rfPIC12F675 FLASH-Based Microcontroller with ASK/FSK Transmitter High Performance RISC CPU: Peripheral Features: * Memory - 1024 x 14 words of FLASH program memory - 128 x 8 bytes of EEPROM data memory - 64 x 8 bytes of SRAM data memory - 100,000 write FLASH endurance - 1,000,000 write EEPROM endurance - FLASH/data EEPROM retention: > 40 years * Programmable code protection * 6 I/O pins with individual direction control, weak pull-ups, and interrupt-on-pin change * High current sink/source for direct LED drive * Analog comparator: 16 internal reference levels * Analog-to-Digital Converter: 10 bits, 4 channels * Timer0: 8-bit timer/counter with 8-bit prescaler * Timer1: 16-bit timer/counter with 3-bit prescaler * Timer1 can use LP oscillator in INTOSC mode * 5 s wake-up from SLEEP typical with VDD = 3V * In-Circuit Serial ProgrammingTM (ICSPTM) Low Power Features: * Low power consumption: (typical with VDD = 3V) - 14 mA transmitting +6 dBm at 434 MHz - 4 mA transmitting -15 dBm at 434 MHz - 500 A, 4.0 MHz INTOSC - 0.6 A SLEEP with watchdog enabled - 0.1 A standby current * Wide operating voltage range from 2.0 - 5.5V * Industrial and Extended temperature range 2003-2013 Microchip Technology Inc. SSOP VDD GP5/T1CKI/OSC1/CLKIN GP4/T1G/OSC2/CLKOUT GP3/MCLR/VPP RFXTAL RFEN REFCLK PS VDDRF VSSRF *1 2 3 4 5 6 7 8 9 10 rfPIC12F675K/F/H * Only 35 instructions to learn - All single cycle instructions except branches * Operating speed: - Precision Internal 4 MHz oscillator, factory calibrated to 1% - DC - 20 MHz Resonator/Crystal/Clock modes - DC - 20 MHz crystal oscillator/clock input - DC - 4 MHz external RC oscillator - DC - 4 MHz XT crystal oscillator - External Oscillator modes * Interrupt capability * 8-level deep hardware stack * Direct, Indirect and Relative Addressing modes Pin Diagram: 20 19 18 17 16 15 14 13 12 11 VSS GP0/CIN+/ICSPDAT GP1/CIN-/ICSPCLK GP2/T0CKI/INT/COUT FSKOUT DATAFSK DATAASK LF VSSRF ANT UHF ASK/FSK Transmitter: * Integrated crystal oscillator, VCO, loop filter and power amp for minimum external components * ASK data rate: 0 - 40 Kbps * FSK data rate: 0 - 40 Kbps by crystal pulling * Output power: +10 dBm to -12 dBm in 4 steps * Adjustable transmitter power consumption * Transmit frequency set by crystal multiplied by 32 * VCO phase locked to quartz crystal reference; allows narrow band receivers to be used to maximize range and interference immunity * Crystal frequency divide by 4 available (REFCLK) * Used in applications conforming to US FCC Part 15.231 and European EN 300 220 regulations Applications: * * * * * * * * * Automotive Remote Keyless Entry (RKE) systems Automotive alarm systems Community gate and garage door openers Burglar alarm systems Building access Low power telemetry Meter reading Tire pressure sensors Wireless sensors Device Frequency Modulation rfPIC12F675K 290-350 MHz ASK/FSK rfPIC12F675F 380-450 MHz ASK/FSK rfPIC12F675H 850-930 MHz ASK/FSK Preliminary DS70091B-page 1 rfPIC12F675 Table of Contents 1.0 Device Overview ............................................................................................................................................................................ 3 2.0 Memory Organization..................................................................................................................................................................... 5 3.0 GPIO Port ................................................................................................................................................................................... 17 4.0 Timer0 Module............................................................................................................................................................................ 25 5.0 Timer1 Module with Gate Control ............................................................................................................................................... 28 6.0 Comparator Module .................................................................................................................................................................... 33 7.0 Analog-to-Digital Converter (A/D) Module .................................................................................................................................. 39 8.0 Data EEPROM Memory.............................................................................................................................................................. 45 9.0 UHF ASK/FSK Transmitter ......................................................................................................................................................... 49 10.0 Special Features of the CPU ...................................................................................................................................................... 55 11.0 Instruction Set Summary ............................................................................................................................................................ 73 12.0 Development Support ................................................................................................................................................................. 81 13.0 Electrical Specifications .............................................................................................................................................................. 87 14.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 113 15.0 Packaging Information .............................................................................................................................................................. 123 Appendix A: Data Sheet Revision History.......................................................................................................................................... 125 Index ................................................................................................................................................................................................. 127 On-Line Support................................................................................................................................................................................ 131 Systems Information and Upgrade Hot Line ..................................................................................................................................... 131 Reader Response ............................................................................................................................................................................. 132 Product Identification System............................................................................................................................................................ 133 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. 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DS70091B-page 2 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 1.0 DEVICE OVERVIEW be considered a complementary document to this Data Sheet, and is highly recommended reading for a better understanding of the device architecture and operation of the peripheral modules. This document contains device specific information for the rfPIC12F675. Additional information may be found in the PICmicroTM Mid-Range Reference Manual (DS33023), which may be obtained from your local Microchip Sales Representative or downloaded from the Microchip web site. The Reference Manual should FIGURE 1-1: The rfPIC12F675 comes in a 20-pin SSOP package. Figure 1-1 shows a block diagram of the rfPIC12F675 device. Table 1-1 shows the pinout description. rfPIC12F675 BLOCK DIAGRAM 13 FLASH Data Bus Program Counter Program Memory Program Bus GP0/AN0/CIN+ GP1/AN1/CIN-/VREF GP2/AN2/T0CKI/INT/COUT GP3/MCLR/VPP GP4/AN3/T1G/OSC2/CLKOUT GP5/T1CKI/OSC1/CLKIN RAM File Registers 64 x 8 8-Level Stack (13-bit) 1K x 14 8 14 RAM Addr(1) 9 Addr MUX Instruction Reg 7 Direct Addr 8 Indirect Addr FSR Reg Internal 4 MHz Oscillator 3 Timing Generation OSC1/CLKIN OSC2/CLKOUT MUX Power-up Timer ALU Oscillator Start-up Timer T1G RFXTAL W Reg Divide by 32 Charge Pump LF Voltage Controlled Oscillator T1CKI Timer0 Timer1 T0CKI PS DATAASK Analog to Digital Converter Analog Comparator and reference EEDATA 8 128 bytes DATA EEPROM EEADDR CIN- CIN+ COUT VREF Crystal Oscillator Phase/Freq Detector 8 Power-on Reset Watchdog Timer Brown-out Detect VDD, VSS REFCLK STATUS Reg 8 Instruction Decode & Control Clock Divider RFEN RF Power Amplifier RF Control Logic ANT VDDRF VSSRF VSSRF DATAFSK FSK Switch FSKOUT AN0 AN1 AN2 AN3 Note 1: Higher order bits are from STATUS register. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 3 rfPIC12F675 TABLE 1-1: rfPIC12F675 PINOUT BUFFER IN OUT WEAK PULL-UP VDD Direct -- -- GP5 TTL CMOS Prog T1CKI OSC1 CLKIN ST Xtal ST -- -- -- -- Bias -- GP4 TTL CMOS Prog ST Analog -- -- -- -- Xtal CMOS -- -- Bias -- TTL -- ST HV Xtal TTL -- -- Xtal -- PIN 1 2 3 T1G AN3 OSC2 CLKOUT GP3 4 DESCRIPTION Power Supply General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. Timer1 clock XTAL connection External RC network or clock input General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. Timer1 gate A/D Channel 3 input XTAL connection TOSC/4 reference clock General purpose input. Individually controlled interrupt-onchange. Master Clear Reset Programming voltage 5 RF Crystal 6 RF Enable Reference Clock/4 Output (on rfPIC12F675K/F) 7 REFCLK -- CMOS -- Reference Clock/8 Output (on rfPIC12F675H) 8 PS Analog -- Bias Power Select 9 VDDRF Direct -- -- RF Power Supply 10 VSSRF Direct -- -- RF Ground Reference 11 ANT -- OD -- RF power amp output to antenna 12 VSSRF Direct -- -- RF Ground Reference 13 LF Analog Analog -- Loop Filter TTL -- -- ASK modulation data 14 DATAASK 15 DATAFSK TTL -- -- FSK modulation data 16 FSKOUT -- OD -- FSK output to modulate reference crystal General purpose I/O. Individually controlled interrupt-on-change. GP2 ST CMOS Prog Individually enabled pull up. AN2 Analog -- -- A/D Channel 2 input 17 COUT -- CMOS -- Comparator output T0CKI ST -- -- External clock for Timer0 INT ST -- -- External interrupt General purpose I/O. Individually controlled interrupt-on-change. GP1 TTL CMOS Prog Individually enabled pull-up. AN1 Analog -- -- A/D Channel 1 input 18 CINAnalog -- -- Comparator input - negative VREF Analog -- -- External voltage reference ICSPCLK ST -- -- Serial programming clock General purpose I/O. Individually controlled interrupt-on-change. GP0 TTL CMOS Prog Individually enabled pull-up. AN0 Analog -- -- A/D Channel 0 input 19 CIN+ Analog -- -- Comparator input - positive ICSPDAT TTL CMOS -- Serial Programming Data I/O 20 VSS Direct -- -- Ground reference Legend: TTL = TTL input buffer, ST = Schmitt Trigger input buffer, OD = Open Drain output MCLR VPP RFXTAL RFEN DS70091B-page 4 No -- Bias -- Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 2.0 MEMORY ORGANIZATION 2.2 2.1 Program Memory Organization The data memory (see Figure 2-2) is partitioned into two banks, which contain the General Purpose registers and the Special Function registers. The Special Function registers are located in the first 32 locations of each bank. Register locations 20h-5Fh are General Purpose registers, implemented as static RAM and are mapped across both banks. All other RAM is unimplemented and returns `0' when read. RP0 (STATUS<5>) is the bank select bit. The rfPIC12F675 devices have a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 1K x 14 (0000h - 03FFh) for the rfPIC12F675 devices is physically implemented. Accessing a location above these boundaries will cause a wrap around within the first 1K x 14 space. The RESET vector is at 0000h and the interrupt vector is at 0004h (see Figure 2-1). FIGURE 2-1: PROGRAM MEMORY MAP AND STACK FOR THE rfPIC12F675 PC<12:0> CALL, RETURN RETFIE, RETLW Data Memory Organization * RP0 = 0 Bank 0 is selected * RP0 = 1 Bank 1 is selected Note: 2.2.1 13 The IRP and RP1 bits STATUS<7:6> are reserved and should always be maintained as `0's. GENERAL PURPOSE REGISTER FILE The register file is organized as 64 x 8 in the rfPIC12F675 devices. Each register is accessed, either directly or indirectly, through the File Select Register FSR (see Section 2.4). Stack Level 1 Stack Level 2 Stack Level 8 RESET Vector 000h Interrupt Vector 0004 0005 On-chip Program Memory 03FFh 0400h 1FFFh 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 5 rfPIC12F675 2.2.2 SPECIAL FUNCTION REGISTERS FIGURE 2-2: The Special Function registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 2-1). These registers are static RAM. DATA MEMORY MAP OF THE rfPIC12F675 File Address Indirect addr.(1) TMR0 PCL STATUS FSR GPIO The special registers can be classified into two sets: core and peripheral. The Special Function registers associated with the "core" are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. PCLATH INTCON PIR1 TMR1L TMR1H T1CON CMCON ADRESH ADCON0 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h General Purpose Registers File Address Indirect addr.(1) OPTION_REG PCL STATUS FSR TRISIO PCLATH INTCON PIE1 PCON OSCCAL WPU IOC VRCON EEDATA EEADR EECON1 EECON2(1) ADRESL ANSEL 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h accesses 20h-5Fh 64 Bytes 5Fh 60h DFh E0h 7Fh Bank 0 1: DS70091B-page 6 Preliminary FFh Bank 1 Unimplemented data memory locations, read as '0'. Not a physical register. 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 2-1: Address SPECIAL FUNCTION REGISTERS SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Page Bank 0 00h INDF(1) Addressing this Location uses Contents of FSR to Address Data Memory 0000 0000 16,63 01h TMR0 Timer0 Module's Register xxxx xxxx 25 02h PCL Program Counter's (PC) Least Significant Byte 0000 0000 15 03h STATUS 04h FSR 05h GPIO IRP(2) RP1(2) RP0 TO PD Z DC C Indirect Data Memory Address Pointer -- --xx xxxx 17 Unimplemented -- -- 07h -- Unimplemented -- -- 08h -- Unimplemented -- -- 09h -- Unimplemented -- -- ---0 0000 15 0Bh 0Ch 0Dh GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 16 -- PCLATH GPIO5 9 xxxx xxxx 06h 0Ah -- 0001 1xxx -- -- -- INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 11 PIR1 EEIF ADIF -- -- CMIF -- -- TMR1IF 00-- 0--0 13 -- Write Buffer for Upper 5 bits of Program Counter -- -- 0Eh TMR1L Unimplemented Holding Register for the Least Significant Byte of the 16-bit Timer1 xxxx xxxx 28 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit Timer1 xxxx xxxx 28 10h T1CON -000 0000 30 11h -- Unimplemented -- -- 12h -- Unimplemented -- -- 13h -- Unimplemented -- -- 14h -- Unimplemented -- -- 15h -- Unimplemented -- -- 16h -- Unimplemented -- -- 17h -- Unimplemented -- -- 18h -- Unimplemented -- -- -0-0 0000 33 19h CMCON -- -- TMR1GE COUT T1CKPS1 -- T1CKPS0 CINV T1OSCEN CIS T1SYNC CM2 TMR1CS CM1 TMR1ON CM0 1Ah -- Unimplemented -- -- 1Bh -- Unimplemented -- -- 1Ch -- Unimplemented -- -- 1Dh -- Unimplemented -- -- 1Eh ADRESH xxxx xxxx 40 1Fh ADCON0 00-- 0000 41,63 Most Significant 8 bits of the Left Shifted A/D Result or 2 bits of the Right Shifted Result ADFM VCFG -- -- CHS1 CHS0 GO/DONE ADON Legend: -- = unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: This is not a physical register. 2: These bits are reserved and should always be maintained as `0'. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 7 rfPIC12F675 TABLE 2-1: Address SPECIAL FUNCTION REGISTERS SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 PS1 PS0 Value on POR, BOD Page 0000 0000 16,63 1111 1111 10,26 0000 0000 15 0001 1xxx 9 xxxx xxxx 16 --11 1111 17 Bank 1 80h INDF(1) 81h OPTION_REG 82h PCL 83h STATUS 84h FSR 85h TRISIO Addressing this Location uses Contents of FSR to Address Data Memory GPPU INTEDG T0CS T0SE PSA PS2 Program Counter's (PC) Least Significant Byte IRP (2) RP0 (2) RP1 TO PD Z DC C TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 Indirect Data Memory Address Pointer -- -- TRISIO5 86h -- Unimplemented -- -- 87h -- Unimplemented -- -- 88h -- Unimplemented -- -- 89h -- Unimplemented -- -- ---0 0000 15 8Ah PCLATH 8Bh INTCON 8Ch PIE1 8Dh 8Eh -- PCON -- -- -- Write Buffer for Upper 5 bits of Program Counter GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 11 EEIE ADIE -- -- CMIE -- -- TMR1IE 00-- 0--0 12 -- -- -- -- -- -- -- POR BOD ---- --0x 14 -- -- CAL4 CAL3 CAL2 CAL1 CAL0 -- -- 1000 00-- 14 Unimplemented -- 8Fh -- 90h OSCCAL 91h -- Unimplemented -- -- 92h -- Unimplemented -- -- 93h -- Unimplemented -- -- 94h -- Unimplemented -- -- 95h WPU 96h IOC Unimplemented CAL5 -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 --11 -111 18 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 19 97h -- Unimplemented -- -- 98h -- Unimplemented -- -- 0-0- 0000 38 0000 0000 45 -000 0000 45 ---- x000 46 46 99h VRCON VREN -- 9Ah EEDATA 9Bh EEADR -- 9Ch EECON1 -- 9Dh EECON2(1) EEPROM Control Register 2 ---- ---- 9Eh ADRESL Least Significant 2 bits of the Left Shifted A/D Result of 8 bits or the Right Shifted Result xxxx xxxx 40 9Fh ANSEL -000 1111 42,63 VRR -- VR3 VR2 VR1 VR0 Data EEPROM Data Register -- Data EEPROM Address Register -- ADCS2 -- ADCS1 -- ADCS0 WRERR ANS3 WREN ANS2 WR ANS1 RD ANS0 Legend: -- = unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: This is not a physical register. 2: These bits are reserved and should always be maintained as `0'. DS70091B-page 8 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains: * the arithmetic status of the ALU * the RESET status * the bank select bits for data memory (SRAM) It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any STATUS bits. For other instructions not affecting any STATUS bits, see the "Instruction Set Summary". The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. Note 1: Bits IRP and RP1 (STATUS<7:6>) are not used by the rfPIC12F675 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). REGISTER 2-1: STATUS -- STATUS REGISTER (ADDRESS: 03h OR 83h) Reserved Reserved IRP RP1 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x RP0 TO PD Z DC C bit 7 bit 0 bit 7 IRP: This bit is reserved and should be maintained as `0' bit 6 RP1: This bit is reserved and should be maintained as `0' bit 5 RP0: Register Bank Select bit (used for direct addressing) 1 = Bank 1 (80h - FFh) 0 = Bank 0 (00h - 7Fh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) For borrow, the polarity is reversed. 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0 C: Carry/borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: For borrow the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 9 rfPIC12F675 2.2.2.2 OPTION Register Note: The OPTION register is a readable and writable register, which contains various control bits to configure: * * * * To achieve a 1:1 prescaler assignment for TMR0, assign the prescaler to the WDT by setting PSA bit to `1' (OPTION<3>). See Section 4.4. TMR0/WDT prescaler External GP2/INT interrupt TMR0 Weak pull-ups on GPIO REGISTER 2-2: OPTION_REG -- OPTION REGISTER (ADDRESS: 81h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual port latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of GP2/INT pin 0 = Interrupt on falling edge of GP2/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on GP2/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on GP2/T0CKI pin 0 = Increment on low-to-high transition on GP2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the TIMER0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 TMR0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Legend: DS70091B-page 10 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 2.2.2.3 INTCON Register Note: The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, GPIO port change and external GP2/INT pin interrupts. REGISTER 2-3: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON -- INTERRUPT CONTROL REGISTER (ADDRESS: 0Bh OR 8Bh) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF bit 7 bit 0 bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: GP2/INT External Interrupt Enable bit 1 = Enables the GP2/INT external interrupt 0 = Disables the GP2/INT external interrupt bit 3 GPIE: Port Change Interrupt Enable bit(1) 1 = Enables the GPIO port change interrupt 0 = Disables the GPIO port change interrupt bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: GP2/INT External Interrupt Flag bit 1 = The GP2/INT external interrupt occurred (must be cleared in software) 0 = The GP2/INT external interrupt did not occur bit 0 GPIF: Port Change Interrupt Flag bit 1 = When at least one of the GP5:GP0 pins changed state (must be cleared in software) 0 = None of the GP5:GP0 pins have changed state Note 1: IOC register must also be enabled to enable an interrupt-on-change. 2: T0IF bit is set when TIMER0 rolls over. TIMER0 is unchanged on RESET and should be initialized before clearing T0IF bit. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 11 rfPIC12F675 2.2.2.4 PIE1 Register The PIE1 register contains the interrupt enable bits, as shown in Register 2-4. REGISTER 2-4: Note: Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. PIE1 -- PERIPHERAL INTERRUPT ENABLE REGISTER 1 (ADDRESS: 8Ch) R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIE ADIE -- -- CMIE -- -- TMR1IE bit 7 bit 0 bit 7 EEIE: EE Write Complete Interrupt Enable bit 1 = Enables the EE write complete interrupt 0 = Disables the EE write complete interrupt bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D converter interrupt 0 = Disables the A/D converter interrupt bit 5-4 Unimplemented: Read as `0' bit 3 CMIE: Comparator Interrupt Enable bit 1 = Enables the comparator interrupt 0 = Disables the comparator interrupt bit 2-1 Unimplemented: Read as `0' bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt Legend: DS70091B-page 12 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 2.2.2.5 PIR1 Register The PIR1 register contains the interrupt flag bits, as shown in Register 2-5. REGISTER 2-5: Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1 -- PERIPHERAL INTERRUPT REGISTER 1 (ADDRESS: 0Ch) R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIF ADIF -- -- CMIF -- -- TMR1IF bit 7 bit 0 bit 7 EEIF: EEPROM Write Operation Interrupt Flag bit 1 = The write operation completed (must be cleared in software) 0 = The write operation has not completed or has not been started bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = The A/D conversion is complete (must be cleared in software) 0 = The A/D conversion is not complete bit 5-4 Unimplemented: Read as `0' bit 3 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 2-1 Unimplemented: Read as `0' bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 13 rfPIC12F675 2.2.2.6 PCON Register The Power Control (PCON) register contains flag bits to differentiate between a: * * * * Power-on Reset (POR) Brown-out Detect (BOD) Watchdog Timer Reset (WDT) External MCLR Reset The PCON Register bits are shown in Register 2-6. REGISTER 2-6: PCON -- POWER CONTROL REGISTER (ADDRESS: 8Eh) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-x -- -- -- -- -- -- POR BOD bit 7 bit 0 bit 7-2 Unimplemented: Read as '0' bit 1 POR: Power-on Reset STATUS bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOD: Brown-out Detect STATUS bit 1 = No Brown-out Detect occurred 0 = A Brown-out Detect occurred (must be set in software after a Brown-out Detect occurs) Legend: 2.2.2.7 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown OSCCAL Register The Oscillator Calibration register (OSCCAL) is used to calibrate the internal 4 MHz oscillator. It contains 6 bits to adjust the frequency up or down to achieve 4 MHz. The OSCCAL register bits are shown in Register 2-7. REGISTER 2-7: OSCCAL -- OSCILLATOR CALIBRATION REGISTER (ADDRESS: 90h) R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 -- -- bit 7 bit 0 bit 7-2 CAL5:CAL0: 6-bit Signed Oscillator Calibration bits 111111 = Maximum frequency 100000 = Center frequency 000000 = Minimum frequency bit 1-0 Unimplemented: Read as '0' Legend: DS70091B-page 14 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 2.3 2.3.2 PCL and PCLATH The program counter (PC) is 13-bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any RESET, the PC is cleared. Figure 2-3 shows the two situations for the loading of the PC. The upper example in Figure 2-3 shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in Figure 2-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). FIGURE 2-3: LOADING OF PC IN DIFFERENT SITUATIONS PCH PCL 12 8 7 0 PC 8 PCLATH<4:0> 5 Instruction with PCL as Destination The rfPIC12F675 Family has an 8-level deep x 13-bit wide hardware stack (see Figure 2-1). The stack space is not part of either program or data space and the stack pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed, or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no STATUS bits to indicate stack overflow or stack underflow conditions. ALU result PCLATH PCH 12 11 10 PCL 8 STACK 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions, or the vectoring to an interrupt address. 