iNAND has innovative algorithms to recover the data. These defect and error management
systems, coupled with the solid state construction, give SanDisk iNAND unparalleled reliability.
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Introduction
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
1.7. MMC bus and Power Line s
SanDisk iNAND with MMC interface supports the MMC protocol. For more details regarding
these buses refer to JEDEC standards No. JESD84-A441.
The iNAND bus has the following communication and power lines:
CMD: Command is a bidirectional signal. The host and iNAND operate in two modes, open
drain and push-pull.
DAT0-7: Data lines are bidirectional signals. Host and iNAND operate in push-pull mode.
CLK: Clock input.
RST_n: Hardware Reset Input
VCCQ: VCCQ is the power supply line for host interface.
VCC: VCC is the power supply line for internal flash memory.
VDDi: VDDi is iNAND’s internal power node, not the power supply. Connect 0.1uF capacitor
from VDDi to ground.
VSS, VSSQ: ground lines.
1.7.1. Bus operating conditions
Table 1 - Bus operating conditions
Parameter Symbol Min Max Unit
Peak voltage on all lines -0.5 VCCQ+0.5 V
Input Leakage Current (before
initializing and/or connecting the
internal pull-up resistors)
-100 100 µA
Input Leakage Current (after changing
the bus width and disconnecti ng the
internal pull-up resistors)
-2 2 µA
Output Leakage Current (before
initializing and/or connecting the
internal pull-up resistors)
-100 100 µA
Output Leakage Current (after
changing the bus width and
disconnecting the internal pull-up
resistors)
-2 2 µA
Table 2 – Power supply voltage
Parameter Symbol Min Max Unit
VCCQ (Low) 1.7 1.95 V
VCCQ ( High) 2.7 3.6 V
VCC 2.7 3.6 V
Supply Voltage
VSS-VSSQ -0.5 0.5 V
© 2010 SanDisk Corporation 80-36-03433
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e.MMC4.41 Features Overview
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
2. E.MMC4.41 FEATURES OVERVIEW
2.1. Boot
iNAND supports e.MMC 4.41 boot operation mode, both mandatory as well as alternate mode are
supported4.
2.2. Automatic Sleep Mode
A unique feature of iNAND is automatic entrance and exit from sleep mode. Upon completion of
an operation, iNAND enters sleep mode to conserve power if no further commands are received.
Typically the entrance to sleep mode occurs immediately5. The host does not have to take any
action for this to occur, however, in order to achieve the lowest sleep current, the host needs to shut
down its clock to the memory device. In most systems, embedded devices are in sleep mode except
when accessed by the host, thus conserving power. When the host is ready to access a memory
device in sleep mode, any command issued to it will cause it to exit sleep and respond.
2.3. Sleep (CMD5)
A card may be switched between a Sleep and a Standby state using the SLEEP/AWAKE (CMD5).
In the Sleep state the power consumption of the memory device is minimized and the memory
device reacts only to the commands RESET (CMD0) and SLEEP/AWAKE (CMD5). All the other
commands are ignored by the memory device.
The Vcc power supply may be switched off in Sleep state is to enable even further system power
consumption saving.
For additional information please refer JESD84-A441 section number 7.6.15
2.4. Reliable Write
iNAND supports 512B reliable write as defined in e.MMC 4.41 spec6.
Reliable write is a special write mode in which the old data pointed to by a logical address must
remain unchanged until the new data written to same logical address has been successfully
programmed. This is to ensure that the target address updated by the reliable write transaction never
contains undefined data. When writing in reliable write, data will remain valid even if a sudden
power loss occurs during programming.
2.5. Secure Erase
In addition to the standard erase command the iNAND supports the optional Secure Erase
command7.
