Semiconductor Group 2
Electrical Characteristics
at Tj = 25 ˚C, unless otherwise specified.
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS = 0, ID = 0.25 mA V(BR)DSS 100 – – V
Gate threshold voltage
VGS = VDS, ID = 1 mA VGS(th) 1.5 2.0 2.5
Zero gate voltage drain current
VGS = 0 V, VDS = 100 Tj = 25 °C
Tj = 125 °C
IDSS
–
–0.1
10 1.0
100
µA
Gate-source leakage current
VGS = ±20 V, VDS = 0 Tj = 25 °C
Tj = 150 °C
IGSS
–
–10
2100
4nA
µA
Drain-source on-state resistance
VGS = 4.5 V, ID = 9.5 A RDS(on) – 0.085 0.1 Ω
Dynamic Characteristics
Forward transconductance
VDS ≥ 2 ×ID×RDS(on)max,ID = 9.5 A gfs 814–S
Input capacitance
VGS = 0, VDS = 25 V, f = 1 MHz Ciss – 1200 1500 pF
Output capacitance
VGS = 0, VDS = 25 V, f = 1 MHz Coss – 320 580
Reverse transfer capacitance
VGS = 0, VDS = 25 V, f = 1 MHz Crss – 160 260
Turn-on time ton, (ton = td(on) + tr)
VCC = 30 V, VGS = 5 V, ID = 3 A, RGS = 50 Ωtd(on) –2540ns
t
r– 110 170
Turn-off time toff, (toff = td(off) + tf)
VCC = 30 V, VGS = 5 V, ID = 3 A, RGS = 50 Ωtd(off) – 210 270
tf– 100 130
BTS 121A