MJE13005 - CENTRAL SEMICONDUCTOR - searchdatasheet.com

August, 2010 − Rev. 9

1Publication Order Number:

MJE13005/D

MJE13005G

SWITCHMODEt Series

NPN Silicon Power

Transistors

These devices are designed for high−voltage, high−speed power

switching inductive circuits where fall time is critical. They are

particularly suited for 115 and 220 V SWITCHMODE applications

such as Switching Regulator’s, Inverters, Motor Controls,

Solenoid/Relay drivers and Deflection circuits.

Features

•VCEO(sus) 400 V

•Reverse Bias SOA with Inductive Loads @ TC = 100_C

•Inductive Switching Matrix 2 to 4 A, 25 and 100_C tc @ 3A,

100_C is 180 ns (Typ)

•700 V Blocking Capability

•SOA and Switching Applications Information

•These Devices are Pb−Free and are RoHS Compliant*

MAXIMUM RATINGS

Rating Symbol Value Unit

Collector−Emitter Voltage VCEO(sus) 400 Vdc

Collector−Emitter Voltage VCEV 700 Vdc

Emitter−Base Voltage VEBO 9 Vdc

Collector Current − Continuous

− Peak (Note 1)

ICM

Adc

Base Current − Continuous

− Peak (Note 1)

IBM

Adc

Emitter Current − Continuous

− Peak (Note 1)

IEM

Adc

Total Device Dissipation @ TA = 25_C

Derate above 25°C

PD2

0.016

W/_C

Total Device Dissipation @ TC = 25_C

Derate above 25°C

PD75

0.6

W/_C

Operating and Storage Junction

Temperature Range

TJ, Tstg −65 to

+150

THERMAL CHARACTERISTICS

Characteristics Symbol Max Unit

Thermal Resistance, Junction−to−Ambient RqJA 62.5 _C/W

Thermal Resistance, Junction−to−Case RqJC 1.67 _C/W

Maximum Lead Temperature for Soldering

Purposes 1/8″ from Case for 5 Seconds

TL275 _C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

4 AMPERE

NPN SILICON

POWER TRANSISTOR

400 VOLTS − 75 WATTS

TO−220AB

CASE 221A−09

STYLE 1

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MARKING DIAGRAM

MJE13005G

AY WW

A = Assembly Location

Y = Year

WW = Work Week

G = Pb−Free Package

Device Package Shipping

ORDERING INFORMATION

MJE13005G TO−220

(Pb−Free)

50 Units / Rail

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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎÎ

Symbol

ÎÎÎÎ

Min

ÎÎÎ

Typ

ÎÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

OFF CHARACTERISTICS (Note 2)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Collector−Emitter Sustaining Voltage

(IC = 10 mA, IB = 0)

ÎÎÎÎ

VCEO(sus)

ÎÎÎÎ

400

ÎÎÎ

−

ÎÎÎÎ

−

ÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Collector Cutoff Current

(VCEV = Rated Value, VBE(off) = 1.5 Vdc)

(VCEV = Rated Value, VBE(off) = 1.5 Vdc, TC = 100_C)

ÎÎÎÎ

ICEV

ÎÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Emitter Cutoff Current

(VEB = 9 Vdc, IC = 0)

ÎÎÎÎ

IEBO

ÎÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SECOND BREAKDOWN

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Second Breakdown Collector Current with base forward biased

ÎÎÎÎ

IS/b

ÎÎÎÎ

−

ÎÎÎÎÎÎÎÎ

See Figure 11

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Clamped Inductive SOA with Base Reverse Biased

ÎÎÎÎ

RBSOA

ÎÎÎÎ

−

ÎÎÎÎÎÎÎÎ

See Figure 12

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ON CHARACTERISTICS (Note 2)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Current Gain

(IC = 1 Adc, VCE = 5 Vdc)

(IC = 2 Adc, VCE = 5 Vdc)

ÎÎÎÎ

hFE

ÎÎÎÎ

ÎÎÎ

−

ÎÎÎÎ

ÎÎÎ

−

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Collector−Emitter Saturation Voltage

(IC = 1 Adc, IB = 0.2 Adc)

(IC = 2 Adc, IB = 0.5 Adc)

(IC = 4 Adc, IB = 1 Adc)

(IC = 2 Adc, IB = 0.5 Adc, TC = 100_C)

ÎÎÎÎ

VCE(sat)

ÎÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

0.5

0.6

ÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Base−Emitter Saturation Voltage

(IC = 1 Adc, IB = 0.2 Adc)

(IC = 2 Adc, IB = 0.5 Adc)

(IC = 2 Adc, IB = 0.5 Adc, TC = 100_C)