The Secure Erase command differs from the basic Erase command in that it requires the iNAND to
4 For additional information refer to JEDEC Standards No. JESD84-A441
5 In rare cases entering sleep mode m ay take 1 Sec due to housekeeping operation.
6 For additional information refer to JEDEC Standards No. JESD84-A441
7 For additional information refer to JEDEC Standards No. JESD84-A441
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e.MMC4.41 Features Overview
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
execute the erase operation on the memory array when the command is issued and requires the
iNAND and host to wait until the operation is complete before moving to the next iNAND
operation.
The secure erase command requires the iNAND to perform a secure purge operation on the erase
groups, and copy items identified for erase, in those erase groups .
A purge operation is defined as overwriting addressable locations with a single character and then
performing an erase.
This new command meets high security application requirements (e,g, those used by military and
government customers) that once data has been erased, it can no longer be retrieved from the
device.
2.6. Secure Trim
The Secure Trim8 command is similar to the Secure Erase command but performs a secure purge
operation on write blocks instead of erase groups. The size of a write block in the iNAND device is
512B
2.7. Trim
The Trim function is similar to the Erase command but applies the erase operation to write blocks
instead of erase groups. The size of a write block in the INAND device is 512B
For additional information on the Trim function, refer to JEDEC standards No. JESD84-A441
2.8. Partition management
The iNAND offers the possibility for the host to configure additional split local memory partitions
with independent addressable space starting from logical address 0x00000000 for different usage
models. Therefore memory block area scan be classified as follows9:
Factory configuration supplies two boot partitions, each 1MB in size, implemented as
enhanced storage media and one RPMB partitioning of 2MB in size
The host is free to configure one segment in the User Data Area to be implemented as
enhanced storage media, and to specify its starting location and size in terms of Write
Protect Groups. The attributes of this Enhanced User Data Area can be programmed only
once during the device life-cycle (one-time programmable).
Up to four General Purpose Area Partitions can be configured to store user data or sensitive
data, or for other host usage models. The size of these partitions is a multiple of the write
protect group. Size and attributes can be programmed once in device life-cycle (one-time
programmable). Each of the General Purpose Area Partitions can be implemented with
enhanced technological features.
8 For additional information refer to JEDEC Standards No. JESD84-A441
9 For additional information refer to JEDEC Standards No. JESD84-A441
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SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
2.9. Enhanced Write Protection
To allow the host to protect data against erase or write, the iNAND supports two levels of write
protect command10:
The entire iNAND (including the Boot Area Partitions, General Purpose Area Partition, and
User/Enhanced User Data Area Partition) may be write-protected by setting the permanent
or temporary write protect bits in the CSD.
Specific segments of the iNAND may be permanently, power-on or temporarily write
protected. Segment size can be programmed via the EXT_CSD register.
For additional information please refer JESD84-A441 standard.
2.10. High Priority Interrupt (HPI)
Many operating-systems use demand-paging to launch a process requested by the user. If the host
needs to fetch pages while in a middle of a wrie operation, the request will be delayed until the
completion of the write command which, in the worst case scenario, can take up to 350ms.
The high priority interrupt (HPI) as defined in JESD84-A441 enables low read latency operation
by suspending a lower priority operation before it is actually completed. This mechanism can
reduce read latency, in typical condition, to 5msec.
For additional information on the HPI function, refer to JESD84-A441 standard section 7.6.20
2.11. Background Operations
Devices have various maintenance operations that they need to perform internally, such as garbage
collection, erase and compaction. In order to reduce latencies during time critical operations, it is
better to execute maintenance operations when the device is not serving the host.
Operations are then separated into two types: foreground operations – such as read or write
commands, and background operations – operations that the device can execute when the host is
not being served.
For additional information on Background Operations, refer to JESD84-A441 standard section
7.6.19
2.12. H/W Reset
Hardware reset may be used by host to reset the device, moving the card to a Pre-idle state and
disabling the power-on period write protect on blocks that was set as pow er-on write protect before
the reset was asserted. For more information, refer to JESD84-A441 standard.
2.13. DDR I/F
Support DDR signaling to double bus performance. For additional information please refer to
JESD84-A441 standard.
