© 2009 Microchip Technology Inc. DS41291F
PIC16F882/883/884/886/887
Data Sheet
28/40/44-Pin, Enhanced Flash-Based 8-Bit
CMOS Microcontrollers with
nanoWatt Technology
DS41291F-page ii © 2009 Microchip Technology Inc.
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce
and may be supers eded by up dates. I t is you r r es ponsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEV AL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Prog ra m ming , IC SP, ICEPI C , M i n di , MiWi , MPASM, MP L AB
Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP,
PICkit, PICDEM, P ICDEM.net, PICtail , PIC32 logo, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Total Endurance, TSHARC, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microch ip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc. DS41291F-page 1
PIC16F882/883/884/886/887
High-Performance RISC CPU:
Only 35 Instructions to Lea rn:
- All single-cycle instructions except branches
Ope rati ng Speed:
- DC – 20 MHz oscillator/clock input
- DC – 200 ns instruction cycle
Interrupt Capability
8-Level Deep Hardware Stack
Direct, Indirect and Relative Addressing modes
S pecial Microcontroller Features:
Precision Internal Oscillator:
- Factory calibrated to ±1%
- Software selectable frequency range of
8 MHz to 31 kHz
- Softwa re tunab le
- Two-Speed Start-up mode
- Crystal fail detect for critical applications
- Clock mode switching during operation for
power saving s
Power-Saving Sleep mode
Wide Operating Voltage Range (2.0V-5.5V)
Indus tri al and Extended Tem pe r atu re Ra nge
Power-on Reset (P OR)
Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
Brown-ou t Reset (BOR) with Softwa re Control
Option
Enhanced Low-Current Watchdog Timer (WDT)
with On-Ch ip Os ci ll ator (software sele ctable
nominal 268 seconds wit h full prescaler) with
software enable
Multiplexed Master Clear with Pull-up/Input Pin
Programmable Code Protection
High Endurance Flash/EEPROM Cell:
- 10 0,000 write Flash endurance
- 1,000,000 write EEPROM endurance
- Flash/Data EEPROM retention: > 40 years
Program Memory Read/Write during run time
In-Circuit Debugger (on board)
Low-Power Features:
Standby Current:
- 50 nA @ 2.0V, typical
Ope rati ng Curren t:
-11μA @ 32 kHz, 2.0V, typical
-220μA @ 4 MHz, 2.0V, typical
Watchdog Timer Current:
-1μA @ 2.0V, typical
Peripheral Feat ures:
24/35 I/O Pins with Individual Direction Control:
- High current source/sink for direct LED drive
- Interrupt-on-Change pin
- Individually programmable weak pull-ups
- Ultra Low-Power Wa ke-up (ULPWU)
Analog Comparator Mo dule with:
- Two analog comparators
- Programmable on-chip voltage reference
(CVREF) module (% of VDD)
- F ixed voltage reference (0.6V)
- Comparator inputs and outputs externally
accessible
- SR Latch mode
- External Timer1 Ga te (c ou nt enab le )
A/D Converter:
- 10-bit resolution and 11/14 channels
Timer0: 8-bit Timer/Counter with 8-bit
Programmable Prescaler
Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Dedicated low-power 32 kHz oscillator
Timer2: 8-bit Timer/Counter with 8-bit Period
Register, Prescaler and Postscaler
Enhanced Capture, Compare, PWM+ Module:
- 1 6-bit Capture, max. resolution 12.5 n s
- Compare, max. resolution 200 ns
- 10-bit PWM with 1, 2 or 4 output channels,
programmable “dead time”, max. frequency
20 kHz
- PWM output steering control
Cap ture , Comp a r e, PWM Mo dul e:
- 1 6-bit Capture, max. resolution 12.5 ns
- 16-bit Compare, max. resolution 200 ns
- 10-bit PWM, max. frequency 20 kHz
Enhanced USART Module:
- Supports RS-485, RS-232, and LIN 2.0
- Auto-Baud Detect
- Auto-Wake-Up on Start bit
In-C ircuit Seri al Prog ram mingTM (ICSPTM) via T wo
Pins
Master Synchronous Serial Port (MSSP) Module
supporting 3-wire SPI (all 4 modes) and I2C™
Master and Slave Modes with I2C Address Mask
28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers with
nanoWatt Technology
PIC16F882/883/884/886/887
DS41291F-page 2 © 2009 Microchip Technology Inc.
Device
Program
Memory Dat a Memory I/O 10-bit A/D
(ch) ECCP/
CCP EUSART MSSP Comparators Timers
8/16-bit
Flash
(words) SRAM
(bytes) EEPROM
(bytes)
PIC16F882 2048 128 128 24 11 1/1 1 1 2 2/1
PIC16F883 4096 256 256 24 11 1/1 1 1 2 2/1
PIC16F884 4096 256 256 35 14 1/1 1 1 2 2/1
PIC16F886 8192 368 256 24 11 1/1 1 1 2 2/1
PIC16F887 8192 368 256 35 14 1/1 1 1 2 2/1
© 2009 Microchip Technology Inc. DS41291F-page 3
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F882/883/886, 28- Pin PDIP, SOIC, SSOP
TABLE 1: PIC16F882/883/886 28-PIN SUMMARY (PDIP, SOIC, SSOP)
I/O Pin Analog Comparators Timers ECCP EUSART MSSP Interrupt Pull-up Basic
RA0 2AN0/ULPWU C12IN0-
RA1 3 AN1 C12IN1-
RA2 4AN2 C2IN+ VREF-/CVREF
RA3 5 AN3 C1IN+ VREF+
RA4 6 C1OUT T0CKI
RA5 7 AN4 C2OUT SS ——
RA6 10 OSC2/CLKOUT
RA7 9 OSC1/CLKIN
RB0 21 AN12 IOC/INT Y
RB1 22 AN10 C12IN3- P1C IOC Y
RB2 23 AN8 P1B IOC Y
RB3 24 AN9 C12IN2- IOC Y PGM
RB4 25 AN11 P1D IOC Y
RB5 26 AN13 T1G IOC Y
RB6 27 IOC YICSPCLK
RB7 28 IOC Y ICSPDAT
RC0 11 T1OSO/T1CKI
RC1 12 T1OSI CCP2
RC2 13 CCP1/P1A
RC3 14 SCK/SCL
RC4 15 SDI/SDA
RC5 16 SDO
RC6 17 TX/CK
RC7 18 RX/DT
RE3 1 Y(1) MCLR/VPP
—20 VDD
8 VSS
—19 VSS
Note 1: Pull-up activated only with external MCLR configuration.
10
11
2
3
4
5
6
1
8
7
9
12
13
14 15
16
17
18
19
20
23
24
25
26
27
28
22
21
PIC16F882/883/886
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11/P1D
RB3/AN9/PGM/C12IN2-
RB2/AN8/P1B
RB1/AN10/P1C/C12IN3-
RB0/AN12/INT
VDD
VSS
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
28-pin PDIP, SOIC, SSOP
PIC16F882/883/884/886/887
DS41291F-page 4 © 2009 Microchip Technology Inc.
Pin Diagrams – PIC16F882/883/886, 28-Pin QFN
16
2
7
1
3
6
5
4
15
21
19
20
17
18
22
28
26
27
23
24
25
14
8
10
9
13
12
11
PIC16F882/883/886
RA1/AN1/C12IN1-
RA0/AN0/ULPWU/C12IN0-
RE3/MCLR/VPP
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11/P1D
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RB3/AN9/PGM/C12IN2-
RB2/AN8/P1B
RB1/AN10/P1C/C12IN3-
RB0/AN12/INT
VDD
VSS
RC7/RX/DT
28-pin QFN
© 2009 Microchip Technology Inc. DS41291F-page 5
PIC16F882/883/884/886/887
TABLE 2: PIC16F882/883/886 28-PIN SUMMARY (QFN)
I/O Pin Analog Comparators Timers ECCP EUSART MSSP Interrupt Pull-up Basic
RA0 27 AN0/ULPWU C12IN0-
RA1 28 AN1 C12IN1-
RA2 1AN2 C2IN+ VREF-/CVREF
RA3 2 AN3 C1IN+ VREF+
RA4 3 C1OUT T0CKI
RA5 4 AN4 C2OUT SS ——
RA6 7 OSC2/CLKOUT
RA7 6 OSC1/CLKIN
RB0 18 AN12 IOC/INT Y
RB1 19 AN10 C12IN3- P1C IOC Y
RB2 20 AN8 P1B IOC Y
RB3 21 AN9 C12IN2- IOC Y PGM
RB4 22 AN11 P1D IOC Y
RB5 23 AN13 T1G IOC Y
RB6 24 IOC YICSPCLK
RB7 25 IOC Y ICSPDAT
RC0 8 T1OSO/T1CKI
RC1 9 T1OSI CCP2
RC2 10 CCP1/P1A
RC3 11 SCK/SCL
RC4 12 SDI/SDA
RC5 13 SDO
RC6 14 TX/CK
RC7 15 RX/DT
RE3 26 Y(1) MCLR/VPP
—17 VDD
5 VSS
—16 VSS
Note 1: Pull-up activated only with external MCLR configuration.
PIC16F882/883/884/886/887
DS41291F-page 6 © 2009 Microchip Technology Inc.
Pin Diagrams – PIC16F884/887, 40-Pin PDIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC16F884/887
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
RE0/AN5
RE1/AN6
RE2/AN7
VDD
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RD0
RD1
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11
RB3/AN9/PGM/C12IN2-
RB2/AN8
RB1/AN10/C12IN3-
RB0/AN12/INT
VDD
VSS
RD7/P1D
RD6/P1C
RD5/P1B
RD4
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
40-pin PDIP
© 2009 Microchip Technology Inc. DS41291F-page 7
PIC16F882/883/884/886/887
TABLE 3: PIC16F884/887 40-PIN SUMMARY (PDIP)
I/O Pin Analog Comparators Timers ECCP EUSART MSSP Interrupt Pull-up Basic
RA0 2AN0/ULPWU C12IN0-
RA1 3 AN1 C12IN1-
RA2 4AN2 C2IN+ VREF-/CVREF
RA3 5 AN3 C1IN+ VREF+
RA4 6 C1OUT T0CKI
RA5 7 AN4 C2OUT SS ——
RA6 14 OSC2/CLKOUT
RA7 13 OSC1/CLKIN
RB0 33 AN12 IOC/INT Y
RB1 34 AN10 C12IN3- IOC Y
RB2 35 AN8 IOC Y
RB3 36 AN9 C12IN2- IOC Y PGM
RB4 37 AN11 IOC Y
RB5 38 AN13 T1G IOC Y
RB6 39 IOC YICSPCLK
RB7 40 IOC Y ICSPDAT
RC0 15 T1OSO/T1CKI
RC1 16 T1OSI CCP2
RC2 17 CCP1/P1A
RC3 18 SCK/SCL
RC4 23 SDI/SDA
RC5 24 SDO
RC6 25 TX/CK
RC7 26 RX/DT
RD0 19
RD1 20
RD2 21
RD3 22
RD4 27
RD5 28 P1B
RD6 29 P1C
RD7 30 P1D
RE0 8AN5
RE1 9 AN6
RE2 10 AN7
RE3 1 Y(1) MCLR/VPP
11 VDD
—32 VDD
12 VSS
—31 VSS
Note 1: Pull-up activated only with external MCLR configuration.
PIC16F882/883/884/886/887
DS41291F-page 8 © 2009 Microchip Technology Inc.
Pin Diagrams – PIC16F884/887, 44-Pin QFN
44-pin QFN
10
11
2
3
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
5
4
PIC16F884/887
RA6/OSC2/CLKOUT
RA7/OSC1/CLKIN
VSS
VSS
NC
VDD
RE2/AN7
RE1/AN6
RE0/AN5
RA5/AN4/SS/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4
RD5/P1B
RD6/P1C
RD7/P1D
VSS
VDD
VDD
RB0/AN12/INT
RB1/AN10/C12IN3-
RB2/AN8
RB3/AN9/PGM/C12IN2-
NC
RB4/AN11
RB5/AN13/T1G
RB6/ICSPCLK
RB7/ICSPDAT
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3//VREF+/C1IN+
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
RD1
RD0
RC3/SCK/SCL
RC2/P1A/CCP1
RC1/T1OSCI/CCP2
RC0/T1OSO/T1CKI
© 2009 Microchip Technology Inc. DS41291F-page 9
PIC16F882/883/884/886/887
TABLE 4: PIC16F884/887 44-PIN SUMMARY (QFN)
I/O Pin Analog Comparators Timers ECCP EUSART MSSP Interrupt Pull-up Basic
RA0 19 AN0/ULPWU C12IN0-
RA1 20 AN1 C12IN1-
RA2 21 AN2 C2IN+ VREF-/CVREF
RA3 22 AN3 C1IN+ VREF+
RA4 23 C1OUT T0CKI
RA5 24 AN4 C2OUT SS ——
RA6 33 OSC2/CLKOUT
RA7 32 OSC1/CLKIN
RB0 9AN12 IOC/INT Y
RB1 10 AN10 C12IN3- IOC Y
RB2 11 AN8 IOC Y
RB3 12 AN9 C12IN2- IOC Y PGM
RB4 14 AN11 IOC Y
RB5 15 AN13 T1G IOC Y
RB6 16 IOC YICSPCLK
RB7 17 IOC Y ICSPDAT
RC0 34 T1OSO/T1CKI
RC1 35 T1OSI CCP2
RC2 36 CCP1/P1A
RC3 37 SCK/SCL
RC4 42 SDI/SDA
RC5 43 SDO
RC6 44 TX/CK
RC7 1 RX/DT
RD0 38
RD1 39
RD2 40
RD3 41
RD4 2
RD5 3 P1B
RD6 4 P1C
RD7 5 P1D
RE0 25 AN5
RE1 26 AN6
RE2 27 AN7
RE3 18 Y(1) MCLR/VPP
7 VDD
—8 VDD
28 VDD
—6 VSS
30 VSS
—31 VSS
13 NC (no connect)
29 NC (no co nnec t)
Note 1: Pull-up activated only with external MCLR configuration.
PIC16F882/883/884/886/887
DS41291F-page 10 © 2009 Microchip Technology Inc.
Pin Diagrams – PIC16F884/887, 44-Pin TQFP
44-pin TQFP
10
11
2
3
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
5
4
PIC16F884/887
NC
RC0/T1OSO/T1CKI
RA6/OSC2/CLKOUT
RA7/OSC1/CLKIN
VSS
VDD
RE2/AN7
RE1/AN6
RE0/AN5
RA5/AN4/SS/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4
RD5/P1B
RD6/P1C
RD7/P1D
VSS
VDD
RB0/AN12/INT
RB1/AN10/C12IN3-
RB2/AN8
RB3/AN9/PGM/C12IN2-
NC
NC
RB4/AN11
RB5/AN13/T1G
RB6/ICSPCLK
RB7/ICSPDAT
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3//VREF+/C1IN+
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
RD1
RD0
RC3/SCK/SCL
RC2/P1A/CCP1
RC1/T1OSCI/CCP2
NC
© 2009 Microchip Technology Inc. DS41291F-page 11
PIC16F882/883/884/886/887
TABLE 5: PIC16F884/887 44-PIN SUMMARY (TQFP)
I/O Pin Analog Comparators Timers ECCP EUSART MSSP Interrupt Pull-up Basic
RA0 19 AN0/ULPWU C12IN0-
RA1 20 AN1 C12IN1-
RA2 21 AN2 C2IN+ VREF-/CVREF
RA3 22 AN3 C1IN+ VREF+
RA4 23 C1OUT T0CKI
RA5 24 AN4 C2OUT SS ——
RA6 31 OSC2/CLKOUT
RA7 30 OSC1/CLKIN
RB0 8AN12 IOC/INT Y
RB1 9 AN10 C12IN3- IOC Y
RB2 10 AN8 IOC Y
RB3 11 AN9 C12IN2- IOC Y PGM
RB4 14 AN11 IOC Y
RB5 15 AN13 T1G IOC Y
RB6 16 IOC YICSPCLK
RB7 17 IOC Y ICSPDAT
RC0 32 T1OSO/T1CKI
RC1 35 T1OSI CCP2
RC2 36 CCP1/P1A
RC3 37 SCK/SCL
RC4 42 SDI/SDA
RC5 43 SDO
RC6 44 TX/CK
RC7 1 RX/DT
RD0 38
RD1 39
RD2 40
RD3 41
RD4 2
RD5 3 P1B
RD6 4 P1C
RD7 5 P1D
RE0 25 AN5
RE1 26 AN6
RE2 27 AN7
RE3 18 Y(1) MCLR/VPP
7 VDD
—28 VDD
6 VSS
13 NC (no co nnec t)
29 VSS
34 NC (no co nnec t)
33 NC (no connect)
12 NC (no co nnec t)
Note 1: Pull-up activated only with external MCLR configuration.
PIC16F882/883/884/886/887
DS41291F-page 12 © 2009 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 13
2.0 Memory Organizati on................................................................................................................................................................. 21
3.0 I/O Ports.............................. ........................... ............................ ..................... ........................................................................... 39
4.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 61
5.0 Timer0 Module ........................................................................................................................................................................... 73
6.0 Timer1 Module with Gate Control............................................................................................................................................... 76
7.0 Timer2 Module ........................................................................................................................................................................... 81
8.0 Comparator Module....................................................... .... .... ......... .... .... .... ......... .... .... .... ........................................................... 83
9.0 Analog-to-Digital Converter (ADC) Module . ............................................................................................................................... 99
10.0 Data EEPROM and Flash Program Memory Control...................................................... ................. ...... .................................. 111
11.0 Enhanced Capture/Compare/PWM Module.................. .... .... ......... .. .... .... .... ......... .. .... .... ......... .. .... .... . ..................................... 123
12.0 Enhanced Universal Sync hronous As ynchr onous Receiver Transmitter (EUSART)............................................................... 151
13.0 Master Sy nchronous Serial Port (M SSP ) Module .................................................................................................................... 179
14.0 Special Features of the CPU........................ ..................... ..................... ........................... ....................................................... 209
15.0 Instruction Set Summary.......................................................................................................................................................... 231
16.0 Development Support. .............................................................................................................................................................. 241
17.0 Electrical Specifications............................................................................................................................................................ 245
18.0 DC and AC Characteristics Graphs and Tables............................. .... .... .... ........... .... .... .... ........... .... ........................................ 273
19.0 Packa g i n g In fo rmation............................ ..................... ........................... ..................... ............................................................. 301
Appendix A: Data Sheet Revision History........................................................ .... ........... .... ...... ......................................................... 313
Appendix B: Migrating from other PIC® Devices................................................................................. .............................................. 313
Index .................................................................................................................................................................................................. 315
The Micro chip Web Site... ..................... ............................ ........................... .......................... ............................................................ 323
Customer Change Notification Service .............................................................................................................................................. 323
Customer Support................................. ................. ...... ................. ................. ...... .............................................................................. 323
Reader Response.............................................................................................................................................................................. 324
Product Identification System............................................................................................................................................................. 325
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© 2009 Microchip Technology Inc. DS41291F-page 13
PIC16F882/883/884/886/887
1.0 DEVICE OVERVIEW
The PIC16F882/883/884/886/887 is covered by this
data she et. The P IC16F882/883/88 6 is avai lable in 28-
pin PDIP, SOIC, SSOP and QFN packages. The
PIC16F884/887 is available in a 40-pin PDIP and 44-
pin QFN and TQFP packages. Figure 1-1 shows the
block diagram of PIC16F882/883/886 and Figure 1-2
shows a block diagram of the PIC16F884/887 device.
Table 1-1 and Table 1-2 show the corresponding pinout
descriptions.
PIC16F882/883/884/886/887
DS41291F-page 14 © 2009 Microchip Technology Inc.
FIGURE 1-1: PIC16F882/883/886 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Ad dr 7
RAM Addr 9
Addr MU X
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode and
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
8
8
8
3
8-Level Stack 128(2)/256(1)/
2K(2)/4K(1)/
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
Data
EEPROM
128(2)/
EEDATA
EEADDR
T0CKI T1CKI
Configuration
Internal
Oscillator
T1G
VDD
8
Timer2 ECCP
Block
2 Analog ComparatorsVREF+and Reference
Analog-To-Digital Converter
(ADC)
AN0
AN1
AN2
AN3
AN4
AN8
AN9
AN10
AN11
AN12
AN13
C1IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1OUT
C2IN+
C2OUT
CCP1/P1A
P1B
P1C
P1D
PORTA
PORTC RC0
RC1
RC2
RC3
RC4
RC5
RC6
RC7
PORTB
EUSART
TX/CK
RX/DT
PORTE
RE3
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
Timer1
32 kHz
Oscillator
Master Synchronous
Serial Port (MSSP)
CCP2
CCP2
SDO
SDI/SDA
SCK/SCL
SS
VREF-
14
Note 1: PIC16F883 only.
2: PIC16F882 only.
VREF+
VREF-
CVREF
In-Circuit
Debugger
(ICD)
T1OSI
T1OSO
8K X 14
368 Bytes
256 Bytes
© 2009 Microchip Technology Inc. DS41291F-page 15
PIC16F882/883/884/886/887
FIGURE 1-2: PI C16F 88 4/PIC16F887 BLOCK DIAGRAM
PORTD RD0
RD1
RD2
RD3
RD4
RD5
RD6
RD7
Flash
Program
Memory
13 Data Bus 8
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode and
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
8
8
8
3
8-Level Stack 256(1)/368 Bytes
4K(1)/8K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
Data
EEPROM
256 Bytes
EEDATA
EEADDR
T0CKI T1CKI
Configuration
Internal
Oscillator
T1G
VDD
8
Timer2 ECCP
Block
2 Analog Comparators
and Reference
Analog-To-Digital Converter
(ADC)
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
PORTA
PORTC RC0
RC1
RC2
RC3
RC4
RC5
RC6
RC7
PORTB
EUSART
PORTE
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
Timer1
32 kHz
Oscillator
Master Synchronous
Serial Port (MSSP)
CCP2
CCP2
14
Note 1: PIC16F 884 only.
RE0
RE1
RE2
RE3
SDO
SDI/SDA
SCK/SCL
SS
CCP1/P1A
P1B
P1C
P1D
TX/CK
RX/DT
VREF+
VREF-
VREF+
VREF-
CVREF
C1IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1OUT
C2IN+
C2OUT
In-Circuit
Debugger
(ICD)
T1OSI
T1OSO
PIC16F882/883/884/886/887
DS41291F-page 16 © 2009 Microchip Technology Inc.
TABLE 1-1: PIC16F882/883/886 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
RA0/AN0/ULPWU/C12IN0- RA0 TTL CMOS General purpose I/O.
AN0 AN A/D Channel 0 input.
ULPWU AN Ultra Low-Power Wake-up input.
C12IN0- AN Comparator C1 or C2 negative input.
RA1/AN1/C12IN1- RA1 TTL CMOS Gener al purpose I/O.
AN1 AN A/D Channel 1 input.
C12IN1- AN Comparator C1 or C2 negative input.
RA2/AN2/VREF-/CVREF/C2IN+ RA2 TTL CMOS General purpose I/O.
AN2 AN A/D Channel 2.
VREF- AN A/D Negative Voltage Reference input.
CVREF AN C omparator Voltage Reference output.
C2IN+ AN Comparator C2 positive input.
RA3/AN3/VREF+/C1IN+ RA3 TTL General purpose I/O.
AN3 AN A/D Channel 3.
VREF+ AN Programming voltage.
C1IN+ AN Comparator C1 positive input.
RA4/T0CKI/C1OUT RA4 TTL CMOS General purpose I/O.
T0CKI ST Timer0 clock input.
C1OUT CMOS Comparator C1 output.
RA5/AN4/SS/C2OUT RA5 TTL CMOS General purpose I/O.
AN4 AN A/D Channel 4.
SS ST Slave Select input.
C2OUT CMOS Comparator C2 output.
RA6/OSC2/CLKOUT RA6 TTL CMOS General purpose I/O.
OSC2 XTAL Master Clear with internal pull-up.
CLKOUT CMOS FOSC/4 output.
RA7/OSC1/CLKIN RA7 TTL CMOS General purpose I/O.
OSC1 XTAL Crystal/Resonator.
CLKIN ST External clock input/RC oscillator connection.
RB0/AN12/INT RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN12 AN A/D Channel 12.
INT ST External interrupt.
RB1/AN10/P1C/C12IN3- RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN10 AN A/D Channel 10.
P1C CMOS PWM output.
C12IN3- AN Comparator C1 or C2 negative input.
RB2/AN8/P1B RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN8 AN A/D Channel 8.
P1B CMOS PWM output.
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
© 2009 Microchip Technology Inc. DS41291F-page 17
PIC16F882/883/884/886/887
RB3/AN9/PGM/C12IN2- RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN9 AN A/D Channel 9.
PGM ST Low-voltage ICSP™ Programming enable pin.
C12IN2- AN Comparator C1 or C2 negative input.
RB4/AN11 /P1D RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN11 AN A/D Channel 11.
P1D CMOS PWM output.
RB5/AN13/T1G RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN13 AN A/D Channel 13.
T1G ST Timer1 Gate input.
RB6/ICSPCLK RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPCLK ST Serial Programming Clock.
RB7/ICSPDAT RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPDAT ST CMOS ICSP™ D a ta I/O.
RC0/T1OSO/T1CKI RC0 ST CMOS General purpose I/O.
T1OSO CMOS Timer1 oscillator output.
T1CKI ST Timer1 clock input.
RC1/T1OSI/CCP2 RC1 ST CMOS General purpose I/O.
T1OSI ST Timer1 oscillator input.
CCP2 ST CMOS Capture/Compare/PWM2.
RC2/P1A/CCP1 RC2 ST CMOS General purpose I/O.
P1A CMOS PWM output.
CCP1 ST CMOS Capture/Compare/PWM1.
RC3/SCK/SCL R C3 ST CMOS General purpose I/O.
SCK ST CMOS SPI cl ock.
SCL ST OD I2C™ clock.
RC4/SDI/SDA RC4 ST CMOS General purpose I/O.
SDI ST SPI data input.
SDA ST OD I2C data input/output.
RC5/SDO RC5 ST CMOS General purpose I/O.
SDO CMOS SPI data output.
RC6/TX/CK RC6 ST CMOS General purpose I/O.
TX CMOS EUSART asynchronous transmit.
CK ST CMOS EUSART synchronous clock.
RC7/RX/DT RC7 ST CMOS General purpose I/O.
RX ST EU SART asynchronous input.
DT ST CMOS EUSART synchronous data.
RE3/MCLR/VPP RE3 TTL G eneral purpose inpu t.
MCLR ST Master Clear with internal pull-up.
VPP HV Programming voltage.
VSS VSS Power Ground reference.
VDD VDD Power Positive supply.
TABLE 1-1: PIC16F882/883/886 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type Output
Type Description
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
PIC16F882/883/884/886/887
DS41291F-page 18 © 2009 Microchip Technology Inc.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
RA0/AN0/ULPWU/C12IN0- RA0 TTL CMOS General purpose I/O.
AN0 AN A/D Channel 0 input.
ULPWU AN Ultra Low-Power Wake-up input.
C12IN0- AN Comparator C1 or C2 negative input.
RA1/AN1/C12IN1- RA1 TTL CM O S General purpose I/O.
AN1 AN A/D Channel 1 input.
C12IN1- AN Comparator C1 or C2 negative input.
RA2/AN2/VREF-/CVREF/C2IN+ RA2 TTL CMOS General purpose I/O.
AN2 AN A/D Channel 2.
VREF- AN A/D Negative Voltage Reference input.
CVREF AN Comparator Voltage Reference output.
C2IN+ AN Comparator C2 positive input.
RA3/AN3/VREF+/C1IN+ RA3 TTL CM O S General purpose I/O.
AN3 AN A/D Channel 3.
VREF+ AN A/D Positive Voltage Reference input.
C1IN+ AN Comparator C1 positive input.
RA4/T0CKI/C1OUT RA4 TTL CMOS General purpose I/O.
T0CKI ST Timer0 clock input.
C1OUT CMOS Comparator C1 output.
RA5/AN4/SS/ C 2OU T RA5 TTL CM O S General purpose I/O.
AN4 AN A/D Channel 4.
SS ST Slave Select input.
C2OUT CMOS Comparator C2 output.
RA6/OSC2/CLKOUT RA6 TTL CMOS General purpose I/O.
OSC2 XTAL Crystal/Resonator.
CLKOUT CMOS FOSC/4 output.
RA7/OSC1/CLKIN RA7 T TL CM O S G eneral purpose I/O.
OSC1 XTAL Crystal/Resonator.
CLKIN ST External clock input/RC oscillator connection.
RB0/AN12/INT RB0 T TL CM OS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN12 AN A/D Channel 12.
INT ST External in te rrupt.
RB1/AN10/C12IN3- RB1 TTL CMO S G eneral purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN10 AN A/D Channel 10.
C12IN3- AN Comparator C1 or C2 negative input.
RB2/AN8 RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN8 AN A/D Channel 8.
RB3/AN9/PGM /C12 IN2- RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN9 AN A/D Channel 9.
PGM ST Low-voltage ICSP™ Programming enable pin.
C12IN2- AN Comparator C1 or C2 negative input.
Legend: AN = Analog input or output CMO S = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Sc hmit t Trigger input with CMOS levels
HV = High Voltage XTA L = Crystal
© 2009 Microchip Technology Inc. DS41291F-page 19
PIC16F882/883/884/886/887
RB4/AN11 RB4 TTL CM O S G eneral purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN11 AN A/D Channel 11.
RB5/AN13/T1G RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN13 AN A/D Channel 13.
T1G ST Timer1 Gate input.
RB6/ICSPC LK RB6 TTL CM O S G eneral purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPCLK ST Serial Programming Clock.
RB7/ICSPD AT RB7 TTL CM OS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPDAT ST TTL ICSP™ Data I/O.
RC0/T1OSO/T1CKI RC0 ST CMOS G eneral purpose I/O.
T1OSO XTAL Timer1 oscillator output.
T1CKI ST Timer1 clock input.
RC1/T1OSI/CCP2 RC1 ST CMOS General purpose I/O.
T1OSI X TAL Timer1 oscillator input.
CCP2 ST CMOS Capture/Compare/PWM2.
RC2/P1A/CCP1 RC2 ST CMOS G eneral purpose I/O.
P1A ST CMO S P W M output.
CCP1 CMOS Capture/Compare/PWM1.
RC3/SCK/SCL RC3 ST CMOS General purpose I/O.
SCK ST CMOS SPI clock.
SCL ST OD I2C ™ clock.
RC4/SDI/SDA RC4 ST CMOS General purpose I/O.
SDI ST SPI data input.
SDA ST OD I2C data input/output.
RC5/SDO RC5 ST CMOS G eneral purpose I/O.
SDO CMOS SPI data output.
RC6/TX/CK RC6 ST CMOS G eneral purpose I/O.
TX CMO S E USA RT asynchronous transmit.
CK ST CMO S EUSART synchronous clock.
RC7/RX/DT RC7 ST CMOS G eneral purpose I/O.
RX ST EUSART asynchronous input.
DT ST CMOS E U SA RT synchronous data.
RD0 RD0 TTL CM O S G eneral purpose I/O.
RD1 RD1 TTL CM O S G eneral purpose I/O.
RD2 RD2 TTL CM O S G eneral purpose I/O.
RD3 RD3 TTL CM O S G eneral purpose I/O.
RD4 RD4 TTL CM O S G eneral purpose I/O.
RD5/P1B RD5 TTL CM O S G eneral purpose I/O.
P1B CM O S P W M output.
RD6/P1C RD6 TTL CM O S G eneral purpose I/O.
P1C CMOS P W M output.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type Output
Type Description
Legend: AN = Analog input or output CMO S = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Sc hmit t Trigger input with CMOS levels
HV = High Voltage XTA L = Crystal
PIC16F882/883/884/886/887
DS41291F-page 20 © 2009 Microchip Technology Inc.
RD7/P1D RD7 TTL CM O S G eneral purpose I/O.
P1D AN PWM output.
RE0/AN5 RE0 TTL CMOS General purpose I/O.
AN5 AN A/D Channel 5.
RE1/AN6 RE1 TTL CMOS General purpose I/O.
AN6 AN A/D Channel 6.
RE2/AN7 RE2 TTL CMOS General purpose I/O.
AN7 AN A/D Channel 7.
RE3/MCLR/VPP RE3 T TL G eneral purpose input.
MCLR ST Master Clear with internal pull-up.
VPP HV P rogramming voltage.
VSS VSS Power G round reference.
VDD VDD Power Positive supply.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type Output
Type Description
Legend: AN = Analog input or output CMO S = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Sc hmit t Trigger input with CMOS levels
HV = High Voltage XTA L = Crystal
© 2009 Microchip Technology Inc. DS41291F-page 21
PIC16F882/883/884/886/887
2.0 MEMORY ORGANIZATION
2.1 Program Memory Organization
The PIC16F882/883/884/886/887 has a 13-bit program
counter cap able of addressing a 2K x 14 (0000h-07FFh)
for the PIC16F882, 4K x 14 (0000h-0FFFh) for the
PIC16F883/PIC16F884, and 8K x 14 (0000h-1FFFh) for
the PIC16F886/PIC16F887 program memory space.
Accessing a locati on above these boundaries will c ause
a wrap-around within th e first 8K x 1 4 sp ac e. The Reset
vector is at 0000h and the interrupt vector is at 0004h
(see Figures 2-2 and 2-3).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F882
FIGURE 2-2: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F883/PIC16F884
FIGURE 2-3: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F886/PIC16F887
PC<12:0>
13
0000h
0004h
0005h
07FFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
On-Chip
Program
Memory
PC<12:0>
13
0000h
0004h
0005h
07FFh
0800h
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
Page 1 0FFFh
On-Chip
Program
Memory
PC<12:0>
13
0000h
0004h
0005h
07FFh
0800h
17FFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
Page 1
Page 2
Page 3
0FFFh
1000h
1FFFh
1800h
On-Chip
Program
Memory
PIC16F882/883/884/886/887
DS41291F-page 22 © 2009 Microchip Technology Inc.
2.2 Dat a Memor y Organization
The data memory (see Figures 2-2 and 2-3) is
partitioned into four banks which contain the General
Purpose Registers (GPR) and the Special Function
Registers (SFR). The Special Function Registers are
located in the first 32 locations of each bank. The
General Purpose Registers, implemented as static RAM,
are located in the last 96 locations of each Bank.
Register locations F0h-FFh in Bank 1, 170h-17Fh in
Bank 2 and 1F0h-1FFh in Bank 3, point to addresses
70h-7Fh in Bank 0. The actual number of General
Purpose Resisters (GPR) implemented in each Bank
depends on the devi ce. Details are sho wn in Figures 2-5
and 2-6. All other RAM is unimplemented and returns ‘0
when read. RP<1:0> of the STATUS register are the
bank sele ct bits:
RP1 RP0
00Bank 0 is selected
01Bank 1 is selected
10Bank 2 is selected
11Bank 3 is selected
2.2.1 GENERAL PURPOSE REGISTER
FILE
The register file is organized as 128 x 8 in the
PIC16F882, 256 x 8 in the PIC1 6F883/PIC16F884, and
368 x 8 i n th e PIC16 F886/PIC16F887. Each regist er i s
accessed, either directly or indirectly, through the File
Select Register (FSR) (see Section 2.4 “Indirect
Addressing, INDF and FSR Registers”).
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
assoc iated with th e “core” are described in this sec tion.
Those related to the operation of the peripheral
features are described in the section of that peripheral
feature.
© 2009 Microchip Technology Inc. DS41291F-page 23
PIC16F882/883/884/886/887
FIGURE 2-4: PI C16F 88 2 SPECIA L FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h In direct addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
08h 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h 110h 190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h General
Purpose
Registers
32 Bytes
A0h
BFh
120h 1A0h
C0h
EFh 16Fh 1EFh
accesses
70h-7Fh F0h accesses
70h-7Fh 170h accesses
70h-7Fh 1F0h
7Fh FFh 17Fh 1FFh
Bank 0 Bank 1 Bank 2 Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
PIC16F882/883/884/886/887
DS41291F-page 24 © 2009 Microchip Technology Inc.
FIGURE 2-5: PI C16F 88 3/PIC16F884 SPECIAL FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h Indirect addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
PORTD(2) 08h TRISD(2) 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h 110h 190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h General
Purpose
Registers
80 Bytes
A0h General
Purpose
Registers
80 Bytes
120h 1A0h
EFh 16Fh 1EFh
accesses
70h-7Fh F0h accesses
70h-7Fh 170h accesses
70h-7Fh 1F0h
7Fh FFh 17Fh 1FFh
Bank 0Bank 1Bank 2Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
2: PIC16F884 only.
© 2009 Microchip Technology Inc. DS41291F-page 25
PIC16F882/883/884/886/887
FIGURE 2-6: PI C16F 88 6/PIC16F887 SPECIAL FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h Indirect addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
PORTD(2) 08h TRISD(2) 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h
General
Purpose
Registers
16 Bytes
110h
General
Purpose
Registers
16 Bytes
190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h
3Fh General
Purpose
Registers
80 Bytes
A0h General
Purpose
Registers
80 Bytes
120h General
Purpose
Registers
80 Bytes
1A0h
40h
6Fh EFh 16Fh 1EFh
70h accesses
70h-7Fh F0h accesses
70h-7Fh 170h accesses
70h-7Fh 1F0h
7Fh FFh 17Fh 1FFh
Bank 0Bank 1Bank 2Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
2: PIC16F887 only.
PIC16F882/883/884/886/887
DS41291F-page 26 © 2009 Microchip Technology Inc.
TABLE 2-1: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 37,217
01h TM R0 Timer0 Module Register xxxx xxxx 73,217
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 37,217
03h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 29,217
04h FSR Indirect Data Memory Address Pointer xxxx xxxx 37,217
05h PORTA(3) RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx xxxx 39,217
06h PORTB(3) RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 48,217
07h PORTC(3) RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx 53,217
08h PORTD(3,4) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 57,217
09h PORTE(3) —RE3RE2
(4) RE1(4) RE0(4) ---- xxxx 59,217
0Ah PCLATH Write Buffer for upper 5 bits of Program Counter ---0 0000 37,217
0Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 31,217
0Ch PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 34,217
0Dh PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF —CCP2IF0000 00-0 35,217
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 76,217
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 76,217
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 79,217
11h TMR2 Timer2 Module Register 0000 0000 81,217
12h T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 82,217
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx 183,217
14h SSPCON(2) WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 181,217
15h CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) xxxx xxxx 126,217
16h CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) xxxx xxxx 126,217
17h CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 124,217
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 161,217
19h TXREG EUSART Transmit Data Register 0000 0000 153,217
1Ah RCREG EUSART Receive Data Register 0000 0000 158,217
1Bh CCPR2L Capture/Compare/PWM Register 2 Low Byte (LSB) xxxx xxxx 126,217
1Ch CCPR2H Capture/Compare/PWM Register 2 High Byte (MSB) xxxx xxxx 126,218
1Dh CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 125,218
1Eh ADRESH A/D Result Register High Byte xxxx xxxx 99,218
1Fh ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 0000 0000 104,218
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset do not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: When SS P CON r e gis t er b it s S SP M<3 : 0> = 1001, any reads or writes to the SSPADD SFR address are accessed through the SSPMSK
register. See Registers • and 13-4 for more detail.
3: Port pins with analog functions controlled by the ANSEL and ANSELH registers will read ‘0’ immediately after a Reset even though the
data latches are either undefined (POR) or unchanged (other Resets).
4: PIC16F884/PIC16F887 only.
© 2009 Microchip Technology Inc. DS41291F-page 27
PIC16F882/883/884/886/887
TABLE 2-2: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 37,217
81h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 30,218
82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 37,217
83h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 29,217
84h FSR Indirect Data Memory Address Pointer xxxx xxxx 37,217
85h TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 39,218
86h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 48,218
87h TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 53,218
88h TRISD(3) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 57,218
89h TRISE TRISE3 TRISE2(3) TRISE1(3) TRISE0(3) ---- 1111 59,218
8Ah PCLATH Write Buffer for the upper 5 bits of the Program Counter ---0 0000 37,217
8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 31,217
8Ch PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 32,218
8Dh PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 33,218
8Eh PCON ULPWUE SBOREN —PORBOR --01 --qq 36,218
8Fh OSCCON IRCF2 IRCF1 IRCF0 OSTS HTS LTS SCS -110 q000 62,218
90h OSCTUNE TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 66,218
91h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 181,218
92h PR2 Time r2 Pe rio d Re gist e r 1111 1111 81,218
93h SSPADD(2) S yn c hr ono us Seri al Po rt (I2C mode) Address Register 0000 0000 189,218
93h SSPMSK(2) MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0 1111 1111 189,218
94h SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 189,218
95h WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 49,218
96h IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 0000 0000 49,218
97h VRCON VREN VROE VRR VRSS VR3 VR2 VR1 VR0 0000 0000 97,218
98h TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 160,218
99h SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 163,218
9Ah SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 163,218
9Bh PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 145,218
9Ch ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 142,218
9Dh PSTRCON STRSYNC STRD STRC STRB STRA ---0 0001 146,218
9Eh ADRESL A/D Result Register Low Byte xxxx xxxx 99,218
9Fh ADCON1 ADFM —VCFG1VCFG0 0-00 ---- 105,218
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset do not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
3: PIC16F884/PIC16F887 only.
PIC16F882/883/884/886/887
DS41291F-page 28 © 2009 Microchip Technology Inc.