ÎÎÎÎ

VBE(sat)

ÎÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

1.2

1.6

1.5

ÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DYNAMIC CHARACTERISTICS

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Current−Gain − Bandwidth Product

(IC = 500 mAdc, VCE = 10 Vdc, f = 1 MHz)

ÎÎÎÎ

ÎÎÎ

−

ÎÎÎÎ

−

ÎÎÎ

MHz

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Capacitance

(VCB = 10 Vdc, IE = 0, f = 0.1 MHz)

ÎÎÎÎ

Cob

ÎÎÎÎ

−

ÎÎÎ

ÎÎÎÎ

−

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SWITCHING CHARACTERISTICS

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Resistive Load (Table 2)

ÎÎÎÎÎÎÎÎ

Delay Time

ÎÎÎÎÎÎÎÎÎÎÎÎÎ

(VCC = 125 Vdc, IC = 2 A,

IB1 = IB2 = 0.4 A, tp = 25 ms,

Duty Cycle v 1%)

ÎÎÎÎ

−

ÎÎÎ

0.025

ÎÎÎÎ

0.1

ÎÎÎ

ÎÎÎÎÎÎÎÎ

Rise Time

ÎÎÎÎ

−

ÎÎÎ

0.3

ÎÎÎÎ

0.7

ÎÎÎ

ÎÎÎÎÎÎÎÎ

Storage Time

ÎÎÎÎ

−

ÎÎÎ

1.7

ÎÎÎÎ

ÎÎÎ

ÎÎÎÎÎÎÎÎ

Fall Time

ÎÎÎÎ

−

ÎÎÎ

0.4

ÎÎÎÎ

0.9

ÎÎÎ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Inductive Load, Clamped (Table 2, Figure 13)

ÎÎÎÎÎÎÎÎ

Voltage Storage Time

ÎÎÎÎÎÎÎÎÎÎÎÎÎ

(IC = 2 A, Vclamp = 300 Vdc,

IB1 = 0.4 A, VBE(off) = 5 Vdc, TC = 100_C)

ÎÎÎÎ

tsv

ÎÎÎÎ

−

ÎÎÎ

0.9

ÎÎÎÎ

ÎÎÎ

ÎÎÎÎÎÎÎÎ

Crossover Time

ÎÎÎÎ

−

ÎÎÎ

0.32

ÎÎÎÎ

0.9

ÎÎÎ

ÎÎÎÎÎÎÎÎ

Fall Time

ÎÎÎÎ

tfi

ÎÎÎÎ

−

ÎÎÎ

0.16

ÎÎÎÎ

−

ÎÎÎ

2. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%.

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C, CAPACITANCE (pF)

VCE(sat), COLLECTOR-EMITTER SATURATION

VOLTAGE (VOLTS)

VBE, BASE-EMITTER VOLTAGE (VOLTS)

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS

)

IC, COLLECTOR CURRENT (AMP)IC, COLLECTOR CURRENT (AMP)

1.1

1.3

0.7

0.3

Figure 1. DC Current Gain

IC, COLLECTOR CURRENT (AMP)

0.1 0.4 2 4

Figure 2. Collector Saturation Region

0.03

IB, BASE CURRENT (AMP)

0.30.05

1.2

0.4

100

hFE, DC CURRENT GAIN

0.1 0.2 0.5 3

Figure 3. Base−Emitter Voltage Figure 4. Collector−Emitter Saturation Voltage

Figure 5. Collector Cutoff Region

0.8

0.1

VBE, BASE-EMITTER VOLTAGE (VOLTS)

TJ = 25°C

0.2 1

Figure 6. Capacitance

2 k

VR, REVERSE VOLTAGE (VOLTS)