10 For additional information refer to JEDEC Standards No. JESD84-A441
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Product Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
3. PRODUCT SPECIFICATIONS
3.1. Typical Power Requirements
Table 3 - iNAND Power Re quirements (Ta=25°C@3.3V)
Max Value Measurement
Auto Sleep mode 350 uA
Sleep (CMD5) 200 (Max)
110 (Typical) uA
Default Speed 100 mA
Read High-Speed 200 mA
Default Speed 100 mA
Write High-Speed 200 mA
VCC (ripple: max, 60mV peak-to-peak) 2.7 V – 3.6 V
Note 1: Current measurements are average over 100 mSecs.
Note 2: Sleep is measured at room temperature
Note 3: In CMD5 Flash Vcc power supply is switched off
3.2. Operating Conditions
3.2.1. Operating and Storage Temperature Specifications
Table 4 - Operating and Storage Temperatures
Operating -25° C to 85° C Temperature
Non-Operating: After soldered onto PC Board -40° C to 85° C
3.2.2. Moisture Sensitivity
The moisture sensitivity level for iNAND is MSL = 3.
3.3. System Performance
All performance values for iNAND in Table 5 were measured under the following conditions:
Voltage range:
Core voltage (VCC): 2.7-3.6v
Host voltage (VCCQ), either: 1.7-1.95v or 2.7-3.6v
Operating temperature -25° C to 85° C
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SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
Table 5 - System Performance
Timing Value
Sustained Re ad 15 MB/s
Sustained Write 9 MB/s
Block Read Access Time (MAX) 100 ms
Block Write Access Time (MAX) 250 ms
CMD1 to Ready after Power-up (MAX) 1000 ms
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Product Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
3.4. Physical Specifications
The SanDisk iNAND is a 169-pin, thin fine-pitched ball grid array (BGA). See Figure 2, Figure 3 and
Table 6 for physical specifications and dimensions.
Figure 2- INAND Specification Top and Side View (Detail A)
© 2010 SanDisk Corporation 80-36-03433
Figure 3- Package Outline Drawing – bottom view
Ball
Test Pad (for SanDisk internal use only)
Legend
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Product Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
Table 6 - iNAND Package Specification
Dimension in millimeters Dimension in inches
Package
Size Symbol Minimum Nominal Maximum Minimum Nominal Maximum
All A --- --- 1.201--- --- 0.047
All A1 0.17 0.22 0.27 0.007 0.009 0.011
12X18mm A2 0.98 1.03 1.08 0.038 0.040 0.042
12X16mm
11.5X13mm
A2 0.785 0.835 0.885 0.031 0.033 0.035
12X18mm C 0.10 0.13 0.16 0.004 0.005 0.006
12X16mm
11.5X13mm
C 0.17 0.21 0.25 0.007 0.008 0.010
12X18mm
12X16mm
D(A) 11.93 12.00 12.07 0.470 0.472 0.476
11.5X13mm D(B) 11.43 11.5 11.57 0.450 0.453 0.456
12X16mm E(A) 15.93 16.00 16.07 0.627 0.630 0.633
12X18mm E(B) 17.90 18.00 18.10 0.706 0.709 0.713
11.5X13mm E(C) 12.93 13.00 13.07 0.509 0.512 0.515
12X18mm
12X16mm
D1 --- 1.50 --- --- 0.059 ---
12X18mm
12X16mm
D2 --- 3.50 --- --- 0.138 ---
12X18mm
12X16mm
D3 --- 5.50 --- --- 0.217 ---
All D4 --- 6.50 --- --- 0.256 ---
All E1 --- 6.50 --- --- 0.256 ---
12X18mm
12X16mm
E2 --- 10.50 --- --- 0.413 ---
12X18mm
12X16mm
E3 --- 12.50 --- --- 0.492 ---
12X18mm
12X16mm
E4 --- 13.50 --- --- 0.531 ---
All E --- .50 --- --- 0.020 ---
1 For SDIN5B2-32G maximum device height (A) is 1.40 mm
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Product Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
All B 0.25 0.30 0.35 0.010 0.012 0.014
All Aaa 0.10 0.004
All Bbb 0.10 0.004
All Ddd 0.08 0.003
All Eee 0.15 0.006
All Fff 0.05 0.002
All MD/ME 14/14 14/14
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Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
4. INTERFACE DESCRIPTION
4.1. MMC I/F Ball Array
Figure 4 illustrates the SanDisk iNAND MMC interface 169 balls array.