TABLE 2-3: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 2
TABLE 2-4: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 3
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Page
Bank 2
100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 37,217
101h TMR0 Timer0 Module Reg is ter xxxx xxxx 73,217
102h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 37,217
103h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 29,217
104h FSR Indirect Data Memory Address Pointer xxxx xxxx 37,217
105h WDTCON WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN ---0 1000 225,218
106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 48,217
107h CM1CON0 C1ON C1OUT C1OE C1POL C1R C1CH1 C1CH0 0000 -000 88,218
108h CM2CON0 C2ON C2OUT C2OE C2POL C2R C2CH1 C2CH0 0000 -000 89,218
109h CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL T1GSS C2SYNC 0000 --10 91,219
10Ah PCLATH Write Buffer for the upper 5 bits of the Program Counter ---0 0000 37,217
10Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 31,217
10Ch EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 0000 0000 112,219
10Dh EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 0000 0000 112,219
10Eh EEDATH EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0 --00 0000 112,219
10Fh EEADRH EEADRH4(2) EEADRH3 EEADRH2 EEADRH1 EEADRH0 ---- 0000 112,219
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset does not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: PIC16F886/PIC16F887 only.
AddrName Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2 Bit 1Bit 0Value on
POR, BOR Page
Bank 3
180h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 37,217
181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 30,218
182h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 37,217
183h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 29,217
184h FSR Indirect Data Memory Address Pointer xxxx xxxx 37,217
185h SRCON SR1 SR0 C1SEN C2REN PULSS PULSR FVREN 0000 00-0 93,219
186h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 48,218
187h BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 162,219
188h ANSEL ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 40,219
189h ANSELH ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 --11 1111 99,219
18Ah PCLATH —— Write Buffer for the upper 5 bits of the Program Counter ---0 0000 37,217
18Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 31,217
18Ch EECON1 EEPGD —— WRERR WREN WR RD x--- x000 113,219
18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- 111,219
Legend: – = Unimpl em ent ed locat io ns rea d as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset does not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: PIC16F884/PIC16F887 only.
© 2009 Microchip Technology Inc. DS41291F-page 29
PIC16F882/883/884/886/887
2.2.2.1 STATUS Register
The S TATUS registe r, shown in R e gis ter 2-1, co nt a ins :
the arithmetic s tatus of the ALU
the Reset status
the bank select bits for data memory (GPR and
SFR)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabl ed. These bit s are set or clea red according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For exam ple, CLRF STATUS, will clear the uppe r three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not affect-
ing any Status b it s , s ee Se ction 15.0 “Instruction Set
Summary”
Note 1: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction.
REGISTER 2-1: STATUS: STATUS REGISTER
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD ZDC
(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: Register Bank Select bi t (use d for indirect addressing)
1 = Bank 2, 3 (100h-1FFh)
0 = Bank 0, 1 (00h-FFh)
bit 6-5 RP<1:0>: Register Bank Select bits (used for direct addressing)
00 = Bank 0 (00h-7Fh)
01 = Bank 1 (80h-FFh)
10 = Bank 2 (100h-17Fh)
11 = Bank 3 (180h-1FFh)
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rot ate (RRF, RLF) instructi ons, this b it is loa ded with ei ther the hi gh-order or low-orde r
bit of the source register.
PIC16F882/883/884/886/887
DS41291F-page 30 © 2009 Microchip Technology Inc.
2.2.2.2 OPTION Register
The OPTION register, shown in Register 2-2, is a
readable and writable register, which contains various
control bits to configure:
Timer0/WDT prescaler
Extern al IN T inter rupt
•Timer0
Weak pu ll-ups on P ORTB
Note: To achieve a 1:1 prescaler assignment fo r
T imer0, assign the prescaler to the WDT by
setting PSA bit of the OPTION register to
1’. See Section 6.3 “Timer1 Prescaler.
REGISTER 2-2: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: Timer0 Clock Sou rce Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clo ck (FOSC/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assig nment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value Timer0 Rate WDT Rate
© 2009 Microchip Technology Inc. DS41291F-page 31
PIC16F882/883/884/886/887
2.2.2.3 INTCON Register
The INTCON register, shown in Register 2-3, is a
readable and writable register , which contains the various
enable and fl ag bits f or TMR 0 re gi ster ov er fl ow, PORTB
change and external INT pin interrupts.
Note: Interru pt flag bi ts are s et when an interrupt
conditi on occ urs, regar dless o f the s tate of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE PEIE T0IE INTE RBIE(1) T0IF(2) INTF RBIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 T0IE: Timer0 Ov erfl ow Interru pt E nab le bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3 RBIE: PORTB Change Interrupt Enable bit(1)
1 = Enables the PORTB change interrupt
0 = Disables the PORTB change interrupt
bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2)
1 = TM R0 register has overflowed (must be cleare d in so ftwa re)
0 = TM R0 register did no t overfl ow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred (must be cleared in software)
0 = The INT external interrupt did not occur
bit 0 RBIF: PORTB Change Interrupt Flag bit
1 = When at least one of the PORTB general purpose I/O pins changed state (must be cleared in
software)
0 = None of the PORTB general purpose I/O pins have changed state
Note 1: IOCB register must also be enabled.
2: T0IF bit is set when Timer0 rolls over. Timer0 is unchanged on Reset and should be initialized before
clearing T0IF bit.
PIC16F882/883/884/886/887
DS41291F-page 32 © 2009 Microchip Technology Inc.
2.2.2.4 PIE 1 Regi st er
The PIE1 regis te r con t ai ns th e in terrupt enable bi t s, a s
shown in Register 2-4.
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 RCIE: EUSART Receive Interrupt Enable bit
1 = Enables the EUSART receive interrupt
0 = Disables the EUSART receive interrupt
bit 4 TXIE: EUSART Transmit Interrupt Enable bit
1 = Enables the EUSART transmit interrupt
0 = Disables the EUSART transmit interrupt
bit 3 SSPIE: Master Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
© 2009 Microchip Technology Inc. DS41291F-page 33
PIC16F882/883/884/886/887
2.2.2.5 PI E2 Regi st er
The PIE2 regis te r con t ai ns th e in terrupt enable bi t s, a s
shown in Register 2-5.
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-5: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables oscillator fail interrupt
0 = Disables oscillator fail interrupt
bit 6 C2IE: Comparator C2 Interrupt Enable bit
1 = Enables Comparator C2 interrupt
0 = Disables Comparator C2 interrupt
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables Comparator C1 interrupt
0 = Disables Comparator C1 interrupt
bit 4 EEIE: EEPROM Write Operation Interrupt Enable bit
1 = Enables EEPROM write operation interrupt
0 = Disables EEPROM write operation interrupt
bit 3 BCLIE: Bus Collision Interrupt Enable bit
1 = Enables Bus Collision interrupt
0 = Disable s Bus Collision interru pt
bit 2 ULPWUIE: Ultra Low-Power Wake-up Interrupt Enable bit
1 = Enables Ultra Low-Power Wake-up interrupt
0 = Disables Ultra Low-Power Wake-up interrupt
bit 1 Unimplemented: Read as ‘0
bit 0 CCP2IE: CCP2 Interrupt Enable bit
1 = Enables CC P2 inte rrup t
0 = Disables CCP2 interrupt
PIC16F882/883/884/886/887
DS41291F-page 34 © 2009 Microchip Technology Inc.
2.2.2.6 PIR1 Register
The PIR1 register contains the interrupt flag bits, as
shown in Register 2-6.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate int errupt fla g bits are clear prior
to enabling an interrupt.
REGISTER 2-6: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = A/D conversion comp lete (must be cleared in software)
0 = A/D conversion has not completed or has not been started
bit 5 RCIF: EUSART Receive Interrupt Flag bit
1 = The EUSART receive buffer is full (cleared by reading RCREG)
0 = The EUSART receive buffer is not full
bit 4 TXIF: EUSART Transmit Interrupt Flag bit
1 = The EUSART transmit buffer is empty (cleared by writing to TXREG)
0 = The EUSART transmit buffer is full
bit 3 SSPIF: Master Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = The MSSP interrupt condition has occurred, and must be cleared in software before returning from the
Interrupt Service Routine. The conditions that will set this bit are:
SPI A transmission/reception has taken place
I2 C Slave/Master
A transmission/reception has taken place
I2 C Master
The initiated St art condition was completed by the MSSP module
The initiated Stop condition was completed by the MSSP module
The initiated restart condition was completed by the MSSP module
The initiated Acknowledge condition was completed by the MSSP module
A Start condition occurred while the MSSP module was idle (Multi-master system)
A Stop condition occurred while the MSSP module was idle (Multi-master system)
0 = No MSSP interrupt condition has occurred
bit 2 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurr ed
PWM mode:
Unused in this mode
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = A Timer2 to PR2 match occurred (mus t be cleared in software)
0 = No Timer2 to PR2 match occur red
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = The TMR1 register overflowed (must be cleared in software)
0 = The TMR1 register did not overflow
© 2009 Microchip Technology Inc. DS41291F-page 35
PIC16F882/883/884/886/887
2.2.2.7 PIR2 Register
The PIR2 register contains the interrupt flag bits, as
shown in Register 2-7.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bit s are clear prior
to enabling an interrupt.
REGISTER 2-7: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSFIF: Oscillator Fail Interrupt Flag bit
1 = System oscillator failed, clock input has changed to INTOSC (must be cleared in software)
0 = System clock operating
bit 6 C2IF: Comparator C2 Interrupt Flag bit
1 = Comparator output (C2OUT bit) has changed (must be cleared in software)
0 = Comparator output (C2OUT bit) has not changed
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Comparator output (C1OUT bit) has changed (must be cleared in software)
0 = Comparator output (C1OUT bit) has not changed
bit 4 EEIF: EE Write Operation Interrupt Flag bit
1 = Write operation completed (must be cleared in software)
0 = Write operation has not completed or has not started
bit 3 BCLIF: Bus Collision Interrupt Flag bit
1 = A bus collision has occurred in the MSSP when configured for I2C Ma ster mode
0 = No bus collision has occurred
bit 2 ULPWUIF: Ultra Low-Po wer Wake -up Inte rrupt Flag bit
1 = Wake-up condition has occurred (must be cleared in software)
0 = No Wake-up condition has o ccurred
bit 1 Unimplemented: Read as ‘0
bit 0 CCP2IF: CCP2 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (m ust be cleared in software )
0 = No TM R1 regist er capture occu rred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
PIC16F882/883/884/886/887
DS41291F-page 36 © 2009 Microchip Technology Inc.
2.2.2.8 PCON Regi st er
The Power Control (PCON) register (see Register 2-8)
cont ains flag bits to differentiat e betwe en a:
Power-on Reset (POR)
Brown-out Reset (BOR)
Watchdog Timer Reset (WDT)
External MCLR Reset
The PCON register also controls the Ultra Low-Power
Wake-up and software enable of the BOR.
REGISTER 2-8: PCON: POWER CONTROL REGISTER
U-0 U-0 R/W-0 R/W-1 U-0 U-0 R/W-0 R/W-x
ULPWUE SBOREN(1) —PORBOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5 ULPWUE: Ultra Low-Power Wake-up Enable bit
1 = Ultra Low-Power Wake-up enabled
0 = Ultra Low-Power Wake-up disabled
bit 4 SBOREN: Software BOR Enable bit(1)
1 = BOR enabled
0 = BOR disabled
bit 3-2 Unimplemented: Read as ‘0
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: BOREN<1:0> = 01 in the Configuration Word Register 1 for this bit to control the BOR.
© 2009 Microchip Technology Inc. DS41291F-page 37
PIC16F882/883/884/886/887
2.3 PCL and PCLATH
The Program Counte r (PC) is 13 bit s wide. The lo w byte
comes from the PCL register, which is a readable and
writable register . The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 2-7 shows the two
situ at i o ns fo r t he l o ad i n g of t h e PC . T he u p per e x am pl e
in Figure 2-7 shows how the PC is loaded on a write to
PCL (PCLATH<4:0> PCH). The lower example in
Figure 2-7 show s how the PC is loaded during a CALL or
GOTO instructi on (PC L ATH<4:3> PCH).
FIGURE 2-7: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
content s of th e PCLATH register. Th is allo ws the enti re
contents of the program counter to be changed by
writing the desire d upper 5 bit s to the PCLATH register.
When th e lower 8 bits are w ritten to the PCL register, all
13 bit s of the program cou nter will chang e to the values
contained in the PCLATH register and those being
written to the PCL register.
A comput ed GOTO is acc om pli sh ed by adding a n offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFF to 0x00 in the middle of
the table, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the target location within the table.
For more information refer to Application Note AN556,
Implementing a Table Read” (DS00556).
2.3.2 STACK
The PIC16F882/883/884/886/887 devices have an
8-level x 13-bit wide hardware stack (see Figures 2-2
and 2-3). The stack s pace is not part of eit her program
or data space and the Stack Pointer is not readable or
writable. The PC is PUSHed onto the stack when a
CALL instruction is executed or an interrupt causes a
branch. The stack i s POPed i n the e vent o f a RETURN,
RETLW or a RETFIE inst ructio n executi on. PC LATH is
not affected by a PUSH or POP operation.
The st ack operates as a circular buf fer . This means that
af ter the st ack ha s be en PUSHed ei ght time s, th e nin th
push ove rwr ites the va lu e that was s tored fro m the firs t
push. The tenth pus h ov erw ri tes the second pus h (an d
so on).
2.4 Indirect Addressing, INDF and
FSR Registers
The INDF register is no t a physica l register . Addr essing
the INDF register will caus e indirect addressing.
Indirect addressing is possible by using the INDF
register . Any instruction using the INDF register actually
accesses data pointed to by the File Select Register
(FSR) . Reading INDF itself in directly w ill produc e 00h.
Writing to the INDF register indirectly results in a no
operation (although Status bits may be affected). An
eff ectiv e 9-bi t address is obta ined by concat enatin g the
8-bit FSR and the IRP bit of the STATUS register, as
shown in Figure 2-8.
A simple program to clear RAM location 20h-2Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1: INDIRECT ADDRESS ING
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
ALU Result
GOTO, CALL
OPCODE<10:0>
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
PCL as
Destination
Note 1: There are no Status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interr upt add res s.
MOVLW 0x20 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR,4 ;all done?
GOTO NEXT ;no clear next
CONTINUE ;yes continue
PIC16F882/883/884/886/887
DS41291F-page 38 © 2009 Microchip Technology Inc.
FIGURE 2-8: DIRECT/INDIRECT ADDRE SSING PIC16F882/883/884/886/887
Note: Fo r mem ory map deta il, see Fi gures 2-2 and 2- 3.
Data
Memory
Indirect AddressingDirect Addressing
Bank Select Location Select
RP1 RP0 6 0
From Opcode IRP File Select Register
70
Bank Select Location Select
00 01 10 11 180h
1FFh
00h
7Fh
Bank 0 Ban k 1 Bank 2 Bank 3
© 2009 Microchip Technology Inc. DS41291F-page 39
PIC16F882/883/884/886/887
3.0 I/O PORTS
There are as many as thirty-five general purpose I/O
pins available. Depending on which peripherals are
enabled , some or all of the pins may not be a vailable as
general purpose I/O. In general, when a peripheral is
enabled, the associated pin may not be used as a
general purpose I/O pin.
3.1 PORTA and the TRISA Registers
PORTA is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 3-2). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a T RISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). Example 3-1 shows how to
initialize PORTA.
Reading the PORTA register (Register 3-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch.
The TRISA register (Register 3-2) controls the PORTA
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISA register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-1: INITIALI ZING PORTA
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’.
BANKSEL PORTA ;
CLRF PORTA ;Init PORTA
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O
BANKSEL TRISA ;
MOVLW 0Ch ;Set RA<3:2> as inputs
MOVWF TRISA ;and set RA<5:4,1:0>
;as outputs
REGISTER 3-1: PORTA: PORTA REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RA<7:0>: PORTA I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-2: TRISA: PORTA TRI-STATE REGISTER
R/W-1(1) R/W-1(1) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISA<7:0>: PORTA Tri-State Control bit
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
Note 1: TRISA<7:6> always reads1’ in XT, HS and LP Oscillator modes.
PIC16F882/883/884/886/887
DS41291F-page 40 © 2009 Microchip Technology Inc.
3.2 Additional Pin Functions
RA0 also has an Ultra Low-Power W ake-up option. The
next three sections descr ibe thes e functio ns.
3.2.1 ANSEL REGISTER
The ANSEL reg ister (Regist er 3-3 ) is us ed to conf igu re
the Input mode of an I/O pin to analog. Setting the
appropriate ANSEL bit high will cause all digital reads
on the pin to be read as ‘0’ and allow analog functions
on the pin to operate correctly.
The st ate of the ANSEL bit s has no af fect on digit al out-
put functi ons. A pin with TRIS clea r and ANSEL set will
still operate as a digital output, but the Input mode will
be analog. This can cause unexpected behavior when
executing read-modify-write instructions on the
affec ted port.
REGISTER 3-3: ANSEL: ANALOG SELECT REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ANS<7:0>: Analog Select bits
Analog select between analog or digital function on pins AN<7:0>, respectively.
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
2: Not implemented on PIC16F883/886.
© 2009 Microchip Technology Inc. DS41291F-page 41
PIC16F882/883/884/886/887
3.2.2 ULTRA LOW-POWER WAKE-UP
The Ultra Low-Power Wake-up (ULPWU) on RA0 allows
a slow falling voltage to generate an interrupt-on-change
on RA0 without exces s current c onsum ption. The m ode
is selected by setting the ULPWUE bit of the PCON
register. This enables a small c urrent sink, w hich can be
used to discharge a cap ac itor on RA0.
Follow these steps to use this feature:
a) Charge the capacitor on RA0 by configuring the
RA0 pin to output (= 1).
b) Configure RA0 as an input.
c) Set the ULPWUIE bit of the PIE2 register to
enable inte rrupt.
d) Set the ULPWUE bit of the PCON register to
begin the capacitor discharge.
e) Execute a SLEEP instruction.
When the v olt ag e on RA0 dro p s below VIL, an interrupt
will be generated which will cause the device to
wake-u p and exec ute the next instru ction . If the GIE b it
of the INTCON register is set, the device will then call
the interrupt vector (0004h).
This feature provides a low-power technique for
periodically waking up the device from Sleep. The
time-out is dependent on the discharge time of the RC
circuit on RA0. See Example 3-2 for initializing the
Ultra Low-Power Wake-up module.
A series resistor between RA0 and the external
capacitor provides overcurrent protection for the
RA0/AN0/ULPWU/C12IN0- pin and can allow for
software calibration of the time-out (see Figure 3-1). A
timer can be used to measure the charge time and
discharge time of the capacitor. The charge time can
then be ad jus t ed to pro vi de th e de si red i nterrupt delay.
This technique will compensate for the affects of
temperature, voltage and component accuracy. The
Ultra Low-Power Wake-up peripheral can also be
configured as a simple Programmable Low Voltage
Detect or temperature sensor.
EXAMPLE 3-2: ULTRA LOW-POWER
WAKE-UP INITIALIZATION
Note: For more information, refer to AN879,
Using the Microchip Ultra Low-Power
Wake-up Module” Application Note
(DS00879).
BANKSEL PORTA ;
BSF PORTA,0 ;Set RA0 data latch
BANKSEL ANSEL ;
BCF ANSEL,0 ;RA0 to digital I/O
BANKSEL TRISA ;
BCF TRISA,0 ;Output high to
CALL CapDelay ;charge capacitor
BANKSEL PIR2 ;
BCF PIR2,ULPWUIF ;Clear flag
BANKSEL PCON
BSF PCON,ULPWUE ;Enable ULP Wake-up
BSF TRISA,0 ;RA0 to input
BSF PIE2, ULPWUIE ;Enable interrupt
MOVLW B’11000000’ ;Enable peripheral
MOVWF INTCON ;interrupt
SLEEP ;Wait for IOC
NOP ;
PIC16F882/883/884/886/887
DS41291F-page 42 © 2009 Microchip Technology Inc.
3.2.3 PIN DESCRIPTIONS AND
DIAGRAMS
Each PORT A pin is multiplexed with other functions. The
pins and their combined functions are briefly described
here. For specific information about individual functions
such as the comparator or the A/D Converter (ADC),
refer to the appropriate section in this dat a shee t.
3.2.3.1 RA0/AN0/ULPWU/C12IN0-
Figure 3-1 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
an analog input for the ADC
a negative analog input to Comparator C1 or C2
an analog input for the Ultra Low-Power Wake-up
FIGURE 3-1: BLOCK DIAGRAM OF RA0
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
RD
WR
WR
RD
To Comparator
Analog(1)
Input Mode
01
IULP
Data Bus
PORTA
TRISA
TRISA
PORTA
Note 1: ANSEL determines Analog Input mode.
-
+V
TRG
ULPWUE
To A/D Converter
VSS
© 2009 Microchip Technology Inc. DS41291F-page 43
PIC16F882/883/884/886/887
3.2.3.2 RA1/AN1/C12IN1-
Figure 3-2 shows the diagram for this pin. This pin is
configurable to function as one of the fol lowing:
a general purpose I/O
an analog input for the ADC
a negative analog input to Comparator C1 or C2
FIGURE 3-2: BLOCK DIAGRAM OF RA1
3.2.3.3 RA2/AN2/VREF-/CVREF/C2IN+
Figure 3-3 shows the diagram for this pin. This pin is
confi gu rab le to func ti on a s one o f t he following :
a genera l purpo se I/O
an analog input for the ADC
a negative voltage reference input for the ADC
and CVREF
a comparator voltage reference output
a positive analog input to Comparator C2
FIGURE 3-3: BLOCK DIAGRAM OF RA2
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
To Comparator
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
To Comparator (V REF-)
Note 1: ANSEL determines Analog Input mode.
To Comparator (positive input)
CVREF
VROE
To A/D Converter (VREF-)
To A/D Converter (analog channel)
PIC16F882/883/884/886/887
DS41291F-page 44 © 2009 Microchip Technology Inc.
3.2.3.4 RA3/AN3/VREF+/C1IN+
Figure 3-4 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose input
an analog input for the ADC
a pos itive vo ltage reference i nput for the ADC and
CVREF
a positive analog input to Comparator C1
FIGURE 3-4: BLOCK DIAGRAM OF RA3
3.2.3.5 RA4/T0CKI/C1OUT
Figure 3-5 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a clock input for Timer0
a di gital output from Comparator C1
FIGURE 3-5: BLOCK DIAGRAM OF RA4
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
Note 1: ANSEL determines Analog Input mode.
To Comparator (VREF+)
To Comparator (positive input)
To A/D Converter (VREF+)
To A/D Converter (analog channel)
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
0
1
C1OUT
C1OUT
Enable
To Timer0
© 2009 Microchip Technology Inc. DS41291F-page 45
PIC16F882/883/884/886/887
3.2.3.6 RA5/AN4/SS/C2OUT
Figure 3-6 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
a slave select input
a digital output from Comparator C2
FIGURE 3-6: BLOCK DIAGRAM OF RA5
3.2.3.7 RA6/OSC2/CLKOUT
Figure 3-7 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a crystal/reso na tor con nec tio n
a clock output
FIGURE 3-7: BLOCK DIAGRAM OF RA6
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
0
1
C2OUT
C2OUT
Enable
To SS Input
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
FOSC/4
OSC2
CLKOUT
0
1
CLKOUT
Enable
Enable
INTOSCIO/
EXTRCIO/EC(1)
CLKOUT
Enable
Note 1: With I/O option.
Circuit
Oscillator
PIC16F882/883/884/886/887
DS41291F-page 46 © 2009 Microchip Technology Inc.
3.2.3.8 RA7/OSC1/CLKIN
Figure 3-8 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a crystal/resonator connection
a clock input
FIGURE 3-8: BLOCK DIAGRAM OF RA7
TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
INTOSC
Mode
OSC1
CLKIN
Circuit
Oscillator
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 0000 0000 0000 0000
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111
CM1CON0 C1ON C1OUT C1OE C1POL C1R C1CH1 C1CH0 0000 -000 0000 -000
CM2CON0 C2ON C2OUT C2OE C2POL C2R C2CH1 C2CH0 0000 -000 0000 -000
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL T1GSS C2SYNC 0000 --10 0000 --10
PCON ULPWUE SBOREN —PORBOR --01 --qq --0u --uu
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx xxxx uuuu uuuu
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
© 2009 Microchip Technology Inc. DS41291F-page 47
PIC16F882/883/884/886/887
3.3 PORTB and TRISB Registers
PORTB is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISB
(Register 3-6). Setting a TRISB bit (= 1) will make the
corresponding PORTB pin an input (i.e., put the
corresponding output driver in a High-Imped ance mode).
Clea ring a TRI SB bi t (= 0) will make the corresponding
PORTB pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 3-3 shows how to ini tialize POR TB.
Reading the PORTB register (Register 3-5) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, th is value is modifi ed and the n written
to the PORT dat a lat ch.
The TRISB register (Register 3-6) controls the PORTB
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISB register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’. Example 3-3 shows how to initiali ze PORTB.
EXAMPLE 3-3: INITIALIZING PORTB
3.4 Additional PORTB Pin Functions
PORT B pins RB<7 :0> on the dev ice family device hav e
an interrupt-on-change option and a weak pull-up
option. The following three sections describe these
PORTB pin functions.
Every PORTB pin on this device family has an
interrupt-on-change option and a weak pull-up option.
3.4.1 ANSELH REGISTER
The ANSELH register (Register 3-4) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELH bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELH bits has no affect on digital
output functions. A pin with TRIS clear and ANSELH
set will still operate as a digital output, but the Input
mode will be analog. This can cause unexpected
behavior when executing read-modify-write
inst ruct ion s on the af f ected port.
3.4.2 WEAK PULL-UPS
Each of the PORTB pi ns has an ind ividually co nfigurable
internal weak pull-up. Control bit s WPUB<7:0> enable or
disable each pull-up (see Register 3-7). Each weak
pull-up is automatically turned off when the port pin is
configured as an output. All pull-ups are disabled on a
Power-on Reset by the RBPU bit of the OPTION register .
3.4.3 INTERRUPT-ON-CHANGE
All of the PORTB pins are individually configurable as an
interrupt-on-change pin. Control bits IOCB<7:0> enable
or disable the interrupt function for each pin. Refer to
Register 3-8. The interrupt-on-change feature is
disabled on a Power-on Reset.
For enabled interrupt-on-change pins, the present value
is compared with the old va lue l atch ed on the last rea d
of PORTB to determine which bits have changed or
mismatched the old value. The ‘mismatch’ outputs of
the last read are OR’d together to set the PORTB
Change Interrupt flag bit (RBIF) in the INTCON register .
This interrupt can wake the device from Sleep. The user,
in the Interrupt Service Routine, clears the inte rrupt by:
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear the flag bit RBIF.
A mismatch condition will continue to set flag bit RBIF.
Reading or writing PORTB will end the mismatch
condition and allow flag bit RBIF to be cleared. The latch
holding the last read value is not affected by a MCLR nor
Brown-out Reset. After these Resets, the RBIF flag will
continue to be set if a mismatch is present.
Note: The ANSELH register must be initialized
to config ure an analog c hannel as a dig ital
input. Pi ns configured as analog inputs w ill
read ‘0’.
BANKSEL PORTB ;
CLRF PORTB ;Init PORTB
BANKSEL TRISB ;
MOVLW B‘11110000’;Set RB<7:4> as inputs
;and RB<3:0> as outputs
MOVWF TRISB ;
Note: If a change on the I/O pin should occur when
the read operation is being executed (start of
the Q2 cycle), then the RBIF interrupt flag
may not get set. Fur thermore, since a read
or write on a port affects all bits of that port ,
care must be taken when using multiple pins
in Interrupt-on-Change mode. Changes on
one pin may not be seen while servicing
changes on another pin.
PIC16F882/883/884/886/887
DS41291F-page 48 © 2009 Microchip Technology Inc.
REGISTER 3-4: ANSELH: ANALOG SELECT HIGH REGISTER
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
ANS13 ANS12 ANS11 ANS10 ANS9 ANS8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 ANS<13:8>: Analog Select bits
Analog select between analog or digital function on pins AN<13:8>, respectively.
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
REGISTER 3-5: PORTB: PORTB REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RB<7:0>: PORTB I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-6: TRISB: PORTB TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISB<7:0>: PORTB Tri-State Control bit
1 = PORTB pin configured as an input (tri-stated)
0 = PORTB pin configured as an output
© 2009 Microchip Technology Inc. DS41291F-page 49
PIC16F882/883/884/886/887
REGISTER 3-7: WPUB: WEAK PULL-UP PORTB REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 WPUB<7:0>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global RBPU bit of the OPTION register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
REGISTER 3-8: IOCB: INTERRUPT-ON-CHANGE PORTB REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 IOCB<7:0>: Interrupt-on-Change PORTB Control bit
1 = Interrupt-on-change enabled
0 = Interrupt-on-change disabled
PIC16F882/883/884/886/887
DS41291F-page 50 © 2009 Microchip Technology Inc.
3.4.4 PIN DESCRIPTIONS AND
DIAGRAMS
Each PORTB pin is multiplexed with other functions. The
pins and their combined functions are briefly described
here. For specific information about individual functions
such as the SSP, I2C or interrupts, refer to the appropriate
section in this data sheet.
3.4.4.1 RB0/AN12/INT
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
an external edge triggered interrupt
3.4.4.2 RB1/AN10/P1C(1)/C12IN3-
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
a PWM output(1)
an analog input to Comparator C1 or C2
3.4.4.3 RB2/AN8/P1B(1)
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
a PWM output(1)
3.4.4.4 RB3/AN9/PGM/C12IN2-
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
Low-voltage In-Circuit Serial Programming enable
pin
an analog input to Comparator C1 or C2
FIGURE 3-9: BLOCK DIAGRAM OF
RB<3:0>
Note 1: P1C is available on PIC16F882/883/886
only.
Note 1: P1B is available on PIC16F882/883/886
only.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
Weak
Analog(1)
Input Mode
Data Bus
WR
WPUB
RD
WPUB
WR
PORTB
WR
TRISB
RD
TRISB
To A/D Converter
RB0/INT
Analog(1)
Input Mode
RBPU
Note 1: ANSELH determines Analog Input mode.
RB3/PGM
To Comparator (RB1, RB3)
D
Q
CK
Q
D
EN
Q
D
EN
Q
RD PORTB
RD
PORTB
WR
IOCB
RD
IOCB
Interrupt-on-
Change
Q3
1
0
CCP1OUT Enable
CCP1OUT
© 2009 Microchip Technology Inc. DS41291F-page 51
PIC16F882/883/884/886/887
3.4.4.5 RB4/AN11/P1D(1)
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
a PWM output(1)
3.4.4.6 RB5/AN13/T1G
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an analog input for the ADC
a Timer1 gate input
3.4.4.7 RB6/ICSPCLK
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
In-Circuit Serial Programming clock
3.4.4.8 RB7/ICSPDAT
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
In-Circ uit Ser ial Program ming data
FIGURE 3-10: BLOCK DIAGRAM OF RB<7:4>
Note 1: P1D is available on PIC16F882/883/886
only.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Data Bus
WR
WPUB
RD
WPUB
RD PORTB
RD
PORTB
WR
PORTB
WR
TRISB
RD
TRISB
WR
IOCB
RD
IOCB
Interrupt-on-
Analog(1) Input Mode
RBPU
Change
Q3
Available on PIC16F882/PIC16F883/PIC16F886 only.
Note 1: ANSELH determines Analog Input mode.
2: Applies to RB<7:6> pins only).
3: Applies to RB5 pin only.
To A/D Converter
1
0
CCP1OUT Enable
CCP1OUT 0
1
1
0
Analog(1)
Input Mode
To Timer1 T1G(3)
ICSP™(2)
To ICSPCLK (RB6) and ICSPDAT (RB7)
PIC16F882/883/884/886/887
DS41291F-page 52 © 2009 Microchip Technology Inc.
TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSELH ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 --11 1111 --11 1111
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —T1GSSC2SYNC 0000 --10 0000 --10
IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, = unimplemented read as ‘0’. Shaded cells are not used by PORTB.
© 2009 Microchip Technology Inc. DS41291F-page 53
PIC16F882/883/884/886/887
3.5 PORTC and TRISC Registers
PORTC is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISC
(Register 3-10). Setting a TRISC bit (= 1) will make the
corresponding PORTC pin an input (i.e., put the
corr esponding o utput dr iver in a Hi gh-Impeda nce mode).
Clearing a TRISC bit (= 0) will make the corresponding
PORTC pi n an outp ut ( i.e. , enab le th e out put dri ver and
put th e co nte nts of t he ou tp ut l atc h on t h e se le cted pi n) .
Example 3-4 show s h ow t o ini ti al iz e PORTC.
Reading the PORTC register (Register 3-9) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pin s are read, thi s value is modi fied and the n written
to the PORT data latch.
The TRISC register (Register 3-10 ) contr ols the PORTC
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISC register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-4: INITIALIZI NG PORTC
BANKSEL PORTC ;
CLRF PORTC ;Init PORTC
BANKSEL TRISC ;
MOVLW B‘00001100’ ;Set RC<3:2> as inputs
MOVWF TRISC ;and set RC<7:4,1:0>
;as outputs
REGISTER 3-9: PORTC: PORTC REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RC<7:0>: PORTC General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-10: TRISC: PORTC TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1(1) R/W-1(1)
TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISC<7:0>: PORTC Tri-State Control bit
1 = PORTC pin configured as an input (tri-stated)
0 = PORTC pin configured as an output
Note 1: TRISC<1:0> always reads ‘1’ in LP Oscillator mode.
PIC16F882/883/884/886/887
DS41291F-page 54 © 2009 Microchip Technology Inc.
3.5.1 RC0/T1OSO/T1CKI
Figure 3-11 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a Ti mer1 oscillator output
a Timer1 clock input
FIGURE 3-11: BLOCK DIAGRAM OF RC0
3.5.2 RC1/T1OSI/CCP2
Figure 3-12 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a Ti mer1 oscillator input
a Capture input and Compare/PWM output for
Comparator C2
FIGURE 3-12: BLOCK DIAGRAM OF RC1
3.5.3 RC2/P1A/CCP1
Figure 3-13 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a PWM output
a Capture input and Compare output for
Compar ator C1
FIGURE 3-13: BLOCK DIAGRAM OF RC2
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To Timer1 clock input
T1OSCEN Circuit
Timer1 Oscillator
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To CCP2
CCP2
CCP2CON
0
1
1
0
T1OSCEN
T1OSCEN Circuit
Timer1 Oscillator
T1OSI
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data bus
WR
PORTC
WR
TRISC
RD
TRISC
To Enhance d CCP1
RD
PORTC
CCP1/P1A
CCP1CON
0
1
1
0I/O Pin
© 2009 Microchip Technology Inc. DS41291F-page 55
PIC16F882/883/884/886/887
3.5.4 RC3/SCK/SCL
Figure 3-14 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a SPI clock
•an I
2C™ clock
FIGURE 3-14: BLOCK DIAGRAM OF RC3
3.5.5 RC4/SDI/SDA
Figure 3-15 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a SPI data I/O
•an I
2C data I/O
FIGURE 3-15: BLOCK DIAGRAM OF RC4
3.5.6 RC5/SDO
Figure 3-16 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a serial data output
FIGURE 3-16: BLOCK DIAGRAM OF RC5
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To SSPSR
SSPEN
0
1
1
0
SCK
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To SSPSR
SSPEN
0
1
1
0
SDI/SDA
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
Port/SDO
0
1
1
0
SDO
Select
PIC16F882/883/884/886/887
DS41291F-page 56 © 2009 Microchip Technology Inc.
3.5.7 RC6/TX/CK
Figure 3-17 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
an asynchronous serial output
a synchronous clock I/O
FIGURE 3-17: BLOCK DIAGRAM OF RC6
3.5.8 RC7/RX/DT
Figure 3-18 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
an asynchronous serial input
a sync hron ou s seri al data I/O
FIGURE 3-18: BLOCK DIAGRAM OF RC7
TABLE 3-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
SPEN
TXEN
CK
TX
SYNC
EUSART
EUSART
0
1
1
0
0
1
1
0
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
SPEN
SYNC
EUSART
0
1
1
0
DT
EUSART RX/DT
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Va lue on
all other
Resets
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu
PSTRCON STRSYNC STRD STRC STRB STRA ---0 0001 ---0 0001
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC.
© 2009 Microchip Technology Inc. DS41291F-page 57
PIC16F882/883/884/886/887
3.6 PORTD and TRISD Registers
PORTD(1) is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISD
(Register 3-12). Setting a TRISD bit (= 1) will make the
corresponding PORTD pin an input (i.e., put the
corr esponding o utput dr iver in a Hi gh-Impeda nce mode).
Clearing a TRISD bit (= 0) will make the corresponding
PORTD pi n an outp ut ( i.e. , enab le th e out put dri ver and
put th e co nte nts of t he ou tp ut l atc h on t h e se le cted pi n) .
Example 3-5 shows how to initialize PORTD.
Reading the PORTD register (Register 3-11) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pin s are read, thi s value is modi fied and the n written
to the PORT data latch.
The TRISD register (Register 3-12 ) contr ols the PORTD
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISD register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-5: INITIALIZI NG PORTD
Note 1: PORTD is available on PIC16F884/887
only.
BANKSEL PORTD ;
CLRF PORTD ;Init PORTD
BANKSEL TRISD ;
MOVLW B‘00001100’ ;Set RD<3:2> as inputs
MOVWF TRISD ;and set RD<7:4,1:0>
;as outputs
REGISTER 3-11: PORTD: PORTD REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RD<7:0>: PORTD General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-12: TRISD: PORTD TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISD<7:0>: PORTD Tri-State Control bit
1 = PORTD pin configured as an input (tri-stated)
0 = PORTD pin configured as an output
PIC16F882/883/884/886/887
DS41291F-page 58 © 2009 Microchip Technology Inc.
3.6.1 RD<4:0>
Figure 3-19 shows the diagram for these pins. These
pins are configured to function as general purpose
I/O’s.
FIGURE 3-19: BLOCK DIAGRAM OF
RD<4:0>
3.6.2 RD5/P1B(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a general purpose I/O
a PWM output
3.6.3 RD6/P1C(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a PWM output
3.6.4 RD7/P1D(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se I/O
a PWM output
FIGURE 3-20: BLOCK DIAGRAM OF
RD<7:5>
TABLE 3-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD
Note: RD<4:0> is available on PIC16F884/887
only.
Note 1: RD5/P1B is available on PIC16F884/887
only. See RB2/AN8/P1B for this f unc tio n
on PIC16F882/883/886.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
WR
PORTD
WR
TRISD
RD
TRISD
RD
PORTD
I/O Pin
Note 1: RD6/P1C is available on PIC16F884/887
only. See RB1/AN10/P1C/C12IN3- for
this functi on on PIC16F 882 /883/886.
Note 1: RD7/P1D is available on PIC16F884/887
only. See RB4/AN11/P1D for this functio n
on PIC16F882/883/886.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
WR
PORTD
WR
TRISD
RD
TRISD
RD
PORTD
CCP1
PSTRCON
0
1
1
0I/O Pin
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Va lue on
all other
Resets
PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx uuuu uuuu
PSTRCON STRSYNC STRD STRC STRB STRA ---0 0001 ---0 0001
TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTD.
© 2009 Microchip Technology Inc. DS41291F-page 59
PIC16F882/883/884/886/887
3.7 PORTE and TRISE Registers
PORTE(1) is a 4-bit wide, bidirectional port. The
corres pond ing d ata direc tion regis ter is TRISE. Se tting a
TRISE bit (= 1) will make the corresponding PORTE pin
an input (i.e., put the corresponding output driver in a
High-Impedance mode). Clearing a TRISE bit (= 0) will
make the corresponding PORTE pin an output (i.e.,
enable the output driver and put the contents of the
output latch on th e s el ected pin). The exception is RE3,
which is input only and its TRIS bit will always read as
1’. Example 3-6 show s how to initia lize PORT E.
Readi ng t he PO R T E register (Reg is ter 3-13) reads th e
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch. RE3 reads ‘0’ when
MCLRE = 1.
The TR IS E r e gist er (R eg ist er 3-1 4 ) c ontr o ls t he P ORTE
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISE register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-6: INITIALIZI NG PORTE
Note 1: RE<2:0> pins are available on
PIC16F884/887 only.
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pi ns configu red as analo g inputs will
read ‘0’.
BANKSEL PORTE ;
CLRF PORTE ;Init PORTE
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O
BCF STATUS,RP1 ;Bank 1
BANKSEL TRISE ;
MOVLW B‘00001100’ ;Set RE<3:2> as inputs
MOVWF TRISE ;and set RE<1:0>
;as outputs
REGISTER 3-13: PORTE: PORTE REGISTER
U-0 U-0 U-0 U-0 R-x R/W-x R/W-x R/W-x
RE3 RE2 RE1 RE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as0
bit 3-0 RD<3:0>: PORTE General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-14: TRISE: PORTE TRI-STATE REGISTER
U-0 U-0 U-0 U-0 R-1(1) R/W-1 R/W-1 R/W-1
TRISE3 TRISE2 TRISE1 TRISE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as0
bit 3-0 TRISE<3:0>: PORTE Tri-State Control bit
1 = PORTE pin configured as an input (tri-stated)
0 = PORTE pin configured as an output
Note 1: TRISE<3> always reads1’.
PIC16F882/883/884/886/887
DS41291F-page 60 © 2009 Microchip Technology Inc.
3.7.1 RE0/AN5(1)
This pin is configurable to function as one of the
following:
a general purpose I/O
an analog input for the ADC
3.7.2 RE1/AN6(1)
This pin is configurable to function as one of the
following:
a general purpose I/O
an analog input for the ADC
3.7.3 RE2/AN7(1)
This pin is configurable to function as one of the
following:
a general purpose I/O
an analog input for the ADC
FIGURE 3-21: BLOCK DIAGRAM OF
RE<2:0>
3.7.4 RE3/MCLR/VPP
Figure 3-22 shows the diagram for this pin. This pin is
configurable to function as one of the following:
a genera l purpo se inp ut
as Master Clear Reset with weak pull-up
FIGURE 3-22: BLOCK DIAGRAM OF RE3
TABLE 3-5: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
Note 1: RE0/AN5 is available on PIC16F884/887
only.
Note 1: RE1/AN6 is available on PIC16F884/887
only.
