DS26LS31MQML
DS26LS31MQML Quad High Speed Differential Line Driver
Literature Number: SNOSAM5A
DS26LS31MQML
Quad High Speed Differential Line Driver
General Description
The DS26LS31MQML is a quad differential line driver de-
signed for digital data transmission over balanced lines. The
DS26LS31MQML meets all the requirements of EIA Stan-
dard RS-422 and Federal Standard 1020. It is designed to
provide unipolar differential drive to twisted-pair or parallel-
wire transmission lines.
The circuit provides an enable and disable function common
to all four drivers. The DS26LS31MQML features TRI-
STATE ®outputs and logically ANDed complementary out-
puts. The inputs are all LS compatible and are all one unit
load.
The DS26LS31 features a power up/down protection circuit
which keeps the output in a high impedance stat (TRI-
STATE) during power up or down preventing erroneous
glitches on the transmission lines.
Features
nOperation from single 5V supply
nOutputs won’t load line when V
CC
=0V
nFour line drivers in one package for maximum package
density
nOutput short-circuit protection
nComplementary outputs
nMeets the requirements of EIA Standard RS-422
nPin compatible with AM26LS31
nGlitch free power up/down
Ordering Information
NS PART NUMBER SMD PART NUMBER NS PACKAGE NUMBER PACKAGE DISCRIPTION
DS26LS31MEFQML 5962F7802301Q2A
300k rd(Si) E20A 20LD Ceramic Leadless Chip Carrier
DS26LS31ME-SMD 5962-7802301Q2A E20A 20LD Ceramic Leadless Chip Carrier
DS26LS31MJFQML 5962F7802301MEA
300k rd(Si) J16A 16LD Ceramic Dual-In-Line
DS26LS31MJ-SMD 5962-7802301MEA J16A 16LD Ceramic Dual-In-Line
DS26LS31MJFQMLV 5962F7802301VEA
300k rd(Si) J16A 16LD Ceramic Dual-In-Line
DS26LS31MJ-QMLV 5962-7802301VEA J16A 16LD Ceramic Dual-In-Line
DS26LS31MWFQML 5962F7802301MFA
300k rd(Si) W16A 16LD Ceramic Flatpak
DS26LS31MW-SMD 5962-7802301MFA W16A 16LD Ceramic Flatpak
DS26LS31MWFQMLV 5962F7802301VFA
300k rd(Si) W16A 16LD Ceramic Flatpak
DS26LS31MW-QMLV 5962-7802301VFA W16A 16LD Ceramic Flatpak
DS26LS31MJ/883 J16A 16LD Ceramic Dual-in-line
DS26LS31MW/883 W16A 16LD Ceramic Flatpak
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
March 2006
DS26LS31MQML Quad High Speed Differential Line Driver
© 2006 National Semiconductor Corporation DS201412 www.national.com
Logic and Connection Diagrams
20141201
Dual-In-Line Package
20141202
Top View
See NS Package E20A, J16A or W16A
DS26LS31MQML
www.national.com 2
Absolute Maximum Ratings (Note 1)
Supply Voltage 7V
Input Voltage 7V
Output Voltage 5.5V
Output Voltage (Power OFF) −0.25 to 6V
Maximum Power Dissipation at 25˚C
(Note 2)
J Package 1400 mW
LCC Package 1600 mW
W Package 850 mW
Junction Temperature (T
J
) +150˚C
Thermal Resistance, Junction-to-Ambient
θ
JA
J Package 94˚C/W derate above +25˚C at 10.6 mW/˚C
LCC Package 83˚C/W derate above +25˚C at 12 mW/˚C
W Package 163˚C/W derate above +25˚C at 6.1 mW/˚C
Thermal Resistance, Junction-to-Case
θ
JC
J Package 16˚C/W
LCC Package 19˚C/W
W Package 14˚C/W
ESD Tolerance 2500V
Recommended Operating
Conditions
Supply Voltage, V
CC
4.5 V to 5.5 V
Temperature, T
A
−55˚C to +125˚C
Radiation Features
DS26LS31MEFQML 300 Krads (Si)
DS26LS31MJFQML 300 Krads (Si)
DS26LS31MJFQMLV 300 Krads (Si)
DS26LS31MWFQML 300 Krads (Si)
DS26LS31MWFQMLV 300 Krads (Si)
DS26LS31MQML
www.national.com3
Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
Subgroup Description Temp (˚C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
DS26LS31M - SMD, QMLV & RH Electrical Characteristics
DC Parameters
The following conditions apply, unless otherwise specified. +V = 5V, V
CM
= 0V. (Note 5)
Symbol Parameters Conditions Notes Min Max Units
Sub-
groups
V
IH
Logical "1" Input Voltage V
CC
= 4.5V (Notes 3,
4) 2 V 1, 2, 3
V
IL
Logical "0" Input Voltage V
CC
= 5.5V (Notes 3,
4) .8 V 1,2,3
V
OH