Figure 7 illustrates the SanDisk iNAND MMC interface 153 balls array.
Figure 4 - 169 balls - Ball Array (T op View)
© 2010 SanDisk Corporation 80-36-03433
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Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC
NC Vddi NC VssQ NC VccQ NC NC NC NC NC NC NC
NC NC NC NC NC NC NC
NC NC NC NC VCC VSS NC NC NC NC NC NC
NC NC NC VCC NC NC NC NC
NC NC NC VSS NC NC NC NC
NC NC NC NC VSS NC NC NC
NC NC NC NC VCC NC NC NC
NC NC NC RESET NC NC NC NC
NC NC NC NC NC NC
NC NC NC VccQ CMD CLK NC NC NC NC NC NC NC NC
NC VssQ NC VccQ VssQ NC NC NC NC NC NC NC NC NC
NC NC VccQ VssQ VccQ VssQ NC NC NC NC NC NC NC NC
NC NC DAT0 DAT1 DAT2 NC NC NC NC NC NC NC NC NC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
91012 345678 1112
13 14
NC
NC NC VSS VCC
Index
Figure 7- 153 balls - Ball Array (T op View)
© 2010 SanDisk Corporation 80-36-03433
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SanDisk iNAND e.MMC 4.41 I/F - data Sheet
4.2. Pins and Signal Description
Table 7 contains the SanDisk iNAND, with MMC interface (169 balls), functional pin assignment.
Table 7 – Functional Pin Assignm ent, 169 balls
Ball No. Ball Signal Type Description
H3 DAT0
H4 DAT1
H5 DAT2
J2 DAT3
J3 DAT4
J4 DAT5
J5 DAT6
J6 DAT7
I/O Data I/O: Bidirectional channel used for data transfer
W5 CMD I/O Command: A bidirectional channel used for device initialization and
command transfers.
W6 CLK Clock: Each cycle directs a 1-bit transfer on the command and DAT
lines
U5 RST_n
Input
Hardware Reset
M6 VCC
N5 VCC
T10 VCC
U9 VCC
Supply Flash I/O and memory power supply
K6 VCCQ
W4 VCCQ
Y4 VCCQ
AA3 VCCQ
AA5 VCCQ
Supply Memory controller core and MMC I/F I/O power supply
M7 VSS
P5 VSS
R10 VSS
U8 VSS
Supply Flash I/O and memory ground connection
K4 VSSQ
Y2 VSSQ
Y5 VSSQ
AA4 VSSQ
AA6 VSSQ
Memory controller core and MMC I/F ground connection
K2 VDDi Internal power node. Connect 0.1uF capacitor from VDDi to ground
Note: All other pins are not connected [NC] and can be connected to GND or left floating.
