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TLV1117
SLVS561L –DECEMBER 2004–REVISED OCTOBER 2014
TLV1117 Adjustable and Fixed Low-Dropout Voltage Regulator
1 Features 3 Description
The TLV1117 device is a positive low-dropout voltage
1• 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and regulator designed to provide up to 800 mA of output
Adjustable-Output Voltage Options current. The device is available in 1.5-V, 1.8-V, 2.5-V,
• Output Current of 800 mA 3.3-V, 5-V, and adjustable-output voltage options. All
• Specified Dropout Voltage at Multiple internal circuitry is designed to operate down to 1-V
input-to-output differential. Dropout voltage is
Current Levels specified at a maximum of 1.3 V at 800 mA,
• 0.2% Line Regulation Maximum decreasing at lower load currents.
• 0.4% Load Regulation Maximum Device Information
2 Applications ORDER NUMBER PACKAGE (PIN) BODY SIZE
• Electronic Points of Sale TLV1117DCY SOT-223 (4) 6.50 mm × 3.50 mm
• Medical, Health, and Fitness Applications TLV1117DRJ SON (8) 4.00 mm × 4.00 mm
TLV1117KVU TO-252 (3) 6.60 mm × 6.10 mm
• Printers TLV1117KCS TO-220 (3) 10.16 mm × 8.70 mm
• Appliances and White Goods TLV1117KCT TO-220 (3) 10.16 mm × 8.59 mm
• TV Set-Top Boxes DDPAK,
TLV1117KTT 10.18 mm × 8.41 mm
TO-263 (3)
4 Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV1117
SLVS561L –DECEMBER 2004–REVISED OCTOBER 2014
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Table of Contents
8.1 Overview................................................................. 10
1 Features.................................................................. 18.2 Functional Block Diagram....................................... 10
2 Applications ........................................................... 18.3 Feature Description................................................. 10
3 Description............................................................. 18.4 Device Functional Modes........................................ 10
4 Simplified Schematic............................................. 19 Application and Implementation ........................ 12
5 Revision History..................................................... 29.1 Typical Application ................................................. 12
6 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 13
7 Specifications......................................................... 411 Layout................................................................... 13
7.1 Absolute Maximum Ratings ..................................... 411.1 Layout Guidelines ................................................. 13
7.2 Handling Ratings ...................................................... 411.2 Layout Example .................................................... 13
7.3 Recommended Operating Conditions....................... 412 Device and Documentation Support................. 14
7.4 Thermal Information.................................................. 512.1 Trademarks........................................................... 14
7.5 TLV1117C Electrical Characteristics ........................ 612.2 Electrostatic Discharge Caution............................ 14
7.6 TLV1117I Electrical Characteristics.......................... 712.3 Glossary................................................................ 14
7.7 Typical Characteristics.............................................. 813 Mechanical, Packaging, and Orderable
8 Detailed Description............................................ 10 Information........................................................... 14
Changes from Revision K (April 2013) to Revision L Page
• Updated data sheet to new TI standards – no specification changes. .................................................................................. 1
• Deleted Ordering Information table. ...................................................................................................................................... 1
• Added Applications................................................................................................................................................................. 1
• Added Device and Documentation Support section............................................................................................................. 14
• Added Mechanical, Packaging, and Orderable Information section..................................................................................... 14
5 Revision History
Changes from Revision J (April 2013) to Revision K Page
• Added additional package options.......................................................................................................................................... 3
• Added ESD warning............................................................................................................................................................. 14
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INPUT
OUTPUT
ADJ/GND
OUTPUT
DCY (SOT-223) PACKAGE
(TOP VIEW)
VOUT(2)
ADJ/GND
2
3
4
1
8
7
6
5
VIN(1)
VIN(1)
VIN(1)
VOUT(2)
VOUT(2)
NC
(1) VIN pins (2, 3, 4) must be connected together.
(2) V
OUT pins (5, 6, 7) must be connected together.