0 7 PC GOTO, CALL 2 PCLATH<4:3> 11 Opcode <10:0> PCLATH 2.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the Application Note "Implementing a Table Read" (AN556). 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 15 rfPIC12F675 2.4 Indirect Addressing, INDF and FSR Registers A simple program to clear RAM location 20h-2Fh using indirect addressing is shown in Example 2-1. The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. EXAMPLE 2-1: Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no operation (although STATUS bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 2-4. FIGURE 2-4: INDIRECT ADDRESSING movlw movwf clrf incf btfss goto NEXT 0x20 FSR INDF FSR FSR,4 NEXT CONTINUE DIRECT/INDIRECT ADDRESSING rfPIC12F675 Direct Addressing RP1(1) RP0 ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue 6 From Opcode Indirect Addressing IRP(1) 0 7 Bank Select Bank Select Location Select 00 01 10 FSR Register 0 Location Select 11 00h 180h Data Memory Not Used 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail see Figure 2-2. Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear. DS70091B-page 16 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 3.0 GPIO PORT register are maintained set when using them as analog inputs. I/O pins configured as analog inputs always read `0'. There are as many as six general purpose I/O pins available. Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled, the associated pin may not be used as a general purpose I/O pin. Note: 3.1 Note: Additional information on I/O ports may be found in the PIC Mid-Range Reference Manual (DS33023) EXAMPLE 3-1: bcf clrf movlw movwf bsf clrf movlw movwf GPIO and the TRISIO Registers GPIO is an 6-bit wide, bi-directional port. The corresponding data direction register is TRISIO. Setting a TRISIO bit (= 1) will make the corresponding GPIO pin an input (i.e., put the corresponding output driver in a Hi-impedance mode). Clearing a TRISIO bit (= 0) will make the corresponding GPIO pin an output (i.e., put the contents of the output latch on the selected pin). The exception is GP3, which is input only and its TRISIO bit will always read as `1'. Example 3-1 shows how to initialize GPIO. 3.2 INITIALIZING GPIO STATUS,RP0 GPIO 07h CMCON STATUS,RP0 ANSEL 0Ch TRISIO ;Bank 0 ;Init GPIO ;Set GP<2:0> to ;digital IO ;Bank 1 ;Digital I/O ;Set GP<3:2> as inputs ;and set GP<5:4,1:0> ;as outputs Additional Pin Functions Every GPIO pin on the rfPIC12F675 has an interrupton-change option and every GPIO pin, except GP3, has a weak pull-up option. The next two sections describe these functions. Reading the GPIO register reads the status of the pins, whereas writing to it will write to the port latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified, and then written to the port data latch. GP3 reads `0' when MCLREN = 1. 3.2.1 WEAK PULL-UP Each of the GPIO pins, except GP3, has an individually configurable weak internal pull-up. Control bits WPUx enable or disable each pull-up. Refer to Register 3-3. Each weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset by the GPPU bit (OPTION<7>). The TRISIO register controls the direction of the GP pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISIO REGISTER 3-1: The ANSEL (9Fh) and CMCON (19h) registers (9Fh) must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0'. GPIO -- GPIO REGISTER (ADDRESS: 05h) U-0 -- U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x -- GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 bit 7 bit 0 bit 7-6: Unimplemented: Read as '0' bit 5-0: GPIO<5:0>: General Purpose I/O pin. 1 = Port pin is >VIH 0 = Port pin is <VIL Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 17 rfPIC12F675 REGISTER 3-2: TRISIO -- GPIO TRISTATE REGISTER (ADDRESS: 85h) U-0 -- U-0 R/W-x R/W-x R-1 -- TRISIO5 TRISIO4 TRISIO3 R/W-x R/W-x TRISIO2 TRISIO1 R/W-x TRISIO0 bit 7 bit 0 bit 7-6: Unimplemented: Read as '0' bit 5-0: TRISIO<5:0>: General Purpose I/O Tri-State Control bit 1 = GPIO pin configured as an input (tri-stated) 0 = GPIO pin configured as an output. Note: TRISIO<3> always reads 1. Legend: REGISTER 3-3: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown WPU -- WEAK PULL-UP REGISTER (ADDRESS: 95h) U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 bit 7 bit 0 bit 7-6 Unimplemented: Read as `0' bit 5-4 WPU<5:4>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 3 Unimplemented: Read as `0' bit 2-0 WPU<2:0>: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global GPPU must be enabled for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0). Legend: DS70091B-page 18 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 3.2.2 INTERRUPT-ON-CHANGE Each of the GPIO pins is individually configurable as an interrupt-on-change pin. Control bits IOC enable or disable the interrupt function for each pin. Refer to Register 3-4. The interrupt-on-change is disabled on a Power-on Reset. For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of GPIO. The `mismatch' outputs of the last read are OR'd together to set, the GP Port Change Interrupt flag bit (GPIF) in the INTCON register. REGISTER 3-4: This interrupt can wake the device from SLEEP. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of GPIO. This will end the mismatch condition. Clear the flag bit GPIF. b) A mismatch condition will continue to set flag bit GPIF. Reading GPIO will end the mismatch condition and allow flag bit GPIF to be cleared. Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the GPIF interrupt flag may not get set. IOC -- INTERRUPT-ON-CHANGE GPIO REGISTER (ADDRESS: 96h) U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 bit 7 bit 0 bit 7-6 Unimplemented: Read as `0' bit 5-0 IOC<5:0>: Interrupt-on-Change GPIO Control bit 1 = Interrupt-on-change enabled 0 = Interrupt-on-change disabled Note 1: Global interrupt enable (GIE) must be enabled for individual interrupts to be recognized. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 19 rfPIC12F675 3.3 FIGURE 3-1: Pin Descriptions and Diagrams Each GPIO pin is multiplexed with other functions. The pins and their combined functions are briefly described here. For specific information about individual functions such as the comparator or the A/D, refer to the appropriate section in this Data Sheet. 3.3.1 GP0/AN0/CIN+ Data Bus WR WPU BLOCK DIAGRAM OF GP0 AND GP1 PINS Analog Input Mode D CK Q VDD Q Weak GPPU RD WPU Figure 3-1 shows the diagram for this pin. The GP0 pin is configurable to function as one of the following: * a general purpose I/O * an analog input for the A/D * an analog input to the comparator 3.3.2 D WR PORT as a general purpose I/O an analog input for the A/D an analog input to the comparator a voltage reference input for the A/D Q I/O pin GP1/AN1/CIN-/VREF D Figure 3-1 shows the diagram for this pin. The GP1 pin is configurable to function as one of the following: * * * * CK VDD Q WR TRISIO CK Q Q VSS Analog Input Mode RD TRISIO RD PORT D WR IOC CK Q Q D Q EN RD IOC Q D EN Interrupt-on-Change RD PORT To Comparator To A/D Converter DS70091B-page 20 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 3.3.3 GP2/AN2/T0CKI/INT/COUT 3.3.4 GP3/MCLR/VPP Figure 3-2 shows the diagram for this pin. The GP2 pin is configurable to function as one of the following: Figure 3-3 shows the diagram for this pin. The GP3 pin is configurable to function as one of the following: * * * * * * a general purpose input * as Master Clear Reset a general purpose I/O an analog input for the A/D the clock input for TMR0 an external edge triggered interrupt a digital output from the comparator FIGURE 3-3: Data Bus FIGURE 3-2: Data Bus WR WPU RD TRISIO CK Q VDD Q D WR PORT WR IOC Q Q RD IOC VDD Q D Q Q D EN CK Q COUT Interrupt-on-Change 1 0 D WR TRISIO CK VSS EN Analog Input Mode COUT Enable MCLRE D GPPU RD WPU I/O pin VSS RD PORT Weak MCLRE RESET BLOCK DIAGRAM OF GP2 Analog Input Mode D BLOCK DIAGRAM OF GP3 CK I/O pin RD PORT Q Q VSS Analog Input Mode RD TRISIO RD PORT D WR IOC CK Q Q D Q EN RD IOC Q D EN Interrupt-on-Change RD PORT To TMR0 To INT To A/D Converter 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 21 rfPIC12F675 3.3.5 GP4/AN3/T1G/OSC2/CLKOUT 3.3.6 GP5/T1CKI/OSC1/CLKIN Figure 3-4 shows the diagram for this pin. The GP4 pin is configurable to function as one of the following: Figure 3-5 shows the diagram for this pin. The GP5 pin is configurable to function as one of the following: * * * * * * * * * a general purpose I/O an analog input for the A/D a TMR1 gate input a crystal/resonator connection a clock output a general purpose I/O a TMR1 clock input a crystal/resonator connection a clock input FIGURE 3-5: FIGURE 3-4: Analog Input Mode Data Bus WR WPU D CK BLOCK DIAGRAM OF GP5 BLOCK DIAGRAM OF GP4 INTOSC Mode CLK Modes(1) Q Data Bus TMR1LPEN(1) D Q WR WPU Weak CK Weak Q GPPU RD WPU GPPU RD WPU Oscillator Circuit Oscillator Circuit OSC1 FOSC/4 D WR PORT CK Q OSC2 VDD CLKOUT Enable D WR PORT 1 0 WR TRISIO CK WR TRISIO INTOSC/ RC/EC(2) Q VSS INTOSC Mode RD TRISIO Q CLKOUT Enable (2) RD PORT Analog Input Mode D RD PORT CK CK Q Q RD TRISIO D Q I/O pin D CLKOUT Enable D CK WR IOC Q CK Q Q D RD IOC Q EN Q Interrupt-on-Change D Q EN Q RD IOC VDD Q I/O pin Q VSS WR IOC VDD Q VDD Q D D EN Interrupt-on-Change EN RD PORT RD PORT To TMR1 or CLKGEN To TMR1 T1G To A/D Converter Note 1: CLK modes are XT, HS, LP, LPTMR1 and CLKOUT Enable. 2: With CLKOUT option. DS70091B-page 22 Preliminary Note 1: Timer1 LP Oscillator enabled 2: When using Timer1 with LP oscillator, the Schmitt Trigger is by-passed. 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 3-1: Address SUMMARY OF REGISTERS ASSOCIATED WITH GPIO Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOD Value on all other RESETS 05h GPIO -- -- GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu 0Bh/8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 19h CMCON -- COUT -- CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 85h TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 95h WPU -- -- WPU5 WPU4 -- WPU2 WPU1 WPU0 --11 -111 --11 -111 96h IOC -- -- IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000 9Fh ANSEL -- ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111 Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by GPIO. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 23 rfPIC12F675 NOTES: DS70091B-page 24 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 4.0 TIMER0 MODULE Counter mode is selected by setting the T0CS bit (OPTION_REG<5>). In this mode, the Timer0 module will increment either on every rising or falling edge of pin GP2/T0CKI. The incrementing edge is determined by the source edge (T0SE) control bit (OPTION_REG<4>). Clearing the T0SE bit selects the rising edge. The Timer0 module timer/counter has the following features: * * * * * * 8-bit timer/counter Readable and writable 8-bit software programmable prescaler Internal or external clock select Interrupt on overflow from FFh to 00h Edge select for external clock Note: Figure 4-1 is a block diagram of the Timer0 module and the prescaler shared with the WDT. Note: 4.1 4.2 Additional information on the Timer0 module is available in the PICmicroTM MidRange Reference Manual (DS33023). Timer0 Interrupt A Timer0 interrupt is generated when the TMR0 register timer/counter overflows from FFh to 00h. This overflow sets the T0IF bit. The interrupt can be masked by clearing the T0IE bit (INTCON<5>). The T0IF bit (INTCON<2>) must be cleared in software by the Timer0 module Interrupt Service Routine before reenabling this interrupt. The Timer0 interrupt cannot wake the processor from SLEEP since the timer is shut-off during SLEEP. Timer0 Operation Timer mode is selected by clearing the T0CS bit (OPTION_REG<5>). In Timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 is written, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. FIGURE 4-1: Counter mode has specific external clock requirements. Additional information on these requirements is available in the PICmicroTM Mid-Range Reference Manual (DS33023). BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER CLKOUT (= FOSC/4) Data Bus 0 8 1 SYNC 2 Cycles 1 T0CKI pin 0 T0SE T0CS Set Flag bit T0IF on Overflow 8-bit Prescaler PSA 1 PSA TMR0 0 8 PS0 - PS2 1 WDT Time-out Watchdog Timer 0 PSA WDTE Note 1: T0SE, T0CS, PSA, PS0-PS2 are bits in the Option register. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 25 rfPIC12F675 4.3 Using Timer0 with an External Clock a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI, with the internal phase clocks, is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and REGISTER 4-1: Note: The ANSEL (9Fh) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0'. OPTION_REG -- OPTION REGISTER (ADDRESS: 81h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual port latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of GP2/INT pin 0 = Interrupt on falling edge of GP2/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on GP2/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on GP2/T0CKI pin 0 = Increment on low-to-high transition on GP2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the TIMER0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 TMR0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Legend: DS70091B-page 26 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 4.4 EXAMPLE 4-1: Prescaler An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer. For simplicity, this counter will be referred to as "prescaler" throughout this Data Sheet. The prescaler assignment is controlled in software by the control bit PSA (OPTION_REG<3>). Clearing the PSA bit will assign the prescaler to Timer0. Prescale values are selectable via the PS2:PS0 bits (OPTION_REG<2:0>). bcf STATUS,RP0 clrwdt clrf TMR0 bsf SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software control (i.e., it can be changed "on the fly" during program execution). To avoid an unintended device RESET, the following instruction sequence (Example 4-1) must be executed when changing the prescaler assignment from Timer0 to WDT. To change prescaler from the WDT to the TMR0 module, use the sequence shown in Example 4-2. This precaution must be taken even if the WDT is disabled. EXAMPLE 4-2: Address CHANGING PRESCALER (WDTTIMER0) clrwdt ;Clear WDT and ; postscaler ;Bank 1 bsf STATUS,RP0 movlw b'xxxx0xxx' ;Select TMR0, ; prescale, and ; clock source OPTION_REG ; STATUS,RP0 ;Bank 0 movwf bcf TABLE 4-1: STATUS,RP0 ;Bank 0 ;Clear WDT ;Clear TMR0 and ; prescaler ;Bank 1 movlw b'00101111' ;Required if desired movwf OPTION_REG ; PS2:PS0 is clrwdt ; 000 or 001 ; movlw b'00101xxx' ;Set postscaler to movwf OPTION_REG ; desired WDT rate bcf STATUS,RP0 ;Bank 0 The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1, x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the Watchdog Timer. 4.4.1 CHANGING PRESCALER (TIMER0WDT) REGISTERS ASSOCIATED WITH TIMER0 Name Bit 7 Bit 6 Value on POR, BOD Value on all other RESETS xxxx xxxx uuuu uuuu 0000 0000 0000 000u 1111 1111 1111 1111 TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 T0IE INTE GPIE T0IF INTF GPIF T0CS T0SE PSA PS2 PS1 PS0 01h TMR0 0Bh/8Bh INTCON Timer0 Module Register 81h OPTION_REG 85h TRISIO Legend: -- = Unimplemented locations, read as `0', u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. GIE PEIE GPPU INTEDG -- -- 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 27 rfPIC12F675 5.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 Control register (T1CON), shown in Register 5-1, is used to enable/disable Timer1 and select the various features of the Timer1 module. The rfPIC12F675 devices have a 16-bit timer. Figure 5-1 shows the basic block diagram of the Timer1 module. Timer1 has the following features: * * * * * * * * Note: Additional information on timer modules is available in the PICmicroTM Mid-Range Reference Manual (DS33023). 16-bit timer/counter (TMR1H:TMR1L) Readable and writable Internal or external clock selection Synchronous or asynchronous operation Interrupt on overflow from FFFFh to 0000h Wake-up upon overflow (Asynchronous mode) Optional external enable input (T1G) Optional LP oscillator FIGURE 5-1: TIMER1 BLOCK DIAGRAM TMR1ON TMR1GE T1G TMR1ON TMR1GE Set Flag bit TMR1IF on Overflow TMR1 Synchronized Clock Input 0 TMR1H TMR1L 1 LP Oscillator T1SYNC OSC1 OSC2 INTOSC w/o CLKOUT T1OSCEN 1 FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 0 2 T1CKPS<1:0> SLEEP Input TMR1CS LP DS70091B-page 28 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 5.1 Timer1 Modes of Operation 5.2 Timer1 can operate in one of three modes: The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit (PIR1<0>) is set. To enable the interrupt on rollover, you must set these bits: * 16-bit timer with prescaler * 16-bit synchronous counter * 16-bit asynchronous counter In Timer mode, Timer1 is incremented on every instruction cycle. In Counter mode, Timer1 is incremented on the rising edge of the external clock input T1CKI. In addition, the Counter mode clock can be synchronized to the microcontroller system clock or run asynchronously. * Timer1 interrupt Enable bit (PIE1<0>) * PEIE bit (INTCON<6>) * GIE bit (INTCON<7>). The interrupt is cleared by clearing the TMR1IF in the Interrupt Service Routine. Note: In Counter and Timer modules, the counter/timer clock can be gated by the T1G input. If an external clock oscillator is needed (and the microcontroller is using the INTOSC w/o CLKOUT), Timer1 can use the LP oscillator as a clock source. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge. FIGURE 5-2: Timer1 Interrupt 5.3 The TMR1H:TTMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4, or 8 divisions of the clock input. The T1CKPS bits (T1CON<5:4>) control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 29 rfPIC12F675 REGISTER 5-1: T1CON -- TIMER1 CONTROL REGISTER (ADDRESS: 10h) U-0 -- R/W-0 R/W-0 R/W-0 R/W-0 TMR1GE T1CKPS1 T1CKPS0 T1OSCEN R/W-0 R/W-0 R/W-0 T1SYNC TMR1CS TMR1ON bit 7 bit 0 bit 7 Unimplemented: Read as `0' bit 6 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 is on if T1G pin is low 0 = Timer1 is on bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale Value 10 = 1:4 Prescale Value 01 = 1:2 Prescale Value 00 = 1:1 Prescale Value bit 3 T1OSCEN: LP Oscillator Enable Control bit If INTOSC without CLKOUT oscillator is active: 1 = LP oscillator is enabled for Timer1 clock 0 = LP oscillator is off Else: This bit is ignored bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from T1OSO/T1CKI pin (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Legend: DS70091B-page 30 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 5.4 Timer1 Operation in Asynchronous Counter Mode 5.5 If control bit T1SYNC (T1CON<2>) is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during SLEEP and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (Section 5.4.1). Note: 5.4.1 The ANSEL (9Fh) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0'. A crystal oscillator circuit is built-in between pins OSC1 (input) and OSC2 (amplifier output). It is enabled by setting control bit T1OSCEN (T1CON<3>). The oscillator is a low power oscillator rated up to 37 kHz. It will continue to run during SLEEP. It is primarily intended for a 32 kHz crystal. Table 10-2 shows the capacitor selection for the Timer1 oscillator. The Timer1 oscillator is shared with the system LP oscillator. Thus, Timer1 can use this mode only when the system clock is derived from the internal oscillator. As with the system LP oscillator, the user must provide a software time delay to ensure proper oscillator start-up. While enabled, TRISIO4 and TRISIO5 are set. GP4 and GP5 read `0' and TRISIO4 and TRISIO5 are read `1'. READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L, while the timer is running from an external asynchronous clock, will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the timer register. Reading the 16-bit value requires some care. Examples 12-2 and 12-3 in the PIC Mid-Range MCU Family Reference Manual (DS33023) show how to read and write Timer1 when it is running in Asynchronous mode. TABLE 5-1: Timer1 Oscillator Note: 5.6 The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to enabling Timer1. Timer1 Operation During SLEEP Timer1 can only operate during SLEEP when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To setup the timer to wake the device: * Timer1 must be on (T1CON<0>) * TMR1IE bit (PIE1<0>) must be set * PEIE bit (INTCON<6>) must be set The device will wake-up on an overflow. If the GIE bit (INTCON<7>) is set, the device will wake-up and jump to the Interrupt Service Routine on an overflow. REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Value on all other RESETS Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD 0Bh/8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF -- -- CMIF -- -- 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON -- EEIE TMR1IF 00-- 0--0 00-- 0--0 TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON -000 0000 -uuu uuuu 8Ch PIE1 Legend: x = unknown, u = unchanged, - = unimplemented, read as '0'. Shaded cells are not used by the Timer1 module. ADIE 2003-2013 Microchip Technology Inc. -- -- CMIE Preliminary -- -- TMR1IE 00-- 0--0 00-- 0--0 DS70091B-page 31 rfPIC12F675 NOTES: DS70091B-page 32 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 6.0 COMPARATOR MODULE be applied to an input of the comparator. In addition, GP2 can be configured as the comparator output. The Comparator Control Register (CMCON), shown in Register 6-1, contains the bits to control the comparator. The rfPIC12F675 devices have one analog comparator. The inputs to the comparator are multiplexed with the GP0 and GP1 pins. There is an on-chip Comparator Voltage Reference that can also REGISTER 6-1: CMCON -- COMPARATOR CONTROL REGISTER (ADDRESS: 19h) U-0 R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- COUT -- CINV CIS CM2 CM1 CM0 bit 7 bit 0 bit 7 Unimplemented: Read as `0' bit 6 COUT: Comparator Output bit When CINV = 0: 1 = VIN+ > VIN- 0 = VIN+ < VINWhen CINV = 1: 1 = VIN+ < VIN0 = VIN+ > VIN- bit 5 Unimplemented: Read as `0' bit 4 CINV: Comparator Output Inversion bit 1 = Output inverted 0 = Output not inverted bit 3 CIS: Comparator Input Switch bit When CM2:CM0 = 110 or 101: 1 = VIN- connects to CIN+ 0 = VIN- connects to CIN- bit 2-0 CM2:CM0: Comparator Mode bits Figure 6-2 shows the Comparator modes and CM2:CM0 bit settings Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 33 rfPIC12F675 6.1 TABLE 6-1: Comparator Operation A single comparator is shown in Figure 6-1, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 6-1 represent the uncertainty due to input offsets and response time. Note: To use CIN+ and CIN- pins as analog inputs, the appropriate bits must be programmed in the CMCON (19h) register. The polarity of the comparator output can be inverted by setting the CINV bit (CMCON<4>). Clearing CINV results in a non-inverted output. A complete table showing the output state versus input conditions and the polarity bit is shown in Table 6-1. OUTPUT STATE VS. INPUT CONDITIONS Input Conditions CINV COUT VIN- > VIN+ 0 0 VIN- < VIN+ 0 1 VIN- > VIN+ 1 1 VIN- < VIN+ 1 0 FIGURE 6-1: SINGLE COMPARATOR VIN+ + VIN- - Output VINVIN+ Output Note: DS70091B-page 34 Preliminary CINV bit (CMCON<4>) is clear. 