BZX85C 3V3 - BZX85C 33 Series
BZX85 Series Rev. A1
Device
VZ
(V)
ZZ
(Ω
ΩΩ
Ω)
IZT
(mA)
ZZK
(Ω
ΩΩ
Ω)
IZK
(mA)
VR
(V)
IR
(µ
µµ
µA)
ISURGE
(mA)
IZRM
(mA)
BZX85C 3V3
BZX85C 3V6
BZX85C 3V9
BZX85C 4V3
BZX85C 4V7
3.3
3.6
3.9
4.3
4.7
20
15
15
13
13
80
60
60
50
45
400
500
500
500
600
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.5
60
30
5.0
3.0
3.0
1,380
1,260
1,190
1,070
970
276
252
234
217
193
BZX85C 5V1
BZX85C 5V6
BZX85C 6V2
BZX85C 6V8
BZX85C 7V5
5.1
5.6
6.2
6.8
7.5
10
7.0
4.0
3.5
3.0
45
45
35
35
35
500
400
300
300
200
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
4.0
4.5
1.0
1.0
1.0
1.0
1.0
890
810
730
660
605
178
162
146
133
121
BZX85C 8V2
BZX85C 9V1
BZX85C 10
BZX85C 11
BZX85C 12
8.2
9.1
10
11
12
5.0
5.0
7.0
8.0
9.0
25
25
25
20
20
200
200
200
300
350
0.5
0.5
0.5
0.5
0.5
5.0
6.5
7.0
7.7
8.4
1.0
1.0
0.5
0.5
0.5
550
500
454
414
380
110
100
91
83
76
BZX85C 13
BZX85C 15
BZX85C 16
BZX85C 18
BZX85C 20
13
15
16
18
20
10
15
15
20
24
20
15
15
15
10
400
500
500
500
600
0.5
0.5
0.5
0.5
0.5
9.1
10.5
11
12.5
14
0.5
0.5
0.5
0.5
0.5
344
304
285
250
225
69
61
57
50
45
BZX85C 22
BZX85C 24
BZX85C 27
BZX85C 30
BZX85C 33
22
24
27
30
33
25
25
30
30
35
10
10
8.0
8.0
8.0
600
600
750
1,000
1,200
0.5
0.5
0.25
0.25
0.25
15.5
17
19
21
23
0.5
0.5
0.5
0.5
0.5
205
190
170
150
135
41
38
34
30
27
V
F Foward Voltage = 1.2 V Maximum @ IF = 200 mA for all BZX85 series
BZX85C 3V3 - 33 Series 1.3 Watt Zeners
Absolute Maximum Ratings* TA = 25°C unless otherwise noted Tolerance: C = 5%
Symbol
Parameter
Value
Units
TSTG Storage Temperature Range -65 to +200 °C
TJ Maximum Junction Operating Temperature + 200 °C
Lead Temperature (1/16” from case for 10
seconds)
+ 230 °C
PD Total Device Dissipation
Derate above 25°C
1.3
10.4
W
mW/°C
NOTES:
1) These ratings are based on a maximum junction temperature of 200 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed
or low duty cycle operations.
*These ratings are limiting values above which the serviceability of the diode may be impaired.