VOUT
DRJ (QFN) PACKAGE
(TOP VIEW)
OUTPUT
INPUT
ADJ/GND
OUTPUT
KCT, KCS (TO-220) PACKAGE
(TOP VIEW)
3
2
1
3
2
1
INPUT
OUTPUT
ADJ/GND
OUTPUT
KTT (TO-263) PACKAGE
(TOP VIEW)
OUTPUT
INPUT
ADJ/GND
OUTPUT
KVU (TO-252) PACKAGE
(TOP VIEW)
3
2
1
3
2
1
TLV1117
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SLVS561L –DECEMBER 2004–REVISED OCTOBER 2014
6 Pin Configuration and Functions
Table 1. Pin Functions
PIN TYPE DESCRIPTION
NAME KTT KVU DCY DRJ KCT
ADJ/GND 1 1 1 1 1 I/O Output voltage adjustment pin. Connect to a resistor divider.
INPUT 3 3 3 2, 3, 4 3 I Voltage input
OUTPUT 2 2 2 5, 6, 7 2 O Voltage output
NC - - - 8 - - No connect
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7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VIN Continuous input voltage 16 V
TJOperating virtual-junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 0 2500
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 0 1500
JESD22-C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions MIN(1) MAX UNIT
TLV1117 2.7 15
TLV1117-15 2.9 15
TLV1117-18 3.2 15
VIN Input voltage V
TLV1117-25 3.9 15
TLV1117-33 4.7 15
TLV1117-50 6.4 15
IOOutput current 0.8 A
TLV1117C 0 125
TJOperating virtual-junction temperature °C
TLV1117I –40 125
(1) The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout
(for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output
voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following:
VIN(min) = VOUT(max) + VDO(max at rated current)
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7.4 Thermal Information TLV1117
PowerFlex
THERMAL METRIC(1)(2)(3) UNITS
KTE KTP DRJ DCY KVU KCS, KCT KTT
(3 PINS) (3 PINS) (8 PINS) (4 PINS) (3 PINS) (3 PINS) (3 PINS)
Junction-to-ambient thermal
RθJA 38.6 49.2 38.3 104.3 50.9 30.1 27.5
resistance
Junction-to-case (top) thermal
RθJC(top) 34.7 60.6 36.5 53.7 57.9 44.6 43.2
resistance
RθJB Junction-to-board thermal resistance 3.2 3.1 60.5 5.7 34.8 1.2 17.3
Junction-to-top characterization
ψJT 5.9 8.7 0.2 3.1 6 5 2.8
parameter °C/W
Junction-to-board characterization
ψJB 3.1 3 12 5.5 23.7 1.2 9.3
parameter
Junction-to-case (bottom) thermal
RθJC(bot) 3 3 4.7 n/a 0.4 0.4 0.3
resistance
Thermal resistance between the die
RθJP junction and the bottom of the 2.7 1.4 1.78 n/a n/a 3 1.94
exposed pad.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA) / θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
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7.5 TLV1117C Electrical Characteristics
TJ= 0°C to 125°C, all typical values are at TJ= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VIN – VOUT = 2 V, IOUT = 10 mA, TJ= 25°C 1.238 1.25 1.262
Reference voltage, VREF TLV1117
VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 1.225 1.25 1.27
VIN = 3.5 V, IOUT = 10 mA, TJ= 25°C 1.485 1.5 1.515
TLV1117-15
VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA 1.455 1.5 1.545
VIN = 3.8 V, IOUT = 10 mA, TJ= 25°C 1.782 1.8 1.818
TLV1117-18
VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA 1.746 1.8 1.854 V
VIN = 4.5 V, IOUT = 10 mA, TJ= 25°C 2.475 2.5 2.525
Output voltage, VOUT TLV1117-25
VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA 2.450 2.5 2.550
VIN = 5 V, IOUT = 10 mA, TJ= 25°C 3.267 3.3 3.333
TLV1117-33
VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA 3.235 3.3 3.365
VIN = 7 V, IOUT = 10 mA, TJ= 25°C 4.950 5.0 5.050
TLV1117-50
VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA 4.900 5.0 5.100
IOUT = 10 mA, VIN – VOUT = 1.5 V to 13.75 V TLV1117 0.035% 0.2% —
IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117-15 1 6
IOUT = 0 mA, VIN = 3.2 V to 10 V TLV1117-18 1 6
Line regulation IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-25 1 6 mV
IOUT = 0 mA, VIN = 4.75 V to 15 V TLV1117-33 1 6
IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-50 1 10
IOUT = 10 mA to 800 mA, VIN – VOUT = 3 V TLV1117 0.2% 0.4% —
IOUT = 0 to 800 mA, VIN = 2.9 V TLV1117-15 1 10
IOUT = 0 to 800 mA, VIN = 3.2 V TLV1117-18 1 10