2003-2013 Microchip Technology Inc. rfPIC12F675 6.2 Comparator Configuration There are eight modes of operation for the comparator. The CMCON register, shown in Register 6-1, is used to select the mode. Figure 6-2 shows the eight possible modes. The TRISIO register controls the data direction of the comparator pins for each mode. If the FIGURE 6-2: Comparator mode is changed, the comparator output level may not be valid for a specified period of time. Refer to the specifications in Section 13.0. Note: Comparator interrupts should be disabled during a Comparator mode change. Otherwise, a false interrupt may occur. COMPARATOR I/O OPERATING MODES Comparator Reset (POR Default Value - low power) Comparator Off (Lowest power) CM2:CM0 = 000 CM2:CM0 = 111 GP1/CIN- A GP0/CIN+ A GP2/COUT D Off (Read as '0') GP1/CIN- D GP0/CIN+ D GP2/COUT D Off (Read as '0') Comparator without Output Comparator w/o Output and with Internal Reference CM2:CM0 = 010 CM2:CM0 = 100 GP1/CIN- A GP0/CIN+ A GP2/COUT D COUT GP1/CIN- A GP0/CIN+ D GP2/COUT D COUT From CVREF Module Comparator with Output and Internal Reference Multiplexed Input with Internal Reference and Output CM2:CM0 = 011 CM2:CM0 = 101 GP1/CIN- A GP0/CIN+ D GP2/COUT D COUT GP1/CIN- A GP0/CIN+ A GP2/COUT D CIS = 0 CIS = 1 COUT From CVREF Module From CVREF Module Comparator with Output Multiplexed Input with Internal Reference CM2:CM0 = 001 CM2:CM0 = 110 GP1/CIN- A GP0/CIN+ A GP2/COUT D COUT GP1/CIN- A GP0/CIN+ A GP2/COUT D CIS = 0 CIS = 1 COUT From CVREF Module A = Analog Input, ports always reads `0' D = Digital Input CIS = Comparator Input Switch (CMCON<3>) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 35 rfPIC12F675 6.3 Analog Input Connection Considerations range by more than 0.6V in either direction, one of the diodes is forward biased and a latchup may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. A simplified circuit for an analog input is shown in Figure 6-3. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this FIGURE 6-3: ANALOG INPUT MODE VDD VT = 0.6V Rs < 10K RIC AIN CPIN 5 pF VA Leakage 500 nA VT = 0.6V Vss Legend: 6.4 CPIN VT ILEAKAGE RIC RS VA = Input Capacitance = Threshold Voltage = Leakage Current at the pin due to Various Junctions = Interconnect Resistance = Source Impedance = Analog Voltage Comparator Output The TRISIO<2> bit functions as an output enable/ disable for the GP2 pin while the comparator is in an Output mode. The comparator output, COUT, is read through the CMCON register. This bit is read-only. The comparator output may also be directly output to the GP2 pin in three of the eight possible modes, as shown in Figure 6-2. When in one of these modes, the output on GP2 is asynchronous to the internal clock. Figure 6-4 shows the comparator output block diagram. Note 1: When reading the GPIO register, all pins configured as analog inputs will read as a `0'. Pins configured as digital inputs will convert an analog input according to the TTL input specification. 2: Analog levels on any pin that is defined as a digital input, may cause the input buffer to consume more current than is specified. FIGURE 6-4: MODIFIED COMPARATOR OUTPUT BLOCK DIAGRAM GP0/CIN+ GP1/CIN- To GP2/T0CKI pin To Data Bus Q RD CMCON Set CMIF bit CVREF D EN Q CINV CM2:CM0 D EN RD CMCON RESET DS70091B-page 36 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 6.5 Comparator Reference The following equations determine the output voltages: The comparator module also allows the selection of an internally generated voltage reference for one of the comparator inputs. The internal reference signal is used for four of the eight Comparator modes. The VRCON register, Register 6-2, controls the voltage reference module shown in Figure 6-5. 6.5.1 CONFIGURING THE VOLTAGE REFERENCE The voltage reference can output 32 distinct voltage levels, 16 in a high range and 16 in a low range. FIGURE 6-5: VRR = 1 (low range): CVREF = (VR3:VR0 / 24) x VDD VRR = 0 (high range): CVREF = (VDD / 4) + (VR3:VR0 x VDD / 32) 6.5.2 VOLTAGE REFERENCE ACCURACY/ERROR The full range of VSS to VDD cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 6-5) keep CVREF from approaching VSS or VDD. The Voltage Reference is VDD derived and therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 13.0. COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 16 Stages 8R R R R R VDD 8R VRR 16-1 Analog MUX VREN CVREF to Comparator Input VR3:VR0 6.6 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output is ensured to have a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (Table 13-7). 6.7 Operation During SLEEP Both the comparator and voltage reference, if enabled before entering SLEEP mode, remain active during SLEEP. This results in higher SLEEP currents than shown in the power-down specifications. The additional current consumed by the comparator and the voltage reference is shown separately in the specifications. To minimize power consumption while in SLEEP mode, turn off the comparator, CM2:CM0 = 111, and voltage reference, VRCON<7> = 0. 2003-2013 Microchip Technology Inc. While the comparator is enabled during SLEEP, an interrupt will wake-up the device. If the device wakes up from SLEEP, the contents of the CMCON and VRCON registers are not affected. 6.8 Effects of a RESET A device RESET forces the CMCON and VRCON registers to their RESET states. This forces the comparator module to be in the Comparator Reset mode, CM2:CM0 = 000 and the voltage reference to its off state. Thus, all potential inputs are analog inputs with the comparator and voltage reference disabled to consume the smallest current possible. Preliminary DS70091B-page 37 rfPIC12F675 REGISTER 6-2: VRCON -- VOLTAGE REFERENCE CONTROL REGISTER (ADDRESS: 99h) R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN -- VRR -- VR3 VR2 VR1 VR0 bit 7 bit 0 bit 7 VREN: CVREF Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down, no IDD drain bit 6 Unimplemented: Read as '0' bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as '0' bit 3-0 VR3:VR0: CVREF value selection 0 VR [3:0] 15 When VRR = 1: CVREF = (VR3:VR0 / 24) * VDD When VRR = 0: CVREF = VDD/4 + (VR3:VR0 / 32) * VDD Legend: 6.9 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Comparator Interrupts The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: The comparator interrupt flag is set whenever there is a change in the output value of the comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<6>, to determine the actual change that has occurred. The CMIF bit, PIR1<3>, is the comparator interrupt flag. This bit must be reset in software by clearing it to `0'. Since it is also possible to write a '1' to this register, a simulated interrupt may be initiated. a) Any read or write of CMCON. This will end the mismatch condition. Clear flag bit CMIF. b) A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition, and allow flag bit CMIF to be cleared. Note: The CMIE bit (PIE1<3>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit must also be set. If any of these bits are cleared, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. TABLE 6-2: x = Bit is unknown If a change in the CMCON register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR1<3>) interrupt flag may not get set. REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other RESETS 0Bh/8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF -- -- CMIF -- -- TMR1IF 00-- 0--0 00-- 0--0 19h CMCON -- COUT -- CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 8Ch PIE1 EEIE ADIE -- -- CMIE -- -- TMR1IE 00-- 0--0 00-- 0--0 85h TRISIO -- -- TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 99h VRCON VREN -- 0-0- 0000 0-0- 0000 Address Legend: VRR -- VR3 VR2 VR1 VR0 x = unknown, u = unchanged, - = unimplemented, read as `0'. Shaded cells are not used by the comparator module. DS70091B-page 38 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 7.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The output of the sample and hold is connected to the input of the converter. The converter generates a binary result via successive approximation and stores the result in a 10-bit register. The voltage reference used in the conversion is software selectable to either VDD or a voltage applied by the VREF pin. Figure 7-1 shows the block diagram of the A/D. The analog-to-digital converter (A/D) allows conversion of an analog input signal to a 10-bit binary representation of that signal. The rfPIC12F675 has four analog inputs, multiplexed into one sample and hold circuit. FIGURE 7-1: A/D BLOCK DIAGRAM VDD VCFG = 0 VREF VCFG = 1 GP0/AN0 GP1/AN1/VREF ADC GP2/AN2 10 GO/DONE GP4/AN3 ADFM CHS1:CHS0 10 ADON ADRESH ADRESL VSS 7.1 A/D Configuration and Operation There are two registers available to control the functionality of the A/D module: 1. 2. 7.1.4 ADCON0 (Register 7-1) ANSEL (Register 7-2) 7.1.1 ANALOG PORT PINS The ANS3:ANS0 bits (ANSEL<3:0>) and the TRISIO bits control the operation of the A/D port pins. Set the corresponding TRISIO bits to set the pin output driver to its high impedance state. Likewise, set the corresponding ANS bit to disable the digital input buffer. Note: 7.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are four analog channels, AN0 through AN3. The CHS1:CHS0 bits (ADCON0<3:2>) control which channel is connected to the sample and hold circuit. 7.1.3 controls the voltage reference selection. If VCFG is set, then the voltage on the VREF pin is the reference; otherwise, VDD is the reference. CONVERSION CLOCK The A/D conversion cycle requires 11 TAD. The source of the conversion clock is software selectable via the ADCS bits (ANSEL<6:4>). There are seven possible clock options: * * * * * * * FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal RC oscillator) For correct conversion, the A/D conversion clock (1/TAD) must be selected to ensure a minimum TAD of 1.6 s. Table 7-1 shows a few TAD calculations for selected frequencies. VOLTAGE REFERENCE There are two options for the voltage reference to the A/D converter: either VDD is used, or an analog voltage applied to VREF is used. The VCFG bit (ADCON0<6>) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 39 rfPIC12F675 TABLE 7-1: TAD vs. DEVICE OPERATING FREQUENCIES A/D Clock Source (TAD) Device Frequency Operation ADCS2:ADCS0 20 MHz 5 MHz 4 MHz 1.25 MHz 2 TOSC 000 100 ns(2) 400 ns(2) 500 ns(2) 1.6 s 4 TOSC 100 200 ns(2) 800 ns(2) 1.0 s(2) 3.2 s 8 TOSC 001 400 ns(2) 1.6 s 2.0 s 6.4 s (2) 16 TOSC 101 800 ns 3.2 s 4.0 s 12.8 s(3) (3) 32 TOSC 010 1.6 s 6.4 s 8.0 s 25.6 s(3) (3) (3) 64 TOSC 110 3.2 s 12.8 s 16.0 s 51.2 s(3) A/D RC x11 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The A/D RC source has a typical TAD time of 4 s for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When the device frequency is greater than 1 MHz, the A/D RC clock source is only recommended if the conversion will be performed during SLEEP. 7.1.5 previous conversion. After an aborted conversion, a 2 TAD delay is required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. STARTING A CONVERSION The A/D conversion is initiated by setting the GO/DONE bit (ADCON0<1>). When the conversion is complete, the A/D module: Note: * Clears the GO/DONE bit * Sets the ADIF flag (PIR1<6>) * Generates an interrupt (if enabled). 7.1.6 If the conversion must be aborted, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete A/D conversion sample. Instead, the ADRESH:ADRESL registers will retain the value of the FIGURE 7-2: The GO/DONE bit should not be set in the same instruction that turns on the A/D. CONVERSION OUTPUT The A/D conversion can be supplied in two formats: left or right shifted. The ADFM bit (ADCON0<7>) controls the output format. Figure 7-2 shows the output formats. 10-BIT A/D RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB Bit 7 Bit 0 Bit 7 10-bit A/D Result (ADFM = 1) Unimplemented: Read as `0' MSB Bit 7 LSB Bit 0 Unimplemented: Read as `0 DS70091B-page 40 Bit 0 Preliminary Bit 7 Bit 0 10-bit A/D Result 2003-2013 Microchip Technology Inc. rfPIC12F675 REGISTER 7-1: ADCON0 -- A/D CONTROL REGISTER (ADDRESS: 1Fh) R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM VCFG -- -- CHS1 CHS0 GO/DONE ADON bit 7 bit 0 bit 7 ADFM: A/D Result Formed Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5-4 Unimplemented: Read as zero bit 3-2 CHS1:CHS0: Analog Channel Select bits 00 = Channel 00 (AN0) 01 = Channel 01 (AN1) 10 = Channel 02 (AN2) 11 = Channel 03 (AN3) bit 1 GO/DONE: A/D Conversion STATUS bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: A/D Conversion STATUS bit 1 = A/D converter module is operating 0 = A/D converter is shut-off and consumes no operating current Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 41 rfPIC12F675 REGISTER 7-2: ANSEL -- ANALOG SELECT REGISTER (ADDRESS: 9Fh) U-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 -- ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 bit 7 bit 0 bit 7 Unimplemented: Read as `0'. bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 bit 3-0 ANS3:ANS0: Analog Select bits (Between analog or digital function on pins AN<3:0>, respectively.) 1 = Analog input; pin is assigned as analog input(1) 0 = Digital I/O; pin is assigned to port or special function Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change. The corresponding TRISIO bit must be set to Input mode in order to allow external control of the voltage on the pin. Legend: DS70091B-page 42 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 7.2 A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 7-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 7-3. The maximum recommended impedance for analog sources is 10 k. As the impedance EQUATION 7-1: TACQ TC TACQ is decreased, the acquisition time may be decreased. After the analog input channel is selected (changed), this acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 7-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. To calculate the minimum acquisition time, TACQ, see the PIC Mid-Range Reference Manual (DS33023). ACQUISITION TIME = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = = = = = = = TAMP + TC + TCOFF 2s + TC + [(Temperature -25C)(0.05s/C)] CHOLD (RIC + RSS + RS) In(1/2047) - 120pF (1k + 7k + 10k) In(0.0004885) 16.47s 2s + 16.47s + [(50C -25C)(0.05s/C) 19.72s Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. FIGURE 7-3: ANALOG INPUT MODEL VDD RS VA ANx CPIN 5 pF VT = 0.6V VT = 0.6V Sampling Switch RIC 1K SS RSS CHOLD = DAC capacitance = 120 pF I LEAKAGE 500 nA VSS Legend CPIN = input capacitance VT = threshold voltage I LEAKAGE = leakage current at the pin due to various junctions RIC = interconnect resistance SS = sampling switch CHOLD = sample/hold capacitance (from DAC) 2003-2013 Microchip Technology Inc. Preliminary 6V 5V VDD 4V 3V 2V 5 6 7 8 9 10 11 Sampling Switch (k) DS70091B-page 43 rfPIC12F675 7.3 A/D Operation During SLEEP The A/D converter module can operate during SLEEP. This requires the A/D clock source to be set to the internal RC oscillator. When the RC clock source is selected, the A/D waits one instruction before starting the conversion. This allows the SLEEP instruction to be executed, thus eliminating much of the switching noise from the conversion. When the conversion is complete, the GO/DONE bit is cleared, and the result is loaded into the ADRESH:ADRESL registers. If the A/D interrupt is enabled, the device awakens from SLEEP. If the A/D interrupt is not enabled, the A/D module is turned off, although the ADON bit remains set. TABLE 7-2: Address 05h Name GPIO When the A/D clock source is something other than RC, a SLEEP instruction causes the present conversion to be aborted, and the A/D module is turned off. The ADON bit remains set. 7.4 Effects of RESET A device RESET forces all registers to their RESET state. Thus the A/D module is turned off and any pending conversion is aborted. The ADRESH:ADRESL registers are unchanged. SUMMARY OF A/D REGISTERS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOD Value on all other RESETS -- -- GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 --xx xxxx --uu uuuu 0Bh, 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF -- -- CMIF -- -- TMR1IF 00-- 0--0 00-- 0--0 1Eh ADRESH Most Significant 8 bits of the Left Shifted A/D result or 2 bits of the Right Shifted Result xxxx xxxx uuuu uuuu 1Fh ADCON0 00-- 0000 00-- 0000 85h TRISIO --11 1111 --11 1111 8Ch PIE1 00-- 0--0 00-- 0--0 9Eh ADRESL xxxx xxxx uuuu uuuu 9Fh ANSEL -000 1111 -000 1111 Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D converter module. DS70091B-page 44 ADFM VCFG -- -- CHS1 -- -- TRISIO5 TRISIO4 TRISIO3 EEIE ADIE -- -- CMIE CHS0 GO ADON TRISIO2 TRISIO1 TRISIO0 -- -- TMR1IE Least Significant 2 bits of the Left Shifted A/D Result or 8 bits of the Right Shifted Result -- ADCS2 ADCS1 ADCS0 ANS3 Preliminary ANS2 ANS1 ANS0 2003-2013 Microchip Technology Inc. rfPIC12F675 8.0 DATA EEPROM MEMORY The EEPROM data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers. There are four SFRs used to read and write this memory: The EEPROM data memory allows byte read and write. A byte write automatically erases the location and writes the new data (erase before write). The EEPROM data memory is rated for high erase/write cycles. The write time is controlled by an on-chip timer. The write time will vary with voltage and temperature as well as from chip to chip. Please refer to AC Specifications for exact limits. * * * * EECON1 EECON2 (not a physically implemented register) EEDATA EEADR When the data memory is code protected, the CPU may continue to read and write the data EEPROM memory. The device programmer can no longer access this memory. EEDATA holds the 8-bit data for read/write, and EEADR holds the address of the EEPROM location being accessed. The rfPIC12F675 devices have 128 bytes of data EEPROM with an address range from 0h to 7Fh. Additional information on the Data EEPROM is available in the PIC Mid-Range Reference Manual (DS33023). REGISTER 8-1: EEDAT -- EEPROM DATA REGISTER (ADDRESS: 9Ah) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 R/W-0 R/W-0 EEDAT2 EEDAT1 R/W-0 EEDAT0 bit 7 bit 7-0 bit 0 EEDATn: Byte value to write to or read from Data EEPROM Legend: REGISTER 8-2: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown EEADR -- EEPROM ADDRESS REGISTER (ADDRESS: 9Bh) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 -- EADR6 EADR5 EADR4 EADR3 EADR2 EADR1 EADR0 bit 7 bit 0 bit 7 Unimplemented: Should be set to '0' bit 6-0 EEADR: Specifies one of 128 locations for EEPROM Read/Write Operation Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003-2013 Microchip Technology Inc. Preliminary x = Bit is unknown DS70091B-page 45 rfPIC12F675 8.1 EEADR The EEADR register can address up to a maximum of 128 bytes of data EEPROM. Only seven of the eight bits in the register (EEADR<6:0>) are required. The MSb (bit 7) is ignored. The upper bit should always be `0' to remain upward compatible with devices that have more data EEPROM memory. 8.2 EECON1 AND EECON2 REGISTERS EECON1 is the control register with four low order bits physically implemented. The upper four bits are nonimplemented and read as '0's. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion REGISTER 8-3: of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset, or a WDT Time-out Reset during normal operation. In these situations, following RESET, the user can check the WRERR bit, clear it, and rewrite the location. The data and address will be cleared, therefore, the EEDATA and EEADR registers will need to be reinitialized. Interrupt flag bit EEIF in the PIR1 register is set when write is complete. This bit must be cleared in software. EECON2 is not a physical register. Reading EECON2 will read all '0's. The EECON2 register is used exclusively in the Data EEPROM write sequence. EECON1 -- EEPROM CONTROL REGISTER (ADDRESS: 9Ch) U-0 U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0 -- -- -- -- WRERR WREN WR RD bit 7 bit 0 bit 7-4 Unimplemented: Read as `0' bit 3 WRERR: EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during normal operation or BOD detect) 0 = The write operation completed bit 2 WREN: EEPROM Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the data EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle (The bit is cleared by hardware once write is complete. The WR bit can only be set, not cleared, in software.) 0 = Write cycle to the data EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set, not cleared, in software.) 0 = Does not initiate an EEPROM read DS70091B-page 46 Legend: S = Bit can only be set R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared Preliminary x = Bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 8.3 READING THE EEPROM DATA MEMORY After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. To read a data memory location, the user must write the address to the EEADR register and then set control bit RD (EECON1<0>), as shown in Example 8-1. The data is available, in the very next cycle, in the EEDATA register. Therefore, it can be read in the next instruction. EEDATA holds this value until another read, or until it is written to by the user (during a write operation). EXAMPLE 8-1: bsf movlw movwf bsf movf 8.4 8.5 ;Bank 1 ; ;Address to read ;EE Read ;Move data to W EXAMPLE 8-3: WRITING TO THE EEPROM DATA MEMORY To write an EEPROM data location, the user must first write the address to the EEADR register and the data to the EEDATA register. Then the user must follow a specific sequence to initiate the write for each byte, as shown in Example 8-2. EXAMPLE 8-2: Required Sequence WRITE VERIFY bcf : bsf movf STATUS,RP0 bsf EECON1,RD STATUS,RP0 EEDATA,W xorwf EEDATA,W btfss STATUS,Z goto WRITE_ERR : ;Bank 0 ;Any code ;Bank 1 READ ;EEDATA not changed ;from previous write ;YES, Read the ;value written ;Is data the same ;No, handle error ;Yes, continue DATA EEPROM WRITE 8.5.1 bsf bsf bcf movlw movwf movlw movwf bsf bsf WRITE VERIFY Depending on the application, good programming practice may dictate that the value written to the data EEPROM should be verified (see Example 8-3) to the desired value to be written. DATA EEPROM READ STATUS,RP0 CONFIG_ADDR EEADR EECON1,RD EEDATA,W At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. The EEIF bit (PIR<7>) register must be cleared by software. STATUS,RP0 EECON1,WREN INTCON,GIE 55h EECON2 AAh EECON2 EECON1,WR INTCON,GIE ;Bank 1 ;Enable write ;Disable INTs ;Unlock write ; ; ; ;Start the write ;Enable INTS The write will not initiate if the above sequence is not exactly followed (write 55h to EECON2, write AAh to EECON2, then set WR bit) for each byte. We strongly recommend that interrupts be disabled during this code segment. A cycle count is executed during the required sequence. Any number that is not equal to the required cycles to execute the required sequence will prevent the data from being written into the EEPROM. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware. 2003-2013 Microchip Technology Inc. USING THE DATA EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specifications D120 or D120A. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in FLASH program memory. 8.6 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: * brown-out * power glitch * software malfunction Preliminary DS70091B-page 47 rfPIC12F675 8.7 DATA EEPROM OPERATION DURING CODE PROTECT Data memory can be code protected by programming the CPD bit to `0'. When the data memory is code protected, the CPU is able to read and write data to the Data EEPROM. It is recommended to code protect the program memory when code protecting data memory. This prevents anyone from programming zeroes over the existing code (which will execute as NOPs) to reach an added routine, programmed in unused program memory, which outputs the contents of data memory. Programming unused locations to `0' will also help prevent data memory code protection from becoming breached. TABLE 8-1: Address REGISTERS/BITS ASSOCIATED WITH DATA EEPROM Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 EEIF ADIF -- -- CMIF -- -- 0Ch PIR1 9Ah EEDATA 9Bh EEADR -- 9Ch EECON1 -- 9Dh EECON2(1) EEPROM Control Register 2 Bit 0 0000 0000 0000 0000 EEPROM Address Register -- Value on all other RESETS TMR1IF 00-- 0--0 00-- 0--0 EEPROM Data Register -- Value on POR, BOD -- -000 0000 -000 0000 WRERR WREN WR RD ---- x000 ---- q000 ---- ---- ---- ---- Legend: x = unknown, u = unchanged, - = unimplemented read as '0', q = value depends upon condition. Shaded cells are not used by Data EEPROM module. Note 1: EECON2 is not a physical register. DS70091B-page 48 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 9.0 UHF ASK/FSK TRANSMITTER 9.1 Transmitter Operation FIGURE 9-1: The transmitter is a fully integrated UHF ASK/FSK transmitter consisting of crystal oscillator, PhaseLocked Loop (PLL), Power Amplifier (PA) with opencollector output, and mode control logic. There are 3 variations of this device to optimize its performance for the most commonly used frequency bands. TABLE 9-1: TRANSMITTER BLOCK DIAGRAM Clock Divider REFCLK Crystal Oscillator RFXTAL FREQUENCY BANDS Device Frequency Modulation rfPIC12F675K 290-350 MHz ASK/FSK rfPIC12F675F 390-450 MHz ASK/FSK rfPIC12F675H 850-930 MHz ASK/FSK Phase/Freq Detector Divide by 32 LF The internal structure of the transmitter is shown in Figure 9-1. A Colpitts oscillator generates the reference frequency set by the attached crystal. The voltage controlled oscillator (VCO) converts the voltage on the LF pin to a frequency. This frequency is divided by 32 and compared to the crystal reference. If the frequency or phase does not match the reference, the charge pump corrects the voltage on the LF pin. The VCO output signal is also amplified by the PA, whose single ended output drives the user's antenna. The external components required are a crystal to set the transmit frequency, a supply bypass capacitor, and two to seven biasing/impedance matching components to get maximum power to the antenna. The two control signals from the microcontroller are connected externally for maximum design flexibility. The rfPIC12F675 is capable of transmitting data by Amplitude Shift Keying (ASK) or Frequency Shift Keying (FSK). The rfPIC12F675 is a radio frequency (RF) emitting device. Wireless RF devices are governed by a country's regulating agency. For example, in the United States it is the Federal Communications Committee (FCC) and in Europe it is the European Conference of Postal and Telecommunications Administrations (CEPT). It is the responsibility of the designer to ensure that their end product conforms to rules and regulations of the country of use and/or sale. RF devices require correct board level implementation in order to meet regulatory requirements. Layout considerations are listed at the end of each subsection. It is required to place a ground plane on the PCB to reduce unwanted radio frequency emissions. 