Cib

Cob

0.3

, COLLECTOR CURRENT (A)μIC

-0.4 -0.2

300

1.6

0.5

IC = 1 A

TJ = -55°C

0.04 0.6

0.06 0.1 10.04 0.40.2 0.6

300

200

100

10050510.5

150°C

IC/IB = 4

+0.6

2 A

0.7 1 2

0.9 0.35

0.55

0.25

0.05

0.45

0.06

VCE = 2 V

VCE = 5 V

TJ = 150°C

25°C

-55°C

0.15

+0.4+0.2

100

1 k

10 k

500

700

1 k

10 30

REVERSE FORWARD

VCE = 250 V

VBE(sat) @ IC/IB = 4

VBE(on) @ VCE = 2 V

3 A 4 A

25°C

0.06 0.1 10.04 0.40.2 0.6 2 4

TJ = -55°C

25°C

150°C

TJ = 150°C

125°C

100°C

75°C

50°C

25°C

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trv

TIME

VCE

90% IB1

tsv

ICPK Vclamp

90% Vclamp 90% IC

10% Vclamp 10%

ICPK 2% IC

tfi tti

Figure 7. Inductive Switching Measurements

Table 1. Typical Inductive Switching Performance

ÎÎÎÎ

AMP

ÎÎÎ

tsv

ÎÎÎ

trv

ÎÎÎ

tfi

ÎÎÎ

tti

ÎÎÎÎ

ÎÎÎ

100

ÎÎÎ

600

900

ÎÎÎ

110

ÎÎÎ

100

240

ÎÎÎ

130

ÎÎÎÎ

180

320

ÎÎÎÎ

ÎÎÎ

100

ÎÎÎ

650

950

ÎÎÎ

100

ÎÎÎ

140

330

ÎÎÎ

100

ÎÎÎÎ

200

350

ÎÎÎÎ

ÎÎÎ

100

ÎÎÎ

550

850

ÎÎÎ

110

ÎÎÎ

160

350

ÎÎÎ

100

160

ÎÎÎÎ

220

390

NOTE: All Data recorded in the inductive Switching Circuit In Table 2.

SWITCHING TIMES NOTE

In resistive switching circuits, rise, fall, and storage times

have been defined and apply to both current and voltage

waveforms since they are in phase. However, for inductive

loads which are common to SWITCHMODE power

supplies and hammer drivers, current and voltage

waveforms are not in phase. Therefore, separate

measurements must be made on each waveform to

determine the total switching time. For this reason, the

following new terms have been defined.

tsv = Voltage Storage Time, 90% IB1 to 10% Vclamp

trv = Voltage Rise Time, 10−90% Vclamp

tfi = Current Fall Time, 90−10% IC

tti = Current Tail, 10−2% IC

tc = Crossover Time, 10% Vclamp to 10% IC

An enlarged portion of the inductive switching

waveforms is shown in Figure 7 to aid in the visual identity

of these terms.

For the designer, there is minimal switching loss during

storage time and the predominant switching power losses

occur during the crossover interval and can be obtained

using the standard equation from AN−222:

PSWT = 1/2 VCCIC(tc)f

In general, trv + tfi ] tc. However, at lower test currents

this relationship may not be valid.

As is common with most switching transistors, resistive

switching is specified at 25°C and has become a benchmark

for designers. However, for designers of high frequency

converter circuits, the user oriented specifications which

make this a “SWITCHMODE” transistor are the inductive

switching speeds (tc and tsv) which are guaranteed at 100_C.

t, TIME (s)μ

Figure 8. Turn−On Time

IC, COLLECTOR CURRENT (AMP)

td @ VBE(off) = 5 V

0.02

0.01

0.5

0.2

IC, COLLECTOR CURRENT (AMP)

0.4 4120.04

VCC = 125 V

IC/IB = 5

TJ = 25°C

0.2

0.05

0.1

Figure 9. Turn−Off Time

0.2

0.1

0.5 4120.04

VCC = 125 V

IC/IB = 5

TJ = 25°C

0.2

0.3

0.5

0.1

RESISTIVE SWITCHING PERFORMANCE

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REVERSE BIAS SAFE OPERATING AREA AND INDUCTIVE SWITCHING RESISTIVE

SWITCHING

OUTPUT WAVEFORMS

TEST CIRCUITS

CIRCUIT

VALUES

TEST WAVEFORMS

NOTE

PW and VCC Adjusted for Desired IC

RB Adjusted for Desired IB1

5 V

DUTY CYCLE ≤ 10%

tr, tf ≤ 10 ns 68

1 k

0.001 mF

0.02 mF

1N493

270

+5 V

1 k

2N2905

1/2 W

100

-V

BE(off)

MJE200

T.U.T.

1N4933

1N4933 33

2N222

1 k

MJE210

VCC

+5 V

MR826*

Vclamp

*SELECTED FOR ≥ 1 kV

VCE

5.1 k

+125 V

SCOPE

-4.0

TUT

t1 ADJUSTED TO

OBTAIN IC

t1 ≈

Lcoil (ICpk)

VCC

t2 ≈

Lcoil (ICpk)

Vclamp

+10 V 25 ms

-8 V

Coil Data:

Ferroxcube Core #6656

Full Bobbin (~16 Turns) #16

GAP for 200 mH/20 A

Lcoil = 200 mH

VCC = 20 V

Vclamp = 300 Vdc

VCC = 125 V

RC = 62 W

D1 = 1N5820 or Equiv.