Load regulation IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-25 1 10 mV
IOUT = 0 to 800 mA, VIN = 4.75 V TLV1117-33 1 10
IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-50 1 15
IOUT = 100 mA 1.1 1.2
Dropout voltage, VDO (2) IOUT = 500 mA 1.15 1.25 V
IOUT = 800 mA 1.2 1.3
Current limit VIN – VOUT = 5 V, TJ= 25°C(3) 0.8 1.2 1.6 A
Minimum load current VIN = 15 V TLV1117 1.7 5 mA
All fixed-voltage
Quiescent current VIN ≤15 V 5 10 mA
options
Thermal regulation 30-ms pulse, TA= 25°C 0.01 0.1 %/W
Ripple rejection VIN – VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz 60 75 dB
ADJ pin current 80 120 μA
Change in ADJ pin current VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 0.2 5 μA
Temperature stability TJ= full range 0.5% —
Long-term stability 1000 hrs, No load, TA= 125°C 0.3% —
Output noise voltage f = 10 Hz to 100 kHz 0.003% —
(% of VOUT)
(1) All characteristics are measured with a 10-μF capacitor across the input and a 10-μF capacitor across the output. Pulse testing
techniques are used to maintain the junction temperature as close to the ambient temperature as possible.
(2) Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT,
measured at VIN = VOUT(nom) + 1.5 V.
(3) Current limit test specified under recommended operating conditions.
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7.6 TLV1117I Electrical Characteristics
TJ= –40°C to 125°C, all typical values are at TJ= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
VIN – VOUT = 2 V, IOUT = 10 mA, TJ= 25°C 1.238 1.25 1.262
Reference voltage, VREF TLV1117
VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 1.200 1.25 1.29
VIN = 3.5 V, IOUT = 10 mA, TJ= 25°C 1.485 1.5 1.515
TLV1117-15
VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA 1.44 1.5 1.56
VIN = 3.8 V, IOUT = 10 mA, TJ= 25°C 1.782 1.8 1.818
TLV1117-18
VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA 1.728 1.8 1.872 V
VIN = 4.5 V, IOUT = 10 mA, TJ= 25°C 2.475 2.5 2.525
Output voltage, VOUT TLV1117-25
VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA 2.4 2.5 2.6
VIN = 5 V, IOUT = 10 mA, TJ= 25°C 3.267 3.3 3.333
TLV1117-33
VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA 3.168 3.3 3.432
VIN = 7 V, IOUT = 10 mA, TJ= 25°C 4.95 5.0 5.05
TLV1117-50
VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA 4.80 5.0 5.20
IOUT = 10 mA, VIN – VOUT = 1.5 V to 13.75 V TLV1117 0.035% 0.3% —
IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117-15 1 10
IOUT = 0 mA, VIN = 3.2 V to 10 V TLV1117-18 1 10
Line regulation IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-25 1 10 mV
IOUT = 0 mA, VIN = 4.75 V to 15 V TLV1117-33 1 10
IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-50 1 15
IOUT = 10 mA to 800 mA, VIN – VOUT = 3 V TLV1117 0.2% 0.5% —
IOUT = 0 to 800 mA, VIN = 2.9 V TLV1117-15 1 15
IOUT = 0 to 800 mA, VIN = 3.2 V TLV1117-18 1 15
Load regulation IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-25 1 15 mV
IOUT = 0 to 800 mA, VIN = 4.75 V TLV1117-33 1 15
IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-50 1 20
IOUT = 100 mA 1.1 1.3
Dropout voltage, VDO (2) IOUT = 500 mA 1.15 1.35 V
IOUT = 800 mA 1.2 1.4
Current limit VIN – VOUT = 5 V, TJ= 25°C(3) 0.8 1.2 1.6 A
Minimum load current VIN = 15 V TLV1117 1.7 5 mA
All fixed-voltage
Quiescent current VIN ≤15 V 5 15 mA
options
Thermal regulation 30-ms pulse, TA= 25°C 0.01 0.1 %/W
Ripple rejection VIN – VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz 60 75 dB
ADJ pin current 80 120 μA
Change in ADJ pin current VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 0.2 10 μA
Temperature stability TJ= full range 0.5% —
Long-term stability 1000 hrs, No load, TA= 125°C 0.3% —
Output noise voltage f = 10 Hz to 100 kHz 0.003% —
(% of VOUT)
(1) All characteristics are measured with a 10-μF capacitor across the input and a 10-μF capacitor across the output. Pulse testing
techniques are used to maintain the junction temperature as close to the ambient temperature as possible.