2003-2013 Microchip Technology Inc. Charge Pump Voltage Controlled Oscillator PS DATAASK RFEN RF Power Amplifier RF Control Logic ANT VDDRF VSSRF VSSRF DATAFSK FSK Switch 9.2 FSKOUT Supply Voltage (VDDRF, VSSRF) Pins VDDRF and VSSRF supply power and ground respectively to the transmitter. These power pins are separate from power supply pins VDD and VSS to the microcontroller. Both VSSRF pins should be tied to the ground plane with the shortest possible traces. The microcontroller ground should be tied to the same RF ground potential. However, the VDDRF supply can be at a different potential than the microcontroller as long as the RFEN and DATA input levels are within specification limits. Layout Considerations - Provide low impedance power and ground traces to minimize spurious emissions. A two-sided PCB with a ground plane on the bottom layer is highly recommended. Separate bypass capacitors should be connected as close as possible to each of the supply pins VDD and VDDRF. Connect both VSSRF pins to the ground plane using multiple PCB vias adjacent to the VSSRF pads. Do not share these PCB vias with other ground traces. Filter the VDDRF with an RC filter if the microcontroller noise spurs exceed regulatory limits. Preliminary DS70091B-page 49 rfPIC12F675 9.3 Crystal Oscillator 9.4 The transmitter crystal oscillator is a Colpitts oscillator that provides the reference frequency to the PLL. It is independent of the microcontroller oscillator. An external crystal or AC coupled reference signal is connected to the XTAL pin. The transmit frequency is fixed and determined by the crystal frequency according to the formula: f transmit f 32 RFXTAL Due to the flexible selection of transmit frequency, the resulting crystal frequency may not be a standard offthe-shelf value. Therefore, for some carrier frequencies the designer will have to consult a crystal manufacturer and have a custom crystal manufactured. For background information on crystal selection see Application Note AN588, PIC(R) Microcontroller Oscillator Design Guide, and AN826 Crystal Oscillator Basics and Crystal Selection for rfPICTM and PIC(R) Devices. ASK Modulation In ASK modulation the data is transmitted by varying the output power. The DATAASK pin enables the PA, toggling the pin turns the RF output signal on and off. A simple receiver using a tuned filter and peak detector diode can capture the data. A more advanced superheterodyne receiver such as the rfRXD0420 can greatly increase the range and reduce susceptibility to interference. In ASK mode the DATAFSK and FSKOUT pins are not used and should both be tied to ground. An example of a typical ASK circuit is shown in Figure 9-5. The C1 capacitor can be replaced by a short to simplify the transmitter if the receiver has a wide enough bandwidth. For a very narrowband receiver the C1 capacitor may need to be replaced by a trimmer cap to tune the transmitter to the exact frequency. FIGURE 9-2: For ASK modulation the crystal can be connected directly from RFXTAL to ground, or in series with an additional capacitor to trim the frequency. Figure 9-2 shows how the crystal is connected and Table 9-2 shows how the frequency of a typical crystal changes with capacitance. XTAL X1 The oscillator is enabled when the RFEN input is high. It takes the crystal approximately 1 ms to start oscillating. Higher frequency crystals start-up faster than lower frequencies. The crystal oscillator start time (TON) is listed in Table 13-11, Transmitter AC Characteristics. This start-up time is mainly due to the crystal building up an oscillation, but also includes the time for the PLL to lock on the crystal frequency. TABLE 9-2: ASK CRYSTAL CIRCUIT rfPIC12F675K/F/H C1 XTAL OSC APPROXIMATE FREQ. VS. CAPACITANCE (ASK MODE) (1) C1 Predicted Frequency (MHz) PPM from 13.55 MHz Transmit Frequency (MHz) (32 * fXTAL) 22 pF 13.551438 +106 433.646 39 pF 13.550563 +42 433.618 100 pF 13.549844 -12 433.595 150 pF 13.549672 -24 433.5895 470 pF 13.549548 -33 433.5856 1000 pF 13.549344 -48 433.579 Note 1: Standard Operating Conditions (unless otherwise stated) TA = 25C, RFEN = 1, VDDRF = 3V, fXTAL = 13.55 MHz DS70091B-page 50 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 9.5 FSK Modulation In FSK modulation the transmit data is sent by varying the output frequency. This is done by loading the reference crystal with extra capacitance to pull it to a slightly lower frequency which the PLL then tracks. Switching the capacitance in and out with the data signal toggles the transmitter between two frequencies. These two crystal based frequencies are then multiplied by 32 for the RF transmit frequency. In FSK mode the DATAASK pin should be tied high to enable the PA. The FSK circuit is shown in Figure 9-6. Use accurate crystals for narrow bandwidth systems and large values for C1 to reduce frequency drift. FIGURE 9-3: FSK CRYSTAL CIRCUIT XTAL Unlike the ASK transmit frequency the FSK center frequency is not actually transmitted. It is the artificial point half way between the two transmitted frequencies, calculated with this formula. fc X1 C2 f max f min 2 FSKOUT C1 The other important parameter in FSK is the frequency deviation of the transmit frequency. This measures how far the frequency will swing from the center frequency. Single ended deviation is calculated with this formula. f f max f min 2 FIGURE 9-4: An FSK receiver will specify its optimal value of deviation. The single ended deviation must be greater than data rate / 4. The minimum deviation is usually limited by the frequency accuracy of the transmitter and receiver components. The maximum deviation is usually limited by the pulling characteristics of the transmitter crystal. FREQUENCY PULLING Fmax Frequency (MHz) An extra capacitor and the internal switch are added to the ASK design to build an FSK transmitter as shown in Figure 9-3. The C1 capacitor in series with the crystal determines the maximum frequency. Fmin With the DATAFSK pin high the FSKOUT pin is open and the C2 capacitor does not affect the frequency. When the DATAFSK pin goes low, FSKOUT shorts to ground, and the C2 is thrown in parallel with C1. The sum of the two caps pulls the oscillation frequency lower as shown in Figure 9-4. TABLE 9-3: rfPIC12F675K/F/H C1 C1||C2 DATAFSK = 1 DATAFSK = 0 Load Capacitance (pF) TYPICAL TRANSMIT CENTER FREQUENCY AND DEVIATION (FSK MODE) (1) C2 = 1000 pF C2 = 100 pF C2 = 47 pF C1 (pF) Freq (MHz) / Dev (kHz) Freq (MHz) / Dev (kHz) Freq (MHz) / Dev (kHz) 22 433.612 / 34 433.619 / 27 433.625 / 21 33 433.604 / 25 433.610 / 19 433.614 / 14 39 433.598 / 20 433.604 / 14 433.608 / 10 47 433.596 / 17 433.601 / 11.5 433.604 / 8 68 433.593 / 13 433.598 / 9 433.600 / 5.5 100 433.587 / 8 -- -- Note 1: Standard Operating Conditions, TA = 25C, RFEN = 1, VDDRF = 3V, fXTAL = 13.55 MHz 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 51 rfPIC12F675 FIGURE 9-5: TYPICAL ASK TRANSMITTER SCHEMATIC +V C3 0.1 F X1 C1 R1 C4 100 pF 1 2 3 4 5 6 7 8 9 10 20 VDD VSS 19 GP5/T1CKI/OSC1/CLKIN GP0/AN0/CIN+/ICSPDAT 18 GP4/AN3/T1G/OSC2/CLKOUT GP1/AN1/CIN-/VREF/ICSPCLK 17 GP3/MCLR/VPP GP2/AN2/T0CKI/INT/COUT 16 RFXTAL FSKOUT 15 DATAFSK RFENIN 14 DATAASK CLKOUT 13 PS LF 12 U1 VSSRF VDDRF 11 rfPIC12F675K VSSRF ANT SW2 SW1 C1 can be shorted R1 can be omitted +V L1 120 nH R2 4.7 k C5 100 pF +V C6 5 pF + - FIGURE 9-6: BT1 CR2032 3V Lithium Cell Loop Antenna C7 4 pF TYPICAL FSK TRANSMITTER SCHEMATIC +V C3 0.1 F X1 13.55 MHz C1 39 pF R1 220 k C4 100 pF 1 2 3 4 5 6 7 8 9 10 VDD VSS GP5/T1CKI/OSC1/CLKIN GP0/AN0/CIN+/ICSPDAT GP4/AN3/T1G/OSC2/CLKOUT GP1/AN1/CIN-/VREF/ICSPCLK GP3/MCLR/VPP GP2/AN2/T0CKI/INT/COUT RFXTAL FSKOUT DATAFSK RFENIN DATAASK CLKOUT PS LF U1 VSSRF VDDRF rfPIC12F675K VSSRF ANT 20 19 18 17 16 15 14 13 12 11 +V SW2 SW1 C2 1000 pF +V C5 100 pF L1 120 nH R2 4.7 k +V C6 5 pF + - DS70091B-page 52 BT1 CR2032 3V Lithium Cell Preliminary Loop Antenna C7 4 pF 2003-2013 Microchip Technology Inc. rfPIC12F675 9.6 Clock Output 9.8 The clock output is available to the microcontroller or other circuits requiring an accurate reference frequency. This signal would typically be used to correct the internal RC oscillator for system designs that require accurate bit synchronization or tight time division multiplexing. The REFCLK output can connect directly to the T0CKI or T1CKI. The PLL output feeds the power amplifier (PA) which drives the open-collector ANT output. The output should be DC biased with an inductor to the VDDRF supply. The output impedance must be matched to the load impedance to deliver the maximum power. This is typically done with a transformer or tapped capacitor circuit. Failure to match the impedance may cause excessive spurious and harmonic emissions. For more information on transformer matching see Application Note AN831, Matching Small Loop Antennas to rfPICTM Devices. For more information on tapped capacitor matching see Application Note AN242 Designing an FCC Approved ASK rfPICTM Transmitter. The REFCLK output frequency is the crystal oscillator divided by 4 on the rfPIC12F675K and rfPIC12F675F. For the rfPIC12F675H the crystal oscillator is divided by 8. Layout considerations - Keep the clock trace short and narrow yet as far as possible from other traces to reduce capacitance and the associated current draw. If the REFCLK trace must pass near the crystal and LF nodes then shield them with ground traces. 9.7 Power Amplifier The transmit output power can be adjusted in five discrete steps from +9 dBm to -70 dBm by varying the voltage on the PS pin. Since the PS pin has an internal 8 A source the voltage can be set with a resistor from the PS pin to ground as shown in Figure 9-7. Some possible resistor values to set the current are shown in Table 9-4. Phase-Locked Loop Filter The LF pin connects to an internal node on the PLL filter. Typically the pin should not be connected. In specialized cases it may be necessary to load this pin with extra capacitance to ground. Adding capacitance reduces the loop filter bandwidth which trades off an increase in phase noise for a reduction in clock spurs. It is usually desirable to select the lowest power level step that does not compromise communications reliablity. The most important benefit is the conservation of battery power. Another reason is to make it easier to pass regulatory limits. And a third reason is to reduce interference to other communications in the shared RF spectrum. Small inefficient antennas will require higher power level settings than larger efficient antennas. Useful diagnostic measurements can be taken on the LF pin with a high impedance, low capacitance probe. Measuring the time from RFEN going high until the LF voltage stabilizes will determine the minimum delay before the start of a transmission. For more information on PLL filters refer to Application Note AN846 Basic PLL Filters for the rfPICTM/rfHCS. FIGURE 9-7: .POWER SELECT CIRCUIT rfPIC12F675 VPS IPS = 8 A Layout considerations - Keep traces short and if the optional loop filter capacitor is required, place it as close as possible to the LF pin with its own via to the ground plane. PS To power select circuitry R1 TABLE 9-4: POWER SELECT RESISTOR SELECTION (1,2) Power Step Output Power (dBm) PS Voltage (Volts) R1 Resistance () RF Transmitter Current (mA) 4 9 1.6 open 10.7 (3) 3 2 0.8 2 -4 0.4 47k (3) 4.7 1 -12 0.2 3.5 0 -70 0.1 22k (3) short 100k 6.5 2.7 Note 1: Standard Operating Conditions, TA = 25C, RFEN = 1, VDDRF = 3V, fTRANSMIT = 433.92 MHz 2: Typical values, for complete specifications see data sheet Section 13.0. 3: R1 resistor variations plus IPS current supply variations must not exceed VPS step limits. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 53 rfPIC12F675 9.9 Digital Control Signals The mode control logic pin RFEN controls the operation of the transmitter. When RFEN goes high, the crystal oscillator starts up. The voltage on the LF pin ramps up proportionally to the RF frequency. The PLL can lock onto the frequency faster than the starting up crystal can stabilize. When the LF pin reaches 0.8V, the RF frequency is close to locked on the crystal frequency. This initiates a 150 microsecond delay to ensure that the PLL settles. After the delay, the PS bias current and power amplifier are enabled to start transmitting when DATAASK goes high. When RFEN is low, the transmitter goes into a very low power Standby mode. The power amplifier is disabled and the crystal oscillator stops. The RFEN pin has an internal pull-down resistor. 9.10 Low Voltage Output Disable The rfPIC12F675 transmitter has a built in low voltage disable centered at about 1.85V. If the supply voltage drops below this voltage the power amplifier is disabled to prevent uncontrolled transmissions. DS70091B-page 54 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 10.0 SPECIAL FEATURES OF THE CPU Certain special circuits that deal with the needs of real time applications are what sets a microcontroller apart from other processors. The rfPIC12F675 Family has a host of such features intended to: * maximize system reliability * minimize cost through elimination of external components * provide power saving operating modes and offer code protection. These features are: * Oscillator selection * RESET - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Detect (BOD) * Interrupts * Watchdog Timer (WDT) * SLEEP * Code protection * ID Locations * In-Circuit Serial Programming 2003-2013 Microchip Technology Inc. The rfPIC12F675 has a Watchdog Timer that is controlled by configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in RESET until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only, designed to keep the part in RESET while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can provide at least a 72 ms RESET. With these three functions on-chip, most applications need no external RESET circuitry. The SLEEP mode is designed to offer a very low current Power-down mode. The user can wake-up from SLEEP through: * External RESET * Watchdog Timer wake-up * An interrupt Several oscillator options are also made available to allow the part to fit the application. The INTOSC option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options (see Register 10-1). Preliminary DS70091B-page 55 rfPIC12F675 10.1 Configuration Bits Note: The configuration bits can be programmed (read as '0'), or left unprogrammed (read as '1') to select various device configurations, as shown in Register 10-1. These bits are mapped in program memory location 2007h. REGISTER 10-1: R/P-1 R/P-1 BG1 bit 13 bit 13-12 bit 11-9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2-0 CONFIG -- CONFIGURATION WORD (ADDRESS: 2007h) U-0 U-0 U-0 R/P-1 R/P-1 -- -- -- CPD CP BG0 Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h 3FFFh), which can be accessed only during programming. See rfPIC12F675 Programming Specification for more information. R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BODEN MCLRE PWRTE WDTE F0SC2 F0SC1 F0SC0 bit 0 BG1:BG0: Bandgap Calibration bits for BOD and POR voltage(1) 00 = Lowest bandgap voltage 11 = Highest bandgap voltage Unimplemented: Read as `0' CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled CP: Code Protection bit(3) 1 = Program Memory code protection is disabled 0 = Program Memory code protection is enabled BODEN: Brown-out Detect Enable bit(4) 1 = BOD enabled 0 = BOD disabled MCLRE: GP3/MCLR pin function select(5) 1 = GP3/MCLR pin function is MCLR 0 = GP3/MCLR pin function is digital I/O, MCLR internally tied to VDD PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled FOSC2:FOSC0: Oscillator Selection bits 111 = RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 110 = RC oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 101 = INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 100 = INTOSC oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 011 = EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN 010 = HS oscillator: High speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 000 = LP oscillator: Low power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN Note 1: The Bandgap Calibration bits are factory programmed and must be read and saved prior to erasing the device as specified in the rfPIC12F675 Programming Specification. These bits are reflected in an export of the configuration word. Microchip Development Tools maintain all calibration bits to factory settings. 2: The entire data EEPROM will be erased when the code protection is turned off. 3: The entire program memory will be erased, including OSCCAL value, when the code protection is turned off. 4: Enabling Brown-out Detect does not automatically enable Power-up Timer. 5: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled. Legend: P = Programmed using ICSP R = Readable bit -n = Value at POR DS70091B-page 56 W = Writable bit 1 = bit is set Preliminary U = Unimplemented bit, read as `0' 0 = bit is cleared x = bit is unknown 2003-2013 Microchip Technology Inc. rfPIC12F675 10.2 FIGURE 10-2: Oscillator Configurations 10.2.1 OSCILLATOR TYPES The rfPIC12F675 can be operated in eight different Oscillator Option modes. The user can program three configuration bits (FOSC2 through FOSC0) to select one of these eight modes: * * * * * * Note: TABLE 10-1: In XT, LP or HS modes a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation (see Figure 10-1). The rfPIC12F675 oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may yield a frequency outside of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1 pin (see Figure 10-2). CRYSTAL OPERATION (OR CERAMIC RESONATOR) HS, XT OR LP OSC CONFIGURATION To Internal Logic XTAL Mode Freq OSC1(C1) OSC2(C2) XT 455 kHz 2.0 MHz 4.0 MHz 68 - 100 pF 15 - 68 pF 15 - 68 pF 68 - 100 pF 15 - 68 pF 15 - 68 pF HS 8.0 MHz 16.0 MHz 10 - 68 pF 10 - 22 pF 10 - 68 pF 10 - 22 pF Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. TABLE 10-2: RF Freq OSC1(C1) OSC2(C2) LP 32 kHz 68 - 100 pF 68 - 100 pF XT 100 kHz 2 MHz 4 MHz 68 - 150 pF 15 - 30 pF 15 - 30 pF 150 - 200 pF 15 - 30 pF 15 - 30 pF HS 8 MHz 10 MHz 20 MHz 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF OSC2 C2(1) 1: 2: 3: RS(2) PIC12F629/675 See Table 10-1 and Table 10-2 for recommended values of C1 and C2. A series resistor may be required for AT strip cut crystals. RF varies with the Oscillator mode selected (Approx. value = 10 M 2003-2013 Microchip Technology Inc. CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Mode SLEEP (3) CAPACITOR SELECTION FOR CERAMIC RESONATORS Ranges Characterized: OSC1 C1(1) OSC2(1) Note 1: Functions as GP4 in EC Osc mode. CRYSTAL OSCILLATOR / CERAMIC RESONATORS FIGURE 10-1: OSC1 Open Additional information on oscillator configurations is available in the PICmicroTM Mid-Range Reference Manual, (DS33023) 10.2.2 Clock from External System PIC12F629/675 LP Low Power Crystal XT Crystal/Resonator HS High Speed Crystal/Resonator RC External Resistor/Capacitor (2 modes) INTOSC Internal Oscillator (2 modes) EC External Clock In Note EXTERNAL CLOCK INPUT OPERATION (HS, XT, EC, OR LP OSC CONFIGURATION) Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. Preliminary DS70091B-page 57 rfPIC12F675 10.2.3 EXTERNAL CLOCK IN 10.2.5 For applications where a clock is already available elsewhere, users may directly drive the rfPIC12F675 provided that this external clock source meets the AC/ DC timing requirements listed in Section 13.0. Figure 10-2 shows how an external clock circuit should be configured. Note: 10.2.4 The microcontroller oscillator is independent of the RF peripheral oscillator. An accurate time-base is still possible with only one crystal. Use the RF crystal on transmitter and tie the REFCLK signal back into T0CKI or T1CKI to correct the RC, INTOSC, or EC clocks. Since REFCLK is only active when RFEN=1, it is not a suitable source for CLKIN. RC OSCILLATOR For applications where precise timing is not a requirement, the RC oscillator option is available. The operation and functionality of the RC oscillator is dependent upon a number of variables. The RC oscillator frequency is a function of: INTERNAL 4 MHZ OSCILLATOR When calibrated, the internal oscillator provides a fixed 4 MHz (nominal) system clock. See Electrical Specifications, Section 13.0, for information on variation over voltage and temperature. Two options are available for this Oscillator mode which allow GP4 to be used as a general purpose I/O or to output FOSC/4. 10.2.5.1 Calibrating the Internal Oscillator A calibration instruction is programmed into the last location of program memory. This instruction is a RETLW XX, where the literal is the calibration value. The literal is placed in the OSCCAL register to set the calibration of the internal oscillator. Example 10-1 demonstrates how to calibrate the internal oscillator. For best operation, decouple (with capacitance) VDD and VSS as close to the device as possible. Note: * Supply voltage * Resistor (REXT) and capacitor (CEXT) values * Operating temperature Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be saved prior to erasing part as specified in the rfPIC12F675 Programming specification. Microchip Development Tools maintain all calibration bits to factory settings. The oscillator frequency will vary from unit to unit due to normal process parameter variation. The difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to account for the tolerance of the external R and C components. Figure 10-3 shows how the R/C combination is connected. EXAMPLE 10-1: Two options are available for this Oscillator mode which allow GP4 to be used as a general purpose I/O or to output FOSC/4. 10.2.6 FIGURE 10-3: RC OSCILLATOR MODE VDD bsf call movwf bcf CALIBRATING THE INTERNAL OSCILLATOR STATUS, RP0 3FFh OSCCAL STATUS, RP0 ;Bank 1 ;Get the cal value ;Calibrate ;Bank 0 CLKOUT The rfPIC12F675 devices can be configured to provide a clock out signal in the INTOSC and RC oscillator modes. When configured, the oscillator frequency divided by four (FOSC/4) is output on the GP4/OSC2/ CLKOUT pin. FOSC/4 can be used for test purposes or to synchronize other logic. PIC12F629/675 REXT GP5/OSC1/ CLKIN Internal Clock CEXT VSS FOSC/4 GP4/OSC2/CLKOUT DS70091B-page 58 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 10.3 RESET The rfPIC12F675 differentiates between various kinds of RESET: a) b) c) d) e) f) Power-on Reset (POR) WDT Reset during normal operation WDT Reset during SLEEP MCLR Reset during normal operation MCLR Reset during SLEEP Brown-out Detect (BOD) A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 10-4. Some registers are not affected in any RESET condition; their status is unknown on POR and unchanged in any other RESET. Most other registers are reset to a "RESET state" on: * * * * * They are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different RESET situations as indicated in Table 10-4. These bits are used in software to determine the nature of the RESET. See Table 10-7 for a full description of RESET states of all registers. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Table 13-4 in Electrical Specifications Section for pulse width specification. Power-on Reset MCLR Reset WDT Reset WDT Reset during SLEEP Brown-out Detect (BOD) Reset FIGURE 10-4: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/ VPP pin WDT WDT Module SLEEP Time-out Reset VDD Rise Detect Power-on Reset VDD Brown-out Detect BODEN S Q R Q OST/PWRT OST Chip_Reset 10-bit Ripple Counter OSC1/ CLKIN pin PWRT On-chip(1) RC OSC 10-bit Ripple Counter Enable PWRT See Table 10-3 for time-out situations. Enable OST Note 1: This is a separate oscillator from the INTOSC/EC oscillator. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 59 rfPIC12F675 10.3.1 10.3.3 MCLR The rfPIC12F675 devices have a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. The behavior of the ESD protection on the MCLR pin has been altered from previous devices of this family. Voltages applied to the pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 10-5, is suggested. An internal MCLR option is enabled by setting the MCLRE bit in the configuration word. When enabled, MCLR is internally tied to VDD. No internal pull-up option is available for the MCLR pin. The Power-up Timer provides a fixed 72 ms (nominal) time-out on power-up only, from POR or Brown-out Detect. The Power-up Timer operates on an internal RC oscillator. The chip is kept in RESET as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A configuration bit, PWRTE can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should always be enabled when Brown-out Detect is enabled. The Power-up Time delay will vary from chip to chip and due to: * VDD variation * Temperature variation * Process variation See DC parameters for details (Section 13.0). 10.3.4 FIGURE 10-5: RECOMMENDED MCLR CIRCUIT VDD POWER-UP TIMER (PWRT) OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. PIC12F629/675 R1 1 kor greater The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from SLEEP. MCLR C1 0.1 f (optional, not critical) 10.3.2 POWER-ON RESET (POR) The on-chip POR circuit holds the chip in RESET until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply tie the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Electrical Specifications for details (see Section 13.0). Note: The POR circuit does not produce an internal RESET when VDD declines. When the device starts normal operation (exits the RESET condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in RESET until the operating conditions are met. For additional information, refer to Application Note AN607 "Power-up Trouble Shooting". DS70091B-page 60 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 10.3.5 BROWN-OUT DETECT (BOD) On any RESET (Power-on, Brown-out, Watchdog, etc.), the chip will remain in RESET until VDD rises above BVDD (see Figure 10-6). The Power-up Timer will now be invoked, if enabled, and will keep the chip in RESET an additional 72 ms. The rfPIC12F675 members have on-chip Brown-out Detect circuitry. A configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Detect circuitry. If VDD falls below VBOD for greater than parameter (TBOD) in Table 13-4 (see Section 13.0), the Brown-out situation will reset the device. This will occur regardless of VDD slew-rate. A RESET is not guaranteed to occur if VDD falls below VBOD for less than parameter (TBOD). FIGURE 10-6: Note: A Brown-out Detect does not enable the Power-up Timer if the PWRTE bit in the configuration word is set. If VDD drops below BVDD while the Power-up Timer is running, the chip will go back into a Brown-out Detect and the Power-up Timer will be re-initialized. Once VDD rises above BVDD, the Power-up Timer will execute a 72 ms RESET. BROWN-OUT SITUATIONS VDD VBOD Internal RESET 72 ms(1) VDD VBOD Internal RESET <72 ms 72 ms(1) VDD VBOD Internal RESET 72 ms(1) Note 1: 72 ms delay only if PWRTE bit is programmed to `0'. 10.3.6 TIME-OUT SEQUENCE 10.3.7 On power-up, the time-out sequence is as follows: first, PWRT time-out is invoked after POR has expired. Then, OST is activated. The total time-out will vary based on oscillator configuration and PWRTE bit status. For example, in EC mode with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figure 10-7, Figure 10-8 and Figure 10-9 depict time-out sequences. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (see Figure 10-8). This is useful for testing purposes or to synchronize more than one rfPIC12F675 device operating in parallel. Table 10-6 shows the RESET conditions for some special registers, while Table 10-7 shows the RESET conditions for all the registers. 2003-2013 Microchip Technology Inc. POWER CONTROL (PCON) STATUS REGISTER The power CONTROL/STATUS (address 8Eh) has two bits. register, PCON Bit0 is BOD (Brown-out). BOD is unknown on Poweron Reset. It must then be set by the user and checked on subsequent RESETS to see if BOD = 0, indicating that a brown-out has occurred. The BOD STATUS bit is a don't care and is not necessarily predictable if the brown-out circuit is disabled (by setting BODEN bit = 0 in the Configuration word). Bit1 is POR (Power-on Reset). It is a `0' on Power-on Reset and unaffected otherwise. The user must write a `1' to this bit following a Power-on Reset. On a subsequent RESET, if POR is `0', it will indicate that a Power-on Reset must have occurred (i.e., VDD may have gone too low). Preliminary DS70091B-page 61 rfPIC12F675 TABLE 10-3: TIME-OUT IN VARIOUS SITUATIONS Power-up Brown-out Detect Oscillator Configuration Wake-up from SLEEP PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 XT, HS, LP TPWRT + 1024*TOSC 1024*TOSC TPWRT + 1024*TOSC 1024*TOSC 1024*TOSC RC, EC, INTOSC TPWRT -- TPWRT -- -- TABLE 10-4: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR BOD TO PD 0 u 1 1 Power-on Reset 1 0 1 1 Brown-out Detect u u 0 u WDT Reset u u 0 0 WDT Wake-up u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during SLEEP Legend: u = unchanged, x = unknown TABLE 10-5: Address SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT Value on POR, BOD Value on all other RESETS(1) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 03h STATUS IRP RP1 RPO TO PD Z DC C 0001 1xxx 000q quuu 8Eh PCON -- -- -- -- -- -- POR BOD ---- --0x ---- --uq Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Detect and Watchdog Timer Reset during normal operation. TABLE 10-6: INITIALIZATION CONDITION FOR SPECIAL REGISTERS Program Counter STATUS Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during SLEEP 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 uuuu ---- --uu PC + 1 uuu0 0uuu ---- --uu 000h 0001 1uuu ---- --10 uuu1 0uuu ---- --uu Condition WDT Wake-up Brown-out Detect Interrupt Wake-up from SLEEP PC + 1(1) Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0'. Note 1: When the wake-up is due to an interrupt and global enable bit GIE is set, the PC is loaded with the interrupt vector (0004h) after execution of PC+1. DS70091B-page 62 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 10-7: Register W INITIALIZATION CONDITION FOR REGISTERS Address Power-on Reset * MCLR Reset during normal operation * MCLR Reset during SLEEP * WDT Reset * Brown-out Detect(1) * Wake-up from SLEEP through interrupt * Wake-up from SLEEP through WDT time-out -- xxxx xxxx uuuu uuuu uuuu uuuu INDF 00h/80h -- -- -- TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu GPIO 05h --xx xxxx --uu uuuu --uu uuuu PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh 0000 0000 0000 000u uuuu uuqq(2) PIR1 0Ch 00-- 0--0 00-- 0--0 qq-- q--q(2,5) T1CON 10h -000 0000 -uuu uuuu -uuu uuuu CMCON 19h -0-0 0000 -0-0 0000 -u-u uuuu ADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 1Fh 00-- 0000 00-- 0000 uu-- uuuu OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu TRISIO 85h --11 1111 --11 1111 --uu uuuu PIE1 8Ch 00-- 0--0 00-- 0--0 uu-- u--u PCON 8Eh ---- --0x ---- --uu(1,6) ---- --uu OSCCAL 90h 1000 00-- 1000 00-- uuuu uu-- WPU 95h --11 -111 --11 -111 uuuu uuuu IOC 96h --00 0000 --00 0000 --uu uuuu VRCON 99h 0-0- 0000 0-0- 0000 u-u- uuuu EEDATA 9Ah 0000 0000 0000 0000 uuuu uuuu EEADR 9Bh -000 0000 -000 0000 -uuu uuuu EECON1 9Ch ---- x000 ---- q000 ---- uuuu EECON2 9Dh ---- ---- ---- ---- ---- ---- ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu ANSEL 9Fh -000 1111 -000 1111 -uuu uuuu Legend: Note 1: 2: 3: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 4: See Table 10-6 for RESET value for specific condition. 5: If wake-up was due to data EEPROM write completing, Bit 7 = 1; A/D conversion completing, Bit 6 = 1; Comparator input changing, bit 3 = 1; or Timer1 rolling over, bit 0 = 1. All other interrupts generating a wake-up will cause these bits to = u. 6: If RESET was due to brown-out, then bit 0 = 0. All other RESETS will cause bit 0 = u. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 63 rfPIC12F675 FIGURE 10-7: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal RESET FIGURE 10-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal RESET FIGURE 10-9: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR Internal POR TPWRT PWRT Time-out TOST OST Time-out Internal RESET DS70091B-page 64 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 10.4 Interrupts interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. The rfPIC12F675 has 7 sources of interrupt: * * * * * * * External Interrupt GP2/INT TMR0 Overflow Interrupt GPIO Change Interrupts Comparator Interrupt A/D Interrupt TMR1 Overflow Interrupt EEPROM Data Write Interrupt Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. The Interrupt Control register (INTCON) and Peripheral Interrupt register (PIR) record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts which were ignored are still pending to be serviced when the GIE bit is set again. A global interrupt enable bit, GIE (INTCON<7>) enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in INTCON register and PIE register. GIE is cleared on RESET. The return from interrupt instruction, RETFIE, exits interrupt routine, as well as sets the GIE bit, which re-enables unmasked interrupts. The following interrupt flags are contained in the INTCON register: * INT pin interrupt * GP port change interrupt * TMR0 overflow interrupt The peripheral interrupt flags are contained in the special register PIR1. The corresponding interrupt enable bit is contained in Special Register PIE1. The following interrupt flags are contained in the PIR register: * * * * EEPROM data write interrupt A/D interrupt Comparator interrupt Timer1 overflow interrupt When an interrupt is serviced: * The GIE is cleared to disable any further interrupt * The return address is pushed onto the stack * The PC is loaded with 0004h Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid GP2/ INT recursive interrupts. For external interrupt events, such as the INT pin, or GP port change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see Figure 10-11). The latency is the same for one or twocycle instructions. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 65 rfPIC12F675 FIGURE 10-10: INTERRUPT LOGIC IOC-GP0 IOC0 IOC-GP1 IOC1 IOC-GP2 IOC2 IOC-GP3 IOC3 IOC-GP4 IOC4 IOC-GP5 IOC5 TMR1IF TMR1IE CMIF CMIE ADIF ADIE T0IF T0IE Wake-up (If in SLEEP mode) INTF INTE GPIF GPIE Interrupt to CPU PEIE GIE EEIF EEIE DS70091B-page 66 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 10.4.1 GP2/INT INTERRUPT 10.4.3 External interrupt on GP2/INT pin is edge-triggered; either rising if INTEDG bit (OPTION<6>) is set, of falling, if INTEDG bit is clear. When a valid edge appears on the GP2/INT pin, the INTF bit (INTCON<1>) is set. This interrupt can be disabled by clearing the INTE control bit (INTCON<4>). The INTF bit must be cleared in software in the Interrupt Service Routine before re-enabling this interrupt. The GP2/INT interrupt can wake-up the processor from SLEEP if the INTE bit was set prior to going into SLEEP. The status of the GIE bit decides whether or not the processor branches to the interrupt vector following wake-up. See Section 10.9 for details on SLEEP and Figure 10-13 for timing of wake-up from SLEEP through GP2/INT interrupt. Note: 10.4.2 GPIO INTERRUPT An input change on GPIO change sets the GPIF (INTCON<0>) bit. The interrupt can be enabled/ disabled by setting/clearing the GPIE (INTCON<3>) bit. Plus individual pins can be configured through the IOC register. Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the GPIF interrupt flag may not get set. 10.4.4 COMPARATOR INTERRUPT See Section 6.9 for description of comparator interrupt. 10.4.5 The ANSEL (9Fh) and CMCON (19h) registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read `0'. A/D CONVERTER INTERRUPT After a conversion is complete, the ADIF flag (PIR<6>) is set. The interrupt can be enabled/disabled by setting or clearing ADIE (PIE<6>). See Section 7.0 for operation of the A/D converter interrupt. TMR0 INTERRUPT An overflow (FFh 00h) in the TMR0 register will set the T0IF (INTCON<2>) bit. The interrupt can be enabled/disabled by setting/clearing T0IE (INTCON<5>) bit. For operation of the Timer0 module, see Section 4.0. FIGURE 10-11: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT 3 4 INT pin 1 1 INTF Flag (INTCON<1>) Interrupt Latency 2 5 GIE bit (INTCON<7>) INSTRUCTION FLOW PC PC Instruction Fetched Inst (PC) Instruction Executed Inst (PC-1) PC+1 PC+1 Inst (PC+1) Inst (PC) -- Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in RC Oscillator mode. 4: For minimum width of INT pulse, refer to AC specs. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 67 rfPIC12F675 TABLE 10-8: Address SUMMARY OF INTERRUPT REGISTERS Name Bit 7 Bit 6 Bit 5 Bit 4 0Bh, 8Bh INTCON GIE PEIE T0IE 0Ch PIR1 EEIF ADIF -- 8Ch PIE1 EEIE ADIE -- Value on all other RESETS Bit 0 Value on POR, BOD GPIF 0000 0000 0000 000u Bit 3 Bit 2 Bit 1 INTE GPIE T0IF INTF -- CMIF -- -- TMR1IF 00-- 0--0 00-- 0--0 -- CMIE -- -- TMR1IE 00-- 0--0 00-- 0--0 Legend: x = unknown, u = unchanged, - = unimplemented read as '0', q = value depends upon condition. Shaded cells are not used by the Interrupt module. 10.5 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt, (e.g., W register and STATUS register). This must be implemented in software. Example 10-2 stores and restores the STATUS and W registers. The user register, W_TEMP, must be defined in both banks and must be defined at the same offset from the bank base address (i.e., W_TEMP is defined at 0x20 in Bank 0 and it must also be defined at 0xA0 in Bank 1). The user register, STATUS_TEMP, must be defined in Bank 0. The Example 10-2: * * * * Stores the W register Stores the STATUS register in Bank 0 Executes the ISR code Restores the STATUS (and bank select bit register) * Restores the W register EXAMPLE 10-2: MOVWF W_TEMP SWAPF BCF STATUS,W STATUS,RP0 SAVING THE STATUS AND W REGISTERS IN RAM ;copy W to temp register, could be in either bank ;swap status to be saved into W ;change to bank 0 regardless of current bank ;save status to bank 0 register Watchdog Timer (WDT) The Watchdog Timer is a free running, on-chip RC oscillator, which requires no external components. This RC oscillator is separate from the external RC oscillator of the CLKIN pin and INTOSC. That means that the WDT will run, even if the clock on the OSC1 and OSC2 pins of the device has been stopped (for example, by execution of a SLEEP instruction). During normal operation, a WDT time-out generates a device RESET. If the device is in SLEEP mode, a WDT time-out causes the device to wake-up and continue with normal operation. The WDT can be permanently disabled by programming the configuration bit WDTE as clear (Section 10.1). 10.6.1 MOVWF STATUS_TEMP : :(ISR) : SWAPF STATUS_TEMP,W;swap STATUS_TEMP register into W, sets bank to original state MOVWF STATUS ;move W into STATUS register SWAPF W_TEMP,F ;swap W_TEMP SWAPF W_TEMP,W ;swap W_TEMP into W DS70091B-page 68 10.6 WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The CLRWDT and SLEEP instructions clear the WDT and the prescaler, if assigned to the WDT, and prevent it from timing out and generating a device RESET. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. 10.6.2 WDT PROGRAMMING CONSIDERATIONS It should also be taken in account that under worst case conditions (i.e., VDD = Min., Temperature = Max., Max. WDT prescaler) it may take several seconds before a WDT time-out occurs. Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 10-12: WATCHDOG TIMER BLOCK DIAGRAM CLKOUT (= FOSC/4) Data Bus 0 8 1 SYNC 2 Cycles 1 T0CKI pin 0 T0CS T0SE TMR0 0 Set Flag bit T0IF on Overflow 8-bit Prescaler PSA 1 8 PSA 1 PS0 - PS2 WDT Time-out Watchdog Timer 0 PSA WDTE Note 1: T0SE, T0CS, PSA, PS0-PS2 are bits in the Option register. TABLE 10-9: Address SUMMARY OF WATCHDOG TIMER REGISTERS Name Bit 7 Bit 6 81h OPTION_REG GPPU INTEDG 2007h Config. bits CP Value on all other RESETS Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 F0SC2 F0SC1 F0SC0 uuuu uuuu uuuu uuuu BODEN MCLRE PWRTE WDTE Legend: u = Unchanged, shaded cells are not used by the Watchdog Timer. 10.7 ID Locations 10.8 Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution but are readable and writable during Program/Verify. Only the Least Significant 7 bits of the ID locations are used. 2003-2013 Microchip Technology Inc. Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. Note: Preliminary The entire data EEPROM and FLASH program memory will be erased when the code protection is turned off. The INTOSC calibration data is also erased. See rfPIC12F675 Programming Specification for more information. DS70091B-page 69 rfPIC12F675 10.9 Power-Down Mode (SLEEP) The Power-down mode is entered by executing a SLEEP instruction. If the Watchdog Timer is enabled: * * * * * External RESET input on MCLR pin Watchdog Timer Wake-up (if WDT was enabled) Interrupt from GP2/INT pin, GPIO change, or a peripheral interrupt. The first event will cause a device RESET. The two latter events are considered a continuation of program execution. The TO and PD bits in the STATUS register can be used to determine the cause of device RESET. The PD bit, which is set on power-up, is cleared when SLEEP is invoked. TO bit is cleared if WDT Wake-up occurred. WDT will be cleared but keeps running PD bit in the STATUS register is cleared TO bit is set Oscillator driver is turned off I/O ports maintain the status they had before SLEEP was executed (driving high, low, or hi-impedance). For lowest current consumption in this mode, all I/O pins should be either at VDD, or VSS, with no external circuitry drawing current from the I/O pin and the comparators and CVREF should be disabled. I/O pins that are hi-impedance inputs should be pulled high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on GPIO should be considered. The MCLR pin must be at a logic high level (VIHMC). Note: 1. 2. 3. When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction, then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have an NOP after the SLEEP instruction. Note: It should be noted that a RESET generated by a WDT time-out does not drive MCLR pin low. 10.9.1 WAKE-UP FROM SLEEP The device can wake-up from SLEEP through one of the following events: FIGURE 10-13: If the global interrupts are disabled (GIE is cleared), but any interrupt source has both its interrupt enable bit and the corresponding interrupt flag bits set, the device will immediately wake-up from SLEEP. The SLEEP instruction is completely executed. The WDT is cleared when the device wakes up from SLEEP, regardless of the source of wake-up. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) INT pin INTF flag (INTCON<1>) Interrupt Latency (Note 2) GIE bit (INTCON<7>) Processor in SLEEP INSTRUCTION FLOW PC PC Instruction Fetched Instruction Executed Note 1: 2: 3: 4: Inst(PC) = SLEEP Inst(PC - 1) PC+1 PC+2 PC+2 Inst(PC + 1) Inst(PC + 2) SLEEP Inst(PC + 1) PC + 2 Dummy cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) XT, HS or LP Oscillator mode assumed. TOST = 1024TOSC (drawing not to scale). Approximately 1 s delay will be there for RC Osc mode. See Section 12 for wake-up from SLEEP delay in INTOSC mode. GIE = '1' assumed. In this case after wake-up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line. CLKOUT is not available in XT, HS, LP or EC Osc modes, but shown here for timing reference. DS70091B-page 70 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 10-14: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION FIGURE 10-15: PARALLEL DIP SOCKET FOR EMULATION 1 To Normal Connections 2 rfPIC12F675 3 +5V VDD 0V VSS VPP GP3/MCLR/VPP CLK GP1 Data I/O GP0 PIC12F675 External Connector Signals 8 4 VDD 10.10 In-Circuit Serial Programming 6 5 VDD VSS GP5 GP0 GP4 GP1 GP3 GP2 rfPIC12F675 To Normal Connections 7 The rfPIC12F675 microcontrollers can be serially programmed while in the end application circuit. This is done with two lines for clock and data, and three lines for power, ground, and programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller before shipping the product. This also allows the most recent firmware or custom firmware to be programmed. The device is placed into a Program/Verify mode by holding the GP0 and GP1 pins low, while raising the MCLR (VPP) pin from VIL to VIHH (see Programming Specification). GP0 becomes the programming data and GP1 becomes the programming clock. Both GP0 and GP1 are Schmitt Trigger inputs in this mode. After RESET, to place the device into Programming/ Verify mode, the program counter (PC) is at location 00h. A 6-bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending on whether the command was a load or a read. For complete details of serial programming, please refer to the Programming Specifications document. A typical In-Circuit Serial Programming connection is shown in Figure 10-14. The programming connections are isolated from conflicting outputs and capacitive loads by the 3 resistors. The VDD connection on MCLR may not be required if the pin is configured as GP3. Do not place sensitive circuitry on the GP3/MCLR pin without protection since the VPP signal goes well above VDD during programming. 2003-2013 Microchip Technology Inc. 10.11 In-Circuit Debugging Since in-circuit debugging requires the loss of clock, data and MCLR pins, MPLAB(R) ICD 2 development with an 8-pin microcontroller is not practical. Since the MPLAB ICE 2000 emulation module leads would be too long for the RF signals the following debug/emulation strategy is recommended. Build a prototype board with all your digital, analog, and RF circuitry. Add an 8 pin DIP socket for the PIC12F675 debugging. Connect the socket as shown in Figure 1015. When soldering the rfPIC12F675 down bend up pins 1-4 and 17-20 so that they do not contact the board. A PIC12F675 or emulation/debugging development tool can be plugged into the socket as in Figure 10-16. This test method encourages RF development to start early, as soon as the firmware can toggle the RF enable and data lines. The socket can even be left in the final layout for in-circuit production programming. A simple method for programming is to solder all the rfPIC12F675 pins to the board and move the 8-pin DIP socket to the back side of the board. Then use the 8-pin standoff from the MPLAB ICE 2000 emulator to connect the PCB to a programmer such as the Pro Mate(R) II or PICkitTM 1 as in Figure 10-17. There is an ICD 2 header inteface board for the PIC12F675, part number AC162050. This special ICD module is mounted on the top of a header and its Preliminary DS70091B-page 71 rfPIC12F675 TABLE 10-10: DEBUGGER RESOURCES signals are routed to the MPLAB ICD 2 connector. On the bottom of the header is an 8-pin socket that plugs into the user's target via the 8-pin standoff connector. When the ICD pin on the PIC12F675-ICD device is held low, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB ICD 2. When the microcontroller has this feature enabled, some of the resources are not available for general use. Table 10-10 shows resources consumed by the background debugger: FIGURE 10-16: I/O pins ICDCLK, ICDDATA Stack 1 level Program Memory Address 0h must be NOP 300h - 3FEh For more information, see 8-Pin MPLAB ICD 2 Header Information Sheet (DS51292) available on Microchip's website (www.microchip.com). IN-CIRCUIT DEBUGGING USING THE PARALLEL DIP SOCKET DVA12XP081 or AC162050 To MPLAB ICE 2000 PCM12XB0 Standoff rfPIC12F675 FIGURE 10-17: Socket IN-CIRCUIT PROGRAMMING USING THE PARALLEL DIP SOCKET rfPIC12F675 Socket Standoff Programmer DS70091B-page 72 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 11.0 INSTRUCTION SET SUMMARY The rfPIC12F675 instruction set is highly orthogonal and is comprised of three basic categories: * Byte-oriented operations * Bit-oriented operations For example, a CLRF GPIO instruction will read GPIO, clear all the data bits, then write the result back to GPIO. This example would have the unintended result that the condition that sets the GPIF flag would be cleared. TABLE 11-1: * Literal and control operations Each rfPIC12F675 instruction is a 14-bit word divided into an opcode, which specifies the instruction type, and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 11-1, while the various opcode fields are summarized in Table 11-1. Table 11-2 lists the instructions recognized by the MPASM TM assembler. A complete description of each instruction is also available in the PIC MidRange Reference Manual (DS33023). For byte-oriented instructions, `f' represents a file register designator and `d' represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If `d' is zero, the result is placed in the W register. If `d' is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, `b' represents a bit field designator, which selects the bit affected by the operation, while `f' represents the address of the file in which the bit is located. Field Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-out bit PD Power-down bit FIGURE 11-1: One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. To maintain upward compatibility with future products, do not use the OPTION and TRISIO instructions. All instruction examples use the format `0xhh' to represent a hexadecimal number, where `h' signifies a hexadecimal digit. 