RB = 22 W

Test Equipment

Scope−Tektronics

475 or Equivalent

tr, tf < 10 ns

Duty Cycle = 1.0%

RB and RC adjusted

for desired IB and IC

VCE

TIME

IC(pk)

VCE or

Vclamp

tf CLAMPED

tf UNCLAMPED ≈ t2

Table 2. Test Conditions for Dynamic Performance

t, TIME (ms)

0.01

0.7

0.2

0.1

0.05

0.02

r(t), TRANSIENT THERMAL RESISTANCE

0.05 1 2 5 10 20 50 100 200 500

ZqJC(t) = r(t) RqJC

RqJC = 1.67°C/W MAX

D CURVES APPLY FOR POWER

PULSE TRAIN SHOWN

READ TIME AT t1

TJ(pk) - TC = P(pk) ZqJC(t)

P(pk)

DUTY CYCLE, D = t1/t2

D = 0.5

0.2

0.05

0.01

SINGLE PULSE

0.1 0.50.2

(NORMALIZED)

1 k

0.5

0.3

0.07

0.03

0.02

Figure 10. Typical Thermal Response [ZqJC(t)]

0.1

0.02

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SAFE OPERATING AREA INFORMATION

The Safe Operating Area Figures 11 and 12 are specified ratings for these devices under the test conditions shown.

IC(pk), COLLECTOR CURRENT (AMP)

IC, COLLECTOR CURRENT (AMP)

5 ms 500 ms

1 ms

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

0.02

400

0.5

0.1

0.05

30 50 70 100

Figure 11. Forward Bias Safe Operating Area Figure 12. Reverse Bias Switching Safe Operating Area

0.2

0.01

300 500

MJE13005

520

800

100 300

TC ≤ 100°C

IB1 = 2.0 A

500 700

VBE(off) = 9 V

VCE, COLLECTOR-EMITTER CLAMP VOLTAGE (VOLTS)

200 400 600

5 V

MJE13005

3 V

200

1.5 V

FORWARD BIAS

There are two limitations on the power handling ability of

a transistor: average junction temperature and second

breakdown. Safe operating area curves indicate IC − VCE

limits of the transistor that must be observed for reliable

operation; i.e., the transistor must not be subjected to greater

dissipation than the curves indicate.

The data of Figure 11 is based on TC = 25_C; TJ(pk) is

variable depending on power level. Second breakdown

pulse limits are valid for duty cycles to 10% but must be

derated when TC ≥ 25_C. Second breakdown limitations do

not derate the same as thermal limitations. Allowable

current at the voltages shown on Figure 11 may be found at

any case temperature by using the appropriate curve on

Figure 13.

TJ(pk) may be calculated from the data in Figure 10. At

high case temperatures, thermal limitations will reduce the

power that can be handled to values less than the limitations

imposed by second breakdown.

REVERSE BIAS

For inductive loads, high voltage and high current must be

sustained simultaneously during turn−off, in most cases,

with the base to emitter junction reverse biased. Under these

conditions the collector voltage must be held to a safe level

at or below a specific value of collector current. This can be

accomplished by several means such as active clamping, RC

snubbing, load line shaping, etc. The safe level for these

devices is specified as Reverse Bias Safe Operating Area

and represents the voltage−current conditions during

reverse biased turn−off. This rating is verified under

clamped conditions so that the device is never subjected to

an avalanche mode. Figure 12 gives the complete RBSOA

characteristics.

Figure 13. Forward Bias Power Derating

TC, CASE TEMPERATURE (°C)

040 120 160

0.6

POWER DERATING FACTOR

SECOND BREAKDOWN

DERATING

0.8

0.4

0.2

60 100 14080

THERMAL

DERATING

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PACKAGE DIMENSIONS

TO−220AB

CASE 221A−09

ISSUE AF

STYLE 1:

PIN 1. BASE

2. COLLECTOR

3. EMITTER

4. COLLECTOR

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL

BODY AND LEAD IRREGULARITIES ARE

ALLOWED.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.570 0.620 14.48 15.75

B0.380 0.405 9.66 10.28

C0.160 0.190 4.07 4.82

D0.025 0.035 0.64 0.88

F0.142 0.161 3.61 4.09

G0.095 0.105 2.42 2.66

H0.110 0.155 2.80 3.93

J0.014 0.025 0.36 0.64

K0.500 0.562 12.70 14.27

L0.045 0.060 1.15 1.52

N0.190 0.210 4.83 5.33

Q0.100 0.120 2.54 3.04

R0.080 0.110 2.04 2.79

S0.045 0.055 1.15 1.39

T0.235 0.255 5.97 6.47

U0.000 0.050 0.00 1.27

V0.045 --- 1.15 ---

Z--- 0.080 --- 2.04

123

SEATING

PLANE

−T−

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MJE13005/D

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

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