(2) Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT,
measured at VIN = VOUT(nom) + 1.5 V.
(3) Current limit test specified under recommended operating conditions
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−2
−1.5
−1
−0.5
0
0.5
1
1.5
2
Temperature (5C)
Output Voltage Variation (%)
1251007550250−25−50 150
60
70
80
90
100
110
120
130
140
150
Temperature (5C)
ADJ Pin Current (mA)
1251007550250−25−50 150
0
10
20
30
40
50
60
70
80
90
0 200 400 600 800
Load (mA)
Ripple Rejection (dB)
f = 120 Hz
−0.35
−0.3
−0.25
−0.2
−0.15
−0.1
−0.05
0
Temperature (5C)
1251007550250−25−50
DVOUT (%)
DLoad = 800 mA
Input/Output Differential (V)
Short-Circuit Current (A)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
TJ = 255C
TJ = 1255C
0 1512963
TLV1117
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7.7 Typical Characteristics
Figure 1. Short-Circuit Current vs (VIN – VOUT)Figure 2. Load Regulation
Figure 3. Ripple Rejection vs Frequency (ADJ Version) Figure 4. Ripple Rejection vs Load Current (ADJ Version)
Figure 5. Temperature Stability Figure 6. ADJ Pin Current vs Temperature
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−20
−10
0
10
20
30
40
50
60
70
80
90
100
Time (ms)
Output Voltage Deviation (mV)
1
2
3
4
5
6
7
Input Voltage (V)
CIN = 0.1 mF
COUT = 10-mF Tantalum
IOUT = 0.1 A
−40 −20 0 20 40 60 80 100 120 140
Input Voltage
Output-Voltage Deviation
−0.5
−0.4
−0.3
−0.2
−0.1
0
0.1
0.2
Time (ms)
Output Voltage Deviation (V)
−0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Load Current (A)
−60 200−20−40
CIN = 10 mF
COUT = 10-mF Tantalum
VIN = 4.8 V
Preload = 0.1 A
Output-Voltage Deviation
Load Current
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Typical Characteristics (continued)
Figure 7. TLV1117-33 Load Transient Response Figure 8. TLV1117-33 Line Transient Response
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1.25 V
+
80 !A
5 mA
INPUT
OUTPUT
ADJUST
Overload
Block
TLV1117
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8 Detailed Description
8.1 Overview
The TLV1117 device is a positive low-dropout voltage regulator designed to provide up to 800 mA of output
current. The device is available in 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and adjustable-output voltage options. All
internal circuitry is designed to operate down to 1-V input-to-output differential. Dropout voltage is specified at a
maximum of 1.3 V at 800 mA, decreasing at lower load currents.
The TLV1117 device is designed to be stable with tantalum and aluminum electrolytic output capacitors having
an ESR between 0.2 Ωand 10 Ω.
Unlike pnp-type regulators, in which up to 10% of the output current is wasted as quiescent current, the
quiescent current of the TLV1117 device flows into the load, increasing efficiency.
The TLV1117C device is characterized for operation over the virtual junction temperature range of 0°C to 125°C,
and the TLV1117I device is characterized for operation over the virtual junction temperature range of –40°C to
125°C.