Electrical Characteristics TA = 25°C unless otherwise noted
@
@
@
DO-41
COLOR BAND DENOTES CATHODE
2001 Fairchild Semiconductor Corporation
BZX85C 3V3 - BZX85C 33 Series
BZX85 Series Rev. A1
Typical Characteristics
Zener Current vs. Zener Impedence
0.1 0.2 0.5 1 2 5 10 20
1
2
5
10
20
50
100
200
500
1000
2000
5000
I - ZENER CURRENT (mA)
Z - IMPEDANCE (ohms)
T = 25 C
º
A
Z
Z
V = 3.3V
Z
V = 5.1V
Z
V = 12.0V
Z
V = 33.0V
Z
3.3 Zener Voltage vs. Temperature
12 5102030
1
2
3
4
5
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 3.3V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
Zener Current vs. Zener Voltage
12 5102030
5
10
15
20
25
30
35
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = 25 C
º
A
Z
Z
V = 12.0V
Z
V = 3.3V
Z
V = 5.1V
Z
V = 33.0V
Z
5.1 Zener Voltage vs. Temperature
12 5102030
4
4.5
5
5.5
6
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 5.1V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
12 Zener Voltage vs. Zener Temperature
12 5102030
0
5
10
15
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 12.0V
Z
T = 85 C
º
A T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
33 Zener Voltage vs. Zener Temperature
12 5102030
20
25
30
35
40
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 33.0V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
DO-41 (Glass) T ape and Ammo Data
August 2000, Rev. B
DO-41 (Glass) Packaging Information
T50R T50A
TNR
10.5
Ammo
-
3,000 3,000
283x257x203 406x267x184
6,000 30,000
0.320 0.320
1.356 1.077
Bulk
Standard
(no flow code)
Bag
-
250
381x203x127
5,000
0.320
-
Note/Comments
Packaging Option
Packaging type
Reel S ize (inch diameter)
Qty per Reel/Tube/Bag
Int Box Dimension (mm)
Max qty per Box
Weig ht pe r un it (gm)
Weig ht pe r Reel (kg)
Inside Tape Spa cing (mm) 52 52 -
DO-41 (Glass) Packaging
Configuration: Figure 1.0
Kraft Paper Wound
Between Layers
Corrugated Outer Liner
Red/Blue (Cat hode)
White (Anode )
Soabar Label
Soabar Label sample
P.O. No.
TYPE 1N4744A MARK BLK-BRN
REV A2 P ART No.
PKG EC No.
QTY 3,000 M.O. No. OX5046F035
Q.C. DATE D9903
MFD. UNDER US PAT 3.025. 589 & OTHER US PATS & APPLICATIONS
DO
DO-41 (Glass) Bulk Packing
Configuration: Figure 3.0
- 41 (Glass) Packaging
Information
Table : Figure 2.0
T50R
TNR Options
283mm x 257m m x 203mm
Intermediate Box (6,000 cap)
TM
381mm x 203m m x 127mm
Intermediate Box (5,000 cap)
102mm x 76mm x 127mm
Immediate Box (1,000 cap)
133mm x 95mm
Anti-static bag (250/bag)
©2000 Fairchild Semiconductor International
DO-41 (Glass) Tape and Ammo Data, continued
August 2000, Rev. B
DO-41 (Glass) Ammo Packing
Configuration: Figure 4.0
DO-41 (Glass) Taping
Dimension: Figure 5.0
F
C
L2
L1
E
GHTAPING DIMENSIONS
INCH MM MILS NOTES
A2.520 64.00 2519 Overall width
+0.066/ +1.69/ +66.5/
-0.027 -0.69 -27.0
B2.047±0.027 52 ±0.69 2047±27 Inside Tape Spacing
C0.200 ±0.0157 5.08 ±0.40 200 ±15.7 Component Pitch
D0.047(max) 1.2(max) 47(max) Component Misalignment
E0.022(max) 0.55(max) 22(max ) Tape Mismatch
F0.027(max) ±0. 69 ±27 U nits in line w/ one another
G0.126(min) 3.2(min) 126(min) Lead am oun t between tapes
H0 0 0 Lead amount beyond tapes
L1-L2 ±0.027 ±0.69 ±27 Delta betw een t wo leads
DO-41 (Glass) Reel
Dimension: Figure 6.0
A
B
D
REEL DI MENSIONS
ITEM DESC RIPTION SYMBOL MINIMUM MAXIMUM
Ree l Di am e ter D1 10. 3 75 10 .62 5
Arb or Hol e Di am et er (S ta nd ard) D2 1.24 5 1.255
Core Diameter D3 3.190 3.310
Flange to Flange Outer Width W1 3.400
Note: All Dimensions are in inches
D1
D3
W1
D2
406mm x 267mm x 184mm
Intermediate Container (50,000 cap)
for T50A option
254mm x 79mm x 79mm
Immediate Container (3,000 cap)
T50A Option
DO-41 (FS PKG Code D4)
DO-41 (Glass) Package Dimensions
July 2000, Rev. A
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.32
1.0 min (25.4)
0.107 (2.72)
0.080 (2.03)
0.034 (0.86)
0.028 (0.71)
0.205 (5.21)
0.160 (4.06)
∅
∅
©2000 Fairchild Semiconductor International
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF F AIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART ST ART™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
FASTr™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Rev . G
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
E2CMOSTM
EnSignaTM
FACT™
F ACT Quiet Series™
FAST
SyncFET™
TinyLogic™
UHC™
VCX™