11.1 GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value READ-MODIFY-WRITE OPERATIONS CALL and GOTO instructions only Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator `d'. A read operation is performed on a register even if the instruction writes to that register. 2003-2013 Microchip Technology Inc. Description f For literal and control operations, `k' represents an 8-bit or 11-bit constant, or literal value. Note: OPCODE FIELD DESCRIPTIONS Preliminary 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value DS70091B-page 73 rfPIC12F675 TABLE 11-2: rfPIC12F675 INSTRUCTION SET Mnemonic, Operands 14-Bit Opcode Description Cycles MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f f, d f, d f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k k k k k k k Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. 3: If Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Note: Additional information on the mid-range instruction set is available in the PIC Mid-Range MCU Family Reference Manual (DS33023). DS70091B-page 74 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 11.2 Instruction Descriptions ADDLW Add Literal and W BCF Bit Clear f Syntax: [label] ADDLW Syntax: [label] BCF Operands: 0 k 255 Operands: Operation: (W) + k (W) 0 f 127 0b7 Status Affected: C, DC, Z Operation: 0 (f<b>) Description: The contents of the W register are added to the eight-bit literal 'k' and the result is placed in the W register. Status Affected: None Description: Bit 'b' in register 'f' is cleared. ADDWF Add W and f BSF Bit Set f Syntax: [label] ADDWF Syntax: [label] BSF Operands: 0 f 127 d Operands: 0 f 127 0b7 Operation: (W) + (f) (destination) Operation: 1 (f<b>) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. Description: Bit 'b' in register 'f' is set. ANDLW AND Literal with W BTFSS Bit Test f, Skip if Set Syntax: [label] ANDLW Syntax: [label] BTFSS f,b Operands: 0 k 255 Operands: Operation: (W) .AND. (k) (W) 0 f 127 0b<7 Status Affected: Z Operation: skip if (f<b>) = 1 Description: The contents of W register are AND'ed with the eight-bit literal 'k'. The result is placed in the W register. Status Affected: None Description: If bit 'b' in register 'f' is '0', the next instruction is executed. If bit 'b' is '1', then the next instruction is discarded and a NOP is executed instead, making this a 2TCY instruction. BTFSC Bit Test, Skip if Clear Syntax: [label] BTFSC f,b k f,d k f,b f,b ANDWF AND W with f Syntax: [label] ANDWF Operands: 0 f 127 d Operands: 0 f 127 0b7 Operation: (W) .AND. (f) (destination) Operation: skip if (f<b>) = 0 Status Affected: Z Status Affected: None Description: AND the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. Description: If bit 'b' in register 'f' is '1', the next instruction is executed. If bit 'b', in register 'f', is '0', the next instruction is discarded, and a NOP is executed instead, making this a 2TCY instruction. 2003-2013 Microchip Technology Inc. f,d Preliminary DS70091B-page 75 rfPIC12F675 CALL Call Subroutine CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0 k 2047 Operands: None Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> Operation: Status Affected: None 00h WDT 0 WDT prescaler, 1 TO 1 PD Description: Call Subroutine. First, return address (PC+1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. STATUS bits TO and PD are set. CLRF Clear f COMF Complement f Syntax: [label] CLRF Syntax: [ label ] COMF Operands: 0 f 127 Operands: Operation: 00h (f) 1Z 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register 'f' are cleared and the Z bit is set. Description: The contents of register 'f' are complemented. If 'd' is 0, the result is stored in W. If 'd' is 1, the result is stored back in register 'f'. CLRW Clear W DECF Decrement f Syntax: [ label ] CLRW Syntax: [label] DECF f,d Operands: None Operands: Operation: 00h (W) 1Z 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. Description: Decrement register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. DS70091B-page 76 f Preliminary f,d 2003-2013 Microchip Technology Inc. rfPIC12F675 DECFSZ Decrement f, Skip if 0 INCFSZ Increment f, Skip if 0 Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register 'f' are decremented. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. If the result is 1, the next instruction is executed. If the result is 0, then a NOP is executed instead, making it a 2TCY instruction. Description: The contents of register 'f' are incremented. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. If the result is 1, the next instruction is executed. If the result is 0, a NOP is executed instead, making it a 2TCY instruction. GOTO Unconditional Branch IORLW Inclusive OR Literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Operation: (W) .OR. k (W) Status Affected: Z Status Affected: None Description: Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a twocycle instruction. The contents of the W register are OR'ed with the eight-bit literal 'k'. The result is placed in the W register. INCF Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register 'f' are incremented. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. Description: Inclusive OR the W register with register 'f'. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. GOTO k INCF f,d 2003-2013 Microchip Technology Inc. Preliminary INCFSZ f,d IORLW k IORWF f,d DS70091B-page 77 rfPIC12F675 MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: No operation Operation: (f) (destination) Status Affected: None Status Affected: Z Description: No operation. Description: The contents of register f are moved to a destination dependant upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register, since status flag Z is affected. MOVLW Move Literal to W RETFIE Return from Interrupt Syntax: [ label ] Syntax: [ label ] Operands: 0 k 255 Operands: None Operation: k (W) Operation: TOS PC, 1 GIE MOVF f,d MOVLW k NOP No Operation Syntax: [ label ] Operands: None NOP RETFIE Status Affected: None Description: The eight-bit literal 'k' is loaded into W register. The don't cares will assemble as 0's. Status Affected: None MOVWF Move W to f RETLW Return with Literal in W Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 Operands: 0 k 255 Operation: (W) (f) Operation: Status Affected: None k (W); TOS PC Description: Move data from W register to register 'f'. Status Affected: None Description: The W register is loaded with the eight-bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. DS70091B-page 78 MOVWF f Preliminary RETLW k 2003-2013 Microchip Technology Inc. rfPIC12F675 RLF Rotate Left f through Carry SLEEP Syntax: [ label ] RLF Syntax: [ label ] SLEEP Operands: 0 f 127 d [0,1] Operands: None Operation: Operation: See description below Status Affected: C Description: The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is stored back in register 'f'. 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down STATUS bit, PD is cleared. Time-out STATUS bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. C f,d Register f RETURN Return from Subroutine SUBLW Subtract W from Literal Syntax: [ label ] Syntax: [ label ] SUBLW k Operands: None Operands: 0 k 255 Operation: TOS PC Operation: k - (W) W) Status Affected: None Status Affected: C, DC, Z Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. Description: The W register is subtracted (2's complement method) from the eight-bit literal 'k'. The result is placed in the W register. RRF Rotate Right f through Carry SUBWF Subtract W from f Syntax: [ label ] Syntax: [ label ] SUBWF f,d Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: See description below Operation: (f) - (W) destination) Status Affected: C The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. Status Affected: C, DC, Z Description: Description: Subtract (2's complement method) W register from register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. RETURN RRF f,d C 2003-2013 Microchip Technology Inc. Register f Preliminary DS70091B-page 79 rfPIC12F675 SWAPF Swap Nibbles in f XORWF Exclusive OR W with f Syntax: [ label ] SWAPF f,d Syntax: [label] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Operation: (W) .XOR. (f) destination) Status Affected: Z Status Affected: None Description: Description: The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed in register 'f'. Exclusive OR the contents of the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. XORLW Exclusive OR Literal with W Syntax: [label] Operands: 0 k 255 Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR'ed with the eight-bit literal 'k'. The result is placed in the W register. DS70091B-page 80 XORWF f,d XORLW k Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 12.0 DEVELOPMENT SUPPORT 12.1 The PIC(R) microcontrollers are supported with a full range of hardware and software development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library * Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator * Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator * In-Circuit Debugger - MPLAB ICD 2 * Device Programmers - PRO MATE(R) II Universal Device Programmer - PICSTART(R) Plus Development Programmer * Low Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board * Evaluation Kits - KEELOQ(R) - PICDEM MSC - microID(R) - CAN - PowerSmart(R) - Analog MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows(R) based application that contains: * An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) * A full-featured editor with color coded context * A multiple project manager * Customizable data windows with direct edit of contents * High level source code debugging * Mouse over variable inspection * Extensive on-line help The MPLAB IDE allows you to: * Edit your source files (either assembly or C) * One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) * Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 12.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: * Integration into MPLAB IDE projects * User defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page1-81 rfPIC12F675 12.3 MPLAB C17 and MPLAB C18 C Compilers 12.6 The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip's PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 12.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from pre-compiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of pre-compiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 12.5 MPLAB C30 C Compiler MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high level source debugging with the MPLAB IDE. DS70091B-page 1-82 MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it's object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 12.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PIC series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break, or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 12.8 The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many commandline options and language extensions to take full advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code generator. MPLAB ASM30 Assembler, Linker, and Librarian MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high speed simulator is designed to debug, analyze and optimize time intensive DSP routines. Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 12.9 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator 12.11 MPLAB ICD 2 In-Circuit Debugger The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft(R) Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 12.10 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PIC microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory, and the ability to view variables in real-time. Microchip's In-Circuit Debugger, MPLAB ICD 2, is a powerful, low cost, run-time development tool, connecting to the host PC via an RS-232 or high speed USB interface. This tool is based on the FLASH PIC MCUs and can be used to develop for these and other PIC microcontrollers. The MPLAB ICD 2 utilizes the incircuit debugging capability built into the FLASH devices. This feature, along with Microchip's In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit FLASH debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, singlestepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 12.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify, and program PIC devices without a PC connection. It can also set code protection in this mode. 12.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PIC devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page1-83 rfPIC12F675 12.14 PICDEM 1 PIC MCU Demonstration Board 12.17 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 12.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a 16 x 2 LCD display. Also included is the book and CD-ROM "TCP/IP Lean, Web Servers for Embedded Systems," by Jeremy Bentham 12.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18-, 28-, and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs, and sample PIC18F452 and PIC16F877 FLASH microcontrollers. DS70091B-page 1-84 12.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8-, 14-, and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 Family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low power operation with the supercapacitor circuit, and jumpers allow onboard hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2x16 liquid crystal display, PCB footprints for HBridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User's Guide. 12.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board FLASH memory. A generous prototype area is available for user hardware expansion. Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 12.20 PICDEM 18R PIC18C601/801 Demonstration Board 12.23 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/De-multiplexed and 16-bit Memory modes. The board includes 2 Mb external FLASH memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 12.21 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PIC microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature onboard LIN transceivers. A PIC16F874 FLASH microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 12.22 PICkitTM 1 FLASH Starter Kit A complete "development system in a box", the PICkit FLASH Starter Kit includes a convenient multi-section board for programming, evaluation, and development of 8/14-pin FLASH PIC(R) microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the user's guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB(R) IDE (Integrated Development Environment) software, software and hardware "Tips 'n Tricks for 8-pin FLASH PIC(R) Microcontrollers" Handbook and a USB Interface Cable. Supports all current 8/14-pin FLASH PIC microcontrollers, as well as many future planned devices. 2003-2013 Microchip Technology Inc. 12.24 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. * KEELOQ evaluation and programming tools for Microchip's HCS Secure Data Products * CAN developers kit for automotive network applications * Analog design boards and filter design software * PowerSmart battery charging evaluation/ calibration kits * IrDA(R) development kit * microID development and rfLabTM development software * SEEVAL(R) designer kit for memory evaluation and endurance calculations * PICDEM MSC demo boards for Switching mode power supply, high power IR driver, delta sigma ADC, and flow rate sensor Check the Microchip web page and the latest Product Line Card for the complete list of demonstration and evaluation kits. Preliminary DS70091B-page1-85 rfPIC12F675 NOTES: DS70091B-page 1-86 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Ambient temperature under bias........................................................................................................... -40 to +125C Storage temperature ........................................................................................................................ -65C to +150C Voltage on VDD with respect to VSS ....................................................................................................... -0.3 to +6.5V Voltage on VDDRF with respect to VSSRF................................................................................................ -0.3 to +7.0V Voltage on MCLR with respect to Vss...................................................................................................-0.3 to +13.5V Voltage on all GPIO pins with respect to VSS............................................................................ -0.3V to (VDD + 0.3V) Voltage on all other RF Transmitter pins with respect to VSSRF .............................................-0.3V to (VDDRF + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin ..................................................................................................................... 300 mA Maximum current into VDD pin ........................................................................................................................ 250 mA Input clamp current, IIK (VI < 0 or VI > VDD)20 mA Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA Maximum output current sunk by any GPIO pin ............................................................................................... 25 mA Maximum output current sourced by any GPIO pin .......................................................................................... 25 mA Maximum total current sunk by all GPIO pins ................................................................................................. 125 mA Maximum total current sourced all GPIO pins................................................................................................. 125 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL) + VDDRF x {IDDRF - IOHRF} + {(VDDRFVOHRF) x IOHRF} + (VOLRF x IOLRF) NOTICE: Stresses above those listed under `Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin, rather than pulling this pin directly to VSS. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 87 rfPIC12F675 FIGURE 13-1: rfPIC12F675 WITH A/D DISABLED VOLTAGE-FREQUENCY GRAPH, -40C TA +125C 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.0 0 4 8 10 12 16 20 Microcontroller Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. FIGURE 13-2: rfPIC12F675 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, -40C TA +125C 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.0 0 4 8 10 12 16 20 Microcontroller Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS70091B-page 88 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 rfPIC12F675 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, 0C TA +125C FIGURE 13-3: 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.2 2.0 0 4 8 10 12 16 20 Microcontroller Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 89 rfPIC12F675 13.1 DC Characteristics: rfPIC12F675-I (Industrial), rfPIC12F675-E (Extended) DC CHARACTERISTICS Param No. Sym VDD Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Min Typ Max Units Conditions 2.0 2.2 2.5 3.0 4.5 -- -- -- -- -- 5.5 5.5 5.5 5.5 5.5 V V V V V FOSC < = 4 MHz: rfPIC12F675 with A/D off rfPIC12F675 with A/D on, 0C to +125C rfPIC12F675 with A/D on, -40C to +125C 4 MHZ < FOSC < = 10 MHz FOSC > 10 MHz 1.5* -- -- V Device in SLEEP mode -- VSS -- V See section on Power-on Reset for details -- -- -- 2.1 -- V 2.0 3.0 4.0 5.0 -- -- -- -- 5.5 5.5 5.5 5.5 V V V V Output Power = 4 dBm Output Power = 7.5 dBm Output Power = 8.5 dBm Output Power = 9 dBm 1.8 1.85 1.9 V TA +23C, RFEN = VDDRF Supply Voltage D001 D001A D001B D001C D001D D002 VDR RAM Data Retention Voltage(1) D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal D004 SVDD VDD Rise Rate to ensure 0.05* internal Power-on Reset signal D005 VBOD D006 D006A D006B D006C D007 VDDRF RF Transmitter Supply Voltage VLVD RF Low Voltage Disable V/ms See section on Power-on Reset for details * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. DS70091B-page 90 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.2 DC Characteristics: rfPIC12F675-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Conditions Param No. Device Characteristics Min Typ Max Units D010 Supply Current (IDD)(3) -- 9 16 A 2.0 -- 18 28 A 3.0 VDD D011 D012 D013 D014 D015 D016 D017 -- 34 54 A 5.0 -- 110 150 A 2.0 -- 190 280 A 3.0 -- 330 450 A 5.0 -- 220 280 A 2.0 -- 370 650 A 3.0 -- 0.6 1.4 mA 5.0 -- 70 110 A 2.0 -- 140 250 A 3.0 -- 260 390 A 5.0 -- 180 250 A 2.0 -- 320 470 A 3.0 -- 580 850 A 5.0 -- 340 450 A 2.0 -- 500 700 A 3.0 -- 0.8 1.1 mA 5.0 -- 180 250 A 2.0 -- 320 450 A 3.0 -- 580 800 A 5.0 -- 2.1 2.95 mA 4.5 -- 2.4 3.0 mA 5.0 Note FOSC = 32 kHz LP Oscillator Mode FOSC = 1 MHz XT Oscillator Mode FOSC = 4 MHz XT Oscillator Mode FOSC = 1 MHz EC Oscillator Mode FOSC = 4 MHz EC Oscillator Mode FOSC = 4 MHz INTOSC Mode FOSC = 4 MHz EXTRC Mode FOSC = 20 MHz HS Oscillator Mode Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. 3: Total device current is the sum of IDD from VDD and IDDRF from VDDRF. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 91 rfPIC12F675 13.3 DC Characteristics: rfPIC12F675-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial Param No. D020 Conditions Device Characteristics Min Typ Max Units VDD Note Power-down Current (IPD)(3) -- 0.99 700 nA 2.0 -- 1.2 770 nA 3.0 WDT, BOD, Comparators, VREF, and T1OSC disabled -- 2.9 995 nA 5.0 -- 0.3 1.5 A 2.0 -- 1.8 3.5 A 3.0 -- 8.4 17 A 5.0 -- 58 70 A 3.0 -- 109 130 A 5.0 -- 3.3 6.5 A 2.0 -- 6.1 8.5 A 3.0 -- 11.5 16 A 5.0 -- 58 70 A 2.0 -- 85 100 A 3.0 -- 138 160 A 5.0 -- 4.0 6.5 A 2.0 -- 4.6 7.0 A 3.0 -- 6.0 10.5 A 5.0 -- 1.2 775 nA 3.0 -- 2.2 1.0 mA 5.0 -- 0.050 TBD A 3.0 D021 D022 D023 D024 D025 D026 D027 Power-down RF Current (IPDRF)(3) WDT Current(1) BOD Current(1) Comparator Current(1) CVREF Current(1) T1 OSC Current(1) A/D Current(1) RF Transmitter with RFEN=0 Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD. 3: Total device current is the sum of IPD from VDD and IPDRF from VDDRF. DS70091B-page 92 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.4 DC Characteristics: rfPIC12F675-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C for extended Conditions Param No. Device Characteristics Min Typ Max Units D010E Supply Current (IDD)(3) -- 9 16 A 2.0 -- 18 28 A 3.0 VDD D011E D012E D013E D014E D015E D016E D017E -- 35 54 A 5.0 -- 110 150 A 2.0 -- 190 280 A 3.0 -- 330 450 A 5.0 -- 220 280 A 2.0 -- 370 650 A 3.0 -- 0.6 1.4 mA 5.0 -- 70 110 A 2.0 -- 140 250 A 3.0 -- 260 390 A 5.0 -- 180 250 A 2.0 -- 320 470 A 3.0 -- 580 850 A 5.0 -- 340 450 A 2.0 -- 500 780 A 3.0 -- 0.8 1.1 mA 5.0 -- 180 250 A 2.0 -- 320 450 A 3.0 -- 580 800 A 5.0 -- 2.1 2.95 mA 4.5 -- 2.4 3.0 mA 5.0 Note FOSC = 32 kHz LP Oscillator Mode FOSC = 1 MHz XT Oscillator Mode FOSC = 4 MHz XT Oscillator Mode FOSC = 1 MHz EC Oscillator Mode FOSC = 4 MHz EC Oscillator Mode FOSC = 4 MHz INTOSC Mode FOSC = 4 MHz EXTRC Mode FOSC = 20 MHz HS Oscillator Mode Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. 3: Total device current is the sum of IDD from VDD and IDDRF from VDDRF. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 93 rfPIC12F675 13.5 DC Characteristics: rfPIC12F675-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +125C for extended Param No. D020E Conditions Device Characteristics Min Typ Max Units VDD Note Power-down Current (IPD)(3) -- 0.0011 3.5 A 2.0 -- 0.0012 4.0 A 3.0 WDT, BOD, Comparators, VREF, and T1OSC disabled -- 0.0022 8.0 A 5.0 -- 0.3 6.0 A 2.0 -- 1.8 9.0 A 3.0 -- 8.4 20 A 5.0 -- 58 70 A 3.0 -- 109 130 A 5.0 -- 3.3 10 A 2.0 -- 6.1 13 A 3.0 -- 11.5 24 A 5.0 -- 58 70 A 2.0 -- 85 100 A 3.0 -- 138 165 A 5.0 -- 4.0 10 A 2.0 -- 4.6 12 A 3.0 D021E D022E D023E D024E D025E D026E D027E Power-down RF Current (IPDRF)(3) -- 6.0 20 A 5.0 -- 0.0012 6.0 A 3.0 -- 0.0022 8.5 A 5.0 -- 0.050 TBD A 3.0 WDT Current(1) BOD Current(1) Comparator Current(1) CVREF Current(1) T1 OSC Current(1) A/D Current(1) RF Transmitter, RFEN=VSSRF Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD. 3: Total device current is the sum of IPD from VDD and IPDRF from VDDRF. DS70091B-page 94 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.6 DC Characteristics: rfPIC12F675K Standard Operating Conditions (unless otherwise stated) Operating temperature TA +23C Operating Frequency fc = 315 MHz Param No. D018A Conditions Device Characteristics Min Typ Max Units VDD 2.9 3.5 7.0 mA 3.0 Power Step 0, RFEN=DATAASK=1 Power Step 1, RFEN=DATAASK=1 D018C 3.2 4.7 7.9 mA 3.0 Power Step 2, RFEN=DATAASK=1 D018D 4.5 6.5 11 mA 3.0 D018E 7.0 10.7 16 mA 3.0 Power Step 3, RFEN=DATAASK=1 Power Step 4, RFEN=DATAASK=1 D018B RF Transmitter Current (IDDRF)(2) 2.0 2.7 5.0 mA 3.0 Note Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as output loading and temperature also have an impact on the current consumption. 2: Total device current is the sum of IDD from VDD and IDDRF from VDDRF. 13.7 DC Characteristics: rfPIC12F675F Standard Operating Conditions (unless otherwise stated) Operating temperature TA +23C Operating Frequency fc = 434 MHz Param No. D018A Conditions Device Characteristics Min Typ Max Units VDD 2.0 2.7 5.0 mA 3.0 2.9 3.5 7.0 mA 3.0 Power Step 0, RFEN=DATAASK=1 Power Step 1, RFEN=DATAASK=1 D018C 3.2 4.7 7.9 mA 3.0 Power Step 2, RFEN=DATAASK=1 D018D 4.5 6.5 11 mA 3.0 D018E 7.0 10.7 16 mA 3.0 Power Step 3, RFEN=DATAASK=1 Power Step 4, RFEN=DATAASK=1 D018B RF Transmitter Current (IDDRF)(2) Note Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as output loading and temperature also have an impact on the current consumption. 2: Total device current is the sum of IDD from VDD and IDDRF from VDDRF. 13.8 DC Characteristics: rfPIC12F675H Standard Operating Conditions (unless otherwise stated) Operating temperature TA +23C Operating Frequency fc = 868 MHz Param No. D018A Conditions Device Characteristics Min Typ Max Units VDD 2.6 4.0 6.5 mA 3.0 3.5 5.3 8.5 mA 3.0 Power Step 0, RFEN=DATAASK=1 Power Step 1, RFEN=DATAASK=1 D018C 4.5 6.7 11 mA 3.0 Power Step 2, RFEN=DATAASK=1 D018D 6.0 9.0 14 mA 3.0 D018E 9.0 14.0 20 mA 3.0 Power Step 3, RFEN=DATAASK=1 Power Step 4, RFEN=DATAASK=1 D018B RF Transmitter Current (IDDRF)(2) Note Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as output loading and temperature also have an impact on the current consumption. 2: Total device current is the sum of IDD from VDD and IDDRF from VDDRF. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 95 rfPIC12F675 13.9 DC Characteristics: rfPIC12F675-I (Industrial), rfPIC12F675-E (Extended) DC CHARACTERISTICS Param Sym No. VIL D030 D030A D031 D032 D033 D033A D034 VIH D040 D040A D041 D042 D043 D043A D043B D044 D070 IPUR D071 D072 D060 IIL D060A D060B D061 D063 D080 D083 VOL D090 D092 VOH Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (RC mode) OSC1 (XT and LP modes) OSC1 (HS mode) DATAASK, DATAFSK, RFEN Input High Voltage I/O ports with TTL buffer Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended Min Typ Max Units VSS VSS VSS VSS VSS VSS VSS -- 0.8 0.15 VDD 0.2 VDD 0.2 VDD 0.3 0.3 VDD 0.3 VDDRF V V V V V V V 4.5V VDD 5.5V Otherwise Entire range V V 4.5V VDD 5.5V otherwise entire range 250 1.5 2.0 VDD VDD VDD VDD VDD VDD VDD VDDRF 400* 12* 20* V V V V V A A A -- 01 1 A -- -- 01 01 01 01 1 1 5 5 A A A A Output Low Voltage I/O ports OSC2/CLKOUT (RC mode) -- -- -- -- 0.6 0.6 V V IOL = 8.5 mA, VDD = 4.5V (Ind.) IOL = 1.6 mA, VDD = 4.5V (Ind.) IOL = 1.2 mA, VDD = 4.5V (Ext.) Output High Voltage I/O ports OSC2/CLKOUT (RC mode) VDD - 0.7 VDD - 0.7 -- -- -- -- V V IOH = -3.0 mA, VDD = 4.5V (Ind.) IOH = -1.3 mA, VDD = 4.5V (Ind.) IOH = -1.0 mA, VDD = 4.5V (Ext.) -- -- -- -- -- (Note 1) (Note 1) -- 2.0 (0.25 VDD+0.8) with Schmitt Trigger buffer 0.8 VDD MCLR 0.8 VDD OSC1 (XT and LP modes) 1.6 OSC1 (HS mode) 0.7 VDD OSC1 (RC mode) 0.9 VDD DATAASK, DATAFSK, RFEN 0.7 VDD GPIO Weak Pull-up Current 50* DATAASK Weak Pull-up 0.1* RFENIN Weak Pull-down 0.2* Input Leakage Current(3) GPIO ports, DATAASK, DATAFSK, RFEN Analog inputs VREF MCLR(2) OSC1 -- Conditions -- -- -- -- -- -- -- -- -- -- (Note 1) (Note 1) VDD = 5.0V, VPIN = VSS VDDRF = RFEN = 3.0V VDDRF = RFEN = 3.0V VSS VPIN VDD, Pin at hi-impedance VSS VPIN VDD VSS VPIN VDD VSS VPIN VDD VSS VPIN VDD, XT, HS and LP osc configuration These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. * Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. DS70091B-page 96 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.10 DC Characteristics: rfPIC12F675-I (Industrial), rfPIC12F675-E (Extended) (Cont.) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial -40C TA +125C for extended DC CHARACTERISTICS Param No. Sym Characteristic Capacitive Loading Specs on Output Pins OSC2 pin Min Typ Max Units Conditions -- -- 15* pF In XT, HS and LP modes when external clock is used to drive OSC1 -- -- 50* pF 100K 10K VMIN 1M 100K -- -- -- 5.5 D100 COSC2 D101 CIO D120 D120A D121 ED ED VDRW D122 D123 TDEW Erase/Write cycle time TRETD Characteristic Retention -- 40 5 -- 6 -- D124 TREF 1M 10M -- D130 D130A D131 EP ED VPR 10K 1K VMIN 100K 10K -- -- -- 5.5 D132 D133 D134 VPEW VDD for Erase/Write TPEW Erase/Write cycle time TRETD Characteristic Retention 4.5 -- 40 -- 2 -- 5.5 2.5 -- -- 1 20 -- 60 -- D150 D151 RON ROFF VPS All I/O pins Data EEPROM Memory Byte Endurance Byte Endurance VDD for Read/Write Number of Total Erase/Write Cycles before Refresh(1) Program FLASH Memory Cell Endurance Cell Endurance VDD for Read RF Transmitter(2) FSK Switch On resistance FSK Switch Off resistance RF Power Select Voltage E/W -40C TA +85C E/W +85C TA +125C V Using EECON to read/write VMIN = Minimum operating voltage ms Year Provided no other specifications are violated E/W -40C TA +85C E/W -40C TA +85C E/W +85C TA +125C V VMIN = Minimum operating voltage V ms Year Provided no other specifications are violated M DATAFSK=0, RFEN=1 DATAFSK=1, RFEN=1 D152A VSSRF -- 0.1 V Power Level Step 0 D152B 0.14 -- 0.24 V Power Level Step 1 D152C 0.28 -- 0.51 V Power Level Step 2 D152D 0.57 -- 1.18 V Power Level Step 3 D152E 1.23 -- VDDRF V Power Level Step 4 D153 IPS Power Select Current 6 8 11 A RFEN=1 * These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: See Section 8.5.1 for additional information. 2: These limits are tested at room temperature. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 97 rfPIC12F675 13.11 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low FIGURE 13-4: T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid Hi-impedance LOAD CONDITIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin CL Pin VSS VSS RL = 464 CL = 50 pF 15 pF DS70091B-page 98 for all pins for OSC2 output Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 13.12 AC CHARACTERISTICS: rfPIC12F675 (INDUSTRIAL, EXTENDED) FIGURE 13-5: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 1 3 4 3 4 2 CLKOUT TABLE 13-1: Param No. Sym FOSC EXTERNAL CLOCK TIMING REQUIREMENTS Characteristic Min Typ Max Units External CLKIN Frequency(1) DC DC DC DC 5 -- DC 0.1 1 -- -- -- -- -- 4 -- -- -- 37 4 20 20 37 -- 4 4 20 kHz MHz MHz MHz kHz MHz MHz MHz MHz LP Osc mode XT mode HS mode EC mode LP Osc mode INTOSC mode RC Osc mode XT Osc mode HS Osc mode 27 50 50 250 27 -- 250 250 50 -- -- -- -- 250 -- -- -- 200 -- -- 10,000 1,000 s ns ns ns s ns ns ns ns LP Osc mode HS Osc mode EC Osc mode XT Osc mode LP Osc mode INTOSC mode RC Osc mode XT Osc mode HS Osc mode 200 2* 20* TCY -- -- DC -- -- ns s ns TCY = 4/FOSC LP oscillator, TOSC L/H duty cycle HS oscillator, TOSC L/H duty cycle XT oscillator, TOSC L/H duty cycle LP oscillator XT oscillator HS oscillator Oscillator Frequency(1) 1 TOSC External CLKIN Period(1) Oscillator Period(1) 2 TCY 3 TosL, TosH 4 Instruction Cycle Time(1) External CLKIN (OSC1) High External CLKIN Low Conditions 100 * -- -- ns -- -- 50* ns -- -- 25* ns -- -- 15* ns * These parameters are characterized but not tested. Data in `Typ' column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. TosR, TosF External CLKIN Rise External CLKIN Fall Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at `min' values with an external clock applied to OSC1 pin. When an external clock input is used, the `max' cycle time limit is `DC' (no clock) for all devices. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 99 rfPIC12F675 TABLE 13-2: Param No. F10 F14 Sym PRECISION INTERNAL OSCILLATOR PARAMETERS Characteristic FOSC Internal Calibrated INTOSC Frequency Freq Min Tolerance Typ Max Units MHz VDD = 3.5V, 25C MHz 2.5V VDD 5.5V 0C TA +85C MHz 2.0V VDD 5.5V -40C TA +85C (IND) -40C TA +125C (EXT) s VDD = 2.0V, -40C to +85C s VDD = 3.0V, -40C to +85C s VDD = 5.0V, -40C to +85C 1 2 3.96 3.92 4.00 4.00 4.04 4.08 5 3.80 4.00 4.20 -- -- -- -- SLEEP start-up time* -- -- * These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise only and are not tested. 6 4 3 TIOSC Oscillator Wake-up from ST DS70091B-page 100 8 6 5 Conditions stated. These parameters are for design guidance Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 13-6: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 22 23 CLKOUT 12 13 19 14 18 16 I/O pin (Input) 15 17 I/O pin (Output) New Value Old Value 20, 21 TABLE 13-3: Param No. CLKOUT AND I/O TIMING REQUIREMENTS Sym Characteristic Min Typ Max Units Conditions 10 TosH2ckL OSC1 to CLKOUT -- 75 200 ns (Note 1) 11 TosH2ckH OSC1 to CLKOUT -- 75 200 ns (Note 1) 12 TckR CLKOUT rise time -- 35 100 ns (Note 1) 13 TckF CLKOUT fall time -- 35 100 ns (Note 1) 14 TckL2ioV CLKOUT to Port out valid 15 TioV2ckH Port in valid before CLKOUT 16 TckH2ioI 17 -- -- 20 ns (Note 1) TOSC + 200 ns -- -- ns (Note 1) Port in hold after CLKOUT 0 -- -- ns (Note 1) TosH2ioV OSC1 (Q1 cycle) to Port out valid -- 50 150 * ns 18 TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) 19 -- -- 300 ns 100 -- -- ns TioV2osH Port input valid to OSC1 (I/O in setup time) 0 -- -- ns 20 TioR Port output rise time -- 10 40 ns 21 TioF Port output fall time -- 10 40 ns 22 Tinp INT pin high or low time 25 -- -- ns 23 Trbp GPIO change INT high or low time TCY -- -- ns * These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4xTOSC. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 101 rfPIC12F675 FIGURE 13-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal RESET Watchdog Timer Reset 34 31 34 I/O Pins FIGURE 13-8: BROWN-OUT DETECT TIMING AND CHARACTERISTICS VDD BVDD (Device not in Brown-out Detect) (Device in Brown-out Detect) 35 RESET (due to BOD) 72 ms time-out(1) Note 1: 72 ms delay only if PWRTE bit in configuration word is programmed to `0'. DS70091B-page 102 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 13-4: Param No. RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT DETECT REQUIREMENTS Sym Characteristic Min Typ Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 TBD -- TBD -- TBD s ms VDD = 5V, -40C to +85C Extended temperature 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 10 10 17 17 25 30 ms ms VDD = 5V, -40C to +85C Extended temperature 32 TOST Oscillation Start-up Timer Period -- 1024TOSC -- -- TOSC = OSC1 period 33* TPWRT Power-up Timer Period 28* TBD 72 TBD 132* TBD ms ms VDD = 5V, -40C to +85C Extended Temperature 34 TIOZ I/O Hi-impedance from MCLR Low or Watchdog Timer Reset -- -- 2.0 s BVDD Brown-out Detect Voltage 2.025 -- 2.175 V Brown-out Hysteresis TBD -- -- -- Brown-out Detect Pulse Width 100* -- -- s 35 TBOD VDD BVDD (D005) * These parameters are characterized but not tested. Data in `Typ' column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 103 rfPIC12F675 FIGURE 13-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 48 47 TMR0 or TMR1 TABLE 13-5: Param No. 40* TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Sym Tt0H Characteristic T0CKI High Pulse Width Min No Prescaler With Prescaler 41* Tt0L T0CKI Low Pulse Width No Prescaler With Prescaler 42* Tt0P T0CKI Period 45* Tt1H T1CKI High Time Synchronous, No Prescaler Synchronous, with Prescaler Asynchronous 46* Tt1L T1CKI Low Time -- ns -- -- ns 0.5 TCY + 20 -- -- ns 10 -- -- ns Greater of: 20 or TCY + 40 N -- -- ns 0.5 TCY + 20 -- -- ns 15 -- -- ns -- -- ns -- -- ns 15 -- -- ns Asynchronous 30 -- -- ns Synchronous Greater of: 30 or TCY + 40 N -- -- ns Tt1P T1CKI Input Period Ft1 Timer1 oscillator input frequency range (oscillator enabled by setting bit T1OSCEN) TCKEZtmr1 Delay from external clock edge to timer increment * -- 10 30 Asynchronous 48 0.5 TCY + 20 0.5 TCY + 20 Synchronous, No Prescaler Synchronous, with Prescaler 47* Typ Max Units 60 -- -- ns DC -- 200* kHz 2 TOSC* -- 7 TOSC* -- Conditions N = prescale value (2, 4, ..., 256) N = prescale value (1, 2, 4, 8) These parameters are characterized but not tested. Data in `Typ' column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS70091B-page 104 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 13-6: COMPARATOR SPECIFICATIONS Comparator Specifications Sym Characteristics Standard Operating Conditions -40C to +125C (unless otherwise stated) Min Typ Max Units VOS Input Offset Voltage -- 5.0 10 mV VCM Input Common Mode Voltage 0 -- VDD - 1.5 V CMRR Common Mode Rejection Ratio +55* -- -- db -- 150 400* ns -- -- 10* s TRT Response Time (1) TMC2COV Comparator Mode Change to Output Valid Comments * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD - 1.5)/2 while the other input transitions from VSS to VDD - 1.5V. TABLE 13-7: COMPARATOR VOLTAGE REFERENCE SPECIFICATIONS Voltage Reference Specifications Sym Characteristics Standard Operating Conditions -40C to +125C (unless otherwise stated) Min Typ Max Units Comments Resolution -- -- VDD/24* VDD/32 -- -- LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Absolute Accuracy -- -- -- -- 1/2 1/2* LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Unit Resistor Value (R) -- 2k* -- Settling Time(1) -- -- 10* s * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 105 rfPIC12F675 TABLE 13-8: Param No. rfPIC12F675 A/D CONVERTER CHARACTERISTICS: Sym Characteristic Min Typ Max Units Conditions A01 NR Resolution -- -- 10 bits A02 EABS Total Absolute Error* -- -- 1 LSb VREF = 5.0V bit A03 EIL Integral Error -- -- 1 LSb VREF = 5.0V A04 EDL Differential Error -- -- 1 LSb No missing codes to 10 bits VREF = 5.0V A05 EFS Full Scale Range 2.2* -- 5.5* A06 EOFF Offset Error -- -- 1 LSb VREF = 5.0V A07 EGN Gain Error -- -- 1 LSb VREF = 5.0V A10 -- Monotonicity -- guaranteed(3) -- -- A20 A20A VREF Reference Voltage 2.0 2.5 -- -- VDD + 0.3 V A21 VREF Reference V High (VDD or VREF) VSS -- VDD V A25 VAIN Analog Input Voltage VSS -- VREF V A30 ZAIN Recommended Impedance of Analog Voltage Source -- -- 10 k A50 IREF VREF Input Current(2) 10 -- 1000 A -- -- 10 A V VSS VAIN VREF+ Absolute minimum to ensure 10-bit accuracy During VAIN acquisition. Based on differential of VHOLD to VAIN. During A/D conversion cycle. * These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from External VREF or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. DS70091B-page 106 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 13-10: rfPIC12F675 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO 134 1 TCY (TOSC/2)(1) 131 Q4 130 A/D CLK 9 A/D DATA 8 7 3 6 2 1 0 NEW_DATA OLD_DATA ADRES 1 TCY ADIF GO SAMPLE DONE SAMPLING STOPPED 132 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 13-9: Param No. 130 130 Sym TAD TAD rfPIC12F675 A/D CONVERSION REQUIREMENTS Characteristic A/D Clock Period A/D Internal RC Oscillator Period 131 TCNV Conversion Time (not including Acquisition Time)(1) 132 TACQ Acquisition Time 134 TGO Q4 to A/D Clock Start Min Typ Max Units Conditions 1.6 -- -- s TOSC based, VREF 3.0V 3.0* -- -- s TOSC based, VREF full range 3.0* 6.0 9.0* s ADCS<1:0> = 11 (RC mode) At VDD = 2.5V 2.0* 4.0 6.0* s At VDD = 5.0V -- 11 -- TAD Set GO bit to new data in A/D result register (Note 2) 11.5 -- s 5* -- -- s The minimum time is the amplifier settling time. This may be used if the "new" input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). -- TOSC/2 -- -- If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 for minimum conditions. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 107 rfPIC12F675 FIGURE 13-11: rfPIC12F675 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO 134 (TOSC/2 + TCY)(1) 1 TCY 131 Q4 130 A/D CLK 9 A/D DATA 8 7 3 6 2 1 NEW_DATA OLD_DATA ADRES 0 ADIF 1 TCY GO DONE SAMPLE SAMPLING STOPPED 132 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 13-10: rfPIC12F675 A/D CONVERSION REQUIREMENTS (SLEEP MODE) Param No. Sym Characteristic Min Typ Max Units 1.6 -- -- s VREF 3.0V 3.0* -- -- s VREF full range 3.0* 6.0 9.0* s ADCS<1:0> = 11 (RC mode) At VDD = 2.5V 2.0* 4.0 6.0* s At VDD = 5.0V -- 11 -- TAD (Note 2) 11.5 -- s 5* -- -- s The minimum time is the amplifier settling time. This may be used if the "new" input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). -- TOSC/2 + TCY -- -- If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 130 TAD A/D Clock Period 130 TAD A/D Internal RC Oscillator Period 131 TCNV Conversion Time (not including Acquisition Time)(1) 132 TACQ Acquisition Time 134 TGO * Q4 to A/D Clock Start Conditions These parameters are characterized but not tested. Data in `Typ' column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 for minimum conditions. DS70091B-page 108 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 13-11: rfPIC12F675K RF TRANSMITTER SPECIFICATIONS (315 MHz) RF Transmitter Specifications Sym Characteristics Standard Operating Conditions TA = +23C (unless otherwise stated) VDDRF = 3.0V (unless otherwise stated) FC = 315 MHz (unless otherwise stated) Min Typ Max Units Comments FC VCO Frequency 290 -- 350 MHz 32 x FRFXTAL FXTAL Crystal Frequency 9.06 -- 10.94 MHz Fundamental mode FREF Reference Frequency 2.265 -- 2.735 MHz FRFXTAL / 4 CL Load Capacitance 10 -- 15 pF CO Static Capacitance -- -- 7 pF RS Series Resistance -- -- 70 ASPUR Spurious response -- -- -10 dB FVDD Frequency Stability vs VDDRF -- -- 3 ppm FTA Frequency Stability vs Temp -- -- 10 ppm Crystal temp constant F FSK Deviation 5 -- 80 kHz Depends on crystal parameters RFSK FSK Data Rate -- -- 40 Kbit/s NRZ RASK ASK Data Rate -- -- 40 Kbit/s NRZ TON RFEN High to Transmit -- 1.2 1.5 ms POFF RF Output Power in Step 0 -- -- -70 dBm RFEN=1 P1 RF Output Power in Step 1 -- -12 -- dBm RFEN=1 P2 RF Output Power in Step 2 -- -4 -- dBm RFEN=1 P3 RF Output Power in Step 3 -- 2 -- dBm RFEN=1 P4 RF Output Power in Step 4 -- 4 -- dBm RFEN=1, VDDRF=2.0V -- 7.5 -- dBm RFEN=1, VDDRF=3.0V -- 8.5 9.5 dBm RFEN=1, VDDRF=4.0V dBm RFEN=1, VDDRF=5.0V For FSK operation -- 9.0 10.5 L(FM) Phase Noise -- -86 -- PSPUR Spurious Emissions -- -- -54 dBm 47 MHz < f < 74 MHZ 87.5 MHz < f < 118 MHZ 174 MHz < f < 230 MHZ 470 MHz < f < 862 MHZ RBW = 100 kHz -- -- -36 dBm f < 1 GHZ RBW = 100 kHz -- -- -30 dBm f > 1 GHZ RBW = 1 MHz 2003-2013 Microchip Technology Inc. Preliminary dBc/Hz 200 kHz offset DS70091B-page 109 rfPIC12F675 TABLE 13-12: rfPIC12F675F RF TRANSMITTER SPECIFICATIONS (434 MHz) RF Transmitter Specifications Sym Characteristics Standard Operating Conditions TA = +23C (unless otherwise stated) VDDRF = 3.0V (unless otherwise stated) FC = 433.92 MHz (unless otherwise stated) Min Typ Max Units Comments FC VCO Frequency 380 -- 450 MHz 32 x FRFXTAL FXTAL Crystal Frequency 11.88 -- 14.06 MHz Fundamental mode FREF Reference Frequency 2.97 -- 3.515 MHz FRFXTAL / 4 CL Load Capacitance 10 -- 15 pF CO Static Capacitance -- -- 7 pF RS Series Resistance -- -- 70 ASPUR Spurious response -- -- -10 dB FVDD Frequency Stability vs VDDRF -- -- 3 ppm FTA Frequency Stability vs Temp -- -- 10 ppm Crystal temp constant F FSK Deviation 5 -- 80 kHz Depends on crystal parameters RFSK FSK Data Rate -- -- 40 Kbit/s NRZ RASK ASK Data Rate -- -- 40 Kbit/s NRZ TON RFEN High to Transmit -- 0.8 1.2 ms POFF RF Output Power in Step 0 -- -- -70 dBm RFEN=1 P1 RF Output Power in Step 1 -- -12 -- dBm RFEN=1 P2 RF Output Power in Step 2 -- -4 -- dBm RFEN=1 P3 RF Output Power in Step 3 -- 2 -- dBm RFEN=1 P4 RF Output Power in Step 4 -- 4 -- dBm RFEN=1, VDDRF=2.0V -- 7.5 -- dBm RFEN=1, VDDRF=3.0V -- 8.5 9.5 dBm RFEN=1, VDDRF=4.0V dBm RFEN=1, VDDRF=5.0V For FSK operation -- 9.0 10.5 L(FM) Phase Noise -- -86 -- PSPUR Spurious Emissions -- -- -54 dBm 47 MHz < f < 74 MHZ 87.5 MHz < f < 118 MHZ 174 MHz < f < 230 MHZ 470 MHz < f < 862 MHZ RBW = 100 kHz -- -- -36 dBm f < 1 GHZ RBW = 100 kHz -- -- -30 dBm f > 1 GHZ RBW = 1 MHz DS70091B-page 110 Preliminary dBc/Hz 200 kHz offset 2003-2013 Microchip Technology Inc. rfPIC12F675 TABLE 13-13: rfPIC12F675H RF TRANSMITTER SPECIFICATIONS (868/915 MHz) RF Transmitter Specifications Sym Characteristics Standard Operating Conditions TA = +23C (unless otherwise stated) VDDRF = 3.0V (unless otherwise stated) FC = 868.3 MHz (unless otherwise stated) Min Typ Max Units Comments FC VCO Frequency 850 -- 930 MHz 32 x FRFXTAL FXTAL Crystal Frequency 26.56 -- 29.06 MHz Fundamental mode FREF Reference Frequency 3.32 -- 3.63 MHz FRFXTAL / 8 CL Load Capacitance 10 -- 15 pF CO Static Capacitance -- -- 7 pF RS Series Resistance -- -- 50 ASPUR Spurious response -- -- -10 dB FVDD Frequency Stability vs VDDRF -- -- 3 ppm FTA Frequency Stability vs Temp -- -- 10 ppm Crystal temp constant F FSK Deviation 5 -- 80 kHz Depends on crystal parameters RFSK FSK Data Rate -- -- 40 Kbit/s NRZ RASK ASK Data Rate -- -- 40 Kbit/s NRZ TON RFEN High to Transmit -- 0.6 1.0 ms POFF RF Output Power in Step 0 -- -- -70 dBm RFEN=1 P1 RF Output Power in Step 1 -- -12 -- dBm RFEN=1 P2 RF Output Power in Step 2 -- -4 -- dBm RFEN=1 P3 RF Output Power in Step 3 -- 2 -- dBm RFEN=1 P4 RF Output Power in Step 4 -- 4 -- dBm RFEN=1, VDDRF=2.0V -- 7.5 -- dBm RFEN=1, VDDRF=3.0V -- 8.5 9.5 dBm RFEN=1, VDDRF=4.0V dBm RFEN=1, VDDRF=5.0V For FSK operation -- 9.0 10.5 L(FM) Phase Noise -- -82 -- PSPUR Spurious Emissions -- -- -54 dBm 47 MHz < f < 74 MHZ 87.5 MHz < f < 118 MHZ 174 MHz < f < 230 MHZ 470 MHz < f < 862 MHZ RBW = 100 kHz -- -- -36 dBm f < 1 GHZ RBW = 100 kHz -- -- -30 dBm f > 1 GHZ RBW = 1 MHz 2003-2013 Microchip Technology Inc. Preliminary dBc/Hz 200 kHz offset DS70091B-page 111 rfPIC12F675 NOTES: DS70091B-page 112 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 14.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. 'Typical' represents the mean of the distribution at 25C. 