8.2 Functional Block Diagram
Functional Block Diagram
8.3 Feature Description
8.3.1 NPN Output Drive
NPN output topology provides lower output impedance than most LDOs. However, an output capacitor is
required. To support maximum current and lowest temperature, 1.4-V headroom is recommended (less for lower
currents) (VI– VO).
8.3.2 Overload Block
Current limiting and over temperature shutdown protects against overload or under heat sinking.
8.3.3 Programmable Feedback
Op amp with 1.25-V offset input at the ADJUST pin provides easy output voltage programming. For current
regulation applications, a single resistor whose resistance value is 1.25 V / IOUT and power rating is greater than
(1.25 V)2/ R should be used. For voltage regulation applications, two resistors set the output voltage.
8.4 Device Functional Modes
8.4.1 Normal operation
The device OUTPUT pin will source current necessary to make OUTPUT pin 1.25 V greater than ADJUST
terminal to provide output regulation.
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Device Functional Modes (continued)
8.4.2 Operation With Low Input Voltage
The adjustable version of the device requires 1-V headroom (VI– VO) to operate in regulation. With less
headroom, the device may drop out and OUTPUT voltage will be INPUT voltage minus drop out voltage.
8.4.3 Operation at Light Loads
The device passes its bias current to the OUTPUT pin. The load or feedback must consume this minimum
current for regulation or the output may be too high.
8.4.4 Operation in Self Protection
When an overload occurs the device will shut down the output stage or reduce the output current to prevent
device damage. The device will automatically reset from the overload. The output may be reduced or alternate
between on and off until the overload is removed.
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R2I
R1
R2
1VV ADJREFOUT u
¸
¹
·
¨
©
§
10 µF
(see Note C) 100 µF
(see Note A)
R1
R2
INPUT OUTPUT
ADJ/GND
TLV1117 − ADJ
VO
VI
CADJ
(see Note B)
1N4002 (See Note D)
IADJ
VREF
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Typical Application
Figure 9. Basic Adjustable Regulator
The adjustable version of the TLV1117 will take a 2.7 to 15-V input. The voltage VREF refers to the voltage
between the output and the ADJUST pin, typically 1.25 V. The VREF voltage causes a current to flow across R1,
which is the same current that will flow across R2 (minus the negligible 50-µA IADJ). Therefore, R2 can be
adjusted to create a larger voltage drop from GND and set the output voltage. The output voltage equation is
described in Detailed Design Procedure.
9.1.1 Design Requirements
• (A) Output capacitor selection is critical for regulator stability. Larger COUT values benefit the regulator by
improving transient response and loop stability. This device is designed to be stable with tantalum and
aluminum electrolytic output capacitors having an ESR between 0.2 Ωand 10 Ω.
• (B) CADJ can be used to improve ripple rejection. If CADJ is used, a COUT that is larger in value than CADJ must
be used.
• (C) CIN is recommended if TLV1117 device is not located near the power-supply filter.
• (D) An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND.
9.1.2 Detailed Design Procedure
The output voltage can be calculated as shown in Figure 10:
Figure 10.
IADJ can be neglected in most applications because its value is approximately 80 µA.
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OUTPUT
INPUT
OUTPUT
ADJ/GND
R2
R1
Cadj
COUT
PF
Ground
Ground
Power
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Load Current (mA)
Dropout Voltage (V)
0 800700600500400300200100
TJ = 255C
TJ = 1255C
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Typical Application (continued)
9.1.3 Application Curves
Figure 11. Dropout Voltage vs Load Current
10 Power Supply Recommendations
The fixed and adjustable versions of the TLV1117 have different recommended ranges of operating voltage.
Refer to Recommended Operating Conditions for specific operating ranges.
11 Layout
11.1 Layout Guidelines
One or two input capacitors are recommended if the TLV1117 is not located near its power supply output filter
capacitor. These capacitors can filter high-frequency noise and mitigate brief voltage surges from the input.
Traces on the input and output pins of the device should be wide enough to support the full range of current
needed in the application to minimize I×R drop.