Note 1: RE2/AN7 is available on PIC16F884/887
only.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTE
WR
PORTE
WR
TRISE
RD
TRISE
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
Input
VSS
Data Bus
RD
PORTE
Reset MCLRE
RD
TRISE VSS
MCLRE
VDD
Weak
MCLRE
Pin
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Value on
all other Resets
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111
PORTE ——— RE3 RE2 RE1 RE0 ---- xxxx ---- uuuu
TRISE ——— TRISE3 TRISE2 TRISE1 TRISE0 ---- 1111 ---- 1111
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTE
© 2009 Microchip Technology Inc. DS41291F-page 61
PIC16F882/883/884/886/887
4.0 OSCILLAT OR M ODULE (WITH
FAIL-SAFE CLOCK MONITOR)
4.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applicati ons while maximizing perfor-
mance and minimizing power consumption. Figure 4-1
illustrates a block diagram of the oscillator module.
Clock sources can be configured from external
oscilla tors, quartz crystal resonators , ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured from one of two
internal oscillators, with a choice of speeds selectable via
softw are . Add itio nal clo ck feat ures inc lud e:
Selectable system clock source between external
or internal via so ftwa re.
Two-Speed Start-up mode, w hich min im iz es
latency between external oscillator start-up and
code execution.
Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
The osc illat or mod ule c an be config ured i n one of eig ht
clock modes.
1. EC – External clock with I/O on OSC2/CLK OUT.
2. LP – 32 kHz Low-Power Crystal mode.
3. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode.
4. HS – High Gain Crystal or Ceramic Resonator
mode.
5. RC – External Resistor-Capacitor (RC) with
FOSC/4 output on OSC2/CLKOUT.
6. RCIO – Exte rnal R es ist or-Capacito r (RC ) with I/
O on OSC2/CLKOUT.
7. INTOSC – Internal oscillator with FOSC/4 output
on OSC2 and I/O on OSC1/CLKIN.
8. INTOSCIO – Internal oscillator with I/O on
OSC1/CLKIN and OSC2/CLKOUT.
Clock Source modes are configured by the FOSC<2:0>
bits in the Configuration Word Register 1 (CONFIG1).
The internal clock can be generated from two internal
oscillators. The HFINTOSC is a calibrated high-
frequenc y osci llator. The LFINT OSC is an unca librate d
low-frequency oscillator.
FIGURE 4-1: SIMPLI FIED P IC® MCU CLOCK SOURCE BLOCK DIAGRAM
(CP U and Peripherals)
OSC1
OSC2
Sleep
External Oscillator
LP, XT, HS, RC, RCIO, EC
System Clock
Postscaler
MUX
MUX
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
250 kHz
IRCF<2:0>
111
110
101
100
011
010
001
000
31 kHz
Power-up Timer (PWRT)
FOSC<2:0>
(Configuration Word Register 1)
SCS<0>
(OSCCON Register)
Internal Oscillator
(OSCCON Register)
Watchdog Timer (WDT)
Fail-Safe Clock Monitor (FSCM)
HFINTOSC
8 MHz
LFINTOSC
31 kHz
INTOSC
PIC16F882/883/884/886/887
DS41291F-page 62 © 2009 Microchip Technology Inc.
4.2 Oscillator Control
The Oscillator Control (OSCCON) register (Figure 4-1)
controls the system clock and frequency selection
options. The OSCCON register contains the following
bits:
Frequency selection bits (IRCF)
Frequency Status bits (HTS, LTS)
System clock control bits (OSTS, SCS)
REGISTER 4-1: OSCCON: OSCILLATOR CONTROL REGISTER
U-0 R/W-1 R/W-1 R/W-0 R-1 R-0 R-0 R/W-0
IRCF2 IRCF1 IRCF0 OSTS(1) HTS LTS SCS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits
111 = 8 MHz
110 = 4 MHz (defaul t)
101 = 2 MHz
100 = 1 MHz
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31 kHz (LFINTOSC)
bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)
1 = Device is running from the c lock defined b y FOSC<2:0> of the CONFIG1 register
0 = Device is r unning f rom the in ternal oscillator (HFINTOSC o r LFI NTOSC)
bit 2 HTS: HFINTOSC Status bit (High Frequency – 8 MHz to 125 kHz)
1 = HFINTOSC is stable
0 = HFINTOSC is not stable
bit 1 LTS: LFINTOSC Stable bit (Low Frequency – 31 kHz)
1 = LFINT OSC is stable
0 = LFINTOSC is not st abl e
bit 0 SCS: System Cl ock Se lect bit
1 = Internal oscillator is used for system clock
0 = Clock source defined by FOSC<2:0> of the CONFIG1 register
Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe
mode is enabled.
© 2009 Microchip Technology Inc. DS41291F-page 63
PIC16F882/883/884/886/887
4.3 Clock Source Modes
Clock Source modes can be classified as external or
internal.
Extern al C lock m odes re ly on exte rnal c ircuitry fo r
the clock source. Examples are: oscillator mod-
ules (EC mode), quartz crystal resonators or
ceramic resonators (LP, XT and HS modes) and
Resistor-Capacitor (RC) mode circuits.
Internal clock sources are contained internally
within the oscil lator module. The oscillator mod ule
has two internal oscillators: the 8 MHz High-
Frequency Internal Oscillator (HFINTOSC) and
the 31 kHz Low-Frequency Internal Oscillator
(LFINTOSC).
The syste m cl oc k can be selected betw ee n ex tern al or
internal clock sources via the System Clock Select
(SCS) bit of the OSCCON register. See Section 4.6
“Clock Switching” for additional information.
4.4 External Clock Modes
4.4.1 OSCILLATOR START-UP TIMER (OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Ti mer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
cryst al res onator o r ce ramic res onator, has st arted an d
is providing a stable system clock to the oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 4-1.
In order to mi nimize laten cy between externa l oscillator
start-up and code execution, the Two-Speed Clock
S tart -up mode can be s elected (see Section 4.7 “T wo-
Speed Clock Start-up Mode”).
TABLE 4-1: OSCILLATOR DELAY EXAMPLES
4.4.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 4-2 shows the pin
connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 4-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Switch From Switch To Frequency Oscillator Delay
Sleep/POR LFINTOSC
HFINTOSC 31 kHz
125 kHz to 8 MHz Oscillator Warm-up Delay (TWARM)
Sleep/POR EC, RC DC – 20 MHz 2 cycles
LFINTOSC (31 kHz) EC, RC DC – 20 MHz 1 cycle of each
Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST)
LFINTOSC (31 kHz) HFINTOSC 125 kHz to 8 MHz 1 μs (approx.)
OSC1/CLKIN
OSC2/CLKOUT(1)
I/O
Clock from
Ext. System PIC® MCU
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview.
PIC16F882/883/884/886/887
DS41291F-page 64 © 2009 Microchip Technology Inc.
4.4.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 a nd OSC2 (Figur e 4-3). The mod e selects a low ,
medium or high gain setting of the internal inverter-
amplifi er to support vari ous resonator typ es and spee d.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier . LP mode current consumption
is the least of the three mo des. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current c onsumption is the medium of the three mo des.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifie r. HS mode current consumption
is the highest of the three modes. This mode is best
suited fo r reso nato rs that require a h igh driv e s ettin g.
Figure 4-3 and Figure 4-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
FIGURE 4-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 4-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MΩ to 10 MΩ).
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary according
to type, package and manufacturer. The
user should consult the manufacturer data
sheet s fo r spec ifica tions and re comm ende d
application.
2: Always veri fy os ci lla tor performance ov er
the VDD and temperature range that is
expected for the application.
3: For oscillator de sign assistance, re ference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 MΩ to 10 MΩ).
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator OSC2/CLKOUT
© 2009 Microchip Technology Inc. DS41291F-page 65
PIC16F882/883/884/886/887
4.4.4 EXTERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 4-5 shows the
external RC mode connections.
FIGURE 4-5: EXTERNAL RC MODES
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes an additional general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resis tor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
threshold voltage variation
component tolerances
packa ging vari ations in c apacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
4.5 Internal Cloc k Modes
The oscillator module has two independent, internal
oscillators that can be configured or selected as the
system clock source.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
8 MHz. The f requenc y o f the HFINTOSC c an b e
user-adjusted via software using the OSCTUNE
register (Register 4-2).
2. The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
The sy stem clock s peed can be selecte d via software
using the Internal Oscillator Frequency Select bits
IRCF<2:0> of the OSCCON register.
The syste m cl oc k can be selected between ext erna l or
inte rnal cloc k sources via the S ystem Clo ck Select ion
(SCS) bit of the OSCCON register. See Section 4.6
“Clock Switching” for more information.
4.5.1 INTOSC AND INTOSCIO MODES
The INTOSC and INTOSCIO modes configure the
internal oscillators as the system clock source when
the devi ce is pr ogrammed using the o scillato r selectio n
or the FOSC<2:0> bits in the Configuration Word
Register 1 (CONFIG1).
In INTOSC mode, OSC1/ CLKIN is av ailable for general
purpose I/O. OSC2/CLKOUT outputs the selected
internal oscillator fre quency divide d by 4. The CLKO UT
signal may be used to provide a clock for external
circuitry, synchronization, calibration, test or other
application requirements.
In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT
are available for general purpose I/O.
4.5.2 HFINTOSC
The Hig h-Frequency Int ernal Oscil lator (HFINT OSC) i s
a factory calibrated 8 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 4-2).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 4-1). One of seven
frequencies can be selected via software using the
IRCF<2:0> bits of the OSCCON register. See
Section 4.5.4 “Frequency Select Bits (IRCF)” for
more information.
The HFINTOSC is enabled by selecting any frequency
betwee n 8 MHz and 125 kHz b y set ting th e IRCF <2:0>
bits of the OSCCON register 000. Then, set the
System Clock Source (SCS) bit of the OSCCON
register to ‘1 or en abl e Two-Spee d Start-up by se ttin g
the IESO bit in the Configuration Word Register 1
(CONFIG1) to 1’.
The HF Internal Oscillator (HTS) bit of the OSCCON
register indicates whether the HFINTOSC is stable or not.
OSC2/CLKOUT(1)
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 o r
Internal
Clock
VDD
VSS
Recommended values: 10 kΩ REXT 100 kΩ, <3V
3 kΩ REXT 100 kΩ, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview”.
2: Output depend s upon RC or RCIO Clock
mode.
I/O(2)
PIC16F882/883/884/886/887
DS41291F-page 66 © 2009 Microchip Technology Inc.
4.5.2.1 OSCTUNE Register
The HFINTOSC is factory calibrated but can be
adjusted in software by writing to the OSCTUNE
register (Register 4-2).
The default value of the OSCTUNE register is ‘0’. The
value is a 5-bit two’s complement number.
When the OSCTUNE register is modified, the
HFINTOSC frequency will begin shifting to the new
frequency. Code execution continues during this shift.
There is no indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and p eripherals, are not affected by the
change in frequency.
REGISTER 4-2: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4-0 TUN<4:0>: Frequency Tuning bits
01111 = Maximu m frequency
01110 =
00001 =
00000 = Oscillator module is running at the factory-calibrated frequency.
11111 =
10000 = Minimum fre quency
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4.5.3 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a postscaler
and multiplexer (see Figure 4-1). Select 31 kHz, via
software, using the IRCF<2:0> bits of the OSCCON
register. See Section 4.5.4 “Frequency Select Bits
(IRCF)” for more inform ation. The LFINTOSC is also the
frequency for the Power-up Timer (PWRT), Watchdog
Timer (WDT) and Fail-Safe Clock Mo nitor (FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<2:0> bit s of the OSCCON regis ter = 000) as the
system clock source (SCS bit of the OSCCON
register = 1), or when any of the follo wing ar e enable d:
Two-Speed St a rt-up IESO bi t of the C on fig urati on
Word Register 1 = 1 and IRCF<2:0> bit s of th e
OSCCON regis ter = 000
Power-up Timer (PWRT)
Watchdog Timer (WDT)
Fail-Safe Clock Monitor (FSCM)
The LF Internal Oscillator (LTS) bit of the OSCCON
register indicates whether the LFINTOSC is stable or
not.
4.5.4 FREQUENCY SELECT BITS (IRCF)
The output of the 8 MHz HFINTOSC and 31 kHz
LFINTOSC connects to a postscaler and multiplexer
(see Figure 4-1). The Internal Oscillator Frequency
Select bits IRCF<2:0> of the OSCCON register select
the frequency output of the internal oscillators. One of
eight frequencies can be selected via software:
•8 MHz
4 MHz (Default after Reset)
•2 MHz
•1 MHz
500 kHz
250 kHz
125 kHz
31 kHz (LFINTOSC)
4.5.5 HFINTOSC AND LFINTOSC CLOCK
SWITCH TIMING
When switching between the LFINTOSC and the
HFINTOSC, the new oscillator may already be shut
down to save power (see Figure 4-6). If th is is the cas e,
there is a delay after the IRCF<2:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The LTS and HTS bits of the
OSCCON register will reflect the current active status
of the LFINTOSC and HFINTOSC oscillators. The
timing of a frequency selection is as follows:
1. IRCF<2:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Cl ock switch ci rcuitry waits for a fal ling edge of
the cu rrent clock.
4. CLKOUT is held low and the clock switch
circuit ry w ai t s for a rising edg e in the new clock.
5. CLKOUT is now connected with the new clock.
LT S and HTS bits of th e OSCCON registe r are
updated as require d.
6. Clock switch is complete.
See Figure 4-1 for more details.
If the internal oscillator speed selected is between
8 MHz and 125 kHz, there is no start-up delay before
the new frequency is selected. This is because the old
and new frequencies are derived from the HFINTOSC
via the post s ca ler and multiplexer.
Start-up delay specifications are located in the
oscillator tables of Section 17.0 “Electrical
Specifications”.
Note: Following any Reset, the IRC F<2:0> bits of
the OSCCON register are set to110’ and
the frequency selection is set to 4 MHz.
The user can modify the IRCF bits to
select a different frequency.
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FIGURE 4-6: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC
LFINTOSC
IRCF <2:0>
System Clock
HFINTOSC
LFINTOSC
IRCF <2:0>
System Clock
0= 0
0= 0
Start-up Time 2-cycle Sync Running
2-cycle Sync Running
HFINTOSC LFINTOSC (FSCM and WDT disabled)
HFINTOSC LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC
IRCF <2:0>
System Clock
= 0¼ 0
Start-up Time 2-cycle Sync Running
LFINTOSC HFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled
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4.6 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bit of the OSCCON
register.
4.6.1 SYSTEM CLOCK SELECT (SCS) BIT
The System Clock Select (SCS) bit of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
Whe n the SCS bit of the OSCCON register = 0,
the system clock source is determined by
configuration of the FOSC<2:0> bits in the
Conf igur ation Word Register 1 (CONFIG1).
Whe n the SCS bit of the OSCCON register = 1,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<2:0>
bits of the OSCCON register. After a Reset, the
SCS bit of the OSCCON register is always
cleared.
4.6.2 OSCIL LAT OR START-UP TIME-OU T
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCCON register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<2:0> bits in the Configuration
Word Regis te r 1 (CONFI G1 ), or from the inte rna l cl oc k
source. In particular , OSTS indicates that the Oscillator
Start-up Timer (OST) has timed out for LP, XT or HS
modes.
4.7 Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device.
This mode allows the application to wake-up from
Sleep, perform a few instructions using the INTOSC
as the clock source and go back to Sleep without
waiting for the primary oscillator to become stable.
When the oscillat or module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) is
enabled (see Section 4.4.1 “Oscillator Start-up Timer
(OST)). The OST will suspend program execution until
1024 oscillations are counted. Two-Speed Start-up
mode minimizes the delay in code execution by
operating from the internal oscillator as the OST is
counting. When the OST count reaches 1024 and the
OSTS bit of the OSCCON register is set, program
executi on switches to the external oscillator.
4.7.1 TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
IESO (of the Configuration Word Register 1) = 1;
Internal/ E xte rnal Switc hov er b it (Two-Speed St a rt-
up mode enabled).
SCS (of the OSCCON register) = 0.
FOSC<2:0> bits in the Configuration Word
Register 1 (CONFIG1) configured for LP, XT or
HS mode.
Two-Speed Start-up mode is entered after:
Pow er-on Reset (POR) and, if enabl ed, after
Power-up Ti mer (PWRT) has expired, or
Wake-up from Sleep.
If the external clock oscillator is configured to be
anything other than LP, XT or HS mode, then Two-
speed S tart-up is disabled. This is because the external
clock oscillator does not require any stabilization time
after POR or an ex it from Sleep.
4.7.2 TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<2:0>
bits of th e O SCCON re giste r.
3. OST enabled to count 1024 clock cycles.
4. OST timed out, wait for falling edge of the
internal oscillator.
5. OSTS is set.
6. System c lock he ld low until the next fal ling edg e
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
Note: Any automatic clock switch, which may
occur from Two-S peed Start-up or Fail-Safe
Clock Monito r , does not update the SCS bit
of the OSCCON register. The user can
monitor the OSTS bit of the OSCCON
register to determine the current system
clock sour ce.
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCCON register to
remain clear.
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4.7.3 CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCCON
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Word Register 1
(CONFIG1), or the internal oscillator.
FIGURE 4-7: TWO-SPEED START-UP
0 1 1022 1023
PC + 1
TOSTT
HFINTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N PC
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4.8 Fail-Safe Clock Monitor
The Fail-Saf e Cl oc k Mo nit or (FSC M) al lows the dev ic e
to continue operat ing should th e external os ci ll ator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Config uration W ord Reg ister 1 (C ONFIG1). The F SCM
is applicable to all external Oscillator modes (LP, XT,
HS, EC, RC and RCIO).
FIGURE 4-8: FSCM BLOCK DIAGRAM
4.8.1 FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
compari ng the extern al osci llat or to the FSCM sa mple
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 4-8. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock cle ars the latch on each ris ing edge of th e
sample c loc k. A fail ure is d ete cte d w h en an entire half-
cycle of the sample clock elapses before the primary
clock goes low.
4.8.2 FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
devi ce clock to an interna l clock s ource and s ets the b it
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<2:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
4.8.3 FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or toggling the SCS bit
of the OSCCON register. Wh e n th e SC S b i t i s t o g gl ed ,
the OST is restarted. While the OST is running, the
device co ntinue s to op erate fro m the I NT OSC sele cted
in OSCCON. When the OST times out, the Fail-Safe
condition is cleared and the device will be operating
from the ex ternal cl ock s ource. The Fai l-Saf e condi tion
must be c le ared bef ore th e O SFIF flag can be cle are d.
4.8.4 RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled . Therefore, the device will alway s be executing
code while the OST is operating.
External
LFINTOSC ÷ 64
S
R
Q
31 kHz
(~32 μs) 488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
OSTS bit of the OSCCON register to verify
the oscillator start-up and that the system
clock switchover has successfully
completed.
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FIGURE 4-9: FSCM TIMING DIAGRAM
TABLE 4-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The syste m clock is normally at a m uch higher frequency than the sam ple clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Test Test Test
Clock Monitor Output
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets(1)
CONFIG1(2) CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
OSCCON IRCF2 IRCF1 IRCF0 OSTS HTS LTS SCS -110 x000 -110 x000
OSCTUNE TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 0000 00-0
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF 0000 00-0 0000 00-0
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by oscillators.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: See Configuration Word Register 1 (Register 14-1) for operation of all register bits.
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5.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
8-bit timer/counter register (TMR0)
8-bit prescaler (shared with Watchdog Timer)
Programmable internal or external clock source
Programmable external clock edge selection
Interrupt on over flow
Figure 5-1 is a block diagram of the Timer0 module.
5.1 Timer0 Operation
When use d as a tim er, the T imer0 modul e can be used
as either an 8-bit timer or an 8-bit counter.
5.1.1 8-BIT TIMER MODE
When used as a timer, the Timer0 module will
increment every instruction cycle (without prescaler).
Timer mode is selected by clearing the T0CS bit of the
OPTION register to ‘0’.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
5.1.2 8-BIT COUNTER MODE
When used as a counter, the Timer0 module will
increment on every rising or falling edge of the T0CKI
pin. The incrementing edge is determined by the T0SE
bit of the OPTION register . Counter mode is selected by
setting the T0CS bit of the OPTION register to ‘1’.
FIGURE 5-1: TIMER0/WDT PRESCALER BLOCK DIAGRAM
Note: The value writ ten to the T MR0 register can
be adju sted, in o rder to ac count for th e two
instruction cycle delay when TMR0 is
written.
T0CKI
T0SE
pin
TMR0
Watchdog
Timer
WDT
Time-out
PS<2:0>
WDTE
Data Bus
Set Flag bi t T0 IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
2: SWDTEN and WDTPS<3:0> are bits in the WDTCON register.
3: WDTE bit is in the Configuration Word Register1.
0
1
0
1
0
1
8
8
8-bit
Prescaler
0
1
FOSC/4
PSA
PSA
PSA
16-bit
Prescaler 16
WDTPS<3:0>
31 kHz
INTOSC
SWDTEN
Sync
2 Tcy
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5.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignme nt is contro lled by the PSA bit o f the OPTION
register. To assign the p res caler to T im er 0, th e PSA b it
must be cleared to a0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
select able via th e PS<2:0> bits of the OPTION registe r .
In order to have a 1:1 prescaler value for the Timer0
module, the prescaler must be assigned to the WDT
module.
The prescaler is not readable or writable. When
assigned to the T im er0 module, all instructions writing to
the TMR0 register will clear the prescaler.
When the prescaler is assigned to WDT, a CLRWDT
instruction will clear the prescaler along with the WDT.
5.1.3.1 Switching Prescaler Between
Timer0 and WDT Modules
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values . When chan gin g th e presca le r ass ig nme nt fro m
Timer0 to the WDT module, the instruction sequence
shown in Example 5-1, must be executed.
EXAMPLE 5-1: CHANGING PRESCALER
(TIMER0 WDT)
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be execute d (see Example 5-2).
EXAMPLE 5-2: CHANGING PRESCA LER
(WDT TIMER0)
5.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit must be
cleared in software. The Timer0 interrupt enable is the
T0IE bit of the INTCON register.
5.1.5 USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer 0 is in Coun ter mode, t he synchronizatio n
of the T0CKI input and the Timer0 register is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, the
high and low peri od s of the ex tern al cl oc k so urc e mus t
meet the timing requirements as shown in the
Section 17.0 “Electrical Specifications”.
BANKSEL TMR0 ;
CLRWDT ;Clear WDT
CLRF TMR0 ;Clear TMR0 and
;prescaler
BANKSEL OPTION_REG ;
BSF OPTION_REG,PSA ;Select WDT
CLRWDT ;
;
MOVLW b’11111000’ ;Mask prescaler
ANDWF OPTION_REG,W ;bits
IORLW b’00000101’ ;Set WDT prescaler
MOVWF OPTION_REG ;to 1:32
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
CLRWDT ;Clear WDT and
;prescaler
BANKSEL OPTION_REG ;
MOVLW b’11110000’ ;Mask TMR0 select and
ANDWF OPTION_REG,W ;prescaler bits
IORLW b’00000011’ ;Set prescale to 1:16
MOVWF OPTION_REG ;
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TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 5-1: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: TMR0 Cloc k Sourc e Sele ct bit
1 = Transit ion on T0CKI pin
0 = Internal instruction cycle clo ck (FOSC/4)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assig nme nt bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
Note 1: A dedicated 16-bit WDT postscaler is available. See Section 14.5 “Watchdog Timer (WDT)” for more
information.
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TMR 0 RA TE WDT RATE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
Legend: – = Un im pl em ente d l oc ati ons, read as ‘ 0’, u = unc ha nge d, x = unknown. Shad ed ce lls are not used by the
Timer0 module .
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6.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
16-bi t timer/c ounter reg ister pai r (TMR1 H:TMR1 L)
Programmable internal or external clock source
3-bit prescaler
Optional LP oscillator
Synchronous or asynchronous operation
Timer1 gate (count enable) via comparator or
T1G pin
Interrupt on over flow
Wak e-up on ov erfl ow (external clock,
Asynchronous mode only)
Time base for the Capture/Compare function
Special Event Trigger (with ECCP)
Comparator output synchronization to Timer1
clock
Figure 6-1 is a block diagram of the Timer1 module.
6.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is acces sed through the TMR 1H:TMR1L reg ister
pair. Writes to TMR1H or TMR1L directly update the
counter.
When us ed with an interna l clock so urce, the module i s
a time r. When us ed wit h an ex terna l clock sourc e, the
module can be used as either a timer or counter.
6.2 Clock Source Selection
The TMR1CS bit of the T1CON register is used to select
the clock source. When TMR1CS = 0, the clock source
is FOSC/4. When TMR1CS = 1, the clock source is
supplied exte rnally.
FIGURE 6-1: TIMER1 BLOCK DIAGRAM
Clock Source TMR1CS
FOSC/4 0
T1CKI pin 1
Note 1: ST Buffer is low power type when using LP osc, or high speed type when using T1CKI.
2: Timer1 register increm ents on rising edge.
3: Synchronize does not operate while in Sleep.
4: SYNCC2OUT is synchronized when the C2SYNC bit of the CM2CON1 register is set.
TMR1H TMR1L
Oscillator T1SYNC
T1CKPS<1:0>
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
1
0
0
1
Synchronized
clock input
2
Set flag bit
TMR1IF on
Overflow TMR1(2)
TMR1GE
TMR1ON
T1OSCEN
1
0
SYNCC2OUT(4)
T1GSS
T1GINV
To C2 Comparator Module
Timer1 Clock
TMR1CS
T1OSI
T1OSO/T1CKI (1)
EN
INTOSC
Without CLKOUT
Synchronize(3)
det
T1G
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6.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
6.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may wo rk as a timer or a cou nter.
When counting, Timer1 is incremented on the rising
edge of the external clock input T1CKI. In addition, the
Counter mode clock can be synchronized to the
microcontroller system clock or run async hronously.
If an external clock oscillator is needed (and the
microc ontroller is using the INT OSC withou t CLKOUT),
Timer1 can use the LP oscillator as a clock source.
In Counter mode, a falling edge must be registered by
the counter prior to the first incrementing rising edge
after one or more of the following conditions (see
Figure 6-2):
Timer1 is enabled after POR or BOR Reset
A write to TMR1H or TMR1L
T1CKI is high when Timer1 is disabled and when
Timer1 is reenabled T1CKI is low.
6.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however , the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
6.4 Timer1 Oscillator
A low-power 32.768 kHz oscillator is built-in between
pins T1OSI (input) and T1OSO (amplifier output). The
oscillator is enabled by setting the T1OSCEN control
bit of th e T1CON register. The oscil lator wi ll contin ue to
run during Sleep.
The Timer1 oscillator is identical to the LP oscillator.
The user m us t prov id e a so ftware tim e de lay to en su re
proper oscillator start-up.
TRISC0 and TRISC1 bits are set when the Timer1
oscill ator is enable d. RC0 an d RC 1 bit s read as ‘0’ an d
TRISC0 and TRISC 1 bits read as ‘1’.
6.5 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
continues to increment asynchronous to the internal
phase clocks. The timer will continue to run during
Sleep and can generate an interrupt on overflow,
which will wake-up the processor. However, special
precautions in software are needed to read/write the
timer (see Section 6.5.1 “Reading and Writing
Timer1 in Asynchronous Counter Mode”).
6.5.1 READING AND WRITING T IMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an e xternal asyn chronous cl ock will ens ure a valid
read (taken care of in hardware). However, the user
should keep i n mind that rea ding t he 16-bi t time r in tw o
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
For writes , it is re commend ed that th e user s imply sto p
the timer and write the desired values. A write
conte ntion may occ ur by w ritin g to th e timer regist ers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TTMR1L register
pair.
6.6 Timer1 Gate
Timer1 gate source is software configurable to be the
T1G pin or the output of Comparator C2. This allows the
device to directly time external events using T1G or
analog events using Comparator C2. See the
CM2CON1 register (Register 8-3) for selecting the
Timer1 gate source. This feature can simplify the
software for a Delta-Sigma A/D converter and many
other applications. For more informatio n on Delt a-Sigma
A/D converters, see the Microchip web site
(www.microchip.com).
Timer1 gate can be inverted using the T1GINV bit of
the T1CON register, whether it orig inates from the T1G
pin or Comparato r C2 output. T his configures T imer1 to
measure either the active-high or active-low time
between events.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce a single spurious
increment.
Note: TMR1GE bit of the T1CON register must be
set to use the Timer1 gate.
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6.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Ti mer1 in terrupt fl ag bit of th e PIR1 regis ter is
set. To enable the interrupt on rollover, you must set
these bits:
Timer1 interrupt enable bit of the PIE1 register
PEIE bit of the INTCON register
GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
6.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynch ronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
TMR1ON bit of the T1CON register must be set
TMR1IE bit of the PIE1 register must be set
PEIE bit of the INTCON register must be set
The device will wake-up on an overflow and execute
the next instruction. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine (0004h).
6.9 ECCP Capture/Compare Time Base
The ECCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPRxH:CCPRxL
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPRxH:CCPRxL register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
See Section 11.0 “Capture/Compare/PWM Modules
(CCP1 and CCP2)” for more information.
6.10 ECCP Special Event Trigger
If an ECCP is confi gure d to trigg er a spe ci al ev ent , the
trigger will clear the TMR1H:TMR1L register pair. This
special event does not cause a Timer1 interrupt. The
ECCP module may still be configured to generate a
ECCP interrupt.
In this mode of operation, the CCPRxH:CCPRxL
register pair ef fe cti ve ly b ec ome s the period regi ste r for
Timer1.
Timer1 should be synchronized to the FOSC to utilize
the Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the eve nt that a wri te to TMR1H or TMR1L coi ncides
with a Special Event Trigger from the ECCP, the write
will take precedence.
For more information, see Section 11.0 “Capture/
Compare/PWM Modules (CCP1 and CCP2)”.
6.11 Comparator Synchronization
The same cloc k used to increment Timer1 can also be
used to synchronize the comparator output. This
feature is enabled in the Comparator module.
When using the comparator for Timer1 gate, the
comparator output should be synchronized to Timer1.
This ensures Timer1 does not miss an increment if the
comp ara tor changes.
For more information, see Section 8.0 “Comparator
Module”.
FIGURE 6-2: TIMER1 INCREMENTING EDGE
Note: The T MR1H:TTMR1L register p air and th e
TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be re gistered by the counter prior to t he first incrementing rising edge of
the clock.
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6.12 Timer1 Control Register
The Timer1 Control register (T1CON), shown in
Register 6-1, is used to control Timer1 and select the
various features of the Timer1 module.
REGISTER 6-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 T1GINV: Timer1 Gate Invert bit(1)
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 6 TMR1GE: Timer1 Gate Enable bit(2)
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 Gate function
0 = Timer1 is always counting
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale Value
10 = 1:4 Prescale Value
01 = 1:2 Prescale Value
00 = 1:1 Prescale Value
bit 3 T1OSCEN: LP Oscillator Enable Contro l bit
1 = LP oscillator is enabled for Timer1 clock
0 = LP oscillator is off
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1:
1 = Do not synchroniz e exte rnal cloc k inp ut
0 = Synchronize external clock input
TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock
bit 1 TMR1CS: Timer1 Clock Sourc e Sele ct bit
1 = External clock from T1CKI pin (on the rising edge)
0 = Internal clock (FOSC/4)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source.
2: TMR1GE b it must be set to us e eithe r T1G pin or C2OUT, as se lecte d by t he T1G SS bit o f the CM 2CON 1
register, as a Timer1 gate source.
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TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL T1GSS C2SYNC 0000 --10 0000 --10
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
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7.0 TIMER2 MODULE
The Timer2 module is an eight-bit timer with the
following features:
8-bit timer register (TMR2)
8-bit period register (PR2)
Interrupt on TMR2 match with PR2
Software programmable prescaler (1:1, 1:4, 1:16)
Software programmable postscaler (1:1 to 1:16)
See Figure 7-1 for a block diagram of Timer2.
7.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4). The clock is fed into the
Timer2 prescaler, which has prescale options of 1:1,
1:4 or 1:16. The output of the prescal er is the n use d to
increm ent the TM R2 regis ter.
The val ues of T MR2 and PR2 are co nstan tly com pared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, two things happen:
TMR2 is reset to 00h on the next increment cycle
The Timer2 postscaler is incremented
The match output of the Timer2/PR2 comparator is
then fed into th e T i mer2 post sca ler. The post s caler has
post scal e options of 1:1 to 1: 16 inclus ive. The output of
the Timer2 postscaler is used to set the TMR2IF
interrupt flag bit in the PIR1 register.
The TMR2 and PR2 registers are both fully readable
and w rita ble. O n any Rese t, the TMR2 regis ter is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Tim er2 is turned off by clearing
the TMR2ON bit to a ‘0’.
The Timer2 presc ale r is contro lle d by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
controlled by the TOUTPS bits in the T2CON register.
The prescaler and postscaler counters are cleared
when:
A write to TMR2 occurs.
A write to T2CON occurs.
Any device Reset occurs (Power-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
FIGURE 7-1: TIMER2 BLOCK DIAGRAM
Note: TMR2 is not cleared when T2CON is
written.
Comparator
TMR2 Sets Flag
TMR2
Output
Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
TOUTPS<3:0>
T2CKPS<1:0>
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TABLE 7-1: SUMMARY OF ASSOCIATED TIMER2 REGISTERS
REGISTER 7-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0
bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 = 1:1 Pos tscaler
0001 = 1:2 Pos tscaler
0010 = 1:3 Pos tscaler
0011 = 1:4 Pos tscaler
0100 = 1:5 Pos tscaler
0101 = 1:6 Pos tscaler
0110 = 1:7 Pos tscaler
0111 = 1:8 Pos tscaler
1000 = 1:9 Pos tscaler
1001 = 1:10 Postscaler
1010 = 1:11 Postscaler
1011 = 1:12 Postscaler
1100 = 1:13 Postscaler
1101 = 1:14 Postscaler
1110 = 1:15 Postscaler
1111 = 1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
1x = Prescaler is 16
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
PR2 Timer2 Module Period Register 1111 1111 1111 1111
TMR2 Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000
T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
Legend: x = unknown, u = unchanged, = unimplemented read as 0’. Shaded cells are not used for Timer2 module.
© 2009 Microchip Technology Inc. DS41291F-page 83
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8.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
The comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of the program execution. The analog
comparator module includes the following features:
Independent comparator control
Programmable input selection
Comp arator ou tput is avail able internall y/externally
Programmable output polarity
Interrupt-on-change
Wake-up from Sleep
•PWM shutdown
Time r1 gate (co unt enable)
Output synchronization to Timer1 clock input
•SR Latch
Programmable and fixed volt age reference
8.1 Comparator Overview
A single comparator is shown in Figure 8-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of th e comp arator is a digita l high leve l.
FIGURE 8-1: SINGLE COMPARATOR
Note: Only Comparator C2 can be linked to
Timer1.
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
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FIGURE 8-2: COMPARATOR C1 SIMPLIFIED BLOCK DIAGRAM
FIGURE 8-3: COMPARATOR C2 SIMPLIFIED BLOCK DIAGRAM
Note 1: When C1ON = 0, the C1 comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
C1POL
C1OUT
To PWM Logic
RD_CM1CON0
Set C1IF
To
DQ
EN
Q1 Data Bus
C1POL
DQ
EN
CL
Q3*RD_CM1CON0
Reset
C1OUT (to SR Latch)
MUX
C1
0
1
2
3
C1ON(1)
C1CH<1:0> 2
0
1
C1R
MUX
C1VIN-
C1VIN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1IN+ +
-
0
1
MUX
CVREF
C1RSEL
FixedRef
C1VREF
MUX C2
C2POL
C2OUT
0
1
2
3
C2ON(1)
C2CH<1:0> 2
0
1
C2R
From Timer1
Clock
Note 1: When C2ON = 0, the C2 comparator will produce a ‘0 output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
MUX
DQ
EN
DQ
EN
CL
DQ
RD_CM2CON0
Q3*RD_CM2CON0
Q1
Set C 2 IF
To
Reset
C2VIN-
C2VIN+
SYNCC2OUT
C2IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
0
1
C2SYNC
C2POL Data Bus
MUX To Timer1 Gate, SR Latch,
0
1
MUX
CVREF
C2RSEL
FixedRef
C2VREF
PWM Logic, and other
peripherals
© 2009 Microchip Technology Inc. DS41291F-page 85
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8.2 Comparator Control
Each comparator has a separate control and
Configuration register: CM1CON0 for Comparator C1
and CM2CON0 for Comparator C2. In addition,
Comparator C2 has a second control register,
CM2CON1, for controlling the interaction with Timer1 and
simultaneous reading of both comparator outputs.
The CM1CON0 and CM2CON0 registers (see Registers
8-1 and 8-2, respectively) contain the control and Status
bits for the followi ng:
Enable
Input selection
Reference selection
•Output selection
Outp ut pol arit y
8.2.1 COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
8.2.2 COMPARATOR INPUT SELECTION
The CxCH<1:0> bits of the CMxCON0 register direct
one of four analog input pins to the comparator
inverting input.
8.2.3 COMPARATOR REFERENCE
SELECTION
Setting the CxR bit of the CMxCON0 register directs an
internal voltage reference or an analog input pin to the
non-inverting input of the comparator. See
Section 8.10 “Comparator Voltage Reference” for
more information on the internal voltage reference
module.
8.2.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CM2CON1 register. In order
to make the output available for an external connection,
the following conditions must be true:
CxOE bit of the CMxCON0 register must be set
Corresponding TRIS bit must be cleared
CxON bit of the CMxCON0 register must be set
8.2.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit result s in a non-inverted output.
Table 8-1 shows the output state versus input
conditions, including polarity control.
8.3 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new refe rence volta ge. This period is refer red to as
the response time. The response time of the
comparator differs from the settling time of the voltage
reference. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See the Comparator and
Voltage Reference specifications in Section 17.0
“Electrical Specifications” for more details.
Note: To use CxIN+ and CxIN- pins as analog
inputs, the appropriate bits must be set in
the ANSEL an d ANSELH registers and the
corresponding TRIS bits must also be set
to disable the output drivers.
Note 1: The CxOE bit overrides the PORT data
latch. Setting the CxON has no impact on
the port overrid e.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
TABLE 8-1: COMPARATOR OUTPUT
STATE VS. IN PUT
CONDITIONS
Input Condition CxPOL CxOUT
CxVIN- > CxVIN+00
CxVIN- < CxVIN+01
CxVIN- > CxVIN+11
CxVIN- < CxVIN+10
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8.4 Comparator Interrupt Operation
The comparator interrupt flag can be set whenever
there is a chang e in the o utput val ue of the compa rator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusive-
or gate (see Figures 8-2 and 8-3). One latch is updated
with the compa rator o utp ut leve l when th e CMxCON 0
register is read. This latch retains the value until the
next read of the CMxCON0 register or the occurrence
of a Reset. The other latch of the mismatch circuit is
updated on every Q1 system clock. A mismatch
condition will occur when a comparator output change
is clocked through the second latch on the Q1 clock
cycle. At this point the two mismatch latches have
opposite output levels which is detected by the
exclusive-or gate and fed to the interrupt circuitry. The
mismatch condition persists until either the CMxCON0
register is read or the comparator output returns to the
previous state.
The comparator interrupt is set by the mismatch edge
and not the mismatch level. This means that the inter-
rupt flag can be reset without the additional step of
reading or writing the CMxCON0 register to clear the
mismatch registers. When the mismatch registers are
cleared, an interrupt will oc cur upon the comparator ’s
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMxCON0 register , or CM2CON1 register, to determine
the actual change that has occ urred.
The CxIF bit of the PIR2 register is the comparator
interrupt flag. This bit must be reset in software by
clearing it to0’. Since i t i s also po ssib le t o writ e a ‘1’ to
this register, an interrupt can be generated.
The CxIE bi t of the PIE2 re gister and the PEIE and G IE
bits of the INTCON register must all be set to enable
comparator interrupts. If any of these bits are cleared,
the interru pt is not en abled, alt hough the Cx IF bit of the
PIR2 register will still be set if an interrupt condition
occurs.
FIGURE 8-4: COMPARATOR
INTERRUPT TIMING W/O
CMxCON0 READ
FIGURE 8-5: COMPARATOR
INTERRUPT TIMING WITH
CMxCON0 READ
Note 1: A write operation to the CMxCON0
register will also clear the mismatch
condition because all writes include a read
operation at the beginning of the write
cycle.
2: Comparator interrupts will operate correctly
regardless of the state of CxOE. Note 1: If a change in the CMxCON0 register
(CxOUT) s hould occu r when a read op er-
ation is being executed (start of the Q2
cycle), then the CxIF of the PIR2 register
interrupt flag may not get set.
2: When either comparator is first enabled,
bias circuitry in the comparator module
may cause an invalid output from the
comparator until the bias circuitry is stable.
Allow about 1 μs for bias settling then clear
the mismatch condition and interrupt flags
before enabling comparator interrupts.
Q1
Q3
CIN+
CxOUT
Set CxIF (level)
CxIF
TRT
reset by software
Q1
Q3
CxIN+
CxOUT
Set CxIF (level)
CxIF
TRT
reset by software
cleared by CMxCON0 read
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8.5 Operation During Sleep
The compa rator , if enabled b efore entering Sleep mode,
remains active during Sleep. The additional current
consumed by the comp arator is show n separately in the
Section 17.0 “Electrical Specifications”. If the
comparator is not used to wake the device, power
consumption can be minimized while in Sleep mode by
turning off the comp arator. Each comparator is turned of f
by clearing the CxON bit of the CMxC ON0 register.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the devic e from Sle ep, the CxIE bit of the PIE2 reg ister
and the PEIE bit of the INTCON register must be set.
The instruction following the Sleep instruction always
executes following a wake from Sleep. If the GIE bit of
the INTCON register is also set, the device will then
execute the Interrupt Service Routine.
8.6 Effects of a Reset
A device Reset forces the CMxCON0 and CM2CON1
registers to their Reset states. This forces both
comparators and the voltage references to their Off
states.
