Javascript must be enabled to view full functionality of our site. ACCOUNT PRODUCTS APPLICATIONS SUPPORT ABOUT ALL CART Search... S912ZVC12F0VKH Package : HLQFP plastic, thermal enhanced low profile quad flat package 64 terminals 0.50 mm pitch 10 mm x 10 mm x 1.4 mm body MagniV 16-bit MCU, S12Z core, 128KB Flash, 32MHz, -40/+105degC, Automotive Qualified, QFP 64 Buy Options ENGLISH Environmental Information Quality Information Shipping Information Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) S912ZVC12F0VKH ( 935320591557 ) Yes Yes Certificate Of Analysis (CoA) Yes D e3 REACH SVHC 373.6 S912ZVC12F0VKHR ( 935320591528 ) Yes Yes Certificate Of Analysis (CoA) Yes D e3 REACH SVHC 373.6 Quality Information Material Declaration Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering Safe Assure Functional Safety S912ZVC12F0VKH ( 935320591557 ) ISO 26262 3 260 40 S912ZVC12F0VKHR ( 935320591528 ) ISO 26262 3 260 40 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) S912ZVC12F0VKH ( 935320591557 ) 854231 3A991A2 S912ZVC12F0VKHR ( 935320591528 ) 854231 3A991A2 ABOUT NXP RESOURCES Investors Mobile Apps Press, News, Blogs Contact Us Careers FOLLOW US News 25 Feb 2019 NXP Launches First MCU-based Solution Qualified for Amazon's Alexa Voice Service (AVS) Read More