11.2 Layout Example
Figure 12. Layout Example
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12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
14 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TLV1117
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV1117-15CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2
TLV1117-15CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2
TLV1117-15CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2
TLV1117-15CDRJR ACTIVE SON DRJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYH
TLV1117-15IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3
TLV1117-15IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3
TLV1117-15IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF15
TLV1117-18CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4
TLV1117-18CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4
TLV1117-18CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4
TLV1117-18CDRJR ACTIVE SON DRJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYK
TLV1117-18CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE18
TLV1117-18IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5
TLV1117-18IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5
TLV1117-18IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5
TLV1117-18IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYL
TLV1117-18IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF18
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV1117-25CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6
TLV1117-25CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6
TLV1117-25CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6
TLV1117-25CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE25
TLV1117-25IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8
TLV1117-25IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8
TLV1117-25IDRJR ACTIVE SON DRJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYN
TLV1117-25IKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI -40 to 125
TLV1117-33CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3
TLV1117-33CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3
TLV1117-33CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3
TLV1117-33CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3
TLV1117-33CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYP
TLV1117-33CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE33
TLV1117-33DCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI 0 to 125
TLV1117-33IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 (V3, VS)
TLV1117-33IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 (V3, VS)
TLV1117-33IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VS
TLV1117-33IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VS
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV1117-33IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYR
TLV1117-33IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF33
TLV1117-50CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT
TLV1117-50CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT
TLV1117-50CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT
TLV1117-50CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT
TLV1117-50CDRJR ACTIVE SON DRJ 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZE50
TLV1117-50CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE50
TLV1117-50IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU
TLV1117-50IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU
TLV1117-50IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU
TLV1117-50IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZF50
TLV1117-50IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZF50
TLV1117-50IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF50
TLV1117CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4
TLV1117CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4
TLV1117CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4
TLV1117CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4
PACKAGE OPTION ADDENDUM
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Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV1117CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYS
TLV1117CKCS ACTIVE TO-220 KCS 3 50 Pb-Free
(RoHS) CU SN N / A for Pkg Type 0 to 125 TLV1117C
TLV1117CKCT ACTIVE TO-220 KCT 3 50 Pb-Free
(RoHS) CU SN N / A for Pkg Type 0 to 125 TLV1117C
TLV1117CKTTR ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) CU SN Level-3-245C-168 HR 0 to 125 TLV1117C
TLV1117CKTTRG3 ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) CU SN Level-3-245C-168 HR 0 to 125 TLV1117C
TLV1117CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 TV1117
TLV1117IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2
TLV1117IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2
TLV1117IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2
TLV1117IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2
TLV1117IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYT
TLV1117IKCS ACTIVE TO-220 KCS 3 50 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 TLV1117I
TLV1117IKCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 TLV1117I
TLV1117IKTTR ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TLV1117I
TLV1117IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 TY1117
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 5
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV1117-15CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-15CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-15CDRJR SON DRJ 8 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-15IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-15IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-15IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-15IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-18CDCYR SOT-223 DCY 4 2500 330.0 12.4 6.55 7.25 1.9 8.0 12.0 Q3
TLV1117-18CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-18CDRJR SON DRJ 8 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-18CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-18CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-18IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-18IDCYR SOT-223 DCY 4 2500 330.0 12.4 6.55 7.25 1.9 8.0 12.0 Q3
TLV1117-18IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-18IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-18IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-25CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jul-2018