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REGISTER 8-1: CM1CON0: COMPARATOR C1 CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
C1ON C1OUT C1OE C1POL C1R C1CH1 C1CH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 C1ON: Comparator C1 Enable bit
1 = Comparator C1 is enabled
0 = Comparator C1 is disabled
bit 6 C1OUT: Comparator C1 Output bit
If C1POL = 1 (inverted polarity):
C1OUT = 0 when C1VIN+ > C1VIN-
C1OUT = 1 when C1VIN+ < C1VIN-
If C1POL = 0 (non-inverted polarity):
C1OUT = 1 when C1VIN+ > C1VIN-
C1OUT = 0 when C1VIN+ < C1VIN-
bit 5 C1OE: Comparator C1 Output Enable bit
1 = C1OUT is present on the C1OUT pin(1)
0 = C1OUT is internal only
bit 4 C1POL: Comparator C1 Output Polarity Select bit
1 = C1OUT logic is inverted
0 = C1OUT logic is not inverted
bit 3 Unimplemented: Read as ‘0
bit 2 C1R: Comparator C1 Refere nce Select bit (non-inverting input)
1 = C1VIN+ connects to C1VREF output
0 = C1VIN+ connects to C1IN+ pin
bit 1-0 C1CH<1:0>: Comparator C1 Channel Select bit
00 = C12IN0- pin of C1 connects to C1VIN-
01 = C12IN1- pin of C1 connects to C1VIN-
10 = C12IN2- pin of C1 connects to C1VIN-
11 = C12IN3- pin of C1 connects to C1VIN-
Note 1: Comparator output requires the following three conditions: C1OE = 1, C1ON = 1 and corresponding port
TRIS bit = 0.
© 2009 Microchip Technology Inc. DS41291F-page 89
PIC16F882/883/884/886/887
REGISTER 8-2: CM2CON0: COMPARATOR C2 CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
C2ON C2OUT C2OE C2POL C2R C2CH1 C2CH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 C2ON: Comparator C2 Enable bit
1 = Compar ator C2 is enab led
0 = Comparator C2 is disabled
bit 6 C2OUT: Comparator C2 Output bit
If C2POL = 1 (inverted polarity):
C2OUT = 0 when C2VIN+ > C2VIN-
C2OUT = 1 when C2VIN+ < C2VIN-
If C2POL = 0 (non-inverted polarity):
C2OUT = 1 when C2VIN+ > C2VIN-
C2OUT = 0 when C2VIN+ < C2VIN-
bit 5 C2OE: Comparator C2 Output Enable bit
1 = C2OUT is present on C2OUT pin(1)
0 = C2OUT is internal only
bit 4 C2POL: Comparator C2 Output Polarity Select bit
1 = C2OUT logic is inverted
0 = C2OUT logic is not inverted
bit 3 Unimplemented: Read as ‘0
bit 2 C2R: Comparator C2 Reference Select bits (non-inverting input)
1 = C2VIN+ connects to C2VREF
0 = C2VIN+ connects to C2IN+ pin
bit 1-0 C2CH<1:0>: Comparator C2 Channel Select bits
00 = C12IN0- pin of C2 connects to C2VIN-
01 = C12IN1- pin of C2 connects to C2VIN-
10 = C12IN2- pin of C2 connects to C2VIN-
11 = C12IN3- pin of C2 connects to C2VIN-
Note 1: Comparator output requires the following three conditions: C2OE = 1, C2ON = 1 and corresponding port
TRIS bit = 0.
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8.7 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 8-6. Since the analog i nput pins share thei r con-
nection with a digital input, they have reverse biased
ESD protection diodes to VDD and VSS. The analog
input, therefore, must be between VSS and VDD. If the
input voltage deviates from this range by more than
0.6V in either direction, one of the diodes is forward
biased and a latch-up may occur.
A maximum source impedance of 10 kΩ is recommended
for the analog sources. Also, any external component
connected to an anal og inpu t pin, such as a capacitor or
a Zener diode, should h ave very little leakage curr ent to
minimize inaccuracies introduced.
FIGURE 8-6: ANALOG INPUT MODEL
Note 1: When reading a PORT register, all pins
configu red a s anal og inp uts will read as a
0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digit al input, may ca use the input buff er to
consume more current than is specified.
VA
Rs < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE(1)
±500 nA
Vss
AIN
Legend: CPIN = Input Capaci tance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source I mpedance
VA= Analog Voltage
VT= Threshold Voltage
To ADC Input
Note 1: See Section 17.0 “Electrical Specifications”.
© 2009 Microchip Technology Inc. DS41291F-page 91
PIC16F882/883/884/886/887
8.8 Additional Comparator Features
There are three additional comparator features:
Timer1 count enable (gate)
Synchronizing output with Timer1
Simultaneous read of comparator outputs
8.8.1 COMPARATOR C2 GATING TIMER1
This feat ure can be used to time the d uration or inte rval
of analog events. Clearing the T1GSS bit of the
CM2CON1 register will enable Timer1 to increment
based on the output of Comparator C2. This requires
that Timer1 is on and gating is enabled. See
Section 6.0 “Timer1 Module with Gate Control” for
details.
It is recommended to synchronize the comparator with
Timer1 by setting the C2SYNC bit when the comparator
is us ed as t he T imer1 gate sou rce. Thi s ensur es T imer1
does not miss a n incr eme nt if the compar a tor ch an ges
during an increment.
8.8.2 SYNCHRONIZING COMPARATOR
C2 OUTPUT TO TIMER1
The Comparator C2 output can be synchronized with
Timer1 by setting the C2SYNC bit of the CM2CON1
register . When enabled, the C2 output is latched on the
falling edge of the Timer1 clock source. If a prescaler is
used with T imer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator o utput is latch ed on the falling e dge of th e
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figures 8-2 and 8-3) and the Timer1
Block Diagram (Figure 6-1) for more infor m ation.
8.8.3 SIMULTANEOUS COMPARATOR
OUTPUT READ
The MC1OUT and MC2OUT bits of the CM2CON1
register are mirror copies of both comparator outputs.
The ability to read both outputs simultaneously from a
single register eliminates the timing skew of reading
separate registers.
Note 1: Obtaining the status of C1OUT or C2OUT
by readi ng C M2CON 1 do es not af fect th e
comparator interrupt mism atch registers.
REGISTER 8-3: CM2CON1: COMPARATOR C2 CONTROL REGISTER 1
R-0 R-0 R/W-0 R/W-0 U-0 U-0 R/W-1 R/W-0
MC1OUT MC2OUT C1RSEL C2RSEL T1GSS C2SYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 MC1OUT: Mirror Copy of C1OUT bit
bit 6 MC2OUT: Mirror Copy of C2OUT bit
bit 5 C1RSEL: Comparator C1 Refe rence Select bit
1 = CVREF routed to C1VREF input of Comparator C1
0 = Absolute voltage reference (0.6) routed to C1VREF input of Comparator C1 (or 1.2V precision
reference on parts so equipped)
bit 4 C2RSEL: Comparator C2 Refe rence Select bit
1 = CVREF routed to C2VREF input of Comparator C2
0 = Absolute voltage reference (0.6) routed to C2VREF input of Comparator C2 (or 1.2V precision
reference on parts so equipped)
bit 3-2 Unimplemented: Read as ‘0
bit 1 T1GSS: Timer1 Gate Source Select bit
1 = Timer1 gate source is T1G
0 = Timer1 gate source is SYNCC2OUT.
bit 0 C2SYNC: Comparator C2 Output Synchronization bit
1 = Output is synchronous to falling edge of Timer1 clock
0 = Output is asynchronous
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8.9 Comparator SR Latch
The SR latch module provides additional control of the
comparator outputs. The module consists of a single
SR latch and output multiplexers. The SR latch can be
set, reset or toggled by the comparator outputs. The SR
latch may also be set or reset, independent of
comparator output, by control bit s in the SRCON control
register. The SR latch output multiplexers select
whether the latch output s or the com p arator output s are
directed to the I/O port log ic for ev entual outpu t to a pin.
8.9.1 LATCH OPERATION
The latch is a Set-Reset latch that does not depend o n a
clock source. Each of the Set and Reset inputs are
active-high. Each latch input is connected to a
comparator output and a software controlled pulse
generator . The latch can be set by C1OUT or the PULSS
bit of the SRCON register. The latch can be reset by
C2OUT or the PULSR bit of the SRCON register. The
latch is reset-dominant, therefore, if both Set and Reset
inputs are high the latch will go to the Reset state. Both
the PULSS and PULSR bits are self resetting which
means that a single write to either of the bits is all that is
necessary to compl e te a latch se t or Reset op eration.
8.9.2 LATCH OUTPUT
The SR<1:0> bits of the SRCON register control the
latch output multiplexers and determine four possible
output configurations. In these four configurations, the
CxOUT I/O port logic is connected to:
C1OUT and C2OUT
C1OUT an d SR latch Q
C2OUT an d SR latch Q
SR latch Q and Q
After any Reset, the default output configuration is the
unlatched C1OUT and C2OUT mode. This maintains
compatibility with devices that do not have the SR latch
feature.
The applicable TRIS bits of the corresponding ports
must be cleared to enable the port pin output drivers.
Additionally, the CxOE comparator output enable bits of
the CMxCON0 registers must be set in order to make the
comparator or latch output s available on the output pins.
The latch configuration enable states are completely
independent of the enable states for the comparators.
FIGURE 8-7: SR LATCH SIMPLIFIED BLOCK DIAGRAM
C1SEN
SR0
PULSS
S
R
Q
Q
C2REN
PULSR SR1
Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q =1
2: Pulse generator causes a 1/2 Q-state (1 Tosc ) pulse width.
3: Output shown for reference only. See I/O port pin block diagram for more detail.
Pulse
Gen(2)
Pulse
Gen(2)
SYNCC2OUT (from comparator)
C1OUT (from comparator)
C2OE
C2OUT pin(3)
C1OE
C1OUT pin(3)
0
1
MUX
1
0
MUX
SR
Latch(1)
© 2009 Microchip Technology Inc. DS41291F-page 93
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REGISTER 8-4: SRCON: SR LATCH CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/S-0 R/S-0 U-0 R/W-0
SR1(2) SR0(2) C1SEN C2REN PULSS PULSR FVREN
bit 7 bit 0
Legend: S = Bit is set only -
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SR1: SR Latch Configuration bit(2)
1 = C2OUT pin is the latch Q output
0 = C2OUT pin is the C2 comparator output
bit 6 SR0: SR Latch Configuration bits(2)
1 = C1OUT pin is the latch Q output
0 = C1OUT pin is the C1 Comparator output
bit 5 C1SEN: C1 Set Enable bit
1 = C1 comparator output sets SR latch
0 = C1 comparator output has no effect on SR latch
bit 4 C2REN: C2 Reset Enable bit
1 = C2 comparator output resets SR latch
0 = C2 comparator output has no effect on SR latch
bit 3 PULSS: Pulse the SET Input of the SR Latch bit
1 = Triggers pulse generator to set SR latch. Bit is immediately reset by hardware.
0 = Does not trigger pulse generator
bit 2 PULSR: Pulse the Reset Input of the SR Latch bit
1 = Triggers pulse generator to reset SR latch. Bit is immediately reset by hardware.
0 = Does not trigger pulse generator
bit 1 Unimplemented: Read as ‘0
bit 0 FVREN: Fixed Voltage Reference Enable bit
1 = 0.6V Reference FROM INTOSC LDO is enabled
0 = 0.6V Reference FROM INTOSC LDO is disabled
Note 1: The CxOUT bit in the CMxCON0 register will always reflect the actual c omp arator output (not the lev el on
the pin), regardless of the SR latch operation.
2: To enable an SR Latch output to the pin, the appropriate CxOE and TRIS bits must be properly
configured.
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8.10 Comparator Voltage Reference
The comparator voltage reference module pr ovides an
internally generated voltage reference for the compara-
tors. The following features are available:
Independent from Comparator operation
Two 16-level voltage ranges
Output clamped to VSS
Ratiometric with VDD
Fix ed Reference (0.6 V)
The VRCON register (Register 8-5) controls the
voltage reference module shown in Figure 8-8.
The voltage source is selectable through both ends of
the 16 co nne ction resis tor l add er ne tw ork. Bit VRSS of
the VRCON register selects either the internal or
external voltage source.
The PIC16F882/883/884/886/887 allows the CVREF
signal to be output to the RA2 pin of PORTA under
certain configurations only. For more details, see
Figure 8-9.
8.10.1 INDEPENDENT OPERATION
The comparator voltage reference is independent of
the comparator configuration. Setting the VREN bit of
the VRCON register will enable the voltage reference.
8.10.2 OUTPUT VOLTAGE SELECTION
The CVREF voltage reference has 2 ranges with 16
voltage levels in each range. Range selection is
controlled by the VRR bit of the VRCON register. The
16 levels are set with the VR<3:0> bits of the VRCON
register.
The CVREF output voltage is determined by the following
equations:
EQUATION 8-1: CVREF OUTPUT VOLTAGE
The full range of VSS to VDD cannot be realized due to
the construction of the module. See Figure 8-8.
8.10.3 OUTPUT CLAMPED TO VSS
The CVREF output voltage can be set to Vss with no
power consumption by clearing the FVREN bit of the
VRCON register.
This allows the comparator to detect a zero-crossing
while not consuming additional CVREF module current.
8.10.4 OUTPUT RATIOMETRIC TO VDD
The comparator voltage reference is VDD derived and
therefore, the CVREF output changes with fluctuations in
VDD. The tested absolute accuracy of the Comparator
Voltage Reference can be found in Section 17.0
“Electrical Specifications”.
8.10.5 FIXED VOLTAGE REFERENCE
The fixed volta ge reference is ind ependent of VDD, with
a nomina l output volt age of 0.6V. This reference can be
enabled by setting the FVREN bit of the SRCON
register to1’. This reference is always enabled when
the HFINTOSC oscillator is active.
8.10.6 FIXED VOLTAGE REFERENCE
STABILIZATION PERIOD
When the fixe d vol tage refe re nce mo dul e is enabled , it
will require some time for the reference and its amplifier
circuits to stabilize. The user program must include a
small delay routine to allow the module to settle. See
Section 17.0 “Electrical Specifications” for the
minimum delay requirement.
8.10.7 VOLTAGE REFERENCE
SELECTION
Multiplexers on the output of the voltage reference
module enable selection of either the CVREF or fixed
voltage reference for use by the comparators.
Setting the C1RSEL bit of the CM2CON1 register
enables current to flow in the CVREF voltage divider
and selects the CVREF volta ge f or us e b y C1 . C l ear i ng
the C1RSEL b it sel ect s the fixed volt age for use b y C1.
Setting the C2RSEL bit of the CM2CON1 register
enables current to flow in the CVREF voltage divider
and selects the CVREF volta ge f or us e b y C2 . C l ear i ng
the C2RSEL b it sel ect s the fixed volt age for use b y C2.
When bo th the C1RSEL an d C2RSEL bits a r e cle are d,
current flow in the CVREF voltage divider is disabled
minimizing the power drain of the voltage reference
peripheral.
VRR 1 (low range):=
VRR 0 (high range):=
CVREF (VLADDER/4) + =
CVREF (VR<3:0>/24) VLADDER×=
(VR<3:0> VLADDER/32)×
VLADDER VDD=or ([VREF+] - [VREF-]) or VREF+
Note: Depending on the application, additional
components may be required for a zero
cross circuit. Reference TB3013, “Using
the ESD Parasiti c Dio des on Mix ed Signa l
Microcontrollers” (DS93013), for more
information.
© 2009 Microchip Technology Inc. DS41291F-page 95
PIC16F882/883/884/886/887
FIGURE 8-8: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
FIGURE 8-9: COMPARATOR AND ADC VOLTAGE REFERENCE BLOCK DIAGRAM
VRR
8R
VR<3:0>
Analog
8RRR RR
16 Stages
MUX
Fixed Voltage
VREN
CVREF
Reference
EN
FVREN
Sleep
HFINTOSC enable
0.6V
FixedRef
To Comparators
and ADC Module
To Comparators
and ADC Module
15
0
4
VREF+
VDD
VRSS = 0
VRSS = 1
VREF-
VRSS = 0
VRSS = 1
CVREF
VROE
C1RSEL
C2RSEL
VREF+
VCFG0
AVDD
VREF-
VCFG1
AVSS
VROE
VCFG1
CVREF
Comparator ADC
AVDD
AVSS
Voltage
Reference Voltage
Reference
VRSS
VRSS
0
1
0
1
0
1
0
1
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TABLE 8-2: COMPARATOR AND ADC VOLTAGE REFERENCE PRIORITY
RA3 RA2 Comp.
Reference (+) Comp.
Reference (-) ADC
Reference (+) ADC
Reference (-) CFG1 CFG0 VRSS VROE
I/O I/O AVDD AVSS AVDD AVSS 0000
I/O CVREF AVDD AVSS AVDD AVSS 0001
VREF+VREF-VREF+VREF-AVDD AVSS 0010
VREF+CVREF VREF+AVSS AVDD AVSS 0011
VREF+I/O AVDD AVSS VREF+AVSS 0100
VREF+CVREF AVDD AVSS VREF+AVSS 0101
VREF+VREF-VREF+VREF-VREF+AVSS 0110
VREF+CVREF VREF+AVSS VREF+AVSS 0111
I/O VREF-AVDD AVSS AVDD VREF-1000
I/O VREF-AVDD AVSS AVDD VREF-1001
VREF+VREF-VREF+VREF-AVDD VREF-1010
VREF+VREF-VREF+VREF-AVDDVREF-1011
VREF+VREF-AVDD AVSS VREF+VREF-1100
VREF+VREF-AVDD AVSS VREF+VREF-1101
VREF+VREF-VREF+VREF-VREF+VREF-1110
VREF+VREF-VREF+VREF-VREF+VREF-1111
© 2009 Microchip Technology Inc. DS41291F-page 97
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T ABLE 8-3: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND VOLTAGE
REFERENCE MODULES
REGISTER 8-5: VRCON: VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
VREN VROE VRR VRSS VR3 VR2 VR1 VR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 VREN: Comparator C1 Voltage Reference Enable bit
1 =CV
REF circuit powered on
0 =CV
REF circuit powered down
bit 6 VROE: Comparator C2 Voltage Reference Enable bit
1 =CV
REF voltage level is also output on the RA2/AN2/VREF-/CVREF/C2IN+ pin
0 =CV
REF voltage is disconnected from the RA2/AN2/VREF-/CVREF/C2IN+ pin
bit 5 VRR: CVREF Range Selection bit
1 = Low range
0 = High range
bit 4 VRSS: Comparator VREF Range Selection bit
1 = Comparato r Reference Source, C VRSRC = (VREF+) - (VREF-)
0 = Comparato r Reference Source, C VRSRC = VDD - VSS
bit 3-0 VR<3:0>: CVREF Value Selection 0 VR<3:0> 15
When VRR = 1: CVREF = (VR<3:0> /24) * VDD
When VRR = 0: CVREF = VDD/4 + (VR<3:0> /32) * VDD
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111
ANSELH ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 --11 1111 --11 1111
CM1CON0 C1ON C1OUT C1OE C1POL C1R C1CH1 C1CH0 0000 -000 0000 -000
CM2CON0 C2ON C2OUT C2OE C2POL C2R C2CH1 C2CH0 0000 -000 0000 -000
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL T1GSS C2SYNC 0000 --10 0000 --10
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 0000 00-0
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF 0000 00-0 0000 00-0
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx xxxx uuuu uuuu
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
SRCON SR1 SR0 C1SEN C2SEN PULSS PULSR FVREN 0000 00-0 0000 00-0
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
VRCON VREN VROE VRR VRSS VR3 VR2 VR1 VR0 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, – = unimplemented, read as0’. Shaded cells are not used for comparator.
PIC16F882/883/884/886/887
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NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 99
PIC16F882/883/884/886/887
9.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC voltage reference is software selectable to be
either internally gene rated or externally s upplied.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt ca n be used to wake-up the
device from Sleep.
Figure 9-1 shows the block diagram of the ADC.
FIGURE 9-1: ADC BLOCK DIAGRAM
AN0
AN1
AN2
AN4
AVDD
VREF+
ADON
GO/DONE
VCFG0 = 1
VCFG0 = 0
CHS<3:0>
VSS
AN5
AN6
AN7
AN3
AN8
AN9
AN10
AN11
AN12
AN13
AVSS
VREF-VCFG1 = 1
VCFG1 = 0
CVREF
FixedRef
0000
0001
0010
0011
0100
0101
0111
0110
1000
1001
1010
1011
1100
1101
1110
1111
ADRESH ADRESL
10
10
ADFM 0 = Le ft Ju stify
1 = Right Justify
ADC
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9.1 ADC Configuration
When configuring and using the ADC the following
functio ns must be considere d:
Port configuration
Channel selection
ADC voltage reference selection
ADC conv ersion clock sour ce
Interrupt control
Results formatting
9.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and digital
signals. When converting analog signals, the I/O pin
should be configured for analog by setting the associated
TRIS and ANSEL bits. See the corresponding Port
section for more information.
9.1.2 CHANNEL SELECTION
The CHS bits of the ADCON0 r egister det ermine whic h
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 9.2
“ADC Operation” for more information.
9.1.3 ADC VOLTAGE REFERENCE
The VCFG bits of the ADCON0 register provide
independent control of the positive and negative
voltage re ferences. The positive voltage reference can
be either VDD or an external voltage source. Likewise,
the negativ e vo ltage referen ce ca n be ei ther V SS or an
external voltage source.
9.1.4 CONVERSION CLOCK
The source of the conversion clock is software select-
able via the ADCS bits of the ADCON0 register. There
are four possible clock options:
•F
OSC/2
•FOSC/8
•F
OSC/32
•FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
TAD. One full 1 0-b it c on ve rsion require s 11 TAD periods
as shown in Figure 9-2.
For correct conversion, the appropriate TAD specificatio n
must be met. See A/D conversion requirements in
Section 17.0 “Electrical Specifications” for more
information. Table 9-1 gives examples of appropriate
ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
© 2009 Microchip Technology Inc. DS41291F-page 101
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TABLE 9-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
FIGURE 9-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
9.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is th e ADIF bit in the
PIR1 reg ister. The ADC inte rrupt en able i s the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operatin g or while in Sle ep. If the device is in Sle ep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruc tio n is always executed. If the user is attem ptin g
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interr u pt Service Routine.
Please see Section 14.3 “Interrupts” for more
information.
ADC Clock Period (TAD) Device Freque ncy (FOSC)
ADC Clock Source ADCS<1:0> 20 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 00 100 ns(2) 250 ns(2) 500 ns(2) 2.0 μs
FOSC/8 01 400 ns(2) 1.0 μs(2) 2.0 μs8.0 μs(3)
FOSC/32 10 1.6 μs4.0 μs8.0 μs(3) 32.0 μs(3)
FRC 11 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 4 μs for VDD > 3.0V.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be perf ormed during S leep.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion Starts
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
PIC16F882/883/884/886/887
DS41291F-page 102 © 2009 Microchip Technology Inc.
9.1.6 RESULT FORMATTING
The 10-bit A/D conversion res ult can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 9-3 shows the two output formats.
FIGURE 9-3: 10-BIT A/D CONVERSION RESULT FORMAT
9.2 ADC Operation
9.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
9.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
Clear the GO/DONE bit
Set the ADIF flag bit
Update the AD RESH:ADRESL reg isters with new
conversion result
9.2.3 TERMINATING A CONVERSION
If a co nver sion must b e term ina ted be fore comp leti on,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion. Addi-
tionall y, a 2 TAD delay is required before ano ther acqui-
sition can be initiated. Following this delay, an input
acquisition is automatically started on the selected
channel.
9.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC wa its on e addition al instru ction bef ore sta rting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conver-
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
9.2.5 SPECIAL EVEN T TRIGGER
The E CCP Spec ial Ev ent Trigg er allow s peri odic A DC
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 counter resets to zero.
Using the S pecial Event T rigger does not assure proper
ADC timi ng. I t is the user’s resp onsib ility t o ensu re that
the ADC timing requirements are met.
See Section 11.0 “Capture/Compare/PWM Modules
(CCP1 and CCP2)” for more information.
ADRESH ADRESL
(ADFM = 0)MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit A/D Result Unimplemented: Read as 0
(ADFM = 1)MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0 10-bit A/D Result
Note: The GO/DONE bit shou ld not be se t in the
same instruction that turns on the ADC.
Refer to Section 9.2.6 “A/D Conversion
Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
© 2009 Microchip Technology Inc. DS41291F-page 103
PIC16F882/883/884/886/887
9.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digit al conve rsion:
1. Conf igure Port:
Disable pin output driver (See TRIS register)
Configure pin as analog
2. Conf igure the ADC module:
Select AD C conversion clock
Configure voltage reference
Select ADC input channel
Select result format
Turn on ADC module
3. Configure ADC interrupt (optional):
Clear ADC interrupt flag
Enable ADC interrupt
Enable peripheral interrupt
Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait f or ADC conv ers ion to com ple te by o ne of
the following:
Po lli ng the GO/DONE bit
Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the AD C interrupt fl ag (required if interrupt
is enabled).
EXAMPLE 9-1: A/D CONVE RSI ON
Note 1: The global int errupt can be d isabl ed if th e
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: See Section 9.3 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd and Vss as reference, Frc
clock and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL ADCON1 ;
MOVLW B’10000000’ ;right justify
MOVWF ADCON1 ;Vdd and Vss as Vref
BANKSEL TRISA ;
BSF TRISA,0 ;Set RA0 to input
BANKSEL ANSEL ;
BSF ANSEL,0 ;Set RA0 to analog
BANKSEL ADCON0 ;
MOVLW B’11000001’ ;ADC Frc clock,
MOVWF ADCON0 ;AN0, On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,GO ;Start conversion
BTFSC ADCON0,GO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
PIC16F882/883/884/886/887
DS41291F-page 104 © 2009 Microchip Technology Inc.
9.2.7 ADC REGISTER DEFINITIONS
The following registers are used to control the opera-
tion of the ADC.
Note: For ANSEL and ANSELH registers, see
Regist er 3-3 and Regis ter 3-4, resp ectively.
REGISTER 9-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADCS<1:0>: A/D Conversion Clock Select bits
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max)
bit 5-2 CHS<3:0>: Analog Channel Select bits
0000 = AN0
0001 = AN1
0010 = AN2
0011 = AN3
0100 = AN4
0101 = AN5
0110 = AN6
0111 = AN7
1000 = AN8
1001 = AN9
1010 = AN10
1011 = AN11
1100 = AN12
1101 = AN13
1110 = CVREF
1111 = Fixed Ref (0.6V fixed voltage reference)
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
© 2009 Microchip Technology Inc. DS41291F-page 105
PIC16F882/883/884/886/887
REGISTER 9-2: ADCON1: A/D CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
ADFM —VCFG1VCFG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Conversion Result Format Select bit
1 = Right justif ied
0 = Left justi fied
bit 6 Unimplemented: Read as ‘0
bit 5 VCFG1: Voltage Reference bit
1 = V REF- pin
0 = VSS
bit 4 VCFG0: Voltage Reference bit
1 = V REF+ pin
0 = VDD
bit 3-0 Unimplemented: Read as ‘0
PIC16F882/883/884/886/887
DS41291F-page 106 © 2009 Microchip Technology Inc.
REGISTER 9-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2
bit 7 bit 0
Legend:
R = Readable bit W = Writ able bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 9-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writ able bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
bit 5-0 Reserved: Do not use.
REGISTER 9-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES9 ADRES8
bit 7 bit 0
Legend:
R = Readable bit W = Writ able bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Reserved: Do not use.
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 9-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writ able bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
© 2009 Microchip Technology Inc. DS41291F-page 107
PIC16F882/883/884/886/887
9.3 A/D Acquisition Requirements
For the A DC t o meet i ts specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 9-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 9-4.
The maximum recommended impedance for analog
sources is 10 kΩ. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 9-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb erro r is the maximum er ror allow ed
for the ADC to meet its specified resolution.
EQUATION 9-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C()0.05µs/°C()[]++=
TCCHOLD RIC RSS RS++() ln(1/2047)=
10pF 1k
Ω
7k
Ω
10k
Ω
++() ln(0.0004885)=
1.37
=µs
TACQ 2ΜS1.37ΜS50°C- 25°C()0.05ΜSC()[]++=
4.67ΜS=
VAPPLIED 1e
Tc
RC
---------
⎝⎠
⎜⎟
⎛⎞
VAPPLIED 11
2n1+
()1
--------------------------
⎝⎠
⎛⎞
=
VAPPLIED 11
2n1+
()1
--------------------------
⎝⎠
⎛⎞
VCHOLD=
VAPPLIED 1e
TC
RC
----------
⎝⎠
⎜⎟
⎛⎞
VCHOLD=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
Ω
5.0V VDD=
Assumptions:
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin
leakage specification.
PIC16F882/883/884/886/887
DS41291F-page 108 © 2009 Microchip Technology Inc.
FIGURE 9-4: ANALOG INPUT MODEL
FIGURE 9-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I LEAKAGE(1)
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(kΩ)
VDD
± 500 nA
Legend: CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
Note 1: See Section 17.0 “Electrical Specifications”.
3FFh
3FEh
ADC Output Code
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1 LSB ideal
VSS/VREF-Zero-Scale
Transition VDD/VREF+
Transition
1 LSB ideal
Full-Scale Range
Analog Input Voltage
© 2009 Microchip Technology Inc. DS41291F-page 109
PIC16F882/883/884/886/887
TABLE 9-2: SUMMARY OF ASSOCIATED ADC REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Va lue on
all other
Resets
ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 0000 0000 0000 0000
ADCON1 ADFM —VCFG1VCFG0 0-00 ---- -000 ----
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111
ANSELH ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 --11 1111 --11 1111
ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu
ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 —ADIERCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 —ADIFRCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx xxxx uuuu uuuu
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
PORTE ————RE3 RE2 RE1 RE0 ---- xxxx ---- uuuu
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 111
TRISE ——— TRISE3 TRISE2 TRISE1 TRISE0 ---- 1111 ---- 111
Legend: x = unknown, u = unchanged, = unimplemented read as 0’. Shaded cells are not used for ADC module.
PIC16F882/883/884/886/887
DS41291F-page 110 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 111
PIC16F882/883/884/886/887
10.0 DAT A EEPROM AND FLASH
PROGRAM MEMORY
CONTROL
The Data EEPROM and Flash program memory are
readable and w ritab le durin g no rmal op eration ( full VDD
range). Th ese memorie s are not di rectly m apped in the
register file space. Instead, they are indirectly
addressed through the Special Function Registers
(SFRs). There are six SFRs used to access these
memories:
EECON1
EECON2
EEDAT
•EEDATH
EEADR
EEADRH (bit 4 on PIC16F886/PIC16F887 only)
When interfacing the data memory block, EEDA T holds
the 8-bit data for read/write, and EEADR holds the
address o f the EEDAT loca tio n being ac ce ss ed . These
devices have 256 bytes of data EEPROM with an
address range from 0h to 0FFh.
When accessing the program memory block of the
PIC16F886/PIC16F887 devices, the EEDAT and
EEDATH registers form a 2-byte word that holds the
14-bit data for read/write, and the EEADR and
EEADRH registers form a 2-byte word that holds the
12-bit address of the EEPROM location being read.
The PIC16F882 devices have 2K words of program
EEPROM with an address range from 0h to 07FFh.
The PIC16 F88 3/PIC16F884 devi ces hav e 4K words of
program EEPROM with an address range from 0h to
0FFFh. The program memory allows one-word reads.
The EEPROM dat a memory allows byte read and write.
A byte write automatically erases the location and
writes the new data (erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge p ump rated to op erate over the v oltage ran ge of
the device for byte or word operations.
Depending on the setting of the Flash Program
Memory Self Write Enable bits WRT<1:0> of the
Configuration Word Register 2, the device may or may
not be able to write certain blocks of the program
memory. However, reads from the program memory
are allowed.
When the device is code-protected, the CPU may
continue to read and write the data EEPROM memory
and Flas h program memory. When code-prote cted, the
device programmer can no longer access data or
program memory .
10.1 EEADR and EEADRH Registers
The EEADR and EEADRH registers can address up to
a maximum of 256 bytes of data EEPROM or up to a
maximum of 8K words of program EEPROM.
When selecting a program address value, the MSB of
the address is written to the EEADRH register and the
LSB is w ritten to t he EEADR register. When sele cting a
data address value, only the LSB of the address is
written to the EEADR register.
10.1.1 EECON1 AND EECON2 REGISTERS
EECON1 is the control register for EE memory
accesses.
Control bit EEPGD determines if the access will be a pro-
gram or data memory access. When cle ar, as it is when
reset, any subsequent operations will operate on the data
memory . When set, any subsequent operations will oper-
ate on the program me mory. Progra m memory ca n only
be read.
Control bits RD and WR initiate read and write,
resp ec ti v el y. Thes e bi ts cann o t be clea r e d, on l y s et , in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, w ill all ow a write op eratio n to
data EEPROM. On power-up, the WREN bit is clear.
The WRERR bit is set when a write operation is
interrupted by a MCLR or a WDT Time-out Reset
during normal operation. In these situations , following
Reset, the user can check the WRERR bit and rewrite
the location.
Interrupt flag bit EEIF of the PIR2 register is set when
write is complete. It must be cleared in the software.
EECON2 is not a physical register. Reading EECON2
will read all ‘0’s. The EECON2 register is used
exclusively in the data EEPROM write sequence.
PIC16F882/883/884/886/887
DS41291F-page 112 © 2009 Microchip Technology Inc.
REGISTER 10-1: EEDAT: EEPROM DATA REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 EEDAT<7:0>: 8 Least Significant A ddress bit s to Wr ite to or R ead from dat a EEPROM or Read fr om program memory
REGISTER 10-2: EEADR: EEPROM ADDRESS REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 EEADR<7:0>: 8 Least Significant Address bits for EEPROM Read/Write Operation(1) or Read from program memory
REGISTER 10-3: EEDATH: EEPROM DATA HIGH BYTE REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 U nimplemented: Read as ‘0
bit 5-0 EEDATH<5:0>: 6 Most Significant Data bits from program memory
REGISTER 10-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEADRH4(1) EEADRH3 EEADRH2 EEADRH1 EEADRH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 U nimplemented: Read as ‘0
bit 4-0 EEADRH<4:0>: Specifies the 4 Most Significant Address bits or high bits for program memory reads
Note 1: PIC16F886/P IC16F887 only.
© 2009 Microchip Technology Inc. DS41291F-page 113
PIC16F882/883/884/886/887
REGISTER 10-5: EECON1: EEPROM CONTROL REGISTER
R/W-x U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD WRERR WREN WR RD
bit 7 bit 0
Legend:
S = Bit can only be set
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Program/Dat a EEPROM Selec t bit
1 = Accesses program memory
0 = Accesses data memory
bit 6-4 Unimplemented: Read as ‘0
bit 3 WRERR: EEPROM Error Flag bit
1 = A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during
normal operation or BOR Reset)
0 = The write operation completed
bit 2 WREN: EEPROM Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a wri te cy cle (T he bit is cle ared by hardwa re onc e wri te is comp let e. The WR bit ca n only
be set, not cleared, in software.)
0 = Write cycle to the data EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates a memory read (the RD is cleared in hardware and can only be set, not cleared, in
software.)
0 = Does not initiate a memory read
PIC16F882/883/884/886/887
DS41291F-page 114 © 2009 Microchip Technology Inc.
10.1.2 READING THE DATA EEPROM
MEMORY
To read a data memory loca tion, the user must write the
address to the EEADR register, clear the EEPGD
control bit of the EECON1 register, and then set contro l
bit RD. The data is available at the very next cycle, in
the EEDA T register; therefore, it can be read in the next
instruction. EEDAT will hold this value until another
read or until it is written to by the user (during a write
operation).
EXAMPLE 10-1: DATA EEPROM READ
10.1.3 WRITING TO THE DATA EEPROM
MEMORY
To write an EEPROM data location, the user must first
wri te t he addr ess to the E EADR regi ster an d the data
to the EEDAT register. Then the user must follow a
specific sequence to initiate the write for each byte.
The write will not initiate if the above sequence is not
followed exactly (write 55h to EECON2, write AAh to
EECON2, then set WR bit) for each byte. Interrupts
should be disabled during this code segment.
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times, except when
updating EEPROM. The WREN bit is not cleared
by hardware.
After a write sequence has been initiated, clearing the
WREN bit wil l not af fect this wr ite cycle. T he WR bit wil l
be inhib ited from bei ng s et unless the W R EN bit is se t.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. EEIF must be
cleared by software.
EXAMPLE 10-2: DATA EEPROM WRITE
BANKSEL EEADR ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ;Data Memory
;Address to read
BANKSEL EECON1 ;
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, RD ;EE Read
BANKSEL EEDAT ;
MOVF EEDAT, W ;W = EEDAT
BCF STATUS, RP1 ;Bank 0
BANKSEL EEADR ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ;Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDAT ;Data Memory Value to write
BANKSEL EECON1 ;
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, WREN ;Enable writes
BCF INTCON, GIE ;Disable INTs.
BTFSC INTCON, GIE ;SEE AN576
GOTO $-2
MOVLW 55h ;
MOVWF EECON2 ;Write 55h
MOVLW AAh ;
MOVWF EECON2 ;Write AAh
BSF EECON1, WR ;Set WR bit to begin write
BSF INTCON, GIE ;Enable INTs.
SLEEP ;Wait for interrupt to signal write complete
BCF EECON1, WREN ;Disable writes
BCF STATUS, RP0 ;Bank 0
BCF STATUS, RP1
Required
Sequence
© 2009 Microchip Technology Inc. DS41291F-page 115
PIC16F882/883/884/886/887
10.1.4 READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must
write the Least an d Most Si gnific ant add ress bit s to the
EEADR and EEADRH registers, set the EEPGD con-
trol bit of th e EEC ON 1 reg ist er, and then set c ont rol b it
RD. Once the read cont rol bit is set, the program mem-
ory Flash controller will use the second instruction
cycle to read th e data. This caus es the second ins t ru c-
tion immediately following the “BSF EECON1,RD
instruction to be ignored. The data is available in the
very ne xt cycle, in the EEDAT and EED ATH reg ister s;
therefore, it can be read as two bytes in the following
instructions.
EEDAT and EEDATH registers will hold this value until
another read or until it is written to by the user.
EXAMPLE 10-3: FLASH PROGRAM READ
Note 1: The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
two-cycle instruction on the next
instruction after the RD bit is set.
2: If the WR bit is set when EEPGD = 1, it
will be immediately reset to ‘0’ and no
operation will take place.
BANKSEL EEADR ;
MOVLW MS_PROG_EE_ADDR ;
MOVWF EEADRH ;MS Byte of Program Address to read
MOVLW LS_PROG_EE_ADDR ;
MOVWF EEADR ;LS Byte of Program Address to read
BANKSEL EECON1 ;
BSF EECON1, EEPGD ;Point to PROGRAM memory
BSF EECON1, RD ;EE Read
;
;First instruction after BSF EECON1,RD executes normally
NOP
NOP ;Any instructions here are ignored as program
;memory is read in second cycle after BSF EECON1,RD
;BANKSEL EEDAT ;
MOVF EEDAT, W ;W = LS Byte of Program Memory
MOVWF LOWPMBYTE ;
MOVF EEDATH, W ;W = MS Byte of Program EEDAT
MOVWF HIGHPMBYTE ;
BCF STATUS, RP1 ;Bank 0
Required
Sequence
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DS41291F-page 116 © 2009 Microchip Technology Inc.
FIGURE 10-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF EECON1,RD
execut ed her e INSTR(PC + 1)
executed here Forced NOP
execut ed her e
PC
PC + 1 EEADRH,EEADR PC+3 PC + 5
Flash ADDR
RD bit
EEDATH,EEDAT
PC + 3 PC + 4
INSTR (PC + 1)
INSTR(PC - 1)
executed here INSTR(PC + 3)
executed here INSTR(PC + 4)
executed here
Flas h Data
EEDATH
EEDAT
Register
EERHLT
INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
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10.2 Writing to Flash Program Memory
Flash program memory may only be written to if the
desti nati on addr ess i s in a se gment of me mory th at is
not write -protec ted, as d efined i n bit s WR T<1: 0> of the
Config uration Wo rd Register 2. Fl ash program memo ry
must be written in eight-word blocks (four-word blocks
for 4K memory devices). See Figures 10-2 and 10-3 for
more details. A block consists of eight words with
sequential addresses, with a lower boundary defined
by an address, where EEADR<2:0> = 000. All block
writes to program memory are done as 16-word erase
by eight-word write operations. The write operation is
edge-aligned and cannot occur across boundaries.
To write program data, it must first be loaded into the
buff er registers (see Figure 10-2). This is accomplished
by first writing the destination address to EEADR and
EEADRH and then writing the data to EEDATA and
EEDATH. Af ter the address and data h ave been set u p,
then the following sequence of events must be
executed:
1. Set the EEPGD control bit of the EECON1
register.
2. Write 55h, then AAh, to EECON2 (Flash
program ming sequence ).
3. Set the WR contr ol bit of the EECON1 register.
All eight buffer register locations should be written to
with correct dat a. If less than eight words are being writ-
ten to in the block of eight words, then a read from the
program memory location(s) not being written to must
be performed. This takes the data from the program
location(s) not being written and loads it into the
EEDAT A and EEDA TH reg isters. Then th e sequence of
events to transfer data to the buffer registers must be
executed.
To transfer data from the buffer registers to the program
memory , the EEADR and EEADRH must point to the last
location in the eight-word block (EEADR<2:0> = 111).
Then the following sequence of events must be
executed:
1. Set the EEPGD control bit of the EECON1
register.
2. Write 55h, then AAh, to EECON2 (Flash
program ming sequence ).