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Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
4.3. iNAND Registers
4.3.1. OCR Register
Value for 4GB-32GB: 0xC0FF8080
Value for 2GB: 0x40FF8080
Note: Bit 30 is set because the device is High Capacity; bit 31 will be set only when the device is
ready
Parameter OCR slice Description Value Width
Access Mode [30:29] Access mode <=2GB 00b
>2GB 10b 2
[23:15] VDD: 2.7 - 3.6 range 111111111b 9
[14:8] VDD: 2.0 - 2.6 range 0000000b 7
[7] VDD: 1.7 - 1.95 range 1b 1
4.3.2. CID Register
Parameter CID slice Description Value Width
MID [127:120] Manufacturer ID 02h 8
CBX [113:112] Card BGA 01h 2
OID [111:104] OEM/Application ID 0000h 8
PNM [103:56] Product name 2GB: 53454d303247h ("SEM02G")
4GB: 53454d303447h ("SEM04G")
8GB: 53454d303847h ("SEM08G")
16GB: 53454d313647h ("SE M16G")
32GB: 53454d333247h ("SE M32G")
48
PRV [55:48] Product revision 90h 8
PSN [47:16] Product serial number Random by Production 32
MDT [15:8] Manufacturing date month, year 8
CRC [7:1] CRC7 checksum 0000000b 7
4.3.3. DSR Register
Parameter DSR slice Description Value Width
RSRVD [15:8] Reserved 04h 8
RSRVD [7:0] Reserved 04h 8
DSR is not implemented; in case of read, value of 0x0404 will be returned.
© 2010 SanDisk Corporation 80-36-03433
80-36-03433
Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
4.3.4. CSD Register
Parameter CSD Slice Description Value Width
CSD_STRUCTURE [127:126] CSD structure 11b 3
SPEC_VERS [125:122] System specification version 0100b 4
TAAC [119:112] Data read access-time 1 0Fh 8
NSAC [111:104] Data read access-time 2 in CLK
cycles (NSAC*100) 00h 8
TRAN_SPEED [103:96] Max. bus clock frequency 32h 8
CCC [95:84] Card command classes 0F5h 12
READ_BL_LEN [83:80] Max. read data block length 9h – Not 2GB
Ah – for 2GB 4
READ_BL_PARTIAL [79:79] Partial blocks for read allowed 0b 1
WRITE_BLK_MISALIGN [78:78] Write block misalignment 0b 0
READ_BLK_MISALIGN [77:77] Read block misalignment 0b 0
DSR_IMP [76:76] DSR implemented 0b 0
*C_SIZE [73:62] Device size 2GB-E97h
>2GB FFFh 12
VDD_R_CURR_MIN [61:59] Max. read current @ VDD min 111b 3
VDD_R_CURR_MAX [58:56] Max. read current @ VDD max 111b 3
VDD_W_CURR_MIN [55:53] Max. write current @ VDD min 111 b 3
VDD_W_CURR_MAX [52:50] Max. write current @ VDD max 111b 3
C_SIZE_MULT [49:47] Device size multiplier 111b 3
ERASE_GRP_SIZE [46:42] Erase group size 11111b 5
ERASE_GRP_MULT [41:37] Erase group size multiplier 2GB 00111b
4GB 01111b
>=8GB 11111b
5
WP_GRP_SIZE [36:32] Write protect group size 11111b 5
WP_GRP_ENABLE [31:31] Write protect group enable 1b 1
DEFAULT_ECC [30:29] Manufacturer default 00b 2
R2W_FACTOR [28:26] Write speed factor 100b 3
WRITE_BL_LEN [25:22] Max. write data block length 9h 4
WRITE_BL_PARTIAL [21:21] Partial blocks for write allowed 0b 1
CONTENT_PROT_APP [16:16] Content protection application 0b 1
FILE_FORMAT_GRP [15:15] File format group 0b 1
COPY [14:14] Copy flag (OTP) 1b 1
PERM_WRITE_PROTECT [13:13] Permanent write protection 0b 1
TMP_WRITE_PROTECT [12:12] Temporary wr ite protection 0b 1
FILE_FORMAT [11:10] File format 00b 2
ECC [9:8] ECC code 00b 2
CRC [7:1] Calculated CRC 0000000b 7
© 2010 SanDisk Corporation 80-36-03433