Logical "1" Output Voltage V
CC
= 4.5V, I
OH
= -20mA (Note 4) 2.5 V 1, 2, 3
V
OL
Logical "0" Output Voltage V
CC
= 4.5V, I
OL
= 20mA (Note 4) .5 V 1, 2, 3
I
IH
Logical "1" Input Current V
CC
= 5.5V, V
IN
= 2.7V (Note 4) -2.0 20 uA 1, 2, 3
I
IL
Logical "0" Input Current V
CC
= 5.5V, V
IN
= .4V (Note 4) 100 -360 uA 1, 2, 3
I
I
Input Reverse Current V
CC
= 5.5V, V
IN
= 7V (Note 4) -.01 .1 mA 1, 2, 3
I
O
TRI-STATE Output Current V
CC
= 5.5V, V
O
= .5V (Note 4) -20 uA 1, 2, 3
V
CC
= 5.5V, V
O
= 2.5V (Note 4) 20 uA 1, 2, 3
V
IC
Input Clamp Voltage V
CC
= 4.5V, I
IN
= -18mA (Note 4) -1.5 V 1, 2, 3
I
OS
Output Short Circuit Current V
CC
= 5.5V (Note 4) -30 -150 mA 1, 2, 3
I
CC
Power Supply Current V
CC
= 5.5V, All Outputs
Disabled or Active (Note 4) 80 mA 1, 2, 3
AC Parameters - Propagation Delay Time
The following conditions apply, unless otherwise specified. V
CC
= 5V, V
IN
= 1.3V to V
O
= 1.3V, V (pulse)=0to3V. (Note 5)
Symbol Parameters Conditions Notes Min Max Unit
Sub-
groups
t
PLH
Input to Output C
L
= 30 pF (Note 4) 20 nS 9
30 nS 10, 11
t
PHL
Input to Output C
L
= 30 pF (Note 4) 20 nS 9
30 nS 10, 11
t
Skew
Output to Output C
L
= 30 pF (Note 4) 6nS 9
9 nS 10, 11
DS26LS31MQML
www.national.com 4
DS26LS31M - SMD, QMLV & RH Electrical Characteristics (Continued)
AC Parameters - Propagation Delay Time (Continued)
The following conditions apply, unless otherwise specified. V
CC
= 5V, V
IN
= 1.3V to V
O
= 1.3V, V (pulse)=0to3V. (Note 5)
Symbol Parameters Conditions Notes Min Max Unit
Sub-
groups
t
PLZ
Enable to Output
S2 Open, Enable, C
L
= 10 pF (Note 4) 35 nS 9
53 nS 10, 11
S2 Open, Enable, C
L
=10pF (Note 4) 35 nS 9
53 nS 10, 11
t
PHZ
Enable to Output
S1 Open, Enable, C
L
= 10 pF (Note 4) 30 nS 9
45 nS 10, 11
S1 Open, Enable, CL = 10 pF (Note 4) 30 nS 9
45 nS 10, 11
t
PZL
Enable to Output
S2 Open, Enable, C
L
= 30 pF (Note 4) 45 nS 9
68 nS 10, 11
S2 Open, Enable, C
L
=30pF (Note 4) 45 nS 9
68 nS 10, 11
t
PZH
Enable to Output
S1 Open, Enable, C
L
= 30 pF (Note 4) 40 nS 9
60 nS 10, 11
S1 Open, Enable, C
L
=30pF (Note 4) 40 nS 9
60 nS 10, 11
DC Parameters - Drift Values
The following conditions apply, unless otherwise specified. Delta calculations performed on QMLV only devices after burn-in
and at Group B5.
Symbol Parameters Conditions Notes Min Max Units
Sub-
groups
V
OL
Output Low Voltage V
CC
= 4.5, I
OL
= 20 mA (Note 4) -50 50 mV 1
V
OH
Output High Voltage V
CC
= 4.5, I
OH
= -20 mA (Note 4) -250 250 mV 1
I
CC
Power Supply Current V
CC
= 5.5, All outputs disabled
or active (Note 4) -8 8 mA 1
DS26LS31MQML
www.national.com5
DS26LS31M - 883 Electrical Characteristics
DC Parameters
Symbol Parameters Conditions Notes Min Max Unit Sub-
groups
V
IH
Logical "1" Input Voltage (Notes 3,
4) 2 V 1, 2, 3
V
IL
Logical "0" Input Voltage (Notes 3,
4) .8 V 1,2,3
V
OH
Logical "1" Output Voltage V
CC
= 4.5V, I
OH
= -20mA (Note 4) 2.5 V 1, 2, 3
V
OL
Logical "0" Output Voltage V
CC
= 4.5V, I
OL
= 20mA (Note 4) .5 V 1, 2, 3
I
IH
Logical "1" Input Current V
CC
= 5.5V, V
IN
= 2.7V (Note 4) 20 uA 1, 2, 3
I
IL
Logical "0" Input Current V
CC
= 5.5V, V
IN
= .4V (Note 4) -200 uA 1, 2, 3
I
I
Input Reverse Current VCC = 5.5V, V
IN
= 7V (Note 4) .1 mA 1, 2, 3
I
O
TRI-STATE Output Current V
CC
= 5.5V, V
O
= .5V (Note 4) -20 uA 1, 2, 3
V
CC
= 5.5V, V
O
= 2.5V (Note 4) 20 uA 1, 2, 3
V
IC
Input Clamp Voltage V
CC
= 4.5V, I
IN
= -18mA (Note 4) -1.5 V 1, 2, 3
I
OS
(min) Output Short Circuit Current V
CC
= 5.5V (Note 4) -30 mA 1, 2, 3
I
OS
(max) Output Short Circuit Current V
CC
= 5.5V (Note 4) -150 mA 1, 2, 3
I
CC
Power Supply Current V
CC
= 5.5V, All Outputs
Disabled or Active (Note 4) 60 mA 1, 2, 3
AC Parameters - Propagation Delay Time
The following conditions apply, unless otherwise specified. V
CC
= 5V, C
L
= 50pF or equivalent impedance provided by diode
load.