3. Set control bit WR of the EECON1 register to
begin the write operation.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011, 100, 101, 110, 111). When the write is
performed on the last word (EEADR<2:0> = 111), a
bloc k of s ix t ee n wor ds i s au t om ati ca l ly er ase d an d the
content of the eight word buffer registers are written
into the program memory.
After th e BSF EECON1,WR” instruction, the processor
requires tw o c ycles to se t up the era se /w rite op era t io n.
The user must p lac e tw o NOP i nst ructions af ter the WR
bit is set. Sinc e dat a is being written to buf fe r registers,
the writing of the first seven words of the block appears
to occur immediately. The processor will halt internal
operat io ns for the typi ca l 4 ms, only during the cy cl e in
which the erase takes place (i.e., the last word of the
sixteen-word block erase). This is not Sleep mode as
the cloc ks and perip herals will co ntinue to run. Af ter the
eight-w ord w rite cy cl e, th e processor wi ll resume op er-
ation with the third instruction after the EECON1 write
instruction. The above sequence must be repeated for
the higher eight words.
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FIGURE 10-2: BLOCK WRITES TO 2K AND 4K FLASH PROGRAM MEMORY
FIGURE 10-3: BLOCK WRITES TO 8K FLASH PROGRAM MEMORY
14 14 14 14
Program Memory
Buffer Register
EEADR<1 :0 > = 00
Buffer Register
EEADR<1:0> = 01
Buffer Register
EEADR<1:0> = 10
Buffer Register
EEADR<1:0> = 11
EEDATAEEDATH
75 07 0
68
First word of block
to be written
Sixteen words of
to Flash
automatically
after this word
is wr itten
are transferred
Flash are eras ed,
then four buffers
14 14 14 14
Program Memory
Buffer Register
EEADR<2 :0 > = 000
Buffer Register
EEADR<2:0> = 001
Buffer Register
EEADR<2:0> = 010
Buffer Register
EEADR<2:0> = 111
EEDATAEEDATH
75 07 0
68
First word of block
to be written
Sixteen words of
to Flash
automatically
after this word
is wr itten
are transferred
Flash are eras ed,
then eight buffers
© 2009 Microchip Technology Inc. DS41291F-page 119
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An exampl e of the complete eight-w ord write sequenc e
is shown in Example 10-4. The initial address is loaded
into the EEADRH and EEADR register pair; the eight
words of data are loaded using indirect addressing.
EXAMPLE 10-4: WRITING TO FLASH PROGRAM MEMORY
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; This write routine assumes the following:
; A valid starting address (the least significant bits = '000')
; is loaded in ADDRH:ADDRL
; ADDRH, ADDRL and DATADDR are all located in data memory
;
BANKSEL EEADRH
MOVF ADDRH,W ; Load initial address
MOVWF EEADRH ;
MOVF ADDRL,W ;
MOVWF EEADR ;
MOVF DATAADDR,W ; Load initial data address
MOVWF FSR ;
LOOP MOVF INDF,W ; Load first data byte into lower
MOVWF EEDATA ;
INCF FSR,F ; Next byte
MOVF INDF,W ; Load second data byte into upper
MOVWF EEDATH ;
INCF FSR,F ;
BANKSEL EECON1
BSF EECON1,EEPGD ; Point to program memory
BSF EECON1,WREN ; Enable writes
BCF INTCON,GIE ; Disable interrupts (if using)
BTFSC INTCON,GIE ; See AN576
GOTO $-2
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; Required Sequence
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write 0AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Required to transfer data to the buffer
NOP ; registers
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts (comment out if not using interrupts)
BANKSEL EEADR
MOVF EEADR, W
INCF EEADR,F ; Increment address
ANDLW 0x0F ; Indicates when sixteen words have been programmed
SUBLW 0x0F ; 0x0F = 16 words
; 0x0B = 12 words (PIC16F884/883/882 only)
; 0x07 = 8 words
; 0x03 = 4 words(PIC16F884/883/882 only)
BTFSS STATUS,Z ; Exit on a match,
GOTO LOOP ; Continue if more data needs to be written
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10.3 W rite Verify
Depending on the application, good programming
practice may dictate that the value written to the data
EEPROM should be verified ( see Exam ple 10-5) to the
des i red value to be written.
EXAMPLE 10- 5: WRITE VERI FY
10.3.1 USING THE DATA EEPROM
The data EEPROM is a high-endurance, byte
addressable array that has been optimized for the
storage of frequently changing information (e.g.,
program variables or other data that are updated often).
When variables in one section change frequently, while
variables in another section do not change, it is possible
to exceed the total number of write cycles to the
EEPROM (specification D124) without exceeding the
total number of write cycles to a single byte
(specifications D120 and D120A). If this is the case,
then a refr esh of the array must be per form ed. F or th is
reason, variables that change infrequently (such as
constants, IDs, calibration, etc.) should be stored in
Flas h program me m ory.
10.4 Protection Against Spurious Writ e
There are conditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been buil t in. On power-u p, WREN is cleare d. Also, the
Power-up Timer (64 ms duration) prevents
EEPROM write.
The wri te in iti ate sequence an d the WR EN bi t tog eth er
help prevent an acciden tal write du ring:
Brown-out
•Power Glitch
Software Malfunction
10.5 Data EEPROM Operation During
Code-Protect
Data me mory can be co de-prot ected by program ming
the CPD bit in the Configuration Word Register 1
(Register 14-1) to ‘0’.
When the data memory is code-protected, only the
CPU is able to read and write data to the data
EEPROM. It is recommended to code-protect the pro-
gram memory when code-protecting data memory.
This prevents anyone from programming zeroes over
the exis ting c ode (whic h wi ll execu te as NOPs) to reach
an added routine, programmed in unused program
memory, which outputs the contents of data memory.
Programming unused locations in program memory to
0’ will also help prevent data memory code protection
from becom ing breached.
BANKSEL EEDAT ;
MOVF EEDAT, W ;EEDAT not changed
;from previous write
BANKSEL EECON1 ;
BSF EECON1, RD ;YES, Read the
;value written
BANKSEL EEDAT ;
XORWF EEDAT, W ;
BTFSS STATUS, Z ;Is data the same
GOTO WRITE_ERR ;No, handle error
: ;Yes, continue
BCF STATUS, RP1 ;Bank 0
© 2009 Microchip Technology Inc. DS41291F-page 121
PIC16F882/883/884/886/887
TABLE 10-1: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM
Name Bit 7 B it 6 Bit 5 Bit 4 B i t 3 B it 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
EECON1 EEPGD WRERR WREN WR RD x--- x000 0--- q000
EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- ---- ----
EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 0000 0000 0000 0000
EEADRH EEADRH4(1) EEADRH3 EEADRH2 EEADRH1 EEADRH0 ---0 0000 ---0 0000
EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 0000 0000 0000 0000
EEDATH EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0 --00 0000 --00 0000
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 0000 00-0
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF 0000 00-0 0000 00-0
Legend: x = unknow n , u = unchanged, = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by data EEPRO M module.
Note 1: PIC16F886/PIC16F887 only.
PIC16F882/883/884/886/887
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NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 123
PIC16F882/883/884/886/887
11.0 CAPTURE/COMP ARE/ PWM
MODULES (CCP1 AND CCP2)
This d evice con tai ns one Enh anced C apture/Com pare/
PWM (CCP1) and Capture/Compare/PWM module
(CCP2 ). The CC P1 and C CP2 m odule s are i dentic al in
operation, with the exception of the Enhanced PWM
features available on CCP1 only. See Section 11.6
“PWM (Enhanced Mode)” for more information.
Note: CCPRx and CCPx throughout this
document refer to CCPR1 or CCPR2 and
CCP1 or CCP2, respectively.
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DS41291F-page 124 © 2009 Microchip Technology Inc.
11.1 Enhanced Capture/Comp are/ PWM
(CCP1)
The Enhanced Capture/Compare/PWM module is a
peripheral which allows the user to time and control
different events. In Capture mode, the peripheral
allows the timing of the duration of an event. The
Compare mode allows the user to trigger an external
event when a predetermined amount of time has
expired. The PWM mode can generate a Pulse-Width
Modulated signal of varying frequency and duty cycle.
Table 11-1 shows the timer resources required by the
ECCP module.
TABLE 11-1: ECCP MODE – TIMER
RESOURCES REQUIR ED
ECCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 11-1: CCP1CON: ENHANCED CCP1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 P1M<1:0>: PWM Output Configuration bits
If CCP1M<3:2> = 00, 01, 10:
xx = P1A assigned as Capture/Compare input; P1B, P1C, P1D assigned as port pins
If CCP1M<3 :2> = 11:
00 = Single output; P1A modulated; P1B, P1C, P1D assigned as port pins
01 = Full-Bridge output forward; P1D modulated; P1A active; P1B, P1C inactive
10 = Half-Bridge output; P1A, P1B modulated with dead-ban d control; P1C, P1D assigned as port pins
11 = Full-Bridge output reverse; P1B modulated; P1C active; P1A, P1D inactive
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mo de:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: ECCP Mode Select bits
0000 = Capture/Compare/PWM off (resets ECCP module)
0001 = Unused (reserved)
0010 = Compare mode, toggle output on match (CCP1IF bit is set)
0011 = Unused (reserved)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP1IF bit is set)
1001 = Compare mode, clear output on mat ch (CC P1IF bit is set)
1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is
unaffected)
1011 = Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 or TMR2
1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high
1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low
1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high
1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low
© 2009 Microchip Technology Inc. DS41291F-page 125
PIC16F882/883/884/886/887
11.2 Capture/Compare/PWM (CCP2)
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events. In Capture mode, the peripheral allows the
timing of the duration of an event. The Compare mode
allows the user to trigger an external event when a
predetermined amount of time has expired. The PWM
mode can generate a Pulse-Width Modulated signal of
varying frequency and duty cycle.
The timer resources used by the module are shown in
Table 11-2.
Additional information on CCP modules is available in
the Applic ation Not e AN594 , “Using the CCP M odule s”
(DS00594).
TABLE 11-2: CCP MODE – TIMER
RESOURCES REQUIR ED
CCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 11-2: CCP2CON: CCP2 CONTROL REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 DC2B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mo de:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR2L.
bit 3-0 CCP2M<3:0>: CCP2 Mode Select bits
0000 = Capture/Compare/PWM off (resets CCP2 module)
0001 = Unused (reserved)
0010 = Unused (reserved)
0011 = Unused (reserved)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP2IF bit is set)
1001 = Compare mode, clear output on match (CCP2IF bit is set)
1010 = Compare mode, generate software interrupt on match (CCP2IF bit is set, CCP2 pin
is unaffected)
1011 = Compare mode, trigger special event (CCP2IF bit is set, TMR1 is reset and A/D
conversion is started if the ADC module is enabled. CCP2 pin is unaffected.)
11xx = PWM mode.
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11.3 Capture Mode
In Capture mode, the CCPRxH, CCPRxL register pair
captures the 16-bi t value o f the TMR1 register w hen an
event occurs on pin CCPx. An event is defined as one
of the following and is configured by the CCP1M<3:0>
bits of the CCP1CON register:
Every falling edge
Every rising edge
Ever y 4th rising edg e
Every 16th rising edge
When a cap ture i s m ade, the I nterrupt Re quest Flag bit
CCPxIF of the PIRx register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPRxH, CCPRxL register pair
is read, the old captured value is overwritten by the new
captured value (see Figure 11-1).
11.3.1 CCP PIN CONFIGURATION
In Capture mode, the CCPx pin should be configured
as an input by setting the associated TRIS control bit.
FIGURE 11 -1: CAP TURE MODE
OPERATION BLOCK
DIAGRAM
11.3.2 TIMER1 MODE SELECTION
T imer1 must be running in T imer mode or Synchroni zed
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
11.3.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCPxIE inte rrupt enable bit of the PIEx regis ter clear to
avoid false interrupts. Additionally, the user should
clear the CCPxIF interrupt flag bit of the PIRx register
following any change in Operating mode.
11.3.4 CCP PRESCALER
There are four prescaler settings specified by the
CCPxM<3 :0> bits of the C CPxCON regis ter . Whenev er
the CCP module is turned off, or the CCP module is not
in Captu re mode, the presca ler count er is clea red. Any
Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCPxCON register before changing the
prescaler (see Example 11-1).
EXAMPLE 11-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If th e CCPx pin is c onfigu red as an o utput,
a write to the port can cause a capture
condition.
CCPRxH CCPRxL
TMR1H TMR1L
Set Flag bit CCPxIF
(PIRx register)
Capture
Enable
CCPxCON<3:0>
Prescaler
÷ 1, 4, 16
and
Edge Detect
pin
CCPx
System Clock (FOSC)
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS;Load the W reg with
; the new prescaler
; move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
; value
© 2009 Microchip Technology Inc. DS41291F-page 127
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11.4 Compare Mode
In Compare mode, the 16-bit CCPRx register value is
constantly compared against the TMR1 register pair
value. When a match o ccurs, the C CPx module may :
Toggle the CCPx output
Set the CCPx output
Clear the CCPx output
Generate a Special Event Trigger
Generate a Software Interrupt
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPx1CON register.
All Compare modes can generate an interrupt.
FIGURE 11 -2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
11.4.1 CCP PIN CONFIGURATION
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
11.4.2 TIMER1 MODE SELECTION
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
11.4.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCP1CON
register).
11.4.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCPxM<3:0> = 1011), the CCPx module does the
following:
Resets Timer1
Starts an ADC conversion if ADC is ena bled
The CCP x module does no t assert control of the C CPx
pin in this mode (see the CCPxCON register).
The Special Event Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPRxH, CCPRxL
register pair. The TMR1H, TMR1L register pair is not
reset until th e next r ising ed ge of the T imer1 clock. This
allows the CCPRxH, CCPRxL register pair to
effectively provide a 16-bit programmable period
register for Timer1.
Note: Clearing the CCP1CON register will force
the CCPx compare output latch to the
default lo w lev el. This is no t the PO R T I/O
data l atch.
CCPRxH CCPRxL
TMR1H TMR1L
Comparator
QS
ROutput
Logic
Special Event Trigger
Set CCPxIF Interrupt Flag
(PIRx)
Match
TRIS
CCPxCON<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger will:
Clear TMR1H and TMR1L registers.
NOT set interrupt flag bit TMR1IF of the PIR1 register.
Set the GO/DONE bit to start the ADC conversion.
CCPx 4
Note 1: The Special Event Trigger from the CCP
module does not set interrupt flag bit
TMRxIF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPRxH
and CCPRxL register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generates the T imer1 Reset, will p reclude
the Reset from occurring.
PIC16F882/883/884/886/887
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11.5 PWM Mode
The PWM mode generates a Pulse-Width Modulated
signal on the CCPx pin. The duty cycle, period and
resolution are determined by the following registers:
•PR2
•T2CON
CCPRxL
CCPxCON
In Pulse-Width Modulation (PWM) mode, the CCP
module produce s up to a 10 -bit resol ution PWM outp ut
on the CCPx pin. Since the CCPx pin is multiplexed
with the POR T dat a latch, the TRIS for that pi n must be
cleared to enable the CCPx pin output driver.
Figure 11-3 shows a simplified block diagram of PWM
operation.
Figure 11-4 shows a typical waveform of the PWM
signal.
For a ste p-by-step proced ure on how t o set up the CCP
module for PWM operation, see Section 11.5.7
“Setup for PWM Operation”.
FIGURE 11-3: SIMPLIFIED PWM BLOCK
DIAGRAM
The PWM output (Figure 11-4) has a time base
(period) and a time that the output stays high (duty
cycle).
FIGURE 11-4: CCP PWM OUTPUT
Note: Clearing the CCPxCON register will
relinquish CCPx control of the CCPx pin.
CCPRxL
CCPRxH(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCPxCON<5:4>
Clear Timer2 ,
toggle CCPx pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler , to create the 10-bit time
base.
2: In PWM mode, CCPRxH is a read-only register.
TRIS
CCPx
Comparator
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxL:CCPxCON<5:4>
TMR2 = PR2
© 2009 Microchip Technology Inc. DS41291F-page 129
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11.5.1 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 11-1.
EQUATION 11-1: PWM PERIOD
When TM R2 is equa l to PR2, t he followi ng three ev ents
occur on t he next inc rement cy cle:
TMR 2 is cl eare d
The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
The PW M duty c ycle is latc hed fro m CCPRx L int o
CCPRxH.
11.5.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPRxH
register is read-on ly.
Equation 11-2 is used to calculate the PWM pulse
width.
Equation 11-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 11-2: PULSE WIDTH
EQUATION 11-3: DUTY CYCLE RATIO
The CCPRxH register and a 2-bit internal latch are
used to dou ble buf fer th e PWM duty cycle. Thi s doubl e
buffering is essential for gl itchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler , to create the 10-bit time ba se. The system
clock is used if the Timer2 pres caler is s et to 1:1.
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 11-3).
Note: The Timer2 postscaler (see Section 7.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
PWM Period PR2()1+[]4TOSC =
(TMR2 Prescale Value)
Note: TOSC = 1/FOSC
Pulse Width CCPRxL:CCPxCON<5:4>()
=
TOSC
(TMR2 Prescale Value)
Duty Cycle Ratio CCPRxL:CCPxCON<5:4>()
4PR2 1+()
-----------------------------------------------------------------------=
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11.5.3 PWM RESOLUTION
The r esolutio n determi nes th e number of avai lable dut y
cycles for a given period. For example, a 10-bit resolution
will r e sult in 10 24 di sc ret e d ut y c ycl es , wh er eas an 8- b it
resol uti on wi ll re su lt in 2 56 di s cre te du ty c ycl es .
The ma ximum P WM re solut ion i s 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 11-4.
EQUATION 11-4: PWM RESOLUTION
TABLE 11-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 11-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution 4PR2 1+()[]log
2()log
------------------------------------------ bits=
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
© 2009 Microchip Technology Inc. DS41291F-page 131
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11.5.4 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state o f the mo dule will no t change. I f the CC Px
pin is dri ving a value , it wil l cont inue to d rive th at valu e.
When the device wakes up, TMR2 wil l continue from it s
previous state.
11.5.5 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 4.0 “Oscillator Module (With Fail-Safe
Clock Monitor)” for ad ditiona l details.
11.5.6 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
11.5.7 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Disable the PWM pin (CCPx) output drivers as
an input by setting the associated TRIS bit.
2. Set the PWM period by loading the PR2 register .
3. Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
4. Set the PWM duty cycle by loading the CCPRxL
register and DCxB<1:0> bits of the CCPxCON
register.
5. Configure and start Timer2:
Clear the TMR2IF interrupt flag bit of the
PIR1 register.
Set t he Timer2 presca le value by loading the
T2CKPS bits of the T2CON register.
Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PW M ou tput after a n ew PWM cyc le ha s
started:
Wait until Timer2 overflows (TMR2IF bit of
the PIR1 register is set).
En able the CCPx pin output d river by cleari ng
the associated TRIS bit.
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11.6 PWM (Enhanced Mode)
The Enhanced PWM Mode can generate a PWM signal
on up to four different output pins with up to 10-bits of
resolution. It can do this through four different PWM
output modes:
Single PWM
Half-Bridge PWM
Full-Bridge PWM, Forward mode
Full-Bridge PWM, Reverse mode
To select an Enhanced PWM mode, the P1M bits of the
CCP1CON register must be set appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A, P1B, P1C and P1D. The polarity of the
PWM pins is configurable and is selected by setting the
CCP1M bits in the CC P1CON register appropriately.
Table 11-5 shows the pin assignments for each
Enhanced PWM mode.
Figure 11-5 shows an example of a simplified block
diagram of the Enhanced PWM module .
FIGURE 11-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE
TABLE 11-5: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
Note: The PWM Enhanc ed mode is ava ilable on
the Enhanced Capture/Compare/PWM
module (CCP1) only.
Note: To prevent the generation of an
incomplete waveform when the PWM is
first enabl ed, the ECCP module w aits unti l
the start of a new PWM period before
generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
RQ
S
Duty Cycle Registers DC1B<1:0>
Clear Timer2,
toggle PWM pin and
latch duty cycle
Note 1: The 8-b it ti m er TMR 2 re giste r is con cate na ted wi th the 2- bit interna l Q clock, or 2 bi ts of th e p res cal er to creat e t he 10- bi t
time base.
TRISn
CCP1/P1A
TRISn
P1B
TRISn
P1C
TRISn
P1D
Output
Controller
P1M<1:0> 2CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
P1C
P1D
Note 1: The TRIS register value for each PWM output must be configured appropriately.
2: Clearing the CCPxCON register will relinquish ECCP control of all PWM output pins.
3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions.
ECCP Mode P1M<1:0> CCP1/P1A P1B P1C P1D
Single 00 Yes(1) Yes(1) Yes(1) Yes(1)
Half-Bridge 10 Yes Yes No No
Full-Bridg e, Forward 01 Yes Yes Yes Yes
Full-Bridg e, Reve rse 11 Yes Yes Yes Yes
Note 1: Pulse Steering enables outputs in Single mode.
© 2009 Microchip Technology Inc. DS41291F-page 133
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FIGURE 11 -6: E XAMP LE PW M (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
0
Period
00
10
01
11
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inact ive
P1D Modulated
P1A Inactive
P1B Modulated
P1C Active
P1D Inact ive
Pulse
Width
(Single Output)
(Half-Bridge)
(Full-Bridge,
Forward)
(Full-Bridge,
Reverse)
Delay(1) Delay(1)
Relationships:
Period = 4 * TOSC * (PR2 + 1) * (TM R2 Presca l e Value)
Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.6.6 “Programmable Dead-Band Delay
Mode”).
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FIGURE 11 -7: EX AMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0
Period
00
10
01
11
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inact ive
P1D Modulated
P1A Inactive
P1B Modulated
P1C Active
P1D Inact ive
Pulse
Width
(Single Output)
(Half-Bridge)
(Full-Bridge,
Forward)
(Full-Bridge,
Reverse)
Delay(1) Delay(1)
Relationships:
Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)
Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.6.6 “Programmable Dead-Band Delay
Mode”).
© 2009 Microchip Technology Inc. DS41291F-page 135
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11.6.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-p ull loa ds. The PW M outp ut sign al is output
on the CCPx/P1A pin, while the complementary PWM
output signal is output on the P1B pin (see Figure 1 1-9).
This mode can be used for Half-Bridge applications, as
shown in Figure 11-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 11.6.6 “Programmable Dead-Band Delay
Mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 11-8: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11 -9: EXAMP LE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-B and Delay
Period
(1) (1)
Note 1: At this time, t he TM R2 register is equal to t he
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-P ull ”)
Half-Bridge Output Driving a Full-Bridge Circuit
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11.6.2 FULL-BRIDGE MODE
In Full-Bridge mode, all four pins are used as outputs.
An example of Full-Bridge application is shown in
Figure 11-10.
In the Forward mode, pin CCP1/P1A is driven to its active
state, p in P1 D is m odul ated, whil e P1B and P1C will be
driven to their inactive state as shown in Figure 11-11.
In the Reverse mode, P1C is driven to its active state,
pin P1B is modulated, while P1A and P1D wi l l be driv en
to th eir in ac t iv e s tate a s s h own Figure 11-11.
P1A, P1B, P1C and P1D outputs are multiplexed with
the POR T dat a latc hes. The a ssoc iated T RIS bit s mus t
be cleared to configure the P1A, P1B, P1C and P1D
pins as outputs.
FIGURE 11 -10: EXAMPL E OF FULL-BRIDGE APPLICAT ION
P1A
P1C
FET
Driver
FET
Driver
V+
V-
Load
FET
Driver
FET
Driver
P1B
P1D
QA
QB QD
QC
© 2009 Microchip Technology Inc. DS41291F-page 137
PIC16F882/883/884/886/887
FIGURE 11-11: EXAMPLE OF FULL-BRIDGE PWM OUTPUT
Period
Pulse Width
P1A(2)
P1B(2)
P1C(2)
P1D(2)
Forw a r d M o de
(1)
Period
Pulse Width
P1A(2)
P1C(2)
P1D(2)
P1B(2)
Reverse Mode
(1)
(1)
(1)
Note 1: At this time, the TMR2 register is equal to the PR2 register.
2: Output signal is shown as active-high.
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11.6.2.1 Direction Change in Full-Bridge
Mode
In the F ull -B rid ge m ode , t he P 1M1 bit in th e CC P1C ON
register allows users to control the forward/reverse
direction. When the application firmware changes this
direction co ntrol bit, the modu le will change to the new
direction on the next PWM cycle.
A direction change is initiated in software by changing
the P1M1 bit of the CCP1CON register. The following
sequence occurs prior to the end of the current PWM
period:
The mo dulated ou tputs (P1 B and P1D) are plac ed
in their inactive state.
The associated unmodulated outputs (P1A and
P1C) are switched to drive in the opposite
direction.
PW M modul ation res umes at the be gin ning of the
next period.
See Figure 11-12 for an illustration of this sequence.
The Full-Bridge mode does not provide dead-band
delay. As one outpu t is modulated at a tim e, dead-band
delay is generally not required. There is a situation
where dead-band delay is required. This situation
occurs when both of the following conditions are true:
1. The direction of the PWM output changes when
the duty cycle of the output is at or near 100%.
2. The turn off time of the power switch, including
the power device and driver circuit, is greater
than the turn on time.
Figure 11-13 shows an example of the PWM direction
chan gi ng from for w ar d to rev ers e , at a ne ar 100% duty
cycle. In this example, at time t1, the output P1A and
P1D become inactive, while output P1C becomes
active. Since the turn off time of the power devices is
longer than the turn on time, a shoot-through current
will flow through power devices QC and QD (see
Figure 11-10) for the duration of ‘t’. The same
phenomenon will occur to power devices QA and QB
for PWM di rec t io n ch an ge from reve rs e to forwa rd.
If changing PWM direction at high duty cycle is required
for an app lication, two possible solutions f or eliminatin g
the shoot-through current are:
1. Reduce PWM duty cycle for one PWM period
before changing directions.
2. Use switch drivers that can drive th e switches of f
faster than they can drive them on.
Other options to prevent shoot-through current may
exist.
FIGURE 11-12: EXAMPLE OF PWM DIRECTION CHANGE
Pulse Width
Period(1)
Signal
Note 1: The direction bit P1M1 of the CCP1CON register is written any time during the PWM cycle.
2: When changing directions, the P1A and P1C signals switch before the end of the current PWM c ycle. The
modulated P1B and P1D signals are inactive at this time. The length of this time is (1/Fosc) TMR2 prescale
value.
Period
(2)
P1A (Active-High)
P1B (Active-High)
P1C (Active-High)
P1D (Active-High)
Pulse Width
© 2009 Microchip Technology Inc. DS41291F-page 139
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FIGURE 11 -1 3: EXAMPLE OF PW M DIRECTION CHANGE AT NEAR 100% DUTY CYCLE
Forward Period Reverse Period
P1A
TON
TOFF
T = TOFF – TON
P1B
P1C
P1D
External Switch D
Potential
Shoot-Through Current
Note 1: All signals are shown as active-high.
2: TON is the turn on delay of power switch QC and its driver.
3: TOFF is the turn off delay of power switch QD and its driver.
External Switch C
t1
PW
PW
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11.6.3 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the us er t o ch oose whe the r th e P WM output si gna ls are
active-high or active-low for each pair of PWM output pins
(P1A/P1C and P1B/P1D). The PWM output polarities
must be selecte d bef ore the PWM pi n output driv ers ar e
enabled. Changing the polarity configuration while the
PWM pin outpu t dr ivers ar e enab le is no t recomme nde d
since it may result in damage to the application circuits.
The P1A, P1B, P1C and P 1D output latches may not be
in the proper states when the PWM module is
initialized. Enabling the PWM pin output drivers at the
same time as the Enhanced PWM modes may cause
damage to the applic ati on circuit. The En han ce d PWM
modes must be enabled in the proper Output mode and
complete a full PWM cycle before enabling the PWM
pin output drivers. The completion of a full PWM cycle
is indicated by the TMR2IF bit of the PIR1 register
being set as th e second PWM pe riod begins.
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the
high-impedance state. The external cir-
cuits must keep t he power switch devic es
in the Off state until the microcontroller
drives the I/O pins with the proper signal
levels or activates the PWM output(s).
© 2009 Microchip Technology Inc. DS41291F-page 141
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11.6.4 ENHANCED PWM AUTO-
SH UTDOWN MODE
The PWM mode supports an Auto-Shutdow n m ode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
ECCPAS<2:0> bits of the ECCP AS regi ster . A shutdown
event may be generated by:
•A logic0’ on the INT pin
Comparator C1
Comparator C2
Setting the ECCPASE bit in firmware
A shutdown condition is indicated by the ECCPASE
(Auto-Shutdown Event Status) bit of the ECCPAS
register. If the bit is a0’, t he P WM pin s ar e oper ating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state.
When a shutdow n event oc curs, two things ha ppen:
The ECCPASE bit is set to ‘1’. The ECCPASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 1 1.6.5 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [P1A/P1C] and [P1B/P1D]. The state
of each pin pair is determined by the PSSAC and
PSSBD bits of the ECCPAS register. Each pin pair may
be placed into one of three st ates:
Drive logic ‘1
Drive logic ‘0
Tri-state (high-impedance)
FIGURE 11 -14: AUTO-SHUTDOWN BLOCK DIAGRAM
PSSAC<1>
TRISx P1A
0
1
P1A_DRV
PSSAC<0>
PSSBD<1>
TRISx P1B
0
1
PSSBD<0>
P1B_DRV
PSSAC<1>
TRISx P1C
0
1
PSSAC<0>
P1C_DRV
PSSBD<1>
TRISx P1D
0
1
PSSBD<0>
P1D_DRV
000
001
010
011
100
101
110
111
From Com parato r C2
From Com parat or C 1
ECCPAS<2:0>
R
DQ
S
ECCPASE
From Data Bus
Write to ECCPASE
PRSEN
INT
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REGISTER 11-3: ECCPAS: ENHANCED CAPTURE/COM PARE/PWM AUTO-SHUTDOWN
CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
0 = ECCP outputs are operating
bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits
000 = Auto-Shutdown is disabled
001 = Comparator C1 output high
010 = Comparator C2 output high(1)
011 = Either Comp arato rs outp ut is high
100 =V
IL on INT pin
101 =V
IL on INT pin or Comparator C1 output high
110 =V
IL on INT pin or Comparator C2 output high
111 =VIL on INT pin or either Comparators output is high
bit 3-2 PSSACn: Pins P1A and P1C Shutdown State Control bits
00 = Drive pins P1A and P1C to ‘0
01 = Drive pins P1A and P1C to ‘1
1x = Pins P1A and P1C tri-state
bit 1-0 PSSBDn: Pins P1B and P1D Shutdown State Control bits
00 = Drive pins P1B and P1D to ‘0
01 = Drive pins P1B and P1D to ‘1
1x = Pins P1B and P1D tri-state
Note 1: If C2SYNC is enabled, the shutdown will be delayed by Timer1.
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
2: Writing to the ECCPASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
© 2009 Microchip Technology Inc. DS41291F-page 143
PIC16F882/883/884/886/887
FIGURE 11-15: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0)
11.6.5 AUTO -RESTART MODE
The Enhanced PWM can be configured to automati-
cally restart the PWM signal once the auto-shutdown
condition has been removed. Auto-restart is enabled by
setting the PRSEN bit in the PWM1CON register.
If auto-restart is enabled, the ECCPASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
ECCPASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 11 -16: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1)
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs Shutdown
Event Clears PWM
Resumes
Start of
PWM Period
ECCPASE
Cleared by
Firmware
PWM Period
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs Shutdown
Event Cle ars PWM
Resumes
PWM Period
Start of
PWM Period
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11.6.6 PROGRAMMABLE DEAD-BAND
DELAY MODE
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If b oth the u pper and lowe r power swit ches ar e
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through c urre nt) wi ll flow throu gh bot h po w er sw itc hes ,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the si gnal tra nsition fro m the no n-acti ve st ate
to the active state. See Figure 1 1-17 for illu stration. The
lower sev en b it s of th e as s oci ate d PWM 1CO N reg ist er
(Register 11-4) sets the delay period in terms of
microcontrolle r instruction cycles (TCY or 4 TOSC).
FIGURE 11-17: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11 -1 8: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-B and Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
V-
Load
+
V
-
+
V
-
Standard Half-Bridge Circuit (“Push-P ull ”)
© 2009 Microchip Technology Inc. DS41291F-page 145
PIC16F882/883/884/886/887
REGISTER 11-4: PWM1CON: ENHANCED PWM CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 PRSEN: PWM Restart Enable bit
1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
PDCn = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal
should transition active and the actual time it transitions active.
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11.6.7 PULSE STEERING MODE
In Sing le Output mode, pul se steering all ows any of the
PWM pins to be t he modulated sig nal . Addi tio nal ly, the
same PWM signal can be simultaneously available on
multiple pins.
Once the Single Output mode is selected
(CCP1M<3:2> = 11 and P1M<1:0> = 00 of the
CCP1CON register), the user firmware can bring out
the same PWM signal to one, two, three or four output
pins by setting the appropriate STR<D:A> bits of the
PSTRCON register, as shown in Table 11-5.
While th e PWM Steering mode is ac ti ve, CCP1M<1:0 >
bits of the CCP1CON register select the PWM output
polarity for the P1<D:A> pins.
The PWM auto-shutdown operation also applies to
PWM Steering mode as described in Section 11.6.4
“Enhanced PWM Auto-shutdown mode”. An auto-
shutdown event will only affect pins that have PWM
outputs enabled.
Note: The associated TRIS bits must be set to
output (‘0) to enable the pin output driver
in or der to s ee the PWM s ign al on the pi n.
REGISTER 11-5: PSTRCON: PULSE STEERING CONTROL REGISTER(1)
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
STRSYNC STRD STRC STRB STRA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4 STRSYNC: S t eeri ng Syn c bit
1 = Output steering update occurs on next PWM period
0 = Output steering update occurs at the beginning of the instruction cycle boundary
bit 3 STRD: S teering Enable bit D
1 = P1D pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1D pin is assigned to port pin
bit 2 STRC: S teering Enable bit C
1 = P1C pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1C pin is assigned to port pin
bit 1 STRB: S teering Enable bit B
1 = P1B pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1B pin is assigned to port pin
bit 0 STRA: S teering Enable bit A
1 = P1A pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1A pin is assigned to port pin
Note 1: The PWM Steering mode is available only wh en the CCP1CON regist er bits CCP1M<3:2> = 11 and
P1M<1:0> = 00.
© 2009 Microchip Technology Inc. DS41291F-page 147
PIC16F882/883/884/886/887
FIGURE 11-1 9: SIMPLIFIED STEE R ING
BLOCK DIAGRAM
1
0TRIS
P1A pin
PORT Data
P1A Signal
STRA
1
0TRIS
P1B pin
PORT Data
STRB
1
0TRIS
P1C pin
PORT Data
STRC
1
0TRIS
P1D pin
PORT Data
STRD
Note 1: Port outputs are configured as shown when
the CCP1CON register bits P1M<1:0> = 00
and CCP1M<3:2> = 11.
2: Single PWM output requires setting at least
one of the STRx bits.
CCP1M1
CCP1M0
CCP1M1
CCP1M0
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11.6.7.1 Steering Synchronization
The STRSYNC bit of the PSTRCON register gives the
user two selections of when the steering event will
happen. When the STRSYNC bit is ‘0’, the steering
event will happen at the end of the instruction that
writes to the PSTRCON register. In this case, the
output signal at the P1<D:A> pins may be an
incomplete PWM waveform. This operation is useful
when the user firmware needs to immediately remove
a PWM signal from the pin.
When the STRSYNC bit is ‘1’, the effective steering
update will happen at the beginning of the next PWM
period. In this case, steering on/off the PWM output will
always produce a complete PWM waveform.
Figur es 1 1-20 an d 1 1-21 ill ustrate the timi ng diagrams
of the PWM steering depending on the STRSYNC
setting.
FIGURE 11-20: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRSYNC = 0)
FIGURE 11 -2 1: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION
(STRSYNC = 1)
PWM
P1n = PWM
STRn
P1<D:A> PORT Data
PWM Period
PORT Data
PWM
PORT Data
P1n = PWM
STRn
P1<D:A> PORT Data
© 2009 Microchip Technology Inc. DS41291F-page 149
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TABLE 11-6: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1
TABLE 11-7: REGISTERS ASSOCIATED WITH PWM AND TIMER2
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
CCPR1L Capture/Compare/PWM Regist er 1 Low Byte (LSB) xxxx xxxx xxxx xxxx
CCPR1H Ca pture/Compare/PWM Register 1 High By te (MS B) xxxx xxxx xxxx xxxx
CCPR2L Capture/Compare/PWM Regist er 2 Low Byte (LSB) xxxx xxxx xxxx xxxx
CCPR2H Ca pture/Compare/PWM Register 2 High By te (MS B) xxxx xxxx xxxx xxxx
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —T1GSSC2SYNC 0000 --10 0000 --10
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 0000 00-0
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF 0000 00-0 0000 00-0
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 0000 0000
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture and
Compare.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
CCP2CON DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000
ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PR2 Timer2 Perio d Regi ste r 1111 1111 1111 1111
PSTRCON STRSYNC STRD STRC STRB STRA ---0 0001 ---0 0001
PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000
T2CON TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
TMR 2 Timer2 Modul e Reg ist er 0000 0000 0000 0000
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
PIC16F882/883/884/886/887
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NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 151
PIC16F882/883/884/886/887
12.0 ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
system. Full-Duplex mode is useful for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These device s typ icall y do n ot have inter nal cl ocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
The EUSART m odule includes the follow ing capabilities:
Full-duplex asynchronous transmit and receive
Two-character input buffer
One -ch arac ter out put buffer
Programmable 8-bit or 9-bit character length
Address detection in 9-bit mode
Input buffer overrun error detection
Received character framing error detection
Hal f-du ple x sy nc hron ous master
Hal f-du ple x sy nc hron ous slave
Programmable clock polarity in synchronous
modes
Sleep operation
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
Automa tic detection and c alibration of the baud rate
Wak e-up on Break re ception
13-bi t Break character transm it
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 12-1 and Figure 12-2.
FIGURE 12-1: EUSART TRANSMIT BLOCK DIAGRAM
TXIF
TXIE
Interrupt
TXEN
TX9D
MSb LSb
Data Bus
TXREG Register
Transmit Shift Register (TSR)
(8) 0
TX9
TRMT SPEN
TX/CK pin
Pin Buffer
and Control
8
SPBRG
SPBRGH
BRG16
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
••
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FIGURE 12-2: EUSART RECEIVE BLOCK DIAGRAM
The operation of the EUSART module is controlled
through three registers:
Transmit Status and Control (TXSTA)
Receive Status and Control (RCSTA)
Baud Rate Control (BAUDCTL)
These registers are detailed in Register 12-1,
Regi st er 12 -2 an d R e gi s ter 12-3, respec ti v ely.
RX/DT pin
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR
FERR
RSR Register
MSb LSb
RX9D RCREG Register FIFO
Interrupt
RCIF
RCIE
Data Bus
8
Stop START
(8) 7 10
RX9
• • •
SPBRGSPBRGH
BRG16
RCIDL
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generato r
© 2009 Microchip Technology Inc. DS41291F-page 153
PIC16F882/883/884/886/887
12.1 EUSART Asynchronous Mode
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH mark state which
represents a ‘1’ data bit, and a VOL space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output l evel of that bit wi thout returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the mark state. Each character
transmission consists of one Start bit followed by eig ht
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is 8 bits. Each transmitted bit persists for a period
of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud
Rate Generator is used to derive standard baud rate
frequencies from the system oscillator. See Table 12-5
for examples of baud rate configurations.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
indepen dent, but share th e sa me dat a format and bau d
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data b it.
12.1.1 EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 12-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREG register.
12.1.1.1 Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
•TXEN = 1
SYNC = 0
SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the TXEN bit of the TXSTA register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCST A register enables the EUSART and automatically
configures the TX/CK I/O pin as an output. If the TX/CK
pin is shared with an analog peripheral the analog I/O
function must be disabled by clearing the corresponding
ANSEL bit.
12.1.1.2 Transmitting Data
A transmission is initiated by writing a character to the
TXREG register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR re gister. If the T SR still contains
all or part of a previous character, the new character
data is held in the TXREG until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREG is then tran sferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bit s
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREG.
12.1.1.3 Transmit Interrupt Flag
The TXIF interrupt flag bit of the PIR1 register is set
whenever the EUSART transmitter is enabled and no
character is being held for transmission in the TXREG.
In other words, the TXIF bit is only clear when the TSR
is busy with a character and a new char acter ha s been
queued for transmission in the TXREG. The TXIF flag bit
is not cleared immediately upon writing TXREG. TXIF
becomes valid in the second instruction cycle following
the write execut ion. Polling TXIF immediately following
the TXREG write will return invalid results. The TXIF bit
is read-only, it cannot be set or cleared by software.
The TXIF interrupt can be enabled by setting the TXIE
interrupt enable bit of the PIE1 register. However, the
TXIF fla g bit will be set wheneve r the TXR EG is emp ty,
regardless of the state of TXIE enable bit.
To use interrupts when transmitting data, set the TXIE
bit only when there is more data to send. Clear the
TXIE i nterrupt en able bi t upon w riting the last charact er
of the transmission to the TXREG.
Note 1: When the SPEN bit is set the RX/DT I/O pin
is automatically configured as an input,
regardless of the state of the corresponding
TRIS bit and whether or not the EUSART
receiver is enabled. The RX/DT pin data
can be read via a normal PORT read but
PORT latch data output is precluded.
2: The TXIF transmitter interrupt flag is set
when the TXEN enable bit is set.
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12.1.1.4 T SR Status
The TRMT bit of the TXSTA register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREG. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user has to
poll this bit to determine the TSR status.
12.1.1.5 Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTA register is set the
EUSART will shif t 9 bits out for each character transmit-
ted. The TX9D bit of the TXSTA register is the ninth,
and Most Significant, data bit. When transmitting 9-bit
data, the TX9D data bit must be written before writing
the 8 Least Sig nificant bit s into the TXREG. All nine bit s
of data will be transferred to the TSR shift register
immediately after the TXREG is written.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 12.1.2.7 “Address
Detection” for more inform ation on the Addre ss mode.