80-36-03433
Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
4.3.5. EXT_CSD Register
Parameter ECSD slice
[bytes] Description Value
S_CMD_SET [504] Supported Command Sets 1h
HPI_FEATURES [503] HPI Features 1h
BKOPS_SUPPORT [502] Background operatio ns support 1h
BKOPS_STATUS [246] Background operations status Default = 0h
Updated in Run time
CORRECTLY_PRG_SECTORS_
NUM [245:242] Number of correctly programmed
sectors Default = 0h
Updated in Run time
INI_TIMEOUT_AP [241] 1st Initialization time after partitioning Ah
TRIM _MULT [232] TRIM Multiplier 1h
SEC_FEATURE_SUPPORT [231] Secure Feature support 15h
SEC_ERASE_MULT [230] Secure Erase Multiplier 96h
SEC_TRIM_MULT [229] Secure TRIM Multiplier 96h
BOOT_INFO [228] Boot Information 7h
BOOT_SIZE_MULTI [226] Boot partition size 8h
ACCESS_SIZE [225] Access size 6h
HC_ERASE_GROUP_SIZE [224] High Capacity Erase unit size Table 9
ERASE_TIMEOUT_MULT [223] High capacity erase time out 1h
REL_WR_SEC_C [222] Reliable write sector count 1h
HC_WP_GRP_SIZE [221] High capacity write protect group size Table 9
S_C_VCC [220] Sleep current [VCC] 8h
S_C_VCCQ [219] Sleep current [VCCQ] 7h
S_A_TIMEOUT [217] Sleep/Awake time out 11h
SEC_COUNT [215:212] Sector count Table 8
MIN_PERF_W_8_52 [210] Minimum Wr ite Performance for 8bit
@52MHz ah
MIN_PERF_R_8_52 [209] Minimum Read Performance for 8bit
@52MHz ah
MIN_PERF_W_8_26_4_52 [208] Minimum Write Performance for 4bit
@52MHz or 8bit @26MHz ah
MIN_PERF_R_8_26_4_52 [207] Minimum R ead Performance for 4bit
@52MHz or 8bit @26MHz ah
MIN_PERF_W_4_26 [206] Minimum Wr ite Performance for 4bit
@26MHz ah
MIN_PERF_R_4_26 [205] Minimum Read Performance for 4bit
@26MHz ah
PWR_CL_26_360 [203] Power Class for 26MHz @ 3.6V 0h
PWR_CL_52_360 [202] Power Class for 52MHz @ 3.6V 0h
80-36-03433
Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
Parameter ECSD slice
[bytes] Description Value
PWR_CL_26_195 [201] Power Class for 26MHz @ 1.95V 0h
PWR_CL_52_195 [200] Power Class for 52MHz @ 1.95V 0h
PARTITION_SWITCH_T I ME [199] Partition switching timing 1h
OUT_OF_INTERRUPT_TIME [198] Out-of-interrupt busy timing 1h
CARD_TYPE [196] Card Type 7h
CSD_STRUCTURE [194] CSD Structure Version 2h
EXT_CSD_REV [192] Extended CSD Revision 5h
CMD_SET [191] Command Set 0h
CMD_SET_REV [189] Command Set Revision 0h
POWER_CLASS [187] Power Class 0h
HS_TIMING [185] High Speed Interface Timing 0h
BUS_WIDTH [183] Bus W idth Mode 0h
ERASE_MEM_CONT [181] Content of explicit erased memory range 0h
PARTITION_CONFIG [179] Partition Configuration 0h
BOOT_CONFIG_PROT [178] Boot config protection 0h
BOOT_BUS_WIDTH [177] Boot bus width1 0h
ERASE_GROUP_DEF [175] High-density erase group definition 0h
BOOT_WP [173] Boot area write protect register 0h
USER_WP [171] User area write protect register 0h
FW_CONFIG [169] FW Configuration 0h
RPMB_SIZE_MULT [168] RPMB Size 1h
WR_REL_SET [167] Write reliability setting register 0h
WR_REL_PARAM [166] Write reliability parameter register 0h
BKOPS_START [164] Manually start background operations 0h
BKOPS_EN [163] Enable background operations
handshake 0h
RST_n_FUNCTION [162] H/W reset function 0h
HPI_MGMT [161] HPI management 0h
PARTITIONING SUPPORT [160] Partitioning support 3h