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV1117-25CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-25CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-25CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-25IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-25IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-25IDRJR SON DRJ 8 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-33CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-33CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-33CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-33CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-33CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-33IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-33IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-33IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-33IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-50CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117-50CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-50CDRJR SON DRJ 8 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-50CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-50CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117-50IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117-50IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117-50IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117-50IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117CDCYR SOT-223 DCY 4 2500 330.0 12.4 6.55 7.25 1.9 8.0 12.0 Q3
TLV1117CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117CKTTR DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.8 16.3 5.11 16.0 24.0 Q2
TLV1117CKTTR DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.8 16.1 4.9 16.0 24.0 Q2
TLV1117CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
TLV1117IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.0 7.42 2.0 8.0 12.0 Q3
TLV1117IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3
TLV1117IDCYR SOT-223 DCY 4 2500 330.0 12.4 6.55 7.25 1.9 8.0 12.0 Q3
TLV1117IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
TLV1117IKTTR DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.8 16.3 5.11 16.0 24.0 Q2
TLV1117IKTTR DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.8 16.1 4.9 16.0 24.0 Q2
TLV1117IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
TLV1117IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.8 8.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jul-2018
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV1117-15CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-15CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-15CDRJR SON DRJ 8 3000 367.0 367.0 35.0
TLV1117-15IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-15IDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-15IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-15IKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-18CDCYR SOT-223 DCY 4 2500 336.0 336.0 48.0
TLV1117-18CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-18CDRJR SON DRJ 8 3000 367.0 367.0 35.0
TLV1117-18CKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-18CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-18IDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-18IDCYR SOT-223 DCY 4 2500 336.0 336.0 48.0
TLV1117-18IDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117-18IKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-18IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-25CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-25CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jul-2018
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV1117-25CKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-25CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-25IDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-25IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-25IDRJR SON DRJ 8 3000 367.0 367.0 35.0
TLV1117-33CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-33CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-33CDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117-33CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-33CKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-33IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-33IDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117-33IKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-33IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-50CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117-50CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-50CDRJR SON DRJ 8 3000 367.0 367.0 35.0
TLV1117-50CKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-50CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117-50IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117-50IDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117-50IKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117-50IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117CDCYR SOT-223 DCY 4 2500 336.0 336.0 48.0
TLV1117CDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117CDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117CKTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0
TLV1117CKTTR DDPAK/TO-263 KTT 3 500 350.0 334.0 47.0
TLV1117CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117CKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
TLV1117IDCYR SOT-223 DCY 4 2500 350.0 334.0 47.0
TLV1117IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0
TLV1117IDCYR SOT-223 DCY 4 2500 336.0 336.0 48.0
TLV1117IDRJR SON DRJ 8 1000 210.0 185.0 35.0
TLV1117IKTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0
TLV1117IKTTR DDPAK/TO-263 KTT 3 500 350.0 334.0 47.0
TLV1117IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0
TLV1117IKVURG3 TO-252 KVU 3 2500 350.0 334.0 47.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jul-2018
Pack Materials-Page 4
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE
4202506/B 06/2002
6,30 (0.248)
6,70 (0.264)
2,90 (0.114)
3,10 (0.122)
6,70 (0.264)
7,30 (0.287) 3,70 (0.146)
3,30 (0.130)
0,02 (0.0008)
0,10 (0.0040)
1,50 (0.059)
1,70 (0.067)
0,23 (0.009)
0,35 (0.014)
1 2 3
4
0,66 (0.026)
0,84 (0.033)
1,80 (0.071) MAX
Seating Plane
0°–10°
Gauge Plane
0,75 (0.030) MIN
0,25 (0.010)
0,08 (0.003)
0,10 (0.004) M
2,30 (0.091)
4,60 (0.181) M
0,10 (0.004)
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
www.ti.com
PACKAGE OUTLINE
C
5.460
4.953
10.41
9.40
2.29
4.58
3X 0.890
0.635 1.02
0.61
1.27
0.89
2.52 MAX
0.61
0.46
4.32
MIN
5.21 MIN
-80 0.13
0.00
1.78
1.40
0.61
0.46
A
6.70
6.35
B6.22
5.97
0.51
GAGE PLANE
TO-252 - 2.52 mm max heightKVU0003A
TO-252
4218915/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Shape may vary per different assembly sites.
