Supplier : Samsung electro-mechanics Samsung P/N: RC6432F***CS
Product : Thick - Film chip RESISTOR Description : 6432, ±1%, (1~1), 1W
RC 6432 F *** CS
①②
Code designation Samsung Thick - Film Chip Resistor
Dimension 643
2
(mm code) L : 6.3 ± 0.2 mm W : ± 0.2 mm
T : ± 0.1 mm
Resistancs tolerance ±1 %
Nominal resistance value 3digits
-
Left 2 digits : Resistance value,Right 1 digits : Exponential number of 10.
ex) 101 : 10×101 = 10×10 = 100Ω
4digits
-
Left 3 digits : Resistance value,Right 1 digits : Exponential number of 10.
ex) 4222 : 422×102 = 422×100 = 42.2㏀
Read alphabet "R" as decimal point "000" : Jumper(0)
ex) 3R7 : 3.7 = 3.7 / 88R7 : 88.7 = 88.7
Packing code 7" Reel packaging
B. Samsung Reliablility Test and Judgement condition
Resistor Jumper Resistor Jumper
Direct Current Within the regulated resistance 50m Max Voltage apply Within 5 sec
Resistance tolerance.
Short-time Less than ±(1%+0.1)of the initial value 50m Max Apply 2.5 times rated voltage for 5sec Max Surge
Overload No evidence of mechanical damage Current
Intermittent Less than ±(3%+0.1)of the initial value 50m Max 2.5 times of rated voltage. Max Surge
Overload No evidence of mechanical damage 1 sec On, 25 sec Off / 10,000cycles Current
Dielectric No evidence of mechanical damage Apply Voltage for 1minute
Withstanding Voltage 0603:50v
Insulation Over 1,000M1005,1608:100v
Resistance Other: 500v
J-Grade Test Temperature() 20℃→-55/20℃→125
Temperature 1Ω≤R<10:+300/-200ppm/T.C.R(ppm/) =
Characteristic 10Ω≤R1M:±100ppm/(0603±250ppm)
1M<R10M:±300ppm/
F-Grade T0 : 20 ± 2, R0 : Resistance at T0 ()
10Ω≤R1M:±100ppm/(0603±250ppm) T : Test temperature , R : Resistance at T ()
Solderability Coverage: 95% each termination. Solder Temp : 245
Dipping time : 3 sec
Judgement Test condition
SPECIFICATION
A. Samsung Part Number
3.2
0.55
RR
RTT
×
×
0
00
6
110
Bending test Less than ±(0.5%+0.05)of the initial value 50m Max 3mm of bending shall be applied
No evidence of mechanical damage for 5sec.
Adhesive strength No mechanical damage or sign of disconnection Test strengh : 5N
of termination Test time: Applying pressure for 10seconds
Resistance to Less than ±(1%+0.05)of the initial value 50m Max 260±5 , 10 sec
soldering heat No evidence of mechanical damage
Anti-Vibration Less than ±(1%+0.05)of the initial value 50m Max Test amplitude : 1.5mm
test No evidence of mechanical damage Frequency 10-55-10 / 2hr in x,y,z direction.
Temperature Less than ±(1%+0.1)of the initial value 50m Max 100cycles, -55/30min 125/30min
cycle No evidence of mechanical damage sweep time:5min
Load life Less than ±(3%+0.1)of the initial value 50m Max Test voltage: rated voltage / 70±2
No evidence of mechanical damage 1,000hours(90min:On , 30min:Off)
Low Temp. Less than ±(3%+0.1)of the initial value 50m Max Dwell in -55 chamber without loading
Exposure No evidence of mechanical damage for 1,000hours
High Temp Less than ±(3%+0.1)of the initial value 50m Max Dwel in 125 or 155 chamber without loading
Exposure No evidence of mechanical damage for 1,000hours
Moisture Less than ±(3%+0.1)of the initial value 50m Max Test voltage: rated voltage / 40±2
Resistance No evidence of mechanical damage 1,000hours(90min:On,30min:Off) / 90~95% RH
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
* For the more detail Specification, Please refer to the samsung chip RESISTOR catalogue.
Judgement Test condition