MAX_ENH_SIZE_MULT [159:157] Max Enhanced Area Size 2GB E8h
4GB EBh
8GB ECh
16GB, 32GB EDh
PARTITIONS_ATTRIBUTE [156] Partitions Attribute 0h
GP_SIZE_MULT [154:143] General Purpose Partition Size 0h
ENH_SIZE_MULT [142:140] Enhanced User Data Area Siz e 0h
ENH_START_ADDR [139:136] Enhanced User Data Start Address 0h
80-36-03433
Interface Description
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
Parameter ECSD slice
[bytes] Description Value
SEC_BAD_BLK_MGMNT [134] Bad Block Management mode 0h
The following table shows the capacity available for user data for the various device capacities:
Table 8: Capacity for User Data
Capacity LBA [Hex] LBA [Dec] Capacity [Bytes]
SDIN5D2-2G
0x3A6000 3,825,664 1,958,739,968
SDIN5C2-4G
0x75F000 7,729,152 3,957,325,824
SDIN5C2-8G
© 2010 SanDisk Corporation 80-36-03433
0xECB000 15,511,552 7,941,914,624
SDIN5C2-16G 0x1DA9000 31,100,928
Table 9: Write protect group size
15,923,675,136
SDIN5B2-32G 0x3B6F000 62,320,640 31,908,167,680
SKU HC_ERASE_GROUP
_SIZE HC_WP_GRP_
SIZE Erase Unit Size
[MB] Write Protect Group
Size [MB]
SDIN5D2-2G 4h 2h 2MB 4MB
SDIN5C2-4G 4h 4h 2MB 8MB
SDIN5C2-8G 4h 8h 2MB 16MB
SDIN5C2-16G 4h 10h 2MB 32MB
SDIN5B2-32G 4h 20h 2MB 64MB
80-36-03433
Power Delivery and Capacitor Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
5. POWER DELIVER Y AND CAPACITOR SPECIFICATIONS
5.1. SanDisk iNAND Power Domains
SanDisk iNAND has three power domains assigned to VCCQ, VCC and VDDi, as shown in Table
10.
Table 10 - Power Domain s
Pin Power Domain Comments
Supported voltage ranges:
High Voltage Region: 3.3V (nominal)
VCCQ Host Interface
Low Voltage Region: 1.8V (nominal)
Supported voltage range: VCC Memory
High Voltage Region: 3.3V (nominal)
VDDi Internal VDDi is the internal regulator connection to an
external decoupling capacitor.
5.2. Capacitor Connection Guidelines
5.2.1. VDDi Connections
The VDDi (K2) ball must only be connected to an external capacitor that is connected to VSS.
This signal may not be left floating. The capacitor’s specifications and it s placement instructions
are detailed below.
The capacitor is part of an internal voltage regulator that provides power to the controller.
Caution: Failure to follow the guidelines below, or connecting the VDDi ball to any external signal
or power supply, may cause the device to malfunction.
The trace requirements for the VDDi (K2) ball to the capacitor are as follows:
Resistance: <2 ohm
Inductance: <5 nH
The capacitor requirements are as follows:
Capacitance: >=0.1 uF
Voltage Rating: >=6.3 V
Dielectric: X7R or X5R
5.2.2. VCC and VCCQ Connections
All VCC balls should be connected to a 3.3V supply
All VCCQ balls should be connected either to a 3.3V or 1.8V supply
SanDisk recommends providing separate bypass capacitors for each power domain as shown in
Figure 8
80-36-03433
Power Delivery and Capacitor Specifications
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
Note: Signal routing in the diagram is for illustration purposes only and the final routing depends
on your PCB layout. Also, for clarity, the diagram does not show the VSS connection. All
balls marked VSS should be connected to a ground (GND) plane.