12.1.1.6 Asynchronous Transmission Set-up:
1. Initialize the SPBRGH, SPBRG register pair and
the BRGH and BRG16 bits to achieve the d esired
baud rate (see Section 12.3 “EUSART Baud
Rate Generator (BRG)”).
2. Enable the as y nch ron ous serial port by cle arin g
the SYNC bit and setting the SPEN bit.
3. If 9-bit tran sm is si on is d es ire d, s et th e TX9 con-
trol bit. A set nin th data bi t will indicat e that the 8
Least Significant data bits are an address when
the receiver is set for address detection.
4. Enable the transmission by setting the TXEN
contr ol bit . Thi s wi ll c aus e th e TXI F i nte rrup t bi t
to be set.
5. If interrupts are desired, set the TXIE interrupt
enable bit of the PIE1 register. An interrupt will
occur immediately provided that the GIE and
PEIE bits of the INTCON register are also set.
6. If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
7. Load 8-bit data into the TXREG register. This
will start the transmission.
FIGURE 12-3: ASYNCHRONOUS TRANSMISSION
FIGURE 12-4: ASYNCHR ON OUS TRANSMISSION (BACK TO BACK)
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
Word 1 Stop bit
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG Word 1
BRG Output
(Shift Clock)
TX/CK
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Tran s mit Sh ift
Reg. Empty Flag)
1 TCY
pin
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
TX/CK
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Start bit Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
pin
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
© 2009 Microchip Technology Inc. DS41291F-page 155
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TABLE 12-1: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Va lue on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Asynchronous Transmission.
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12.1.2 EUSART ASYNCHRONOUS
RECEIVER
The Asynchronous mode is typically used in RS-232
systems. The receiver block diagram is shown in
Figure 12-2. The d ata is received on th e RX/DT pin and
drives the data recov ery block. The data recovery block
is actually a high-speed shifter operating at 16 times
the baud rate, whereas the serial Receive Shift
Register (RSR) op erat es at the bit rat e. When all 8 or 9
bits of the character have been shifted in, they are
immediately transferred to a two character First-In-
First-Out (FIFO) memory. The FIFO buffering allows
receptio n of two complete characters and the s t art of a
third cha rac ter be fore software must start servi ci ng th e
EUSART receiver. The FIFO and RSR registers are not
direc tly ac cessible b y s oftwar e. Ac cess to the r e ce ived
data is via the RCREG register.
12.1.2.1 Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operatio n by configuring the fol lowing three control bits:
CREN = 1
SYNC = 0
SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the CREN bit of the RCST A register enables the
receiver circuitry of the EUSART. Clearing the SYNC bit
of the TXSTA register configures the EUSART for asyn-
chronous operation. Setting the SPEN bit of the RCSTA
register enables the EUSART and automatically config-
ures the RX/DT I /O pin as an in put. If t he RX/DT pin is
shared with an analog peripheral the analog I/O function
must be disabled by clearing the corresponding ANSEL
bit.
12.1.2.2 Receiving Data
The receiver data recovery circuit initiates character
receptio n on t he fallin g edge of the first bit. Th e f irst bit,
also known as the Start bit, is always a zero. The data
recovery circuit co unt s one-h alf bi t time to the c enter of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit c ounts a full bit time to the ce nter of the
next bit. The bit is then sampled by a majority detect
circuit and the resultin g ‘0’ or ‘1’ is sh ifted int o the RSR.
This repeats until all data bits have been sampled and
shif ted into the RSR. One final bit time is measured and
the le ve l samp le d . Thi s is th e Sto p bi t, wh ic h is alwa ys
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
charact er , otherwise th e framing error is c leared for thi s
character. See Section 12.1.2.4 “Receive Framing
Error” for more information on framing errors.
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCIF interrupt
flag bit of the PIR1 register is set. The top character in
the FIFO is transferred out of the FIFO by reading the
RCREG register.
12.1.2.3 Receive Interrupts
The RCIF interrupt flag bit of the PIR1 register is set
whenever the EUSAR T receiver i s enabled and there is
an unread character in the receive FIFO. The RCIF
interrupt fla g bit is read-o nly, it ca nnot b e set or cl eared
by software.
RCIF interrupts are enabled by setting all of the
following bits:
RCIE interrupt enable bit of the PIE1 register
PEIE peripheral interrupt enable bit of the INT-
CON register
GIE global interrupt enable bit of the INTCON
register
The RCIF interrupt flag bit will be set when there is an
unread c haracter in the FIFO, regardless of the st ate of
interrupt enable bits.
Note: When the SPEN bit is set the TX/CK I/O
pin is automatically configured as an
output, regardless of the state of the
corresp onding TRI S bit and whe ther or not
the EUSART transmitter is enabled. The
PORT latch is disconnected from the
output driver so it is not possible to use the
TX/CK pin as a general purpose output.
Note: If the receive FIFO is overrun, no addi tional
characters will be received until the overrun
condition is cleared. See Section 12.1.2.5
“Receive Overrun Error” for more
information on overrun errors.
© 2009 Microchip Technology Inc. DS41291F-page 157
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12.1.2.4 Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indic ates t hat a Stop bit was not seen at the e xpect ed
time. The framing error status is accessed via the
FERR bit of the RCSTA register. The FERR bit
represen ts the s ta tus o f the top u nread charac ter in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.
The FERR bit is read-only and only applies to the top
unre ad char acter in the re ceive F IFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTA register which resets the EUSART.
Clearing the CREN bit of the RCSTA register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
12.1.2.5 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun erro r will be generated If a thi rd character, in its
entirety , is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTA register is set.
The characters already in the FIFO buffer can be read
but no additional characters will be received until the
error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTA register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTA register.
12.1.2.6 Rec ei vi ng 9-bit Chara cte rs
The EUS ART support s 9-bit c haracter rece ption. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9 bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth and Most Significant data bit of the top unread
charact er in the recei ve FIFO. When read ing 9- bit dat a
from the receive FIFO buffer, the RX9D data bit must
be read befo re reading the 8 L east Signifi cant bits fro m
the RCREG.
12.1.2. 7 Addres s Detecti on
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTA
register.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
rece iv e FI F O bu ffe r, there by s et t i ng th e R CI F i nte r r up t
bit. All other characters will be ignored.
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop b it oc cu rs. When use r s oftware de tec t s th e end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
Note: If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREG will not clear the FERR bit.
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12.1.2.8 Asynchronous Reception Set-up:
1. Initialize the SPBRGH, SPBRG reg ister pair and
the BRGH and BRG16 bits to achieve the
des i red baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit reception is desired, set the RX9 bit.
5. Enable reception by setting the CREN bit.
6. The RCIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCIE interrupt enable bit was also set.
7. Read the RCSTA register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data b it.
8. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register.
9. If an overrun occurred, clear the OERR flag by
clearing the C REN r eceiver e nable bit.
12.1.2.9 9-bit Address Detection Mode Set-up
This m ode w o uld ty pi cally be us ed in RS-485 sy ste ms .
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGH, SPBRG register p air and
the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. Enable 9-bit reception by setting the RX9 bit.
5. Enable a ddress d etection by setti ng the ADD EN
bit.
6. Enable reception by setting the CREN bit.
7. The RCIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will b e gener ated if t he RCIE inte rrupt en able b it
was also set.
8. R ead the RCS TA regi ste r to get th e err or f lag s.
The ninth data bit will always be set.
9. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register. Software determines if this is the
device’s address.
10. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
11. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
FIGURE 12-5: ASYNCHRONOUS RECEPTION
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit Start
bit
bit 7/8 Stop
bit
RX/DT pin
Reg
Rcv Buffer Reg
Rcv Shift
Read Rcv
Buffer Reg
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG Word 2
RCREG
Stop
bit
Note: This timin g diagram sho ws three words appearing on the RX input. The RCREG (receive buffer) is r ead after the third word,
causing the OERR (overrun) bit to be set.
RCIDL
© 2009 Microchip Technology Inc. DS41291F-page 159
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TABLE 12-2: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Asynchronous Reception.
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DS41291F-page 160 © 2009 Microchip Technology Inc.
12.2 Clock Accuracy with
Asynchronous Operation
The factory calibrates the Internal Oscillator block out-
put (INTOSC). However, the INTOSC frequency may
drift as VDD or temperature changes, and this directly
af fects the asynch ronous baud rate. T wo methods ma y
be used to adjust the baud rate clock, but both require
a reference clock source of some kind.
The first (preferred) method uses the OSCTUNE
register to adjust the INTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See Section 4.5
“Internal Clock Modes” for more information.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 12.3.1 “Auto-
Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
REGISTER 12-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission co mpleted
Synchronous mode:
Don’t care
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode :
Unused in this mode
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0 TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
© 2009 Microchip Technology Inc. DS41291F-page 161
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REGISTER 12-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single r eceive
This bit is cleared after reception is complete.
Synchronou s mod e – Slave
Don’t care
bit 4 CREN: Conti nuous Receive Enab le bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables contin uou s r ece iv e
bit 3 ADDEN: Address Detect Enab le bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2 FERR: Framing Error bit
1 = Fra ming error (can be updated by reading RCREG register and receive next valid byte)
0 = No f raming error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: Ninth bit of Received D ata
This can be address/data bit or a parity bit and must be calculated by user firmware.
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REGISTER 12-3: BAUDCTL: BAUD RATE CONTROL REGISTER
R-0 R-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
ABDOVF RCIDL SCKP BRG16 WUE ABDEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1 = Auto-baud timer overflowed
0 = Auto-baud timer did not overflow
Synchronous mode:
Don’t care
bit 6 RCIDL: Receive Idle Flag bit
Asynchronous mode:
1 = Receiver is Idle
0 = Start bit has been received and the receiver is receiving
Synchronous mode:
Don’t care
bit 5 Unimplemented: Read as ‘0
bit 4 SCKP: Synchronou s Clock Polari ty Select bit
Asynchronous mode:
1 = Transmit inverted data to the RB7/TX/CK pin
0 = Transmit non-inverted data to the RB7/TX/CK pin
Synchronous mode:
1 = Data is clocked on rising edge of the clock
0 = Data is clocked on falling edge of the clock
bit 3 BRG16: 16-bit Baud Rate Generator bit
1 = 16-bit Baud Rate Ge ner ator is used
0 = 8-bit Baud Rate Generator is used
bit 2 Unimplemented: Read as ‘0
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = Receiv er is waiting fo r a falling ed ge. No charac ter will be rece ived byte RCIF will be se t. WUE will
automatically clear after RCIF is set.
0 = Receiv er is operatin g normally
Synchronous mode:
Don’t care
bit 0 ABDEN: Auto-Baud Dete ct Enab le bit
Asynchronous mode:
1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0 = Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
© 2009 Microchip Technology Inc. DS41291F-page 163
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12.3 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By defau lt, the BRG ope rates in 8-bit mode . Setting th e
BRG16 bit of the BAUDCTL register selects 16-bit
mode.
The SPBRGH, SPBRG register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXST A
register and the BRG16 bit of the BAUDCTL register. In
Synchronous mode, the BRGH bit is ignored.
Table 12-3 contains the formulas for determining the
baud rate . Example 12-1 provides a s ample calcul ation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 12-3. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to redu ce th e baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
Writing a new value to the SPBRGH, SPBRG register
pair c auses the BRG timer to be reset (or cleared). Thi s
ensures that the BRG do es not wait fo r a timer overflow
before outputting the new baud rate.
If the s ys tem c lo ck is changed duri ng an active r ece iv e
operation, a receive error or data loss may result. To
avoid thi s problem , check the status of the RCID L bit to
make sure that the receive operation is Idle before
changing the system clock.
EXAMPLE 12-1: CALCULATING BAUD
RATE ERROR
TABLE 12-3: BAUD RATE FORMULAS
TABLE 12-4: REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
For a devi ce w ith FOSC of 16 MHz, desired baud rate
of 9600, Asynch rono us mode, 8-bit BRG:
Solving for SPBRGH:SPBRG:
X
FOSC
Desired Baud Rate
---------------------------------------------
64
--------------------------------------------- 1=
Desired Baud Rate FOSC
64 [SPBRGH:SPBRG] 1+()
---------------------------------------------------------------------=
16000000
9600
------------------------
64
------------------------1=
25.042[]25==
Calculated Baud Rate 16000000
64 25 1+()
---------------------------=
9615=
Error Calc. Baud Rate Desired Baud Rate
Desired Baud Rate
--------------------------------------------------------------------------------------------=
9615 9600()
9600
---------------------------------- 0 . 1 6 %==
Configuration Bits BRG/EUSART Mode Baud Rate Form ula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/ [64 (n+1)]
001 8-bit/Asynchronous FOSC/[16 (n+1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n+1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t car e , n = valu e of SPBR GH, SPBRG register p a ir
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, - = unimplemented read as ‘0’. Shaded cells are not used for the Baud Rate Generator.
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DS41291F-page 164 © 2009 Microchip Technology Inc.
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300—— —— —— ——
1200 1221 1.73 255 1200 0.00 239 1200 0.00 143 1202 0.16 103
2400 2404 0.16 129 2400 0.00 119 2400 0.00 71 2404 0.16 51
9600 9470 -1.36 32 9600 0.00 29 9600 0.00 17 9615 0.16 12
10417 10417 0.00 29 10286 -1.26 27 10165 -2.42 16 10417 0.00 11
19.2k 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8
57.6k 57.60k 0.00 7 57.60k 0.00 2
115.2k
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300 0.16 207 300 0.00 191 300 0.16 103 300 0.16 51
1200 1202 0.16 51 1200 0.00 47 1202 0.16 25 1202 0.16 12
2400 2404 0.16 25 2400 0.00 23 2404 0.16 12
9600 9600 0.00 5
10417 10417 0.00 5 10417 0.00 2
19.2k 19.20k 0.00 2
57.6k 57.60k 0.00 0
115.2k
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 —— —— —— ——
1200
2400 —— 2404 0.16 207
9600 9615 0.16 129 9600 0.00 119 9600 0.00 71 9615 0.16 51
10417 10417 0.00 119 10378 -0.37 110 10473 0.53 65 10417 0.00 47
19.2k 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 19231 0.16 25
57.6k 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11 55556 -3.55 8
115.2k 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5
© 2009 Microchip Technology Inc. DS41291F-page 165
PIC16F882/883/884/886/887
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300 0.16 207
1200 1202 0.16 207 1200 0.00 191 1202 0.16 103 1202 0.16 51
2400 2404 0.16 103 2400 0.00 95 2404 0.16 51 2404 0.16 25
9600 9615 0.16 25 9600 0.00 23 9615 0.16 12
10417 10417 0.00 23 10473 0.53 21 10417 0.00 11 10417 0.00 5
19.2k 19.23k 0.16 12 19.2k 0.00 11
57.6k 57.60k 0.00 3
115.2k 115.2k 0.00 1
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303 299.9 -0.02 1666
1200 1200 -0.03 1041 1200 0.00 959 1200 0.00 575 1199 -0.08 416
2400 2399 -0.03 520 2400 0.00 479 2400 0.00 287 2404 0.16 207
9600 9615 0.16 129 9600 0.00 119 9600 0.00 71 9615 0.16 51
10417 10417 0.00 119 10378 -0.37 110 10473 0.53 65 10417 0.00 47
19.2k 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 19.23k 0.16 25
57.6k 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11 55556 -3.55 8
115.2k 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300.1 0.04 832 300.0 0.00 767 299.8 -0.108 416 300.5 0.16 207
1200 1202 0.16 207 1200 0.00 191 1202 0.16 103 1202 0.16 51
2400 2404 0.16 103 2400 0.00 95 2404 0.16 51 2404 0.16 25
9600 9615 0.16 25 9600 0.00 23 9615 0.16 12
10417 10417 0.00 23 10473 0.53 21 10417 0.00 11 10417 0.00 5
19.2k 19.23k 0.16 12 19.20k 0.00 11
57.6k 57.60k 0.00 3
115.2k 115.2k 0.00 1
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
PIC16F882/883/884/886/887
DS41291F-page 166 © 2009 Microchip Technology Inc.
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 9215 300.0 0.00 6666
1200 1200 -0.01 4166 1200 0.00 3839 1200 0.00 2303 1200 -0.02 1666
2400 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151 2401 0.04 832
9600 9597 -0.03 520 9600 0.00 479 9600 0.00 287 9615 0.16 207
10417 10417 0.00 479 10425 0.08 441 10433 0.16 264 10417 0 191
19.2k 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143 19.23k 0.16 103
57.6k 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47 57.14k -0.79 34
115.2k 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23 117.6k 2.12 16
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
Actual
Rate %
Error
SPBRG
value
(decimal)
300 300.0 0.01 3332 300.0 0.00 3071 299.9 -0.02 1666 300.1 0.04 832
1200 1200 0.04 832 1200 0.00 767 1199 -0.08 416 1202 0.16 207
2400 2398 0.08 416 2400 0.00 383 2404 0.16 207 2404 0.16 103
9600 9615 0.16 103 9600 0.00 95 9615 0.16 51 9615 0.16 25
10417 10417 0.00 95 10473 0.53 87 10417 0.00 47 10417 0.00 23
19.2k 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 25 19.23k 0.16 12
57.6k 58.82k 2.12 16 57.60k 0.00 15 55.56k -3.55 8
115.2k 111.1k -3.55 8 115.2k 0.00 7
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
© 2009 Microchip Technology Inc. DS41291F-page 167
PIC16F882/883/884/886/887
12.3.1 AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a receiv ed 55h (ASCII “U ”) which is the Sync charac ter
for the LIN bus. The unique feature of this character is
that it has five rising edges in cluding the S top bit ed ge.
Setting the ABDEN bit of the BAUDCTL register starts
the auto-baud calibration sequence (Figure 12-6).
While the ABD sequence takes place, the EUSART
state machine is held in Idle. On the first rising edge of
the receive line, after the Start bit, the SPBRG begins
counting up using the BRG counter clock as shown in
Table 12-6. Th e fifth rising edge will occur on the RX pin
at the end of the eighth bit period. At that time, an
accumulated value totaling the proper BRG period is
left in the SPBRGH, SPBRG register pair, the ABDEN
bit is automatically cleared and the RCIF interrupt flag
is set. The value in the RCREG needs to be read to
clear the RCIF interrupt. RCREG content should be
discarded. When calibrating for modes that do not use
the SPBRGH register the user can verify that the
SPBRG register did not o verflow by check ing for 00h i n
the SPBRGH register.
The BRG au to-baud clock is d etermined by the BRG1 6
and BRGH bits as shown in Table 12-6. During ABD,
both the SPBRGH and SPBRG registers are used as a
16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGH
and SPBRG registers are clocked at 1/8th the BRG
base clo ck rate. The resu lting byte meas urement is the
average bit time when clocked at full speed.
TABLE 12-6: BRG COUNTER CLOCK RATES
FIGURE 12-6: AUTOMATIC BAUD RATE CALIBRATION
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection w ill occur on the by te
following the Break character (see
Section 12.3.2 “Auto-Wake-up on
Break”).
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscill ator freq uency
and EUSART baud rates are not possible.
3: During the auto-baud process, the auto-
baud counter starts counting at 1. Upon
completion of the auto-baud sequence, to
achieve maximum accuracy, subtract 1
from the SPBRGH:SPBRG register pair.
BRG16 BRGH BRG Base
Clock BRG ABD
Clock
00FOSC/64 FOSC/512
01FOSC/16 FOSC/128
10FOSC/16 FOSC/128
11 FOSC/4 FOSC/32
Note: During the ABD sequence, SPBRG and
SPBRGH registers are both used as a 16-bit
counter , independent of BRG16 setting.
BRG Value
RX pin
ABDEN bit
RCIF bit
bit 0 bit 1
(Interrupt)
Read
RCREG
BRG Clock
Start
Auto Cleared
Set by User
XXXXh 0000h
Edge #1 bit 2 bit 3
Edge #2 bit 4 bit 5
Edge #3 bit 6 bit 7
Edge #4 Stop bit
Edge #5
001Ch
Note 1: The ABD sequen ce requ i re s the EUSART modul e to be configur ed in Asyn chr ono us mod e
SPBRG XXh 1Ch
SPBRGH XXh 00h
RCIDL
PIC16F882/883/884/886/887
DS41291F-page 168 © 2009 Microchip Technology Inc.
12.3.2 AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controll er to w ake -up due to ac tiv ity on the R X/DT line.
This feature is available only in Asynchronous mode.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCTL regis ter. Onc e set, the normal
receive sequence on RX/DT is disabled, and the
EUSART remains in an Idle state, monitoring for a wake-
up event independent of the CPU mode. A wake-up
event consists of a high-to-low transition on the RX/DT
line. (This coincides with the start of a Sync Break or a
wake-up si gnal character fo r the LIN pro toc ol.)
The EUSART module generates an RCIF interrupt
coincident with the wake-up event. The interrupt is
generated s ynchronously to the Q clocks in normal CPU
operating modes (Figure 12-7), and asynchronously if
the device is in Sleep mode (Figure 12-8). The interrupt
condition is cleared by reading the RCRE G regis ter.
The WUE bit is automatically cleared by the low-to-high
transition on the RX line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
12.3.2.1 Special Considerations
Brea k Cha ract er
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
receive d, the low time from the S tar t bit to the firs t rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the ini tial cha racter in the transmi ssion mus t
be all ‘0s. This must be 10 or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
Oscillator Startup Time
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval , to allow eno ugh ti me fo r the se lecte d osc illat or
to start and provide proper initialization of the EUSART.
WUE Bit
The wake-up event causes a receive interrupt by
setting the RCIF bit. The WUE bit is cleared in
hardware by a rising edge on RX/DT. The interrupt
condition is then cleared in software by reading the
RCREG register and discarding its contents.
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before set ting the WU E bit. If a recei ve opera tion is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
FIGURE 12-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
Q1 Q2Q3 Q4Q1 Q2Q3Q4 Q1Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3Q4 Q1Q2 Q3Q4 Q1 Q2Q3Q4 Q1Q2 Q3Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit set by user Auto Cleared
Cleared due to User Read of RCREG
Note 1: The EUSART remains in Idle while the WUE bit is set.
© 2009 Microchip Technology Inc. DS41291F-page 169
PIC16F882/883/884/886/887
FIGURE 12-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
12.3.3 BREAK CHARACTER SEQUENCE
The EUSART mod ule ha s t he c apabili ty of s en din g th e
special Break chara cter sequences that are required by
the LIN bus standard. A Break character consists of a
St ar t bit, follo w ed by 12 ‘0bits and a Stop bit.
To send a Break character, set the SENDB and TXEN
bits of the TXSTA register. The Break character trans-
mission is then initiated by a write to the TXREG. The
value of data written to TXREG will be ignored and all
0’s will be transmitted.
The SENDB bit is automatically reset by hardware af ter
the correspon din g Stop bit is s ent. This al lo w s t he us er
to preloa d the trans mit FIFO with the n ext transm it byte
following the Break character (typically, the Sync
character in the LIN specification).
The TRMT bit of the TXSTA register indicates when the
transmit operation is active or Idle, jus t as it does during
normal transmission. See Figure 12-9 for the timing of
the Break character sequence.
12.3.3.1 Bre a k and Sync Trans mit Seque nce
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
1. Configure the EUSART for the desire d mode.
2. Set the TXEN and SENDB bits to enable the
Break sequence.
3. Load the TXREG with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREG to load the Sync character
into the transm it FIFO buf f er.
5. After the Break has been se nt, the SEN DB bit i s
reset by hardware and the Sync character is
then transm itte d.
When the TXREG bec omes em pty, as indica ted by th e
TXIF, the next data byte can be written to TXREG.
12.3.4 RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
The first method to detect a Break character uses the
FERR bit of the RCSTA regist er and the Rece ived data
as indicated by RCREG. The Baud Rate Generator is
assum ed to ha ve been initiali zed to the exp ec t ed bau d
rate.
A Break charac ter has been received when;
RCIF bit is set
FERR bit is set
RCREG = 00h
The second method uses the Auto-Wake-up feature
described in Section 12.3.2 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RX/DT, cause an
RCIF interru pt, and recei ve th e n ext d ata byte fol lowe d
by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCTL register before placing the EUSART in
Sleep mode.
Q1Q2Q3Q4 Q1Q2Q3Q4 Q1Q2Q3Q4 Q1 Q2Q3Q4 Q1Q2Q3Q4 Q1Q2Q3 Q4Q1Q2Q3 Q4 Q1Q2Q3Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit Set by User Auto Clear ed
Cleared due to User Read of RCREG
Sleep Command Executed
Note 1
Note 1: If the wake-up e vent requires long oscillator warm-up time, th e automatic cle aring of the WUE bit ca n occur wh ile the stposc sign al is
still active. This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
Sleep Ends
PIC16F882/883/884/886/887
DS41291F-page 170 © 2009 Microchip Technology Inc.
FIGURE 12-9: SEND BREAK CHARACTE R SEQUENCE
Write to TXREG Dummy Write
BRG Output
(Shift Clock)
S tart bit bit 0 bit 1 bit 11 Stop bit
Break
TXIF bit
(Transmit
Interrupt Flag)
TX (pin)
TRMT bit
(Transmit Shift
Empty Flag)
SENDB
(send Break
control bit)
SENDB Sam ple d Here Auto Cleared
© 2009 Microchip Technology Inc. DS41291F-page 171
PIC16F882/883/884/886/887
12.4 EUSART Synchronous Mode
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary cir-
cuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the
internal clock generation circuitry.
There are t wo signal lines in Synchronous mode: a bidi-
rectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and trans-
mit shift registers. Since the data line is bidirectional,
synchronous operation is half-duplex only. Half-duplex
refers to the fact that master and slave devices can
receive and transmit data but not both simultaneously.
The EUSART can operate as either a master or slave
device.
Start and Stop bits are not used in synchronous
transmissions.
12.4.1 SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for Synchronous Master operation:
SYNC = 1
CSRC = 1
SREN = 0 (for transmit); SREN = 1 (for receive)
CREN = 0 (for transmit); CREN = 1 (for receive)
SPEN = 1
Setting the SYNC bit of the TXSTA register configures
the de vi c e f or sy n ch ron ous opera tion. Setti ng the CSRC
bit of the TXSTA register configures the device as a
master. Clearing the SREN and CREN bits of the RCST A
regis ter ensures th at the dev ic e i s in th e Tra ns m it mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSAR T. If the RX/DT or TX/CK pins are shared with an
analog peripheral the analog I/O functions must be
disab le d by c le aring the co rre sp on ding ANSE L b its.
12.4.1.1 Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device config-
ured as a master transmit s the c lock on the TX/CK lin e.
The TX/CK pin output driver is automatically enabled
when the EUSART is configured for synchronous
transmit or receive operation. Serial data bits change
on the le ading edg e to ensure they are v alid at the trail-
ing edge of each clock. One clock cycle is generated
for each data bit. Only as many clock cycles are
generated as there are data bits.
12.4.1.2 Clock Polarity
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the SCKP
bit of the BAUDCTL register. Setting th e SCKP bit sets
the clock Idle state as high. When the SCKP bit is set,
the data changes on the falling edge of each clock.
Clearing the SCKP bit sets the Idle state as low. When
the SCKP bit is cle ared, the da ta ch anges on the rising
edge of each clock.
12.4.1.3 Synchronous Master Transmission
Data is transferred out of the device on the RX/DT pin.
The RX/DT and TX/C K pi n outp ut driv ers ar e aut oma t-
ically enabled when the EUSART is configured for
synchronous master transmit operation.
A transmission is initiated by writing a character to the
TXREG reg is ter. If the TSR st ill co nt a ins al l or part of a
previous character the new character dat a is held in the
TXREG until the last bit of the previous character has
been tr ansmitted. If this is the first charac ter , or the pre-
vious character has been completely flushed from the
TSR, the d ata in th e TXREG is im mediatel y transferre d
to the TSR. The transmission of the character com-
mences immediately following the transfer of the data
to the TSR from the TXREG.
Each data bit changes on the leading edge of the
master clock and remains valid until the subsequent
leading clock edge.
12.4.1.4 Synchronous Master Transmission
Set-up:
1. Initialize the SPBRGH, SPBRG register p air and
the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN, and CSRC.
3. Disable Receive mode by clearing bits SREN
and CREN.
4. Enable Transmit mode by setting the TXEN bit.
5. If 9-bit transmission is desired, set the TX9 bit.
6. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
7. If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
8. S tart transmission b y loadin g data to the TXREG
register.
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
PIC16F882/883/884/886/887
DS41291F-page 172 © 2009 Microchip Technology Inc.
FIGURE 12-10: SYNCHRONOUS TRANSMISSION
FIGURE 12-11: SYNCHRONOUS TRA NSM ISSION (THROUGH TXEN)
TABLE 12-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Master Transmission.
bit 0 bit 1 bit 7
Word 1 bit 2 bit 0 bit 1 bit 7
RX/DT
Write to
TXREG Reg
TXIF bit
(Interrupt Flag)
TXEN bit 1 1
Word 2
TRMT bi t
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.
pin
TX/CK p in
TX/CK pin
(SCKP = 0)
(SCKP = 1)
RX/DT pin
TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bi t
© 2009 Microchip Technology Inc. DS41291F-page 173
PIC16F882/883/884/886/887
12.4.1.5 Synchronous Master Reception
Data is received at the RX/DT pin. The RX/DT pin
output driver is automatically disabled when the
EUSAR T is config ured fo r synch ronous master receiv e
operation.
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTA register) or the Continuous Receive Enable bit
(CREN of the RCSTA register).
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the com pletio n of one c har acter. When CREN is set,
clocks are continuously generated until CREN is
cleared . If CREN is cleared in the middle of a c haracter
the CK clo ck sto p s imm ed iat ely and t he p a rtia l charac-
ter is discarded. If SREN and CREN are both set, then
SREN is cl eared at the co mpletion of the first cha racter
and CREN takes precedence.
To initiate reception, set either SREN or CREN. Data is
sampled at the RX/DT pin on the trailing edge of the
TX/CK clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
receive d into the RSR, the RCI F bit is set and the ch ar-
acter is automatically transferred to the two character
receive FIFO. The Least Sign ificant e ight bit s of the to p
character in the receive FIFO are available in RCREG.
The RCIF bit remains set as long as there are un-read
characters in the receive FIFO.
12.4.1.6 Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous wi th the data. A device configured
as a slave receives the cloc k on the TX/CK line . The TX/
CK pin output driver is automatically disabled when the
device is configured for synchronous slave transmit or
receive operation. Serial dat a bits change on the leading
edge to ensure they are valid at the trailing edge of each
clock. One data bit is transferred for each clock cycle.
Only as many clock cycles should be received as there
are data bits.
12.4.1.7 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be genera ted if a th ird charac ter , in it s
entirety, is received before RCREG is read to access
the FIFO. When this happens the OERR bit of the
RCSTA register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be recei ved until the erro r is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREG. If the overrun occurred when the CREN bit is
set then th e error conditi on is cleared b y either clearin g
the CREN bit of the RCSTA register or by clearing the
SPEN bit which resets the EUSART.
12.4.1.8 Receiving 9-bit Characters
The EUSAR T support s 9-bit chara cter receptio n. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9-bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth, and Most Significant, data bit of the top unread
charact er i n t he rec eiv e FIFO . Whe n r ead ing 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read befo re reading the 8 Le ast Signifi cant bit s from
the RCREG.
12.4.1.9 Synchronous Master Reception Set-
up:
1. Initialize the SPBRGH, SPBRG register pair for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Ensure bits CREN and SREN are clear.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit reception is desired, set bit RX9.
6. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
7. Interrupt fla g bit RCIF will be se t when recep tion
of a character is complete. An interrupt will be
generated if the enable bit RCIE was set.
8. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG register.
10. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register o r by clearing the SPEN bit which res ets
the EUSART.
PIC16F882/883/884/886/887
DS41291F-page 174 © 2009 Microchip Technology Inc.
FIGURE 12-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 12-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL SCKP BRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Master Reception.
CREN bit
RX/DT
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RXREG
0
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
0
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
TX/CK pin
TX/CK pin
pin
(SCKP = 0)
(SCKP = 1)
© 2009 Microchip Technology Inc. DS41291F-page 175
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12.4.2 SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for Synchronous slave operation:
SYNC = 1
CSRC = 0
SREN = 0 (for transmit); SREN = 1 (for receive)
CREN = 0 (for transmit); CREN = 1 (for receive)
SPEN = 1
Setting the SYNC bit of the TXSTA register configures the
device for synchronous operation. Clearing the CSRC bit
of the TX STA reg ister configur es the device as a slave.
Clearing the SREN and CREN bits of the RCST A register
ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART. If the RX/DT or TX/CK pins are shared with an
analog peripheral the analog I/O functions must be
disabled by clearing the corresponding ANSEL bits.
12.4.2.1 EUSART Synchronous Slave
Transmit
The operation of the Synchronous Master and Slave
modes are identical (see Section 12.4.1.3
“Synchronous Master Transmission”), except in the
case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
1. The first character will immediately transfer to
the TSR register and transmit.
2. The seco nd word wil l remain in TXR EG registe r .
3. The TXIF bit will not be set.
4. After the first character has been shifted out of
TSR, the TXREG register will transfer the second
character to the TSR and the TXIF bit will now be
set.
5. If the PEIE and TXIE bits are set, the interrupt
will wa ke the dev ice from Sleep and e xecute the
next instruction. If the GIE bit is also set, the
program will call the Interrupt Service Routine.
12.4.2.2 Synchronous Slave Transmission
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the CREN and SREN bits.
3. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit transmission is desired, set the TX9 bit.
5. Enable transmission by setting the TXEN bit.
6. If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
7. Start transmission by writing the Least
Significant 8 bits to the TXREG register.
TABLE 12-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL —SCKPBRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Slave Transmission.
PIC16F882/883/884/886/887
DS41291F-page 176 © 2009 Microchip Technology Inc.
12.4.2.3 EUSART Synchronous Slave
Reception
The operation of the Synchronous Master and Slave
modes is identical (Section 12.4.1.5 “Synchronous
Master Reception”), with the following exceptions:
Sleep
CREN bit is always set, therefore the receiver is
nev er Idle
SREN bit, whic h is a “don't ca re” in Slave mode
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is rec eived, th e RSR regist er will tran sfer the da ta
to the RCREG register . If the RCIE enable bit is set, the
interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE bit is also
set, the program will branch to the interrupt vector.
12.4.2.4 Synchronous Slave Reception Set-
up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
3. If 9-bit reception is desired, set the RX9 bit.
4. Set the CREN bit to enable reception.
5. The RCIF bit will be set when reception is
complete. An interrupt will be generated if the
RCIE bit was set.
6. If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTA
register.
7. Retrieve the 8 Least Significant bits from the
receive FIFO by reading the RCREG register.
8. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register o r by clearing the SPEN bit which res ets
the EUSART.
TABLE 12-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
NameBit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0Value on
POR, BOR
Value on
all other
Resets
BAUDCTL ABDOVF RCIDL —SCKPBRG16 WUE ABDEN 01-0 0-00 01-0 0-00
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
RCREG EUSART Receive Data Register 0000 0000 0000 0000
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
TXREG EUSART Transmit Data Register 0000 0000 0000 0000
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Slave Reception.
© 2009 Microchip Technology Inc. DS41291F-page 177
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12.5 EUSART Operation During Sleep
The EUSART WILL remain active during Sleep only in
the Synchronous Slave mode. All other modes require
the system clock and therefore cannot generate the
necessary signals to run the Transmit or Receive Shift
registers during Sleep.
Synchronous Slave mode uses an exte rnally generated
clock to run the Transmit and R eceive Shift regis ters.
12.5.1 SYNCHRONOUS RECEIVE DURING
SLEEP
To receive during Sleep, all the following conditions
must be met before entering Sleep mode:
RCSTA and TXSTA Control registers must be
configu red for Synchron ous Slave Recep tion (see
Section 12.4.2.4 “Synchronous Slave
Reception Set-up:”).
If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
The RCIF interrupt flag must be cleared by read-
ing RCREG to unload any pending characters in
the receive buffer.
Upon entering Sleep mode, the device will be ready to
accept data and clocks on the RX/DT and TX/CK pins,
respectively. When the da ta word has b een c om ple tel y
clocked in by the external device, the RCIF interrupt
flag bi t of th e PIR1 regis ter will be s et. The reb y, waking
the processor from Sleep.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the GIE global
interrupt enable bit of the INTCON register is also set,
then the Interrupt Service Routine at address 004h will
be called.
12.5.2 SYNCHRONOUS TRANSMIT
DURING SLEEP
To transmit during Sleep, all the following conditions
must be met before entering Sleep mode:
RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Transmission
(see Section 12.4.2.2 “Synchronous Slave
Transmission Set-up:”).
The TXIF interru pt flag must be c leared by writing
the output data to the TXREG, thereby filling the
TSR and transmit buffer.
9. If interrupts are desired, set the TXIE bit of the
PIE1 register and the PEIE bit of the INTCON
register.
Interru pt enable bits T XIE of the PIE1 re gister and
PEIE of the INTCON register must set.
Upon entering Sleep mode, the device will be ready to
accept clocks on TX/CK pin and transmit data on the
RX/DT pin. When the data word in the TSR has been
completely clocked out by the external device, the
pending byte in the TXREG will tra nsfer to the TSR an d
the TXIF flag will be set. Thereby, waking the processor
from Sleep. At this point, the TXREG is available to
accept another character for transmission, which will
clear the TXIF flag.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the GIE global
interrupt enable bit is also set th en the Interrupt Service
Routine at address 0004h will be called.
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NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 179
PIC16F882/883/884/886/887
13.0 MASTE R SYNCHRONOUS
SERIAL PORT (MS SP)
MODULE
13.1 Master SSP (MSSP) Module
Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
periphera l or m icroc ontroll er dev ices. Th ese p eriphera l
devices may be Serial EEPROMs, shift registers,
displa y drivers, A/D converte rs, etc. The MSSP modul e
can operate in one of two modes:
Serial Peripheral Interface (SPI)
Inter-Integrated CircuitTM (I2CTM)
- F ull Master mode
- Slave mode (with general address call).
The I2C interface supports the following modes in
hardware:
•Master mode
Multi-Master mode
Slave mode.
13.2 Control Registers
The MSSP module has three associated registers.
These include a STATUS register and two control
registers.
Register 13-1 shows the MSSP STATUS register
(SSPSTAT), Register 13-2 shows the MSSP Control
Register 1 (SSPCON), and Register 13-3 shows the
MSSP Control Register 2 (SSPCON2).
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REGISTER 13-1: SSPSTAT: SSP STATUS REGISTER
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A PSR/WUA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SMP: Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
In I2 C Master or Slave mode:
1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high speed mode (400 kHz)
bit 6 CKE: SPI Clock Edge Select bit
CKP = 0:
1 = Data transmitted on rising edge of SCK
0 = Data transmitted on falling edge of SCK
CKP = 1:
1 = Data transmitted on falling edge of SCK
0 = Data transmitted on rising edge of SCK
bit 5 D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4 P: Stop bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Res et)
0 = Stop bit was not detected last
bit 3 S: Start bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Re set)
0 = Start bit was not detected last
bit 2 R/W: Read/Write bit information (I2C mode only)
This bit holds the R / W bi t i nformati on fo llow ing the las t addr ess match. T hi s bi t is on ly v alid from the ad dres s ma tch to
the next Start bit, Stop bit, or not ACK bi t.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN, or ACKEN will indicate if the MSSP is in Idle mode.
bit 1 UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2 C mode only):
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
© 2009 Microchip Technology Inc. DS41291F-page 181
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REGISTER 13-2: SSPCON: SSP CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0
bit 7 bit 0
Legend:
R = Rea da b l e bi t W = Writab l e b it U = Un i m pl e m e nted bi t , re ad as ‘ 0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attemp ted while the I 2C condition s were n ot valid f or a trans mission t o be star ted
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software)
0 = No collision
bit 6 SSPOV: Receive Overflow Indicator bit
In SPI mode:
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow , the data in SSPSR
is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting
data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is
initia ted by writ ing t o th e SS PBUF re gist er (must be cle ar ed in sof twar e).
0 = No overflow
In I2 C mode:
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit
mode (must be cleared in software).
0 = No overflow
bit 5 SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly confi gured as input or output
In SPI mode:
1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In I2 C mode:
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: Clock Polarity Select bit
In SPI mode:
1 = Idle state for clock is a high lev el
0 = Idle state for clock is a low level
In I2 C Slave mode:
SCK release control
1 = Enable clock
0 = Holds clock low (clock stretch ). (Used to ensure data setup time.)
In I2 C Master mode:
Unused in this mode
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
0000 = SPI Master mode, cloc k = FOSC/4
0001 = SPI Master mode, cloc k = FOSC/16
0010 = SPI Master mode, cloc k = FOSC/64
0011 = SPI Master mode, clock = TMR2 output/2
0100 = SPI Slave mode, clock = SC K pin, SS pin co ntrol enabled
0101 = SPI Slave mode, clock = SC K pin, SS pin co ntrol disabled, SS can be used as I/O pin
0110 = I2C Slave mode, 7-bit address
0111 = I2C Slave mode, 10-bit address
1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))
1001 = Load Mask function
1010 = Reserved
1011 = I2C firmware controlled Master mode (Slave idle)
1100 = Reserved
1101 = Reserved
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
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REGISTER 13-3: SSPCON2: SSP CONTROL REGISTER 2
R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0000h) is received in the SSPSR
0 = General call address disabled
bit 6 ACKSTAT: Acknowledge Status bit (in I2C Master mode only)
In Master Transmit mode:
1 = Acknowledge was not received from slave
0 = Acknowledg e was receiv ed fr om slave
bit 5 ACKDT: Acknowledge Data bit (in I2C Master mode only)
In Master Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowl edge
0 = Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mo de only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0 = Acknowledge sequence idle
bit 3 RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only)
SCK Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0 SEN: Start Condition Enabled bit (in I2C Master mode only)
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
In Slave mode:
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
© 2009 Microchip Technology Inc. DS41291F-page 183
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13.3 SPI Mode
The SPI mode allows 8 bits of data to be sy nchronous ly
transmitted and received, simultaneously . All four modes
of SPI are supported. To accomplish communication,
typically thre e pins are use d:
Serial Data Out (SDO) – RC5/SDO
Serial Data In (SDI) – RC4/SDI/SDA
Serial Clock (SCK) – RC3/SCK/SCL
Additionally, a fourth pin may be used when in any
Slave mode of operation:
Slave Select (SS) – RA5/SS/AN4
13.3.1 OPERATION
When initializing the SPI, several options need to be
specif ied. This is done by progra mming the ap propriate
control bits SSPCON<5:0> and SSPSTAT<7:6>.
These control bits allow the following to be specified:
Master mode (SCK is the clock output)
Slave mode (SCK is the clock input)
Clock polarity (Idle state of SCK)
Data input sample phase (middle or end of data
output time)
Clock edge (output data on rising/falling edge of
SCK)
Clock rate (Master mode only)
Slave Select mode (Slave mode only)
Figure 13-1 shows the block diagram of the MSSP
module, when in SPI mode.
FIGURE 13-1: MSSP BLOCK DIAGRAM
(SPI MODE)
The MSSP consists of a transmit/receive shift register
(SSPSR) and a buf fer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR,
until the received data is ready. Once the 8 bits of data
have bee n received, that byte is m oved to the SSPBUF
register. Then, the buffer full-detect bit BF of the SSP-
STAT register and the interrupt flag bit SSPIF of the
PIR1 register are set. This double buffering of the
received data (SSPBUF) allows the next byte to start
reception before reading the data that was just
received. Any write to the SSPBUF register during
transmission/reception of data will be ignored, and the
write coll ision detect bi t WCOL of the SSPCON register
will be set. User software must clear the WCOL bit so
that it can be determined if the following write(s) to the
SSPBUF register completed successfully.
( )
Read Write
Internal
Data Bus
SSPSR Reg
SSPM<3:0>
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
TOSC
Prescaler
4, 16, 64
2
Edge
Select
2
4
Data to TX/RX in SSPSR
TRIS bit
2
SMP:CKE
SDI
SDO
SS
SCK
Note: I/O pins have diode protection to VDD and VSS.
SSPBU F Reg
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When the application software is expecting to receive
valid da ta, the SSPBUF shoul d be read before th e next
byte of data to transfer is written to the SSPBUF. The
buffer full bit BF of the SSPSTAT register indicates
when SSPBUF has been loaded wi th the recei ved data
(transmi ssion is co mplete). When th e SSPBUF is read,
the BF bit is cleared. This data may be irrelevant if the
SPI is only a tra nsmitter . Generally, the MSSP Interru pt
is used to determine when the transmission/reception
has completed. The SSPBUF must be read and/or
written. If the interrupt method is not going to be used,
then sof tware pol ling can be d one to ensure that a write
collision does not occur. Example 13-1 shows the
loading of the SSPBUF (SSPSR) for data transmission.
The SSPSR is not directly readable or writable, and
can only be accessed by addressing the SSPBUF
register. Additionally, the MSSP STATUS register
(SSPSTAT register) indicates the various status
conditions.
13.3.2 ENABLING SPI I/O
To enable the se rial port, SSP Enabl e bit SSPEN of the
SSPCON register must be set. To reset or reconfigure
SPI mode, clear the SSPEN bit, re-initialize the
SSPCON registers, and then set the SSPEN bit. This
configures the SDI, SDO, SCK and SS pins as serial
port pins. For the pins to behave as the serial port
function, some must have their data direction bits (in
the TRIS register) appropriately programmed. That is:
SDI i s a utom atically c ont roll ed by the SPI module
SDO must have TRISC<5> bit cleared
SCK (Master mode) must have TRISC<3> bit
cleared
SCK (Slave mode) must have TRISC<3> bit set
•SS
must have TRISA<5> bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
EXAMPLE 13-1: LOADING THE SSPBUF (SSPSR) REGISTER
LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)?
GOTO LOOP ;No
MOVF SSPBUF, W ;WREG reg = contents of SSPBUF
MOVWF RXDATA ;Save in user RAM, if data is meaningful
MOVF TXDATA, W ;W reg = contents of TXDATA
MOVWF SSPBUF ;New data to xmit
© 2009 Microchip Technology Inc. DS41291F-page 185
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13.3.3 MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK. The master determines
when the slave is to broadcast data by the software
protocol.
In Master mode, the data is transmitted/received as
soon as the SSPBUF registe r is written to. If the SPI is
only going to receive, the SDO output could be dis-
abled (programmed as an input). The SSPSR register
will co ntinue to shift in the signal pre sent on the SDI pin
at the programmed clock rate. As each byte is
received, it will be loaded into the SSPBUF register as
a normal received byte (interrupts and Status bits
appropriately set). This could be useful in receiver
applications as a “Line Activity Monitor” mode.
The clock polarity is selected by appropri ately pro gram-
ming the CKP bit of the SSPCON register. This, then,
would give waveforms for SPI communication as
shown in Figure 13-2, Figure 13-4 and Figure 13-5,
where t he MSb is tra nsmitted first. In Ma ster mode, th e
SPI clock ra te (bit rate) is user programmable t o be one
of the fo llowing:
•F
OSC/4 (or TCY)
•FOSC/16 (or 4 • TCY)
•F
OSC/64 (or 16 • TCY)
Timer2 output/2
This allows a maximum data rate (at 40 MHz) of
10.00 Mbps.
Figure 13-2 shows the waveforms for Master mode.
When the CKE bit of the SSPSTAT register is set, the
SDO dat a is val id befo re ther e is a cl ock edge on SCK.
The chang e of th e input sa mple is show n base d on the
state of the SM P bi t o f th e SSPSTAT register. T he time
when the SSPBUF is loaded with the received data is
shown.
FIGURE 13-2: SPI MODE WAVEFORM (MASTER MODE)
SCK
(CKP = 0
SCK
(CKP = 1
SCK
(CKP = 0
SCK
(CKP = 1
4 Clock
Modes
Input
Sample
Input
Sample
SDI bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
bit7 bit 0
SDI
SSPIF
(SMP = 1)
(SMP = 0)
(SMP = 1)
CKE = 1)
CKE = 0)
CKE = 1)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
(CKE = 0)
(CKE = 1)
Next Q4 Cycle
after Q 2
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13.3.4 SLAVE MODE
In Slave m ode , the data is trans mi tted and rece iv ed as
the external clock pulses appear on SCK. When the
last bit is latched, the SSPIF interrupt flag bit of the
PIR1 register is set.
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times, as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. When a byte is received, the device will wake-up
from Sleep.
13.3.5 SLAVE SELECT
SYNCHRONIZATION
The SS pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SS pin control
enabled (SSPCON<3:0> = 04h). The pin must not
be driven low for the SS pin to function as an input.
The Data Latch must be high. When the SS pin is
low, transmission and reception are enabled and
the SDO pin is driven. When the SS pin goes high,
the SDO pin is no longer driven, even if in the mid-
dle of a transmitted byte, and becomes a floating
output. External pull-up/pull-down resistors may be
desirable, depending on the application.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SS pin to
a high level, or clearing the SSPEN bit.
To emulate two-wire communication, the SDO pin can
be connected to the SDI pin. When the SPI needs to
operate as a receiver, the SDO pin can be configured
as an in put. This d isables transmissi ons from th e SDO.
The SDI can always be left as an input (SDI function),
since it can not cre ate a bus con f li ct .
FIGURE 13-3: SLAVE SY NCHRONIZATION WAVEFORM
Note 1: When the SPI is in Slave mode with SS
pin control enabled (SSPCON<3:0> =
0100), the SPI module will reset if the SS
pin is set to VDD.
2: If the SPI is us ed in Slave mo de with CK E
set (SSPSTAT register), then the SS pin
control must be enabled.
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI bit 7
SDO bit 7 bit 6 bit 7
SSPIF
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
bit 0
bit 7 bit 0
Next Q4 Cycle
after Q2
© 2009 Microchip Technology Inc. DS41291F-page 187
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FIGURE 13-4: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
FIGURE 13-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Optional
Next Q4 Cycle
after Q2
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
(SMP = 0)
CKE = 1)
CKE = 1)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Required
Next Q4 Cycle
after Q2
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13.3.6 SLEEP OPERATION
In Master mode, all module clocks are halted, and the
transmission/reception will remain in that state until the
device wakes from Sleep. After the device returns to
normal mode, the module will continue to transmit/
receive data.
In Slave mode, the SPI transmit/receive shift register
operat es asy nchron ously to the devi ce. Th is al lows the
device to be placed in Sleep mode and data to be
shifted into the SPI transmit/receive shift register.
When all eight bits have been received, the MSSP
inter rupt flag bit wi ll be set and , if enabled, will wake th e
device from Sleep.
13.3.7 EFFECTS OF A RESET
A Reset disable s the MSSP module and termina tes the
current transfer.
13.3.8 BUS MODE COMPATIBILITY
Table 13-1 shows the compatibility between the
standard SPI modes and the states of the CKP and
CKE control bits.
TABLE 13-1: SPI BUS MODES
There is al so a SMP b it that co ntrols when the da t a will
be sampled.
TABLE 13-2: REGISTERS ASSOCIATED WITH SPI OPERATION
Standard SPI Mode
Terminology Control Bits State
CKP CKE
0, 001
0, 100
1, 011
1, 110
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
RESETS
INTCON GIE/GIEH PEIE/GIEL T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 0000 0000
SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
Legend: x = unknow n , u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode.
Note 1: Bit 6 of PORTA, LA TA and TRISA are enabled in ECIO and RCIO Oscillator modes only. In all other oscillator modes, they are disabled and
read ‘0’.
© 2009 Microchip Technology Inc. DS41291F-page 189
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13.4 MSSP I2C Operation
The MSSP module in I2C mode, fully implements all
master and slave functions (including general call
support) and provides interrupts on S ta rt and S top bits in
hardware, to determine a free bus (Multi-Master mode).
The MSSP module implements the standard mode
specifications, as well as 7-bit and 10-bit addres sing.
T wo pins are used for dat a transfer . These are the RC3/
SCK/SCL pin, which is the clock (SCL), and the RC4/
SDI/S DA pin, which i s the data ( SDA). T he user mu st
configure these pins as inputs or outputs through the
TRISC<4:3> bits.
The MSSP module functions are enabled by setting
MSSP Enable bit SSPEN of the SSPCON register.
FIGURE 13-6: MSSP BLOCK DIAGRAM
(I2C MODE)
The MSSP module has these six registers for I2C
operation:
MSSP Control Register 1 (SSPCON)
MSSP Control Register 2 (SSPCON2)
MSSP STATUS register (SSPSTAT)
Serial Receive/Transmit Buffer (SSPBUF)
MSSP Shift Register (SSPSR) – Not directly
accessible
MSSP Address register (SSPADD)
MSSP Mask register (SSPMSK)
The SSPCON register allows control of the I2C
operation. The SSPM<3:0> mode selection bits
(SSPCON register) allow one of the following I2C modes
to be selected:
•I
2C Master mode, clock = OSC/4 (SS PADD +1)
•I
2C Slave mode (7-bit address)
•I
2C Slave mode (10-bit address)
•I
2C Slave mode (7-bit address), with Start and
Stop bit interrupts enabled
•I
2C Slave mode (10-bit address), with Start and
Stop bit interrupts enabled
•I
2C firmw are co ntrolle d master op erat ion, slav e is
idle
Selection of any I2C mode with the SSPEN bit set,
forces the SCL and SDA pins to be open drain,
provided these pins are programmed to be inputs by
setting the appropriate TRISC bits.
13.4.1 SLAVE MODE
In Slave mode, the SCL and SDA pins must be
configured as inputs (TRISC<4:3> set). The MSSP
module will overrid e the input sta te with the ou tput dat a
when required (slave-transmitter).
When an address is m atc he d, or the data tra ns fer after
an address match is received, the hardware
automatically will generate the Acknowledge (ACK)
pulse and load the SSPBUF register with the received
value currently in the SSPSR register.
If either or b oth o f the followin g co nd itio ns are tru e, th e
MSSP module will not give this ACK pulse:
a) The buf fer full bit BF (SSPCON regis ter) was set
before the transfer was received.
b) The overflow bit SSPOV (SSPCON register)
was set before the transfer was received.
In this event, the SSPSR register value is not loaded
into the SSPBUF, but bit SSPIF of the PIR1 register is
set. The BF bit is cleared by reading the SSPBUF
register, while bit SSPOV is cleared through software.
The SCL clock input must have a minimum high and
low fo r pro per ope rati on. The high an d l ow ti me s o f th e
I2C specification, as well as the requirement of the
MSSP module, are shown in timing parameter #100
and parameter #101.
Read Write
SSPSR Reg
Match Detect
SSPADD Reg
Start and
Stop bit Detect
SSPBUF Reg
Internal
Data Bus
Addr Match
Set, Reset
S, P bits
(SSPSTAT Reg)
RC3/SCK/SCL
RC4/
Shift
Clock
MSb
SDI/ LSb
SDA
Note: I/O pins have diode protection to VDD and VSS.
SSPMSK Reg
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13.4.1.1 Addressing
Once the MSSP module has been enabled, it waits for
a Start cond ition to oc cur. Followin g the St art condi tion,
the eight bits are shifted into the SSPSR register. All
incoming bits are sampled with the rising edge of the
clock (SCL) line. The value of register SSPSR<7:1> is
compared to the value of the SSPADD register. The
address is compared on the falling edge of the eighth
clock (SCL) pulse. If the addresses match, and the BF
and SSPOV bits are clear, the following events occur:
a) The SSPSR register value is loaded into the
SSPBUF register.
b) The buffer full bit BF is set.
c) An ACK pulse is generated.
d) MSSP interrupt flag bit, SSPIF of the PIR1
register, is set on the falling edge of the ninth
SCL pulse (interrupt is generated, if enabled).
In 10-bit address mode, two address bytes need to be
received by the slave. The five Most Significant bits
(MSb) of the first address byte specify if this is a 10-bit
address. The R/W bit (SSPSTA T register) mu st specif y
a write so the slave device will receive the second
address by te. F or a 10 -bi t add res s, t he fi rst byt e woul d
equal ‘1111 0 A9 A8 0’, where A9 and A8 are the
two MSb’s of the address.
The sequence of events for 10-bit addressing is as
follows, with steps 7-9 for slave-transmitter:
1. Receive first (high) byte of address (bit SSPIF of
the PIR1 register and bits BF and UA of the
SSPSTAT register are set).
2. Update the SSPADD register with second (low)
byte of address (clears bit UA and releases the
SCL line).
3. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
4. Receive second (low) byte of address (bits
SSPIF, BF, and UA are set).
5. Update the SSPADD register with the firs t (high)
byte of address. If match releases SCL line, this
will clear bit UA.
6. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
7. Receive Repeated Start condition.
8. Receive first (high) byte of address (bits SSPIF
and BF are set).
9. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
13.4.1.2 Reception
When the R/W bit of the address byte is clear and an
address match occurs, the R/W bit of the SSPSTAT
register is cleare d. The re ceived ad dre ss is loa ded in to
the SSPBUF register.
When the address byte overflow condition exists, then
no Acknowledge (ACK) pulse is given. An overflow
condition is defined as either bit BF (SSPST AT register)
is set, or bit SSPOV (SSPCON register) is set.
An MSSP interrupt is generated for each data transfer
byte. Flag bit SSPIF of the PIR1 register must be
cleared in software. The SSPSTAT register is used to
determine the status of the byte.
13.4.1.3 Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register. The ACK pulse will
be sent on the ninth bit and pin RC3/SCK/SCL is held
low. The transmit data must be loaded into the
SSPBUF register, which also loads the SSPSR regis-
ter. Then pin RC3/SC K/SC L s ho uld be e na ble d by se t-
ting bit CKP (SSPCON register). The master must
monitor the SCL pin prior to asserting another clock
pulse. T he slave devices may be h olding of f th e master
by stretching the clock. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time
(Figure 13-8).
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared in software and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the ninth clock pulse.
As a s lav e-t rans mi tte r, the ACK puls e from the mast er-
receiver is latched on the rising edge of the ninth SCL
input pulse. If the SDA line is high (not ACK), then the
data transfer is complete. When the ACK is latched by
the slave, the slave logic is reset and the slave moni-
tors for another occurrence of the Start bit. If the SDA
line was low (ACK), the transmit data must be loaded
into the S SPBUF register, which also lo ads the SSPSR
register. Pin RC3/SCK/SCL should be enabled by
setting bit CKP.
© 2009 Microchip Technology Inc. DS41291F-page 191
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FIGURE 13-7: I2C™ SLAVE MODE WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)
FIGURE 13-8: I2C™ SLAVE MODE WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)
P
9
8
765
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1SDA
SCL 1234567891234567891234
Bus Master
Terminates
Transfer
Bit SSPOV is set because the SSPBUF register is still full
Cleared in software
SSPBUF register is read
ACK Receiving Data
Receiving Data D0
D1
D2
D3D4
D5
D6D7
ACK
R/W = 0
Receiving Address
SSPIF
BF
SSPOV
Not ACK
ACK is not sent
SDA
SCL
SSPIF
BF
CKP
A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0 Not ACKTransmitting DataR/W = 1Receiving Address
123456789 123456789 P
Cleared in software
SSPBUF is written in software From SSP Interrupt
Service Routine
Set bit after writing to SSPBUF
SData in
Sampled
(the SSPBUF must be written to
before the CKP bit can be set)
R/W = 0
responds to SSPIF
SCL held low
while CPU
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13.4.2 GENERAL CALL ADDRESS
SUPPORT
The addressing procedure for the I2C bus is such that,
the first byte after the Start condition usually deter-
mines which device will be the slave addressed by the
master. The exception is the general call address,
which can address all devices. When this address is
used, all devices should, in theory, respond with an
Acknowledge.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all 0’s with R/W = 0.
The gene ral call add ress is recog nized (ena bled) when
the General Call Enable (GCEN) bit is set (SSPCON2
register). Following a Start bit detect, eight bits are
shifted into the SSPSR and the address is compared
agains t the SSP AD D. It is also c ompared to the genera l
call address and fixed in hardware.
If the general call address matches, the SSPSR is
transferre d to the SSPBUF, the BF bit is set (eigh th bit),
and on the falling edge of the ninth bit (ACK bit), the
SSPIF interrupt flag bit is set.
When the i nterrupt is serv iced, the source f or the inter-
rupt can be checked by reading the contents of the
SSPBUF. The value can be used to determine if the
address was device specific or a general call address.
In 10-bit mode, the SSPADD is required to be updated
for the secon d half of the address to match , and the UA
bit is set (SSPST A T register). If the general call address
is sampled when the GCEN bit is set, and while the
slave is configured in 10-bit address mode, then the
second half of th e address is not n ecessary. The UA bit
will not be set, and the slave will begin receiving data
after the Acknowledge (Figure 13-9).
FIGURE 13-9: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESS)
SDA
SCL S
SSPIF
BF
SSPOV
Cleared in software
SSPBUF is read
R/W = 0ACK
General Call Address
Address is compared to General Call Address
GCEN
Receiving Data ACK
123456789123456789
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interru pt
0
1
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13.4.3 MASTER MODE
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset, or when the MSSP module is disabled.
Control of the I 2C bus may be taken when the P bit is
set, or the bus is idle, with both the S and P bits clear.
In Master mode, the SCL and SDA lines are manipu-
lated by the MSSP hardware.
The following events will cause SSP Interrupt Flag bit,
SSPIF, to be set (SSP Interrupt if enabled):
Start condition
Stop condition
Data transfer byte transmitted/received
Acknowledge t ransmit
Repeated Start condition
13.4.4 I2C™ MASTER MODE SUPPORT
Master mode is enabled by setting and clearing the
appropriate SSPM bits in SSPCON and by setting the
SSPEN bit. Once Master mode is enabled, the user
has the follow i ng six optio ns :
1. Assert a Start condition on SDA and SCL.
2. Assert a Repeated Start condition on SDA and
SCL.
3. Write to the SSPBUF register initiating
transmission of data/address.
4. Generate a Stop condition on SDA and SCL.
5. Config ure the I2C port to receive data.
6. Ge nera te an Ack nowl edge c ondit ion at t he end
of a received byte of data.
FIGURE 13-10: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)
Note: The MSSP modu le, when configured in I2C
Master mode, does not allow queueing of
events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
imitate transmission, before the Start
condition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, ind icating tha t a write
to the SSPBUF did not occur.
Read Write
SSPSR
Start bit, Stop bit,
SSPBUF
Internal
Data Bus
Set/Res e t, S, P, WCO L (SSPSTAT )
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate
SCL
SCL In
Bus Collision
SDA In
Receive Enable
Clock Cntl
Clock Arbitrate/WCO L Detect
(hold off clock source)
SSPADD<6:0>
Baud
Set SSPIF, BCLIF
Reset ACKSTAT, PEN (SSPCON2)
Rate
Generator
SSPM<3:0>
Note: I/O pins have diode protection to VDD and VSS.
Star t b it De te ct
Stop bit Detect
Write Collision Detect
Clock Arbitration
State Counter for
End of XMIT/RCV
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13.4.4.1 I2C™ Master Mode Operation
The master device generates all of the serial clock
pulses and the S t a rt and Stop condition s. A transfer i s
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer , the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
recei vin g dev ice ( 7 bits) and the Rea d/Writ e (R/ W) bit.
In this case, the R/W bit wi ll be lo gic ‘0 . S eri al d ata is
transmi tted eight bits a t a time. Af ter each byte is trans-
mitted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Rec eive mode , the first byte transm itted con-
tains the slave address of the transmitting device
(7 bits) and th e R/W bit. In this case, the R/W bit w ill b e
logic ‘ 1’. Thus, the first byte transmitted is a 7-bit slave
addr ess f oll owed by a 1’ to indicate receive bit. Serial
data is rece ived via S DA, while SCL o utp uts the se ri al
clock. Serial data is received eight bits at a time. After
each byte is received, an Acknowledge bit is transmit-
ted. Start and Stop conditions indicate the beginning
and end of transmission.
The Baud R ate Generator us ed for the SPI mod e oper-
ation is now used to set the SCL clock frequency for
either 100 kHz, 400 kHz, or 1 MHz I2C operation. The
Baud Rate Generator reload value is contained in the
lower 7 bits of the SSPADD register. The Baud Rate
Generator will automatically begin counting on a write
to the SSPBUF. Once the given operation is complete
(i.e., transmission of the last data bit is followed by
ACK), the internal clock will automatically stop counting
and the SCL pin will remain in its last state.
A typical transmit sequence would go as follows:
a) The user generates a Start condition by setting
the Sta rt Enab le (SEN) bit (SSPCON2 regi ster).
b) SSPIF is set. The MSSP module will wait the
required start time before any other operation
takes place.
c) The user loa ds the SSPBUF with the addres s to
transmit.
d) Address is shifted out the SDA pin until all eight
bits are transmitted.
e) The MSSP module sh ift s in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit (SSPCON2 register).
f) Th e MSSP module g enerate s an interrup t at th e
end of th e ninth c lock cyc le by settin g the SSPIF
bit.
g) The user loads the SSPBUF with eight bits of
data.
h) Dat a is shi fte d out the SD A pin un til all e ight bit s
are transmitted.
i) The MSSP modu le shift s in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit (SSPCON2 register).
j) The MSSP modul e gene rates an int errupt a t the
end of th e ninth c lock cyc le by settin g the SSPIF
bit.
k) The user generates a Stop condition by setting
the Stop Enable bit PEN (SSPCON2 register).
l) Interru pt is genera ted once the Stop condition i s
complete.
© 2009 Microchip Technology Inc. DS41291F-page 195
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13.4.5 BAUD RATE GENERATOR
In I2C Master mode, the reload value for the BRG is
located in the lower 7 bits of the SSPADD register
(Figure 13-11). When the BRG is loaded with this
value, the BRG counts down to 0 and stops until
another reload has taken place. The BRG count is
decremented twice per instruction cycle (TCY) on the
Q2 and Q4 clocks. In I2C Master mode, the BRG is
reloaded automatically. If clock arbitration is taking
place, for instance, the BRG will be reloaded when the
SCL pin is sampled high (Figure 13-12).
FIGURE 13-11: BAUD RATE GENERATOR BLOCK DIAGRAM
FIGURE 13-12: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SSPM<3:0>
BRG Down Counter
CLKOUT FOSC/4
SSPADD<6:0>
SSPM<3:0>
SCL
Reload
Control Reload
SDA
SCL
SCL de-asserted but slave holds
DX-1DX
BRG
SCL is sampled high, reload takes
place and BRG starts it s count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration) SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
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13.4.6 I2C™ MASTER MODE START
CONDITION TIMING
To initiate a Start condit ion, the user sets the S tar t Con-
dition Enable bit SEN of the SSPCON2 register. If the
SDA and SCL pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPADD<6:0> and start s its count. If SCL and SDA a re
both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
of the SDA being driven low, while SCL is high, is the
Start condition, and causes the S bit of the SSPSTAT
register to be set . Follow ing this, the Baud Rat e Gener-
ator is reloaded with the contents of SSPADD<6:0>
and res umes it s co unt. When the Baud Rate G enerator
times out (T BRG), the SEN bit of th e SSPCON2 regis ter
will be automatically cleared by hardware, the Baud
Rate Generator is suspended leaving the SDA line held
low and the Start condition is complete.
13.4.6.1 WCOL Status Flag
If the user writes the SSPBUF when a Start sequence
is in progress, the WCOL is set and the contents of the
buffer are unchanged (the write doesn’t occur).
FIGURE 13-13: FIRST START BIT TIMING
Note: If, at the beginning of the Start condition,
the SDA and SCL pins are already sam-
pled low, or if during the Start conditio n the
SCL line is sampled low before the SDA
line is driven low , a bus collision occurs, the
Bus Collision Interrupt Flag, BCLIF, is set,
the Start condition is aborted, and the I2C
module is reset into its Idle state.
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPCON2 is disabled until the Start
conditi on is complete.
SDA
SCL
S
TBRG
1st Bit 2nd Bit
TBRG
SDA = 1, At completion of Start bit,
SCL = 1
Write to SSPBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSPSTAT)
and sets SSPIF bit
© 2009 Microchip Technology Inc. DS41291F-page 197
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13.4.7 I2C™ MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
(SSPCON2 register) is programmed high and the I2C
logic module is in the Idle state. When the RSEN bit is
set, the SCL pin is asserted low. When the SCL pin is
sampled low, the Baud Rate Generator is loaded with
the contents of SSPADD<5:0> and begins counting.
The SDA pin is released (brought high) for one Baud
Rate Generator count (TBRG). When the Baud Rate
Generator times out, if SDA is sampled high, the SCL
pin will be de-asserted (brought high). When SCL is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD<6:0> and begins count-
ing. SDA and SCL mu st be sampled high for one TBRG.
This ac tion is then followed by assertio n of the SDA pin
(SDA = 0) for one TBRG, while SCL is high. Following
this, the RSEN bit (SSPCON2 reg ister) will be aut omat-
ically cleared and the Baud Rate Generator will not be
reloaded, leaving the SDA pin held low. As soon as a
Start condition is detected on the SDA and SCL pins,
the S bit (SSPSTAT register) wil l be set. The SSPIF bit
will no t be set unt il the Baud Rate Gene rator has timed
out.
Immediately following the SSPIF bit getting set, the
user may write the SSPBUF with the 7-bit address in
7-bit mode, or the default first address in 10-bit mode.
After the first eight bits are transmitted and an ACK is
received, the user may then tra nsmit an additional eight
bits of add ress (1 0-bit mod e), or ei ght bi ts o f dat a (7-b it
mode).
13.4.7.1 WCOL Status Flag
If the user writes the SSPBUF when a Repeated Start
sequenc e is in pro gress , the WCOL is set and the con-
tents of the buffer are unchanged (the write doesn’t
occur).
FIGURE 13-14: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
conditi on occ urs if:
SDA is sampled l ow wh en SCL goes
from low-to-high.
SCL goes low before SDA is
asserted low. This may indicate that
another master is attempting to
transmit a data “1”.
Note: Because queueing of events is not
allowed, writing of the lower 5 bits of
SSPCON2 is disabled until the Repeated
Start condition is complete.
SDA
SCL
Sr = Repeated Start
Write to SSPCON 2
Write to SSPBUF occurs here
Falling edge of ninth clock
End of Xmit
At completion of Start bit,
hardware clear RSEN bit
1st bit
Set S (SSPSTAT<3>)
TBRG
TBRG
SDA = 1,
SDA = 1,
SCL (no change) SCL = 1
occurs here,
TBRG TBRG TBRG
and set SSPIF
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13.4.8 I2C™ MAST E R MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address, or the
other half of a 10-bit address, is accomplished by sim-
ply writing a value to the SSPBUF register. This action
will set the Buffer Full bit, BF, and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDA pin after the falling edge of SCL is
asserted (see data hold time specification, parameter
106). SC L is held low for o ne Baud Rate G enerator roll-
ove r co un t ( TBRG). Data should be valid before SCL is
released high (see data setup time specification,
parameter 107). When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF bit is cleared and the master releases SDA,
allowing the slave device being addressed to respond
with an ACK bit during the ninth bit time, if an address
match occurs, or if data was received properly. The
status of ACK is written into the ACKDT bit on the fall-
ing edge of the ninth clock. If the master receives an
Acknowledge, the Acknowledge Status bit, ACKSTAT,
is cle are d. I f no t, the bit is s et. Af te r th e n int h c lo ck , th e
SSPIF bit i s s et and th e m aster clo ck (Ba ud Rate Gen-
erator) is suspended until the next data byte is loaded
into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 13-15).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL, until all
seven addres s bit s an d the R/W bit, a re com pleted . On
the falling edge of the eighth clock, the master will de-
assert the SDA pin, allowing the slave to respond with
an Ackno wledge. On th e fallin g edge of the n inth clock ,
the master will sample the SDA pin to see if t he address
was rec ognized by a sla ve. The st atus of the ACK bit is
loaded into the ACKSTAT Status bit (SSPCON2 regis-
ter). Following the falling edge of the ninth clock trans-
mission of the address, the SSPIF is set, the BF bit is
cleared and the Baud Rate Generator is turned off, until
another write to the SSPBUF takes p lac e, ho ldi ng SCL
low and allowing SDA to float.
13.4.8.1 BF Status Flag
In Transm it mo de, the BF bit (SS PSTAT register) is s et
when the CPU writes to SSPBUF, and is cleared when
all eight bits are shifted out.
13.4.8.2 WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the buf-
fer are unchanged (the write doesn’t occur). WCOL
must be cleared in software.
13.4.8.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2
register) is cleared when the slave has sent an
Acknowledge (ACK = 0), and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call), or when the slave has
properly received its data.
13.4.9 I2C™ MASTER MODE RECEPTION
Master mode recepti on is enabl ed by progra mmin g the
Receive Enable bit, RCEN (SSPCON2 register).
The Baud Rate Generator begins counting, and on
each rollover, the state of the SCL pin changes (high-
to-low/low-to-high) and data is shifted into the SSPSR.
After the falling edge of the eighth clock, the RCEN bit
is automatically cleared, the contents of the SSPSR are
loaded into the SSPBUF, the BF bit is set, the SSPIF
flag bit is set and the Baud Rate Generator is sus-
pended from counting, holding SCL low. The MSSP is
now in Idle state, awaiting the next command. When
the buffer is read by the CPU, the BF bit is automati-
cally c leared . The us er can then s end an A cknowl edg e
bit at the end of reception, by setting the Acknowledge
Sequence Enable bit ACKEN (SSPCON2 register).
13.4.9.1 BF Status Flag
In receiv e op eration, the B F bit is s et whe n an add r es s
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
13.4.9.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when eight
bits are received into the SSPSR and the BF bit is
already set from a previous reception.
13.4.9.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), th e WCOL bi t is set an d the conte nts of th e buffer
are unchanged (the write doesn’t occur).
Note: The MSSP module must be in an Idle state
before the R CEN bit is set, or the R CEN bit
will be disregarded.
© 2009 Microchip Technology Inc. DS41291F-page 199
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FIGURE 13-15 : I2C™ MASTER MODE WAVEFORM (T RANSMISSION, 7 OR 10-BIT ADDRESS)
SDA
SCL
SSPIF
BF
SEN
A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting Data or Second Half
R/W = 0Transmit Address to Slave
123456789 123456789 P
Cleared in software service routine
SSPBUF is written in software
From SSP inter rupt
After Start condition, SEN cleared by hardware.
S
SSPBUF written with 7-bit address and R/W
start transmit
SCL held low
while CPU
responds to SSPIF
SEN = 0
of 10-bit Address
Write SSPCON2<0> SEN = 1
Start condition begins From slave, clear ACKSTAT bit SSPCON2<6>
ACKSTAT in
SSPCON2 = 1
Cleared in software
SSPBUF written
PEN
Cleared in software
R/W
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FIGURE 13-16 : I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
87
6
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1
SDA
SCL 12345678912345678 9 1234
Bus Master
terminates
transfer
ACK Receiving Data from Slave
Receiving Data from Slave D0
D1
D2
D3D4
D5
D6D7
ACK
R/W = 1
Transmit Address to Slave
SSPIF
BF
ACK is not sent
Write to SSPCON2<0> (SEN = 1)
Write to SSPBUF occurs here
ACK from Slave
Master configured as a receiver
by programming SSPCON2<3>, (RCEN = 1)PEN bit = 1
written her e
Data shifted in on falling edge of CLK
Cleared in software
Start XMIT
SEN = 0
SSPOV
SDA = 0, SCL = 1
while CPU
ACK
Last bit is shifted into SSPSR and
contents ar e unloaded into SSPBUF
Cleared in software
Cleared in software
Set SSPIF interrupt
at end of receive
Set P bit
(SSPSTAT<4>)
and SSPIF
Cleared in
software
ACK from Master
Set SSPIF at end
Set SSPIF interrupt
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of Acknow-
ledge sequ en ce
of receive
Set ACKEN start Acknowledge sequence
SSPOV is set because
SSPBUF is still full
SDA = ACKDT = 1
RCEN cleared
automatically
RCEN = 1 start
next receive
Write to SSPCON2<4>
to start Acknowledge sequence
SDA = ACKDT (SSPCON2<5>) = 0
RCEN cleared
automatically
responds to SSPIF
ACKEN
Begin Start Condition
Cleared in software
SDA = ACKDT = 0
© 2009 Microchip Technology Inc. DS41291F-page 201
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13.4.10 ACKNOWLEDGE SEQUENCE TIMING
An Acknowledge sequence is enabled by setting the
Acknowle dge Sequ ence Enable b it, ACKEN (SSPCON2
register). When this bit is set, the SCL pin is pulled low
and the co ntents of th e Acknow ledge Data bit (ACKD T)
is pres ented on th e SDA pin. If the us er wish es to gener-
ate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generato r then count s for one ro llover pe riod (TBRG) and
the SCL pin is de-asserted (pulled high). When the SCL
pin is sampled high (clock arbitration), the Baud Rate
Generator counts for TBRG. The SCL pin is then pulled
low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP mo du le t hen g oe s in to Idle m od e ( Fig ure 13-17).
13.4.10.1 WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
13.4.11 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN (SSPCON2 register). At the end of a receive/
transmit, the SCL line is held low after the falling edge
of the ninth clock. When the PEN bit is set, the master
will assert th e SDA line low. When the SDA li ne is sam-
pled low, the Baud Rate Generator is reloaded and
counts down to 0. When the Baud Rate Generator
times out, the SCL pin will be brought high, and one
TBRG (Baud Rate Generator rollover count) later, the
SDA pin wi ll be de-asserte d. When the SDA p in is sam-
pled high while SCL is high, the P bit (SSPSTAT regis-
ter) is set. A TBRG later, the PEN bit is cleared and the
SSPIF bit is set (Figure 13-18).
13.4.11.1 WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the bu f fer are un ch anged (th e write doesn’t
occur).
FIGURE 13-17: ACKNOWLEDGE SEQUENCE WAVEFORM
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
Set SSPIF at the end
Acknowledge sequence starts here,
Write to SSPCON 2 ACKEN automatically cleared
Cleared in
TBRG TBRG
of receive
ACK
8
ACKEN = 1, AC K D T = 0
D0
9
SSPIF
software Set SSPIF at the end
of Acknowledge sequence
Cleared in
software
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FIGURE 13-18: STOP CONDITION RECEIVE OR TRANSMIT MODE
13.4.12 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition, de-
asserts the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate Gen-
erator (BRG) is suspended from counting until the SCL
pin is ac tually sam pled high. When the SCL pin is sam -
pled high, the Baud Rate Generator is reloaded with
the contents of SSPADD<6:0> and begins counting.
This ensures that the SCL high time will always be at
least one BRG rollover count, in the ev ent that the clock
is held low by an external device (Figure 13-19).
13.4.13 SL EE P OP ER AT ION
While in Sleep mode, the I2C module can receive
addresses or data, and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
13.4.14 EFFECT OF A RESET
A Reset disables the MSSP module and terminat es the
current transfer.
FIGURE 13-19: CLOCK ARBITRATION TIMING IN MASTER TRANSMIT MODE
SCL
SDA
SDA asserted low before rising edge of clock
Write to SSPCON2
Set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high, P bit (SSPSTAT) is set
TBRG
to set up Stop cond iti on
ACK
P
TBRG
PEN bit (SSPCON2) is cleared by
hardware and the SSPIF bi t is set
SCL
SDA
BRG overflow,
Release SCL,
If SCL = 1, load BRG with
SSPADD<6:0>, and start count BRG overflow occurs,
Release SCL, Slave device holds SCL low SCL = 1, BRG starts counting
clock high interval
SCL line sampled once every machine cycle (TOSC*4),
Hold off BRG until SCL is sampled high
TBRG TBRG TBRG
to measure high time interval
© 2009 Microchip Technology Inc. DS41291F-page 203
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13.4.15 MULT I-MAS TER MO DE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
deter mination of when the bus i s free. The S top (P) and
Start (S) bits are cleared from a Reset, or when the
MSSP module is disabled. Control of the I 2C b us may
be taken when the P bit (SSPSTAT register) is set, or
the bus is idle with both the S and P bits clear. When
the bus is busy, enabling the SSP Interrupt will gener-
ate the interrupt when the Stop condition occurs.
In Multi-Master operation, the SDA line must be moni-
tored for arbitration, to see if the signal level is the
expect ed output level. This c heck is perfo rmed in hard-
ware, with the result placed in the BCLIF bit.
Arbitration can be lost in the following states:
Address transfer
Data transfer
A Start condition
A Repeated Start condition
An Acknowledg e condition
13.4.16 MULTI -MASTER
COMMUNICATION, BUS
COLLISION, AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitra-
tion. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a ‘1’ on SDA, by letting SDA float high and
anothe r mast er asser ts a ‘ 0’. When the SCL pin float s
high, data should be stable. If the expected data on
SDA is a1’ and the da t a s am ple d on th e SDA pin = 0,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag (BCLIF) and reset the
I2C port to its Idle state (Figure 13-20).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF bit is
cleared, the SDA and SCL lines are de-asserted, and
the SSPBUF c an be writte n to. W hen the user services
the bus c ollis ion inte rrupt ser vice ro utine, a nd if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop, or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDA and SCL
lines are de- assert ed, and t he respe ctiv e contro l bit s in
the SSPCON2 register are cleared. When the user
services the bus collision interrupt service routine, and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be
set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the trans-
mitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of t he I2C
bus can be t aken when the P bit is set in the SSPSTAT
register, or the bus is idle and the S and P bits are
cleared.
FIGURE 13-20: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCLIF
SDA released
SDA line pulled low
by an other source Sample SDA,
While SCL is high, data doesn’t
Bus collis ion has occ urred
Set bus collision
interrupt (BCLIF)
match what is driven by the master,
by master
Data changes
while SCL = 0
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13.4.16.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the begi nning of
the Start condition (Figure 13-21).
b) SCL is sam pl ed l ow before SDA is as se rted low
(Figure 13-22).
During a Start condition, both the SDA and the SCL
pins are monitored, if:
the SDA pin is already low,
or the SCL pin is already low,
then:
the Start condition is aborted,
and the BCLIF flag is set,
and the MSSP module is reset to its Idle state
(Figure 13-21).
The Start condition begins with the SDA and SCL pins
de-asserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded from SSPADD<6:0>
and counts down to 0. If the SCL pin is sampled low
whil e SD A is hi g h, a bus co l li si o n oc cur s, be ca use it is
assumed that another master is attempting to drive a
data1’ during the S tart condit ion .
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 13-23). If, however , a ‘1’ is sampled on the SDA
pin, the SDA pin is as sert ed low at the end of the B RG
count. The Baud Rate Generator is then reloaded and
count s down to 0, and during thi s time, if the SCL pin is
sampled as ‘0’, a bus collision does not occur. At the
end of t he BRG co unt , the SCL pin is a ss erte d lo w.
FIGURE 13-21: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The re ason that bus coll ision is not a fact or
during a Start condition, is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDA before the other.
This condition does not cause a bus colli-
sion, because the two masters must be
allow ed to arbitrate t he first addres s follow-
ing the Start co nditio n. If the addres s is the
same, arbitration must be allowed to con-
tinue into the data portion, Repeated Start
or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSPIF set because
SSP module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPIF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1.
SDA = 0, SCL = 1.
BCLIF
S
SSPIF
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared in software.
SSPIF and BCLIF are
cleared in software.
Set BCLIF,
Start condition. Set BCLIF.