Symbol Parameters Conditions Notes Min Max Unit Sub-
groups
t
PLH
Input to Output (Notes 4,
6)
15 nS 9
30 nS 10, 11.
t
PHL
Input to Output (Notes 4,
6)
15 nS 9
30 nS 10, 11.
t
Skew
Output to Output (Notes 4,
6)
6nS 9
9 nS 10, 11.
t
PLZ
Enable to Output
S2 Open, Enable (Notes 4,
6)
35 nS 9
53 nS 10, 11.
S2 Open, /Enable (Notes 4,
6)
35 nS 9
53 nS 10, 11.
t
PHZ
Enable to Output
S1 Open, Enable (Notes 4,
6)
25 nS 9
45 nS 10, 11.
S1 Open, /Enable (Notes 4,
6)
25 nS 9
45 nS 10, 11.
t
PZL
Enable to Output
S2 Open, Enable (Notes 4,
6)
30 nS 9
68 nS 10, 11.
S2 Open, /Enable (Notes 4,
6)
30 nS 9
68 nS 10, 11.
t
PZH
Enable to Output
S1 Open, Enable (Notes 4,
6)
30 nS 9
60 nS 10, 11.
S1 Open, /Enable (Notes 4,
6)
30 nS 9
60 nS 10, 11.
DS26LS31MQML
www.national.com 6
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
Note 2: Derate CDip = 11.5 mW/˚C, CLCC = 13mW/˚C, Cerpack = 7.4mW/˚C above 25˚C.
Note 3: Parameter tested go-no-go only.
Note 4: Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
Note 5: Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate sensitive in a space
environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified
in MIL-STD 883, Method 1019, Condition A.
Note 6: Subgroup 10 and 11 guaranteed but not tested.
AC Test Circuit and Switching Time Waveforms
20141203
S1 and S2 of load circuit are closed except where shown.
FIGURE 1. AC Test Circuit
20141204
f = 1 MHz, tr≤15 ns, tf≤6ns
FIGURE 2. Propagation Delays
20141205
f = 1 MHz, tr≤15 ns, tf≤6ns
FIGURE 3. Enable and Disable Times
DS26LS31MQML
www.national.com7
Typical Applications
Two-Wire Balanced System, RS-422
20141206
Note 7: RTis optional although highly recommended to reduce reflection.
Typical Performance Characteristics
DS26LS31MQMLCN Unloaded I
C
vs Frequency vs T
A
DS26LS31MQML I
CC
vs V
CC
vs T
A
20141207 20141208
DS26LS31MQMLCN V
OH
vs I
OH
vs T
A
DS26LS31MQMLCN V
OL
vs I
OL
vs T
A
20141209 20141210
DS26LS31MQML
www.national.com 8
Typical Performance Characteristics (Continued)
DS26LS31MQMLCN V
OD
vs I
O
vs T
A
20141211
DS26LS31MQML
www.national.com9
Revision History Section
Date
Released Revision Section Originator Changes
08/04/05 A New Release, Corporate format R. Malone 2 MDS data sheets converted into a Corp.
data sheet format. Following MDS data
sheets will be Archived
MDDS26LS31M-X-RH, Rev.2A0,
MNDS26LS31M-X, Rev. 0A0
03/01/06 B Ordering Info. Table, Absolute
Ratings, Maximum Operating
Conditions, New Radiation Section.
Typo’s in QMLV & RH, 883 AC
Electrical Characteristics Parameters
Column
R. Malone Added: Juction temp., Thermal Resistance
θ
JA
and θ
JC
. Added a Radiation Section.
Changed: Maximum Operating Conditions to
Recommended Operating Conditions,
Enable and Disable Time to Enable to
Output. Revision A will be archived.
DS26LS31MQML
www.national.com 10
Physical Dimensions inches (millimeters) unless otherwise noted
16 Lead Ceramic Flatpak (W)
NS Package Number W16A
16 Lead Ceramic Dual-in-Line Package (J)
NS Package Number J16A
DS26LS31MQML
www.national.com11
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20 Lead Ceramic Leadless Chip Carrier (E)
NS Package Number E20A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
DS26LS31MQML Quad High Speed Differential Line Driver
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated
