DISCRETE SEMICONDUCTORS DATA SHEET lfpage M3D121 BAS86 Schottky barrier diode Product data sheet Supersedes data of 1996 Oct 01 2000 May 25 NXP Semiconductors Product data sheet Schottky barrier diode BAS86 FEATURES DESCRIPTION * Low forward voltage Planar Schottky barrier diode with an integrated protection ring against static discharges. This surface mounted diode is encapsulated in a hermetically sealed * High breakdown voltage * Guard ring protected * Hermetically-sealed small SMD package. SOD80C glass SMD package with tin-plated metal discs at each end. It is suitable for "automatic placement" and as such it can withstand immersion soldering. APPLICATIONS k handbook, halfpage * Ultra high-speed switching a * Voltage clamping * Protection circuits MAM190 * Blocking diodes. Cathode indicated by a grey band. Fig.1 Simplified outline (SOD80C), pin configuration and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage - 50 V IF continuous forward current - 200 mA IF(AV) average forward current see Fig.2 - 200 mA IFRM repetitive peak forward current tp 1 sec.; 0.5 - 500 mA IFSM non-repetitive peak forward current tp = 10 ms - 5 A Tstg storage temperature -65 +150 C Tj junction temperature - 125 C Tamb operating ambient temperature -65 +125 C 2000 May 25 2 NXP Semiconductors Product data sheet Schottky barrier diode BAS86 ELECTRICAL CHARACTERISTICS Tamb = 25 C; unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS MAX. UNIT see Fig.3 IF = 0.1 mA 300 mV IF = 1 mA 380 mV IF = 10 mA 450 mV IF = 30 mA 600 mV IF = 100 mA 900 mV IR reverse current VR = 40 V; see Fig.4; note 1 5 A trr reverse recovery time when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.6 4 ns Cd diode capacitance f = 1 MHz; VR = 1 V; see Fig.5 8 pF Note 1. Pulsed test: tp = 300 s; = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 Note 1. Refer to SOD80 standard mounting conditions. 2000 May 25 3 VALUE UNIT 320 K/W NXP Semiconductors Product data sheet Schottky barrier diode BAS86 GRAPHICAL DATA MRA540 MLD357 103 handbook, halfpage 250 handbook, halfpage I F(AV) IF (mA) (mA) 200 (1) (2) (3) 102 150 10 100 (1) (2) (3) 1 50 0 0 50 100 10-1 150 0 0.4 0.8 o Tamb ( C) VF (V) 1.2 (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. Fig.3 Forward current as a function of forward voltage; typical values. Fig.2 Derating curve. MGC686 5 10halfpage handbook, I R (nA) 10 MGC687 12 handbook, halfpage (1) Cd (pF) 4 (2) 10 3 8 10 2 10 4 (3) 1 10 -1 0 0 10 20 30 40 0 50 10 VR (V) 30 40 50 VR (V) (1) Tamb = 85 C. (2) Tamb = 25 C. (3) Tamb = -40 C. f = 1 MHz. Fig.4 Fig.5 Reverse current as a function of reverse voltage; typical values. 2000 May 25 20 4 Diode capacitance as a function of reverse voltage; typical values. NXP Semiconductors Product data sheet Schottky barrier diode BAS86 handbook, halfpage I F dI F dt 10% t Qr 90% IR tf MRC129 - 1 Fig.6 Reverse recovery definitions. 2000 May 25 5 NXP Semiconductors Product data sheet Schottky barrier diode BAS86 PACKAGE OUTLINE Hermetically sealed glass surface mounted package; 2 connectors k SOD80C a (1) D L L H DIMENSIONS (mm are the original dimensions) 0 UNIT D H L mm 1.60 1.45 3.7 3.3 0.3 1 2 mm scale Note 1. The marking band indicates the cathode. REFERENCES OUTLINE VERSION IEC SOD80C 100H01 2000 May 25 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-20 6 NXP Semiconductors Product data sheet Schottky barrier diode BAS86 DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions 2000 May 25 7 NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were made to the content, except for the legal definitions and disclaimers. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/03/pp8 Date of release: 2000 May 25 Document order number: 9397 750 07025