'Max' or 'min' represents (mean + 3) or (mean - 3) respectively, where is standard deviation, over the whole temperature range. FIGURE 14-1: TYPICAL IPD vs. VDD OVER TEMP (-40C TO +25C) Typical Baseline IPD 6.0E-09 5.0E-09 IPD (A) 4.0E-09 -40 3.0E-09 0 25 2.0E-09 1.0E-09 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 14-2: TYPICAL IPD vs. VDD OVER TEMP (+85C) Typical Baseline IPD 3.5E-07 3.0E-07 IPD (A) 2.5E-07 2.0E-07 85 1.5E-07 1.0E-07 5.0E-08 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 113 rfPIC12F675 FIGURE 14-3: TYPICAL IPD vs. VDD OVER TEMP (+125C) Typical Baseline IPD 4.0E-06 3.5E-06 IPD (A) 3.0E-06 2.5E-06 125 2.0E-06 1.5E-06 1.0E-06 5.0E-07 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 14-4: MAXIMUM IPD vs. VDD OVER TEMP (-40C TO +25C) Maximum Baseline IPD 1.0E-07 9.0E-08 IPD (A) 8.0E-08 7.0E-08 6.0E-08 -40 5.0E-08 0 4.0E-08 25 3.0E-08 2.0E-08 1.0E-08 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) DS70091B-page 114 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 14-5: MAXIMUM IPD vs. VDD OVER TEMP (+85C) Maximum Baseline IPD 9.0E-07 8.0E-07 IPD (A) 7.0E-07 6.0E-07 5.0E-07 4.0E-07 85 3.0E-07 2.0E-07 1.0E-07 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 14-6: MAXIMUM IPD vs. VDD OVER TEMP (+125C) Maximum Baseline IPD 9.0E-06 8.0E-06 IPD (A) 7.0E-06 6.0E-06 5.0E-06 125 4.0E-06 3.0E-06 2.0E-06 1.0E-06 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 115 rfPIC12F675 FIGURE 14-7: TYPICAL IPD WITH BOD ENABLED vs. VDD OVER TEMP (-40C TO +125C) Typical BOD IPD 130 120 110 IPD (uA) -40 100 0 90 25 80 85 125 70 60 50 3 3.5 4 4.5 5 5.5 VDD(V) FIGURE 14-8: TYPICAL IPD WITH CMP ENABLED vs. VDD OVER TEMP (-40C TO +125C) Typical Comparator IPD 1.8E-05 1.6E-05 1.4E-05 -40 IPD (A) 1.2E-05 0 1.0E-05 25 8.0E-06 85 6.0E-06 125 4.0E-06 2.0E-06 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS70091B-page 116 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 14-9: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (-40C TO +25C) IPD (A) Typical A/D IPD 5.0E-09 4.5E-09 4.0E-09 3.5E-09 3.0E-09 2.5E-09 2.0E-09 1.5E-09 1.0E-09 5.0E-10 0.0E+00 -40 0 25 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 14-10: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+85C) Typical A/D IPD 3.5E-07 3.0E-07 IPD (A) 2.5E-07 2.0E-07 85 1.5E-07 1.0E-07 5.0E-08 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 117 rfPIC12F675 FIGURE 14-11: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+125C) Typical A/D IPD 3.5E-06 IPD (A) 3.0E-06 2.5E-06 2.0E-06 125 1.5E-06 1.0E-06 5.0E-07 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 14-12: TYPICAL IPD WITH T1 OSC ENABLED vs. VDD OVER TEMP (-40C TO +125C), 32 KHZ, C1 AND C2=50 pF) Typical T1 IPD 1.20E-05 1.00E-05 -40 IPD (A) 8.00E-06 0 25 6.00E-06 85 4.00E-06 125 2.00E-06 0.00E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS70091B-page 118 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 FIGURE 14-13: TYPICAL IPD WITH CVREF ENABLED vs. VDD OVER TEMP (-40C TO +125C) Typical CVREF IPD 160 IPD (uA) 140 -40 120 0 25 100 85 80 125 60 40 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 14-14: TYPICAL IPD WITH WDT ENABLED vs. VDD OVER TEMP (-40C TO +125C) Typical WDT IPD 16 IPD (uA) 14 12 -40 10 0 8 25 6 85 4 125 2 0 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 119 rfPIC12F675 FIGURE 14-15: MAXIMUM AND MINIMUMINTOSC FREQ vs. TEMPERATURE WITH 0.1F AND 0.01F DECOUPLING (VDD = 3.5V) Internal Oscillator Frequency vs Temperature 4.20E+06 Frequency (Hz) 4.15E+06 4.10E+06 4.05E+06 -3sigma 4.00E+06 average 3.95E+06 +3sigma 3.90E+06 3.85E+06 3.80E+06 -40C 0C 25C 85C 125C Temperature (C) FIGURE 14-16: MAXIMUM AND MINIMUMINTOSC FREQ vs. VDD WITH 0.1F AND 0.01F DECOUPLING (+25C) Internal Oscillator Frequency vs VDD Frequency (Hz) 4.20E+06 4.15E+06 4.10E+06 4.05E+06 4.00E+06 -3sigma 3.95E+06 3.90E+06 +3sigma average 3.85E+06 3.80E+06 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V VDD (V) DS70091B-page 120 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 TYPICAL WDT PERIOD vs. VDD (-40C TO +125C) FIGURE 14-17: WDT Time-out 50 Time (mS) 45 40 35 -40 30 25 0 20 15 10 5 85 25 125 0 2 2.5 3 3.5 4 4.5 5 5.5 V DD (V) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 121 rfPIC12F675 NOTES: DS70091B-page 122 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 15.0 PACKAGING INFORMATION 15.1 Package Marking Information 20-Lead SSOP Example XXXXXXXXXXX XXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: rfPICTM 12F675H 0314CBP Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 123 rfPIC12F675 Package Type: 20-Lead SSOP 20-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D B 2 1 n c A2 A L A1 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .068 .064 .002 .299 .201 .278 .022 .004 0 .010 0 0 INCHES* NOM 20 .026 .073 .068 .006 .309 .207 .284 .030 .007 4 .013 5 5 MAX .078 .072 .010 .322 .212 .289 .037 .010 8 .015 10 10 MILLIMETERS NOM 20 0.65 1.73 1.85 1.63 1.73 0.05 0.15 7.59 7.85 5.11 5.25 7.06 7.20 0.56 0.75 0.10 0.18 0.00 101.60 0.25 0.32 0 5 0 5 MIN MAX 1.98 1.83 0.25 8.18 5.38 7.34 0.94 0.25 203.20 0.38 10 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-150 Drawing No. C04-072 DS70091B-page 124 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 APPENDIX A: DATA SHEET REVISION HISTORY Revision A This is a new data sheet. Revision B Added a note to each package outline drawing. 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 125 rfPIC12F675 NOTES: DS70091B-page 126 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 INDEX A A/D ...................................................................................... 39 Acquisition Requirements ........................................... 43 Block Diagram............................................................. 39 Calculating Acquisition Time....................................... 43 Configuration and Operation....................................... 39 Effects of a RESET ..................................................... 44 Internal Sampling Switch (Rss) Impedance ................ 43 Operation During SLEEP ............................................ 44 PIC12F675 Converter Characteristics ...................... 106 Source Impedance...................................................... 43 Summary of Registers ................................................ 44 Absolute Maximum Ratings ................................................ 87 AC Characteristics Industrial and Extended .............................................. 99 Additional Pin Functions ..................................................... 17 Interrupt-on-Change.................................................... 19 Weak Pull-up............................................................... 17 Analog Input Connection Considerations............................ 36 Analog-to-Digital Converter. See A/D Assembler MPASM Assembler..................................................... 81 B Block Diagram TMR0/WDT Prescaler................................................. 25 Block Diagrams Analog Input Mode...................................................... 36 Analog Input Model ..................................................... 43 Comparator Output ..................................................... 36 Comparator Voltage Reference .................................. 37 GP0 and GP1 Pins...................................................... 20 GP2............................................................................. 21 GP3............................................................................. 21 GP4............................................................................. 22 GP5............................................................................. 22 On-Chip Reset Circuit ................................................. 59 RC Oscillator Mode..................................................... 58 Timer1......................................................................... 28 Watchdog Timer.......................................................... 69 Brown-out Associated Registers .................................................. 62 Brown-out Detect (BOD) ..................................................... 61 Brown-out Detect Timing and Characteristics................... 102 Operation.................................................................... 34 Operation During SLEEP............................................ 37 Output......................................................................... 36 Reference ................................................................... 37 Response Time .......................................................... 37 Comparator Specifications................ 105, 108, 109, 110, 111 Comparator Voltage Reference Specifications................. 105 Configuration Bits ............................................................... 56 Configuring the Voltage Reference..................................... 37 Crystal Operation................................................................ 57 Crystal Oscillator................................................................. 50 D Data EEPROM Memory Associated Registers/Bits........................................... 48 Code Protection.......................................................... 48 EEADR Register......................................................... 45 EECON1 Register ...................................................... 45 EECON2 Register ...................................................... 45 EEDATA Register....................................................... 45 Data Memory Organization................................................... 5 DC Characteristics Extended and Industrial.............................................. 96 Industrial ..................................................................... 90 Demonstration Boards PICDEM 1................................................................... 84 PICDEM 17................................................................. 84 PICDEM 18R PIC18C601/801 ................................... 85 PICDEM 2 Plus........................................................... 84 PICDEM 3 PIC16C92X............................................... 84 PICDEM 4................................................................... 84 PICDEM LIN PIC16C43X ........................................... 85 PICDEM USB PIC16C7X5 ......................................... 85 PICDEM.net Internet/Ethernet.................................... 84 Development Support ......................................................... 81 Device Overview................................................................... 3 E EEPROM Data Memory Reading ...................................................................... 47 Spurious Write ............................................................ 47 Write Verify ................................................................. 47 Writing ........................................................................ 47 Electrical Specifications ...................................................... 87 Errata .................................................................................... 2 Evaluation and Programming Tools.................................... 85 C F C Compilers MPLAB C17 ................................................................ 82 MPLAB C18 ................................................................ 82 MPLAB C30 ................................................................ 82 Calibrated Internal RC Frequencies.................................. 100 CLKOUT ............................................................................. 58 Code Examples Changing Prescaler .................................................... 27 Data EEPROM Read .................................................. 47 Data EEPROM Write .................................................. 47 Initializing GPIO .......................................................... 17 Saving STATUS and W Registers in RAM ................. 68 Write Verify ................................................................. 47 Code Protection .................................................................. 69 Comparator ......................................................................... 33 Associated Registers .................................................. 38 Configuration............................................................... 35 Effects of a RESET ..................................................... 37 I/O Operating Modes................................................... 35 Interrupts..................................................................... 38 Firmware Instructions ......................................................... 73 2003-2013 Microchip Technology Inc. G General Purpose Register File ............................................. 5 GPIO Associated Registers.................................................. 23 GPIO Port ........................................................................... 17 GPIO, TRISIO Registers..................................................... 17 I ID Locations........................................................................ 69 In-Circuit Debugger............................................................. 71 In-Circuit Serial Programming............................................. 71 Indirect Addressing, INDF and FSR Registers ................... 16 Instruction Format............................................................... 73 Instruction Set..................................................................... 73 ADDLW....................................................................... 75 ADDWF ...................................................................... 75 ANDLW....................................................................... 75 ANDWF ...................................................................... 75 BCF ............................................................................ 75 Preliminary DS70091B-page 127 rfPIC12F675 BSF ............................................................................. 75 BTFSC ........................................................................ 75 BTFSS ........................................................................ 75 CALL ........................................................................... 76 CLRF........................................................................... 76 CLRW ......................................................................... 76 CLRWDT..................................................................... 76 COMF ......................................................................... 76 DECF .......................................................................... 76 DECFSZ...................................................................... 77 GOTO ......................................................................... 77 INCF............................................................................ 77 INCFSZ ....................................................................... 77 IORLW ........................................................................ 77 IORWF ........................................................................ 77 MOVF.......................................................................... 78 MOVLW ...................................................................... 78 MOVWF ...................................................................... 78 NOP ............................................................................ 78 RETFIE ....................................................................... 78 RETLW ....................................................................... 78 RETURN ..................................................................... 79 RLF ............................................................................. 79 RRF............................................................................. 79 SLEEP ........................................................................ 79 SUBLW ....................................................................... 79 SUBWF ....................................................................... 79 SWAPF ....................................................................... 80 XORLW ....................................................................... 80 XORWF....................................................................... 80 Summary Table........................................................... 74 Internal 4 MHz Oscillator..................................................... 58 Internal Sampling Switch (Rss) Impedance ........................ 43 Interrupts ............................................................................. 65 A/D Converter ............................................................. 67 Comparator ................................................................. 67 Context Saving............................................................ 68 GP2/INT ...................................................................... 67 GPIO ........................................................................... 67 Summary of Registers ................................................ 68 TMR0 .......................................................................... 67 M MCLR .................................................................................. 60 Memory Organization Data EEPROM Memory.............................................. 45 Mode Control Logic ............................................................. 54 MPLAB ASM30 Assembler, Linker, Librarian ..................... 82 MPLAB ICD 2 In-Circuit Debugger...................................... 83 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator .............................................................. 83 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator .............................................................. 83 MPLAB Integrated Development Environment Software .............................................................................. 81 MPLINK Object Linker/MPLIB Object Librarian .................. 82 O OPCODE Field Descriptions ............................................... 73 Oscillator Configurations ..................................................... 57 Oscillator Start-up Timer (OST) .......................................... 60 P Package Marking Information ........................................... 123 Packaging Information ...................................................... 123 PCL and PCLATH ............................................................... 15 Computed GOTO ........................................................ 15 Stack ........................................................................... 15 DS70091B-page 128 Phase-Locked Loop (PLL) .................................................. 53 PICkit 1 FLASH Starter Kit.................................................. 85 PICSTART Plus Development Programmer....................... 83 Pin Descriptions and Diagrams .......................................... 20 Power Amplifier................................................................... 53 Power Control/Status Register (PCON).............................. 61 Power Select (Table) .......................................................... 53 Power-Down Mode (SLEEP) .............................................. 70 Power-on Reset (POR)....................................................... 60 Power-up Timer (PWRT) .................................................... 60 Prescaler............................................................................. 27 Switching Prescaler Assignment ................................ 27 PRO MATE II Universal Device Programmer ..................... 83 Program Memory Organization............................................. 5 Programming, Device Instructions...................................... 73 R RC Oscillator....................................................................... 58 READ-MODIFY-WRITE OPERATIONS ............................. 73 Registers ADCON0 (A/D Control)............................................... 41 ANSEL (Analog Select) .............................................. 42 CMCON (Comparator Control) ................................... 33 CONFIG (Configuration Word) ................................... 56 EEADR (EEPROM Address) ...................................... 45 EECON1 (EEPROM Control) ..................................... 46 EEDAT (EEPROM Data) ............................................ 45 INTCON (Interrupt Control)......................................... 11 IOCB (Interrupt-on-Change GPIO) ............................. 19 Maps PIC12F629 ........................................................... 6 PIC12F675 ........................................................... 6 OPTION_REG (Option) ........................................ 10, 26 OSCCAL (Oscillator Calibration) ................................ 14 PCON (Power Control) ............................................... 14 PIE1 (Peripheral Interrupt Enable 1)........................... 12 PIR1 (Peripheral Interrupt 1)....................................... 13 STATUS ....................................................................... 9 T1CON (Timer1 Control) ............................................ 30 VRCON (Voltage Reference Control) ......................... 38 WPU (Weak Pull-up)................................................... 18 RESET................................................................................ 59 Revision History................................................................ 125 S Software Simulator (MPLAB SIM) ...................................... 82 Software Simulator (MPLAB SIM30) .................................. 82 Special Features of the CPU .............................................. 55 Special Function Registers ................................................... 6 Special Functions Registers Summary................................. 7 T Time-out Sequence ............................................................ 61 Timer0................................................................................. 25 Associated Registers .................................................. 27 External Clock............................................................. 26 Interrupt ...................................................................... 25 Operation .................................................................... 25 T0CKI ......................................................................... 26 Timer1 Associated Registers .................................................. 31 Asynchronous Counter Mode ..................................... 31 Reading and Writing ........................................... 31 Interrupt ...................................................................... 29 Modes of Operations .................................................. 29 Operation During SLEEP............................................ 31 Oscillator..................................................................... 31 Prescaler .................................................................... 29 Preliminary 2003-2013 Microchip Technology Inc. rfPIC12F675 Timer1 Module with Gate Control ....................................... 28 Timing Diagrams CLKOUT and I/O....................................................... 101 External Clock............................................................. 99 INT Pin Interrupt.......................................................... 67 PIC12F675 A/D Conversion (Normal Mode)............. 107 PIC12F675 A/D Conversion Timing (SLEEP Mode) .......................................................... 108 RESET, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer ....................................... 102 Time-out Sequence on Power-up (MCLR not Tied to VDD)/ Case 1 ................................................................ 64 Case 2 ................................................................ 64 Time-out Sequence on Power-up (MCLR Tied to VDD) ........................................................................ 64 Timer0 and Timer1 External Clock ........................... 104 Timer1 Incrementing Edge.......................................... 29 Timing Parameter Symbology............................................. 98 U UHF ASK/FSK Transmitter CEPT .......................................................................... 49 FCC............................................................................. 49 Radio Frequency......................................................... 49 Transmitter.................................................................. 49 V Voltage Reference Accuracy/Error ..................................... 37 W Watchdog Timer Summary of Registers ................................................ 69 Watchdog Timer (WDT) ...................................................... 68 WWW, On-Line Support ....................................................... 2 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 129 rfPIC12F675 NOTES: DS70091B-page 130 Preliminary 2003-2013 Microchip Technology Inc. THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2003-2013 Microchip Technology Inc. DS70091B-page 131 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: DS70091B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70091B-page 132 2003-2013 Microchip Technology Inc. rfPIC12F675 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX XXX Package Pattern Device : Standard VDD range T: (Tape and Reel) Temperature Range I E Package SS Pattern 3-Digit Pattern Code for QTP (blank otherwise) = = Examples: a) rfPIC12F675F - E/SS 301 = Extended Temp., SSOP package, 434 MHz, QTP pattern #301 b) rfPIC12F675FHT - I/SS = Industrial Temp., SSOP package, 868 MHz, Tape and Reel -40C to +85C -40C to +125C = SSOP * JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) 2003-2013 Microchip Technology Inc. Preliminary DS70091B-page 133 rfPIC12F675 DS70091B-page 134 Preliminary 2003-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2003-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769683 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2003-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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