4. Reference JEDEC registration TO-252.
1
2
3
0.25 C A B OPTIONAL NOTE 3
SCALE 1.500
SEE DETAIL A
EXPOSED
THERMAL PAD
NOTE 3
1
2
3
4
A 7.000
DETAIL A
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
(6.15)
(5.55)
(4.58)
2X (1) 2X (2.75)
(4.2) (2.5)
(R0.05) TYP
TO-252 - 2.52 mm max heightKVU0003A
TO-252
4218915/A 02/2017
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
PKG
SYMM
3
1
4
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING METAL
EXPOSED
METAL
SOLDER MASK DETAILS
NOT TO SCALE
NON SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
20X (0.98) 20X (1.13)
(R0.05)
2X (2.75)
2X (1)
(4.58)
(1.33) TYP
(1.18) TYP
(0.14)
(4.2)
TO-252 - 2.52 mm max heightKVU0003A
TO-252
4218915/A 02/2017
PKG
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
65% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
SYMM
3
1
4
www.ti.com
PACKAGE OUTLINE
9.25
9.05
6.5
6.1
2.9
2.6
10.36
9.96
13.12
12.70
3X
3.9 MAX
3X 1.36
1.23
3X 0.90
0.77
( 3.84)
5.08
2X 2.54
8.55
8.15
12.5
12.1
(6.3)
19.65 MAX
4.7
4.4 1.32
1.22
2.79
2.59
0.47
0.34
4222214/B 08/2018
TO-220 - 19.65 mm max heightKCS0003B
TO-220
NOTES:
1. Dimensions are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-220.
13
SCALE 0.850
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND
0.07 MAX
ALL AROUND
(1.7)
3X (1.2)
(2.54)
(5.08)
R (0.05)
2X (1.7)
METAL 2X SOLDER MASK
OPENING
4222214/B 08/2018
TO-220 - 19.65 mm max heightKCS0003B
TO-220
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:15X
123
OPENING
SOLDER MASK
A
SIZE
SCALE 4
PAGE
4OF
4222214
REV
B
REVISIONS
ENGINEER / DRAFTSMANDATEECRDESCRIPTIONREV J. NOQUIL / T. LEQUANG10/22/20152151829RELEASE NEW DRAWINGA E. PREISS / K. SINCERBOX08/17/20182175971CORRECT NOTE 1A
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Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
TLV1117-18CDCYRG3 TLV1117-25CDCYRG3 TLV1117-33CDCYRG3 TLV1117-33IDCYRG3 TLV1117-
50CDCYRG3 TLV1117-50IDCYRG3 TLV1117IDCYG3 TLV1117-15CDCYRG3 TLV1117-18CDCYG3 TLV1117-
18IDCYG3 TLV1117-18IDCYRG3 TLV1117-33CDCYG3 TLV1117-33IDCYG3 TLV1117-50CDCYG3 TLV1117-
33IDRJRG4 TLV1117-50CDRJRG4 TLV1117-50IDRJRG4 TLV1117-15CDCY TLV1117-15CDCYR TLV1117-
15CDRJR TLV1117-15IDCY TLV1117-15IDCYR TLV1117-18CDCY TLV1117-18CDCYR TLV1117-18CDRJR
TLV1117-18IDCY TLV1117-18IDCYR TLV1117-18IDRJR TLV1117-25CDCY TLV1117-25CDCYR TLV1117-25IDCY
TLV1117-25IDCYR TLV1117-25IDRJR TLV1117-33CDCY TLV1117-33CDCYR TLV1117-33CDRJR TLV1117-
33IDCY TLV1117-33IDCYR TLV1117-33IDRJR TLV1117-50CDCY TLV1117-50CDCYR TLV1117-50CDRJR
TLV1117-50IDCY TLV1117-50IDCYR TLV1117-50IDRJR TLV1117CDCY TLV1117CDCYG3 TLV1117CDCYR
TLV1117CDRJR TLV1117CKCS TLV1117CKCSE3 TLV1117CKTER TLV1117CKTPR TLV1117CKTPRG3
TLV1117CKVURG3 TLV1117IDCY TLV1117IDCYR TLV1117IDRJR TLV1117IKCS TLV1117IKCSE3
TLV1117IKTER TLV1117IKTPR TLV1117IKTPRG3 TLV1117IKVURG3 TLV1117CDCYRG3 TLV1117IDCYRG3
TLV1117-15CKVURG3 TLV1117-15IKVURG3 TLV1117-18CKVURG3 TLV1117-18IKVURG3 TLV1117-25CKVURG3
TLV1117-33CKVURG3 TLV1117-33IKVURG3 TLV1117-50CKVURG3 TLV1117-50IKVURG3 TLV1117CKTTR
TLV1117CKTTRG3 TLV1117IKTTR TLV1117IKTTRG3 TLV1117CKCT