T10
Vcc
U9
Vcc
K6
VccQ
M6
Vcc
AA5
VccQ
W4
VccQ
Y4
VccQ
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ABCDEFGHJKLMNP
AA3
VccQ
N5
Vcc
C_1 C_2C_3 C_4C_5
VSS VSS VSS VSS VSS
C_1=C_3>=2.2uF
C_2=C_4<=100nF
Close to
Ball N5
Close to
Ball AA3
Capacitor C_5:
Capacitance >= 0.1uF
Voltage >= 6.3V
Dielectric: X7R or X5R
Trace Requirements (C_5):
Resistance < 2 ohm
Inductance < 5nH
K2
VDDi
Top View
VccQ
power
supply
Vcc = 3.3V (nom)
RT VWYAAABACADAEAFAGAHU
Figure 8- Recommended Power Dom ain Connections
© 2010 SanDisk Corporation 80-36-03433
80-36-03433
Marking
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
6. MARKING
First row: SanDisk Logo
Second row: iNAND Logo
Third row: Sales item
Fourth row: Y-year
WW-work week
V, XXXXN – Internal use
Fifth row: LLLLLLLLLLLS – SanDisk lot number (in certain cases can reach up to 12 digits)
Country of origin i.e ‘TAIWAN’ or ‘CHINA’
Figure 9: Product marking
© 2010 SanDisk Corporation 80-36-03433
80-36-03433
Ordering Information
SanDisk iNAND e.MMC 4.41 I/F -Data Sheet
© 2010 SanDisk Corporation 80-36-03433
7. ORDERING INFORMATION
Table 11 – Ordering Information
Part Number Capacity11
12 mm x 18 mm x 1.4 mm Package
SDIN5B2-32G 32GB
12 mm x 16 mm x 1.2 mm Package
SDIN5C2-16G 16GB
SDIN5C2-8G 8GB
SDIN5C2-4G 4GB
11.5 mm x 13 mm x 1.2 mm Package
SDIN5D2-2G 2GB
Note: Suffix “T” added to the P/N indicates tape/reel. For example, SDIN5C2-8G would become
SDIN5C2-8G-T. The default P/Ns in Table 14 are shipped in trays.
11 1 megabyte (MB) = 1 million bytes; 1 gigabyte (GB) = 1 billion bytes. Some of the listed capacity is used for formatting and other functions, and
thus is not available for data storage.
80-36-0338196
Ordering Information
SanDisk iNAND eMMC 4.3 I/F - Extended TemperatureReleased Data
Sheet
80-36-03433
HOW TO CONTACT US
USA
SanDisk Corporation, Corpor ate Headquarters.
601 McCarthy Blvd
Milpitas, CA 95035
Phone: +1-408-801-1000
Fax: +1-408-801-8657
Europe
SanDisk IL Ltd.
7 Atir Yeda St.
Kfar Saba 44425, Israel
Phone: +972-9- 764-5000
Fax: +972-3-548-8666
Japan
SanDisk Limited (Japan)
Nisso 15 Bldg. 8F
2-17-19 Shin-Yokohama,
Kohoku-ku
Yokohama, Japan, 222-0033,
Phone: +81-45-474-0181
Fax: +81-45-474-0371
Korea
SanDisk Korea Ltd.
6F Samhwa bldg,
Yangjae-dong 14-8,
Seocho-gu, Seoul 137-130, Korea
Phone:+82-2 -3452-9079
Fax: +82-2-3452-9145
Taiwan
SanDisk Asia Ltd.
37F, Taipei 101 Tower, No 7,
Xinyi Rd, Section 5.
Taipei, Taiwan, 110
Tel: +886-2-8758-2 966
Fax: +886-2-8758-2999
China
SanDisk China Ltd.
Room 121-122
Bldg. 2, International Commerce & Exhibition Ctr.
Hong Hua Rd. Futian Free Trade Zone
Shenzhen, China
Phone: +86-755-8348-5218
Fax: +86-755-8348-5418
Internet
http://www.SanDisk.com/mobile
Sales and Technical Information
techsupport@SanDisk.com