© 2009 Microchip Technology Inc. DS41291F-page 205
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FIGURE 13-22: BUS COLLISION DURING ST ART CONDITION (SCL = 0)
FIGURE 13-23: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN Bus collision occurs, set BCLIF
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
Interrupt cleared
in software
Bus collision occurs, set BCLIF
SCL =0 before BRG time-out,
0’‘0
00
SDA
SCL
SEN
Set S
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
Less th an TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
S
Interrupts cleared
in software
Set SS PIF
SDA = 0, SCL = 1
SDA pulled low by other master
Reset BRG and assert SDA
SCL pulled low after BRG
time-out
Set SS PIF
0
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13.4.16.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occu rs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level.
b) SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled.
If SDA is low, a bus collis ion has oc curr ed (i.e, another
master is attempting to transmit a data ‘0’, see
Figure 13-24). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from high-
to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDA at
exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not alread y been asserted, a bus collision
occurs. In this case, another master is attempting to
tran smit a data ‘1’ during the Repeated Start condition
(Figure 13-25).
If at the end of the BRG time-out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven l ow and the R epe ated S tart cond ition is c omp lete.
FIGURE 13-24: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 13-25: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDA
SCL
BCLIF
RSEN
S
SSPIF
Interrupt cleare d
in software
SCL goes low before SDA,
Set BCLIF, release SDA and SCL
TBRG TBRG
0
© 2009 Microchip Technology Inc. DS41291F-page 207
PIC16F882/883/884/886/887
13.4.16.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been de-asserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
b) After the SCL pin is de-asserted, SCL is
sampled low before SDA goes high.
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
floa t. Wh en t he p in i s sa mpled hig h (c loc k arbi tr atio n),
the Baud R ate Generator is load ed with SSP AD D<6:0>
and cou nt s d own to 0. After the BRG times o ut, SDA i s
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data0’ (Figure 13-26). If the SCL pin is sam-
pled low be fore SDA is all owed to flo at h igh , a bus co l-
lision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 13-27).
FIGURE 13-26: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 13-27: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCLIF
0
0
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
Assert SDA SCL goes low before SDA goes high,
set BCLIF
0
0
PIC16F882/883/884/886/887
DS41291F-page 208 © 2009 Microchip Technology Inc.
13.4.17 SSP MA SK REGIS T ER
An SSP Mask (SSPMSK) register is available in I2C
Slave mode as a mask for the value held in the
SSPSR register during an address comparison
operation. A zero (0’) bit in the SSPMSK register has
the effect of making the corresponding bit in the
SSPSR register a “don’t care”.
This register is reset to all ‘1s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
This register must be initiated prior to setting
SSPM<3:0> bits to select the I2C Slave mode (7-bit or
10-bit address).
This register can only be accessed when the appropriate
mode is selected by bits (SSPM<3:0> of SSPCON).
The SSP Mask register is active during:
7-bit Address mode: address compare of A<7:1>.
10- bit Address mode : address com pare of A<7:0 >
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
REGISTER 13-4: SSPMSK: SSP MASK REGISTER(1)
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-1 MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address(2)
I2C Slave mode, 10-bit Address (SSPM<3:0> = 0111):
1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match
Note 1: When SSPCON bits SSPM<3 :0> = 1001, any read s or writes to the SSPADD SFR addre ss are a ccessed
through the SSPMSK register.
2: In all other SSP modes, this bit has no effect.
© 2009 Microchip Technology Inc. DS41291F-page 209
PIC16F882/883/884/886/887
14.0 SPECIAL FEATURES OF THE
CPU
The PIC16F882/883/884/886/887 have a host of fea-
tures intended to maximize system reliability, minimize
cost through elimination of external components, pro-
vide power-saving features and offer code protection.
These features are:
Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Ti mer (OST)
- Brown-out Reset (BOR)
Interrupts
Watchdog Timer (WDT)
Oscillator selection
Sleep
Code protection
ID Locations
In-Circuit Serial Programming™
Low-voltage In-Circuit Serial Programming™
The PIC16 F88 2/8 83/8 84 /886/887 have two time rs that
offer necessary delays on power-up. One is the
Oscillator Start-up Timer (OST), intended to keep the
chip in Reset until the crystal oscillator is stable. The
other is t he Power-up Timer (PWRT), wh ic h p rov ide s a
fixed delay of 64 ms (nominal) on power-up only,
designed to keep the part in Reset while the power
supply stabilizes. There is also circuitry to reset the
device if a brown-out occurs, which can use the
Power-up Timer to provide a t least a 64 ms Reset. With
these three functions-on-chip, most applications need
no external Reset circuitry.
The Sleep mode is de signe d to of fer a very low-c urrent
Power-Dow n mode. The us er ca n wa ke -up fro m Slee p
through:
External Reset
Watchdog Timer Wake-up
An interrupt
Several oscillator options are also made available to
allow the part to fit the application. The INTOSC option
saves system cost while the LP crystal option saves
power. A set of Configuration bits are used to select
various options (see Register 14-3).
PIC16F882/883/884/886/887
DS41291F-page 210 © 2009 Microchip Technology Inc.
14.1 Configuration Bits
The Configuration bits can be programmed (read as
0’), or lef t unprogrammed (read as1’) to select various
device configurations as shown in Register 14-1.
These bits are mapped in program memory location
2007h and 2008h, respectively.
Note: Address 2007h and 2 008h are beyond t he
user program memor y space. It belon gs to
the special configuration memory space
(2000h-3FFFh), which can be accessed
only during programming. See “PIC16F88X
Memory Programming Specification”
(DS41287) for more information.
REGISTER 14-1: CONFIG1: CONFIGURATION WORD REGISTER 1
—DEBUGLVP FCMEN IESO BOREN1 BOREN0
bit 15 bit 8
CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0
bit 7 bit 0
bit 15-14 Unimplemented: Read as ‘1
bit 13 DEBUG: In-Circuit Debugger Mode bit
1 = In-Circuit Debugger disabled, RB6/ICSPCLK and RB7/ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, RB6/ICSPCLK and RB7/ICSPDAT are dedicated to the debugger
bit 12 LVP: Low Voltage Programming Enable bit
1 = RB3/PGM pin has PGM fun ction , low voltage pro gr amm i ng enable d
0 = RB3 pin is digital I/O, HV on MCLR must be used for programming
bit 11 FCMEN: Fail-Safe Clock Monitor Enabled bit
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
bit 10 IESO: Internal External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1)
11 = BOR enabled
10 = BOR enabled dur ing ope ration and disa bled in Sleep
01 = BOR controlled by SBOREN bit of the PCON register
00 = BOR disabled
bit 7 CPD: Data Code Protection bit(2)
1 = Dat a memory code protection is disabled
0 = Data memory code protection is enabled
bit 6 CP: Code Protection bit(3)
1 = Program memory code pro tection is disabled
0 = Program memory code pro tection is enabled
bit 5 MCLRE: RE3/MCLR pin function select bit(4)
1 = RE3/MCLR pin function is MCLR
0 = RE3/MCLR pin function is digital input, MCLR internally tied to VDD
bit 4 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled and can be enabled by SWDTEN bit of the WDTCON register
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = RC oscillator: CLKOUT function on RA6/OSC2/CLKOUT pin, RC on RA7/OSC1/CLKIN
110 = RCIO oscillator: I/O function on RA6/OSC2/CLKOUT pin, RC on RA7/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on RA6/OSC2/CLKOUT pin, I/O function on RA7/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on RA6/OSC2/CLKOUT pin, I/O function on RA7/OSC1/CLKIN
011 = EC: I/O function on RA6/OSC2/CLKOUT pin, CLKIN on RA7/OSC1/CLKIN
010 = HS oscillator: High-speed crystal/resonator on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
001 = XT oscillator: Crystal/resonator on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
000 = LP oscillator: Low-power crystal on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire data EEPROM will be erased when the code protection is turned off.
3: The entire program memory will be erased when the code protection is turned off.
4: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
© 2009 Microchip Technology Inc. DS41291F-page 211
PIC16F882/883/884/886/887
REGISTER 14-2: CONFIG2: CONFIGURATION WORD REGISTER 2
WRT1 WRT0 BOR4V
bit 15 bit 8
bit 7 bit 0
bit 15-11 Unimplemented: Read as 1
bit 10-9 WRT<1:0>: Flash Program Memory Self Write Enable bits
PIC16F883/PIC16F884
00 = 0000h to 07FFh write protected, 0800h to 0FFFh may be modified by EECON control
01 = 0000h to 03FFh write protected, 0400h to 0FFFh may be modified by EECON control
10 = 0000h to 00FFh write protected, 0100h to 0FFFh may be modified by EECON control
11 = Write protection off
PIC16F886/PIC16F887
00 = 0000h to 0FFFh write protected, 1000h to 1FFFh may be modified by EECON control
01 = 0000h to 07FFh write protected, 0800h to 1FFFh may be modified by EECON control
10 = 0000h to 00FFh write protected, 0100h to 1FFFh may be modified by EECON control
11 = Write protection off
PIC16F882
00 = 0000h to 03FFh write protected, 0400h to 07FFh may be modified by EECON control
01 = 0000h to 00FFh write protected, 0100h to 07FFh may be modified by EECON control
11 = Write protection off
bit 8 BOR4V: Brown-out Reset Selection bit
0 = Brown-out Reset set to 2.1V
1 = Brown-out Reset set to 4.0V
bit 7-0 Unimplemented: Read as1
PIC16F882/883/884/886/887
DS41291F-page 212 © 2009 Microchip Technology Inc.
14.2 Reset
The PIC16F882/883/884/886/887 differentiates
between various kinds of Reset:
a) Power-on Reset (POR)
b) WDT Reset during normal operation
c) WDT Reset during Sleep
d) MCLR Reset during normal operation
e) MCLR Reset during Sleep
f) Brown-out Reset (BOR)
Some regi sters a re not af fected in a ny Rese t conditio n;
their st a tus is un kn ow n o n POR a nd un ch ang ed in any
other Reset. Most other registers are reset to a “Reset
state” on:
Power-on Reset
•MCLR
Reset
•MCLR
Reset du ring Sleep
•WDT Reset
Brown-out Reset (BOR)
They are not affected by a WDT Wake-up since this is
viewe d as the resumptio n of no rm al op eration. TO an d
PD bits are set or cleared differently in different Reset
situations, as indicated in Table 14-2. These bits are
used in software to determine the nature of the Reset.
See Table 14-5 for a full description of Reset states of
all registers.
A simplif ied block diagra m of the On-Chip Rese t Circu it
is sh own i n Figure 14- 1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 17.0 “Electrical
Specifications” for pulse-width specifications.
FIGURE 14-1: SIMPLIFI ED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR/VPP pin
VDD
OSC1/
WDT
Module
VDD Rise
Detect
OST/PWRT
LFINTOSC
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
11-bit Ripple Counter
Reset
Enable OST
Enable PWRT
Sleep
Brown-out(1)
Reset SBOREN
BOREN
CLKI pin
Note 1: Refer to the Conf iguration Word Register 1 (Register 14-1).
© 2009 Microchip Technology Inc. DS41291F-page 213
PIC16F882/883/884/886/887
14.2.1 POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in Reset until VDD
has reached a high en ough level for proper operation. A
maximum rise time for VDD is required. See
Section 17.0 “Electrical Spe cification s” for details . If
the BOR is enabled, the maximum rise time specification
does not apply. The BOR circuitry will k eep the device in
Reset until VDD reaches VBOR (see Section 14.2.4
“Brown- ou t Re set (B OR )).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
14.2.2 MCLR
PIC16F882/883/884/886/887 has a noise filter in the
MCLR Reset path. The filter will detect and ignore
small pul ses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
The behavior of the ESD protection on the MCLR pin
has been altered from early devices of this family.
Vo lta ges app lied to the pin th at exce ed it s s pecif icatio n
can resu lt in both MCL R Rese t s a nd e xc es sive c urre nt
bey ond t h e de v ic e sp e ci fic at i on du ri ng th e ESD ev e nt .
For this rea son, Microc hip recomme nds that the MC LR
pin no long er be tied direc tly to VDD. The use of an RC
network, as shown in Figure 14-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bi t in the Configura tion Word R egister 1. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the RA3/MCLR pin
becomes an external Reset input. In this mode, the
RA3/MCLR pin has a we ak pull -up to VDD.
FIGURE 14-2: RECOMMENDED MCLR
CIRCUIT
14.2.3 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Ti mer operates from the 31 kHz
LFINTOSC oscillator. For more information, see
Section 4.5 “Internal Clock Mo des”. Th e ch ip is ke pt
in Reset as long as PWRT is active. The PWRT delay
allows the VDD to rise to an acceptable level. A
Configuration bit, PWR TE, can disable (if set) or enable
(if cleared or programmed) the Power-up Timer. The
Power-up Timer should be enabled when Brown-out
Reset is enabled, although it is not required.
The Power-up Timer delay will vary from chip-to-chip
and vary due to:
•V
DD variation
Temperature variation
Process variation
See DC parameters for details (Section 17.0 “Electrical
Specifications).
Note: The POR circuit does not produce an
internal Reset when VDD declines. To
re-enable the POR, VDD must reach Vss
for a minimum of 100 μs.
VDD PIC16F886
MCLR
R1
1kΩ (or greater)
C1
0.1 μF
(optional, not critical)
PIC16F882/883/884/886/887
DS41291F-page 214 © 2009 Microchip Technology Inc.
14.2.4 BROWN-OUT RESET (BOR)
The BOREN0 and BOREN1 bits in the Configuration
Word Register 1 select one of four BOR modes. Two
modes h ave been a dded to all ow softwa re or hardwa re
control of the BOR enable. When BOREN<1:0> = 01,
the SBOREN bit (PCON<4>) enables/disables the
BOR allowing it to be controlled in software. By
selecting BOREN<1:0>, the BOR is automatically
disabled in Sleep to conserve power and enabled on
wake-up. In this mode, the SBOREN bit is disabled.
See Register 14-3 for the Configuration Word
definition.
The BOR4V bit in the Configuration Word Register 2
selects one of two Brown-out Reset voltages. When
BOR4B = 1, VBOR is s et to 4V. When BOR4V = 0, VBOR
is set to 2.1V.
If VDD falls below VBOR for greater than parameter
(TBOR) (see Section 17.0 “Electrical Specifications”),
the Brown-out situation will reset the device. This will
occur regardless of VDD slew rate. A Reset is not insured
to occur if VDD falls bel ow VBOR for less than p arameter
(TBOR).
On any Reset (Power-on, Brown-out Reset, Watchdog
T imer , et c.), the ch ip will remai n in Reset unt il VDD rises
above VBOR (see Figure 14-3). The Power-up Timer
will no w be invoked, if enabled and will keep the chip in
Reset an additional 64 ms.
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-u p Timer will be re-initialized. Onc e VDD
rises above VBOR, the Power-up Timer will execute a
64 ms Reset.
FIGURE 14-3: BROWN-OUT SITUATIONS
Note: The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
Register 1.
64 ms(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset 64 ms(1)
< 64 ms
64 ms(1)
VBOR
VDD
Internal
Reset
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
© 2009 Microchip Technology Inc. DS41291F-page 215
PIC16F882/883/884/886/887
14.2.5 TIME-OUT SEQUENCE
On power-u p, the tim e-out sequ ence is as fo llows: first,
PWR T time-out is invoked after PO R has exp ired, the n
OST is act iv ated af te r the PWRT time-ou t has exp ire d.
The total time-out will vary based on oscillator
configuration and PWRTE bit status. For example, in
EC mode with PWRTE bit erased (PWRT disabled),
there will be no time-out at all. Figures 14-4, 14-5
and 14-6 depict time-out sequences. The device can
execute code from the INTOSC while OST is active by
enablin g Two-Spee d Start-up or Fai l-Saf e M on itor (see
Section 4.7.2 “Two-speed Start-up Sequence” and
Section 4.8 “Fail-Safe Clock Monitor”).
Since the time-outs oc cur from the PO R pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 14-5). This is useful for testing purposes or
to synchronize more than one
PIC16F882/883/884/886/887 device operating in par-
allel.
Table 14-5 shows the Reset conditions for some
special registers, while Table 14-4 shows the Reset
conditions for all the registers.
14.2.6 POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset that last
occurred.
Bit 0 is BOR (Brown-out Reset). BOR is unknown on
Power-on Reset. It must then be set by the user and
checked on subsequent Resets to see if BOR = 0,
indicating that a Brown-out has occurred. The BOR
Status bit is a “don’t care” and is not necessarily
predictable if the brown-out circuit is disabled
(BOREN<1:0> = 00 in the Configuration Word
Register 1).
Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaf fec ted oth erwise. T he user m ust write a
1’ to this bit following a Power-on Reset. On a
subsequent Reset, if POR is ‘0’, it will indicate that a
Power-on Reset has occurred (i.e., VDD may have
gone too low).
For more information, see Section 3.2.2 “Ultra
Low-Power Wake-up” and Section 14.2.4
“Brown-out Reset (BOR)”.
TABLE 14-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 14-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE
TABLE 14-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT
Oscillator Configuration Power-up Brown-out Reset Wake-up from
Sleep
PWRTE = 0PWRTE = 1PWRTE = 0PWRTE = 1
XT, HS, LP TPWRT +
1024 • TOSC 1024 • TOSC TPWRT +
1024 • TOSC 1024 • TOSC 1024 • TOSC
LP, T1OSCIN = 1TPWRT —TPWRT ——
RC, EC, INTOSC TPWRT —TPWRT ——
POR BOR TO PD Condition
0x11Power-on Reset
u011Brown-out Reset
uu0uWDT Reset
uu00WDT Wake-up
uuuuMCLR Reset during normal operation
uu10MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
PCON ULPWUE SBOREN —PORBOR --01 --qq --0u --uu
STATUS IRP RP1 RPO TO PD ZDC C0001 1xxx 000q quuu
Legend: u = unchanged , x = unknown, = unimplemented bit, reads as 0’, q = value depends on condition. Shaded cells are not used by BOR.
Note 1: Other (non Power-up) Resets include MCLR Rese t and Watchdog Timer Reset dur ing nor ma l operation.
PIC16F882/883/884/886/887
DS41291F-page 216 © 2009 Microchip Technology Inc.
FIGURE 14-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
FIGURE 14-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
FIGURE 14-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT T ime-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
© 2009 Microchip Technology Inc. DS41291F-page 217
PIC16F882/883/884/886/887
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER
Register Address Power-on
Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h/10
0h/180h xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h/101h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h/10
2h/182h 0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h/10
3h/183h 0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h/10
4h/184h xxxx xxxx uuuu uuuu uuuu uuuu
PORTA 05h xxxx xxxx 0000 0000 uuuu uuuu
PORTB 06h/106h xxxx xxxx 0000 0000 uuuu uuuu
PORTC 07h xxxx xxxx 0000 0000 uuuu uuuu
PORTD 08h xxxx xxxx 0000 0000 uuuu uuuu
PORTE 09h ---- xxxx ---- 0000 ---- uuuu
PCLATH 0Ah/8Ah/10
Ah/18Ah ---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh/10
Bh/18Bh 0000 000x 0000 000u uuuu uuuu(2)
PIR1 0Ch 0000 0000 0000 0000 uuuu uuuu(2)
PIR2 0Dh 0000 0000 0000 0000 uuuu uuuu(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
TMR2 11h 0000 0000 0000 0000 uuuu uuuu
T2CON 12h -000 0000 -000 0000 -uuu uuuu
SSPBUF 13h xxxx xxxx uuuu uuuu uuuu uuuu
SSPCON 14h 0000 0000 0000 0000 uuuu uuuu
CCPR1L 15h xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H 16h xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 17h 0000 0000 0000 0000 uuuu uuuu
RCSTA 18h 0000 000x 0000 0000 uuuu uuuu
TXREG 19h 0000 0000 0000 0000 uuuu uuuu
RCREG 1Ah 0000 0000 0000 0000 uuuu uuuu
CCPR2L 1Bh xxxx xxxx uuuu uuuu uuuu uuuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Rese ts will caus e bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
PIC16F882/883/884/886/887
DS41291F-page 218 © 2009 Microchip Technology Inc.
CCPR2H 1Ch xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON 1Dh --00 0000 --00 0000 --uu uuuu
ADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 1Fh 00-0 0000 00-0 0000 uu-u uuuu
OPTION_REG 81h/181h 1111 1111 1111 1111 uuuu uuuu
TRISA 85h 1111 1111 1111 1111 uuuu uuuu
TRISB 86h/186h 1111 1111 1111 1111 uuuu uuuu
TRISC 87h 1111 1111 1111 1111 uuuu uuuu
TRISD 88h 1111 1111 1111 1111 uuuu uuuu
TRISE 89h ---- 1111 ---- 1111 ---- uuuu
PIE1 8Ch 0000 0000 0000 0000 uuuu uuuu
PIE2 8Dh 0000 0000 0000 0000 uuuu uuuu
PCON 8Eh --01 --0x --0u --uu(1, 5) --uu --uu
OSCCON 8Fh -110 q000 -110 q000 -uuu uuuu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
SSPCON2 91h 0000 0000 0000 0000 uuuu uuuu
PR2 92h 1111 1111 1111 1111 1111 1111
SSPADD(6) 93h 0000 0000 0000 0000 uuuu uuuu
SSPMSK(6) 93h 1111 1111 1111 1111 1111 1111
SSPSTAT 94h 0000 0000 0000 0000 uuuu uuuu
WPUB 95h 1111 1111 1111 1111 uuuu uuuu
IOCB 96h 0000 0000 0000 0000 uuuu uuuu
VRCON 97h 0000 0000 0000 0000 uuuu uuuu
TXSTA 98h 0000 -010 0000 -010 uuuu -uuu
SPBRG 99h 0000 0000 0000 0000 uuuu uuuu
SPBRGH 9Ah 0000 0000 0000 0000 uuuu uuuu
PWM1CON 9Bh 0000 0000 0000 0000 uuuu uuuu
ECCPAS 9Ch 0000 0000 0000 0000 uuuu uuuu
PSTRCON 9Dh ---0 0001 ---0 0001 ---u uuuu
ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON1 9Fh 0-00 ---- 0-00 ---- u-uu ----
WDTCON 105h ---0 1000 ---0 1000 ---u uuuu
CM1CON0 107h 0000 0-00 0000 0-00 uuuu u-uu
CM2CON0 108h 0000 0-00 0000 0-00 uuuu u-uu
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER (CONTINUED)
Register Address Power-on
Reset
MCLR Reset
WDT Reset (Continued)
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-o ut (Continue d)
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Rese ts will caus e bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
© 2009 Microchip Technology Inc. DS41291F-page 219
PIC16F882/883/884/886/887
TABLE 14-5: INITIALIZATION CONDITION FOR SPECIAL REGISTERS
CM2CON1 109h 0000 0--0 0000 0--0 uuuu u--u
EEDAT 10Ch 0000 0000 0000 0000 uuuu uuuu
EEADR 10Dh 0000 0000 0000 0000 uuuu uuuu
EEDATH 10Eh --00 0000 --00 0000 --uu uuuu
EEADRH 10Fh ---0 0000 ---0 0000 ---u uuuu
SRCON 185h 0000 00-0 0000 00-0 uuuu uu-u
BAUDCTL 187h 01-0 0-00 01-0 0-00 uu-u u-uu
ANSEL 188h 1111 1111 1111 1111 uuuu uuuu
ANSELH 189h 1111 1111 1111 1111 uuuu uuuu
EECON1 18Ch ---- x000 ---- q000 ---- uuuu
EECON2 18Dh ---- ---- ---- ---- ---- ----
Condition Program
Counter Status
Register PCON
Register
Power-on Reset 000h 0001 1xxx --01 --0x
MCLR Reset during normal operation 000h 000u uuuu --0u --uu
MCLR Reset during Sleep 000h 0001 0uuu --0u --uu
WDT Reset 000h 0000 uuuu --0u --uu
WDT Wake- up PC + 1 uuu0 0uuu --uu --uu
Brown-out Reset 000h 0001 1uuu --01 --u0
Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu --uu --uu
Legend: u = unchanged, x = unknown, = unimplemented bit, reads as ‘0’.
Note 1: When the wak e-up is due to an interrupt and Gl obal Interrup t Enable bit, GIE, is set, the PC is loade d with
the inter rupt vector (0004h) after executio n of PC + 1.
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER (CONTINUED)
Register Address Power-on
Reset
MCLR Reset
WDT Reset (Continued)
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-ou t (Continued )
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Rese ts will caus e bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
PIC16F882/883/884/886/887
DS41291F-page 220 © 2009 Microchip Technology Inc.
14.3 Interrupts
The PIC16F882/883/884/886/887 has multiple
interrupt sources:
Extern al Inte rrup t RB0/INT
Tim er0 Overflow Interrupt
PORTB Change Interrupts
2 Comparator Interrupts
A/D Interrupt
Tim er1 Overflow Interrupt
Timer2 Match Interrupt
EEPROM Data Write Interrupt
Fail-Safe Clock Monitor Interrupt
Enhanced CCP Interrupt
EUSART Receive and Transmit Interrupts
Ultra Low-Power Wake-up Interrupt
MSSP Interrupt
The Interrup t Control register (INTCON) and Peripheral
Interrupt Request Register 1 (PIR1) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
A Global Interrupt Enable bit, GIE (INTCON<7>),
enables (if set) all unmasked interrupts, or disables (if
cleared) all interrupts. Individual interrupts can be
disabled through their corresponding enable bits in the
INTCON, PIE1 and PIE2 re gis ter s, respe ctive ly. GIE is
cleared on Reset.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enabl es unm as ke d interrupts.
The following interrupt flags are contained in the INT-
CON register:
INT Pin Interrupt
PORTB Change Interrupts
Tim er0 Overflow Interrupt
The perip heral interru pt flags ar e cont ained in the PIR1
and PIR2 registers. The co rresponding interrupt enable
bits are contained in PIE1 and PIE2 registers.
The following interrupt flags are contained in the PIR1
register:
A/D Interrupt
EUSART Receive and Transmit Interrupts
Tim er1 Overflow Interrupt
Synchronous Serial Port (SSP) Interrupt
Enhanced CCP1 Interrupt
Tim er1 Overflow Interrupt
Timer2 Match Interrupt
The following interrupt flags are contained in the PIR2
register:
Fail-Safe Clock Monito r Interru pt
2 Comp ara tor Inte rrupts
EEPROM Data Write Interrupt
Ultra Low-Power Wake-up Interrupt
CCP2 Inte rrupt
When an interrupt is serviced:
The G IE is c lea red t o di sa ble any fu rthe r int errupt.
The return address is pushed onto the stack.
The PC is loaded with 0004h.
For external interrupt events, such as the INT pin,
PORTB change interrupts, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 14-8). The latency is the same for one or
two-cycle instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
For additional information on Timer1, Timer2,
comparators, A/D, data EEPROM, EUSART, MSSP or
Enhanced CCP modules, refer to the respective
peripheral section.
14.3.1 RB0/INT INTERRUPT
External interrupt on RB0/INT pin is edge-triggered;
either rising if the INTEDG bit (OPTION_REG<6>) is
set, or falling, if the INTEDG bit is clear. When a valid
edge appears on the RB0/INT pin, the INTF bit
(INTCO N<1>) is set. This interr upt can be disabled by
clearing the INTE control bit (INTCON<4>). The INTF
bit must be cl eared in software in the Inte rrupt Servi ce
Routine b efore re- enabling t his interr upt. The RB 0/INT
interrup t can wake-up t he processor fr om Sleep, if th e
INTE bit was set prior to going into Sleep. The status of
the GIE bit decides whether or not the processor
branches to the interrupt vector following wake-up
(0004h). See Section 14.6 “Power-Down Mode
(Sleep) for details on Sleep and Figure 14-10 for
timing of wake-up from Sleep through RB0/INT
interrupt.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
© 2009 Microchip Technology Inc. DS41291F-page 221
PIC16F882/883/884/886/887
14.3.2 TIMER0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
the T0IF (INTCON<2>) bit. The interrupt can be
enabled/disabled by setting/clearing T0IE (INTCON<5>)
bit. See Section 5.0 “Timer0 Module” for operation of
the Timer0 module.
14.3.3 PORTB INTERRUPT
An input change on PORTB change sets the RBIF
(INTCON<0>) bit. The interrupt can be
enabled/disabled by setting/clearing the RBIE
(INTCON<3>) bit. Plus, individual pins can be
configured through the IOCB register.
FIGURE 14-7: INTERRUPT LOGIC
Note: If a change on the I/O pin should occur
when the read operation is being executed
(start of the Q2 c ycle), then the RBIF int er-
rupt flag may not get set. See
Section 3.4.3 “Interrupt-on-Cha nge” for
more information.
C1IF
C1IE
T0IF
T0IE
INTF
INTE
RBIF
RBIE
GIE
PEIE
Wake-up (If in Sleep mode)(1)
Inter rupt to CPU
EEIE
EEIF
ADIF
ADIE
IOC-RB0
IOCB0
IOC-RB1
IOCB1
IOC-RB2
IOCB2
IOC-RB3
IOCB3
CCP1IF
CCP1IE
OSFIF
OSFIE
C2IF
C2IE
IOC-RB4
IOCB4
IOC-RB5
IOCB5
IOC-RB6
IOCB6
IOC-RB7
IOCB7
RCIF
RCIE
TMR2IE
TMR2IF
SSPIE
SSPIF
TXIE
TXIF
TMR1IE
TMR1IF
Note 1: Some peripherals depend upon the
system clock for operation. Since the
system clock is suspended during
Sleep, these peripherals will not wake
the part from Sleep. See Section 14.6.1
“Wake-up from Sleep”.
BCLIE
BCLIF
ULPWUIF
ULPWUIE
CCP2IF
CCP2IE
PIC16F882/883/884/886/887
DS41291F-page 222 © 2009 Microchip Technology Inc.
FIGURE 14-8: INT PIN INTERRUPT TIMING
TABLE 14-6: SUMMARY OF INTERRUPT REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all ot her
Resets
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000x
PIE1 ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 -000 0000
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE CCP2IE 0000 00-0 0000 00-0
PIR1 ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 -000 0000
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF CCP2IF 0000 00-0 0000 00-0
Legend: x = unknown, u = unchanged, = unimplemented read as 0’, q = value depends upon condition.
Shaded cells are not used by the Interrupt module.
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT p in
INTF flag
(INTCON<1>)
GIE bi t
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycl e
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Dummy Cycl e
Inst ( PC)
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency
is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 17.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1) (2)
(3) (4)
(5)
(1)
© 2009 Microchip Technology Inc. DS41291F-page 223
PIC16F882/883/884/886/887
14.4 Context Savi ng During Int errupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Since th e upper 16 bytes of all GPR banks are c om-
mon in the PIC16F882/883/884/886/887 (see
Figures 2-2 and 2-3), temporary holding registers,
W_TEMP and STATUS_TEMP, should be placed in
here. These 16 lo cations do not require banking and
theref ore, ma ke it e asi er to con tex t save and r estor e.
The same c ode show n in Exa mple 14-1 c an be used
to:
Store the W register
Store the STATUS register
Execute the ISR code
Restore the Status (and Bank Select Bit register)
Restore the W register
EXAMPLE 14-1: SAVING STATUS AND W REGISTERS IN RAM
Note: The PIC16F882/883/884/886/887 nor-
mally does not require saving the
PCLATH. However, if computed GOTO’s
are used in the ISR and the main code, the
PCLATH must be saved and restored in
the ISR.
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS,W ;Swap status to be saved into W
;Swaps are used because they do not affect the status bits
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
PIC16F882/883/884/886/887
DS41291F-page 224 © 2009 Microchip Technology Inc.
14.5 Watchdog Timer (WDT)
The WDT has the following features:
Operates from the LFINTOSC (31 kHz)
Contains a 16-bit prescaler
Shares an 8-bit prescaler with Timer0
Time-out period is from 1 ms to 268 seconds
Configuration bit and software controlled
WDT is cleared under certain conditions described in
Table 14-7.
14.5.1 WD T OS CIL LAT OR
The WDT derives its time base from the 31 kHz
LFINTOSC. The LTS bit of the OSCCON regi ste r doe s
not reflect that the LFINTOSC is enabled.
The value of WDTCON is ‘---0 1000’ on all R esets.
This gives a nominal time base of 17 ms.
14.5.2 WDT CONTROL
The WDTE bit is located in the Configuration Word
Register 1. When set, the WDT runs continuously.
When the WDTE bit in the Configuration Word
Register 1 is set, the SWDTEN bit of the WDTCON
register has no effect. If WDTE is clear, then the
SWDTEN bit can be used to enable and disable the
WDT. Setting the bit will enable it and clearing the bit
will disable it.
The PSA and PS<2:0> bits of the OPTION register
have the same function as in previous versions of the
PIC16F882/883/884/886/887 Family of microcon-
trollers. See Section 5.0 “Timer0 Module for more
information.
FIGURE 14-9: WATCHDOG TIMER BLOCK DIAGRAM
Note: When the Oscillator Start-up Timer (OST)
is invoked, the WDT is held in Reset,
bec ause the WD T Ri pple Cou nte r i s us ed
by the OST to perform the oscillator delay
count. When the OST count has expired,
the WDT will begin counting (if enabled).
TABLE 14-7: WDT STATUS
Conditions WDT
WDTE = 0Cleared
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
31 kHz
PSA
16-bit WDT Prescaler
From TMR0 Clock Source
Prescaler(1)
8
PS<2:0>
PSA
WDT Time-out
WDTPS<3:0>
WDTE from the Configuration Word Register 1
1
1
0
0
SWDTEN from WDTCON
LFINTOSC Clock
Note 1: This is the shared Timer0/WDT prescaler . See Section 5.1.3 “Software Programmable Prescaler” for more information.
© 2009 Microchip Technology Inc. DS41291F-page 225
PIC16F882/883/884/886/887
TABLE 14-8: SUMMARY OF WATCHDOG TIMER REGISTER
REGISTER 14-3: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 U-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0
WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0
bit 4-1 WDTPS<3:0>: Watchdog Timer Period Select bits
Bit Value = Prescale Rate
0000 = 1:32
0001 = 1:64
0010 = 1:128
0011 = 1:256
0100 = 1:512 (Reset v alue)
0101 = 1:1024
0110 = 1:2048
0111 = 1:4096
1000 = 1:8192
1001 = 1:16384
1010 = 1:32768
1011 = 1:65536
1100 = reserved
1101 = reserved
1110 = reserved
1111 = reserved
bit 0 SWDTEN: Software Enable or Disable the Watchdog Timer(1)
1 = WDT is turned on
0 = WDT is turned off (Reset value)
Note 1: If WDTE Configuration bit = 1, then WDT is always enabled, irrespective of this control bit. If WDTE
Configu ration bi t = 0, then it is possible to turn WDT on/off with this control bit.
Name B it 7 B i t 6 Bit 5 Bit 4 Bit 3 B it 2 B it 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
CONFIG1(1) CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 ——
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
WDTCON WDTPS3 WDTPS2 WSTPS1 WDTPS0 SWDTEN ---0 1000 ---0 1000
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Register 1 4-1 for operation of all Configuration Word Register 1 bits.
PIC16F882/883/884/886/887
DS41291F-page 226 © 2009 Microchip Technology Inc.
14.6 Power-Down Mode (Sleep)
The Power-down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
WDT will be cleared but keeps running.
•PD
bit in the STATUS register is cleared.
•TO
bit is set.
Oscillator driver is turned off.
I/O ports maintain the status they had before
SLEEP was executed (driving high, low or
high-impedance).
For lowest current consumption in this mode, all I/O pins
should be either at VDD or VSS, with no external circuitry
drawing current from the I/O pin and the comparators
and CVREF should be disabled. I/O pins that are
high-impedance inputs should be pulled high or low
externally to avoid switching current s caused by floating
input s. The T0CKI input should also be at VDD or VSS for
lowest current consumption. The contribution from
on-chip pull-ups on PORTA should be considered.
The MCLR pin must be at a logic high level.
14.6.1 WAKE-UP FROM SLEEP
The devi ce can wa ke-up from Sleep through on e of the
following events:
1. External Reset input on MCLR pin.
2. W atchd og T imer W ake-up (if WDT was enabled).
3. Interrupt from RB0/INT pin, PORTB change or a
peripheral interrupt.
The firs t event wi ll ca use a de vice Res et. The two latter
events are considered a continuation of program exe-
cution. The T O an d PD bit s in the STATUS re gister can
be used to determine the c ause of device Reset. The
PD bit, which is set on power-up, is cleared when Sleep
is invoked. TO bit is cleare d if W DT Wake-u p occurre d.
The follo wing periph eral interrupt s can wake the device
from Sleep:
1. TMR1 inte rrupt. T imer1 must be operating as a n
asynchronous counter.
2. ECCP Capture mode interrupt.
3. A/D conversion (when A/D clo ck source is FRC).
4. EEPROM write operation completion.
5. Comparator output changes state.
6. Interrupt-on-change.
7. External Interrupt from INT pin.
8. EUSART Break detect, I2C slave.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up thro ugh an interrupt eve nt, the co rres pon din g
interrupt enable bit must be set (enabled). Wake-up
occurs regardless of the state of the GIE bit. If the GIE
bit is clear (disabled), the device continues execution at
the inst ruction af ter the SLEEP ins truction. If the GIE b it
is set (enabled), the device executes the instruction
after the SLEEP instruction, then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following SLEEP is not desirable, the
user should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
14.6.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and inte rrupt fla g bit s et, one of the fo llow ing wil l occu r:
If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
comple te as a NOP. Therefo re, the WDT an d WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
If the interrupt occurs during or after the ex ecu-
tion of a SLEEP instruction, the device will imme-
diately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. The refore, the WDT and WDT pres caler
and pos tsc aler (if enable d) wi ll be c leared , the T O
bit will be set and the PD bit will be cl eare d.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruct ion completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instru ction
should be executed before a SLEEP instruction.
Note: It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note: If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt enable bit and the corresponding
interrupt flag bits set, the device will
immediately wake-up from Sleep. The
SLEEP instruction is completely executed.
© 2009 Microchip Technology Inc. DS41291F-page 227
PIC16F882/883/884/886/887
FIGURE 14-10: WAKE-UP FROM SLEEP THROUGH INTERRUPT
14.7 Code Protecti on
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out using ICSP for verifi cation purposes.
14.8 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal exe cution but are readable
and writable during Program/Verify mode. Only the
Least Significan t 7 bit s of the ID locations are used.
14.9 In-Ci rcuit Serial Programming™
The PIC1 6F8 82/ 883 /884 /886/887 mic roc on trol lers ca n
be seri ally pr ogrammed while in the en d app lication c ir-
cuit. This is simply done with two lines for clock and
data and three other lines for:
power
ground
programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the micro-
controller just before shipping the product. This also
allows the most recent firmware or a custom firmware
to be programmed.
The device is placed into a Program/Verify mode by
holding the RB6/ICSPCLK and RB7/ICSPDA T pins low ,
while raising th e MCLR (VPP) pin from VIL to VIHH. See
the “PIC16F88X Memory Programming Specification”
(DS41287) for more information. RB7 becomes the
programming data and RB6 becomes the programming
clock. Bo th RB7 and RB 6 are Schmi tt Trigger inputs in
this mode.
After Reset, to place the device into Program/Verify
mode, the Program Counter (PC) is at location 00h. A
6-bit command is then supplied to the device.
Depending on the command, 14 bits of program data
are then supplied to or from the device, depending on
whether the command was a Load or a Read. For
complete details of serial programming, please refer to
the “PIC16F88X Memory Programming Specification”
(DS41287).
A typical In-Circuit Serial Programming connection is
shown in Figure 14-11.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(3)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 000 5h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Osc illa tor mode assume d.
2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC and RC Oscillator modes.
3: GIE = 1 assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = 0, execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
Note: The entire data EEPROM and Flash
program memory will be erased when the
code protection is switched from on to off.
See the “PIC16F88X Memory Programming
Specification” (DS41287) for more
information.
PIC16F882/883/884/886/887
DS41291F-page 228 © 2009 Microchip Technology Inc.
FIGURE 14-11: TYPICAL IN-CIRCUIT
SERIAL
PROGRAMMING™
CONNECTION
14.10 Low-Voltage (Single-Supply) ICSP
Programming
The LVP bit of the Configuration Word enables
low-voltage ICSP programming. This mode allows the
microcontroller to be programmed via ICSP using a
VDD source in the operating voltage range. This only
means that VPP does not h ave to be brough t to VIHH but
can instead be left at the normal operating voltage. In
this mode, the RB3/PGM pin is dedicated to the
programming function and ceases to be a general
purpose I/O pin. During programming, VDD is app lied to
the MC LR pin. To enter Programming mode, VDD must
be appli ed to the RB3/PG M provid ed the LVP bit is set.
The LVP bit defaults to on (‘1’) from the factory.
If Low-V olt age Programming mode is not us ed, the L VP
bit can be programmed t o a ‘0’ and RB3/PGM be comes
a digital I/O pin. However, the LVP bit may only be
programmed when programming is entered with VIHH
on MCL R. The L VP bi t can only be charged whe n using
high voltage on MCLR.
It should be noted, that once the LVP bit is programmed
to ‘0’, only the High-Voltage Programming mode is
available and only High-Voltage Programming mode
can be used to program the device.
When using low-voltage ICSP, the part must be
supplied at 4.5V to 5.5V if a bulk erase will be executed.
This includes reprogramming of the code-protect bits
from an on state to an off state. For all other cases of
low-voltage ICSP, the part may be programmed at the
normal operating voltage. This means calibration
values, unique user IDs or user code can be
reprogrammed or added.
External
Connector
Signals
To Normal
Connections
To Normal
Connections
PIC16F882/883/
VDD
VSS
RE3/MCLR/VPP
RB6
RB7
+5V
0V
VPP
CLK
Data I/O
* * *
*
* Isolation devices (as required)
884/886/887
Note 1: The High-Voltage Programming mode is
always available, regardless of the state
of the LVP bit, by applying VIHH to the
MCLR pin.
2: While in Low-Voltage ICSP mode, the
RB3 pin can no longer be used as a
general purpose I/O pin.
3: When using Low-Voltage ICSP Program-
ming (LVP) and the pull-ups on PORTB
are enabled, bit 3 in the TRISB register
must be cleared to disable the pull-up on
RB3 and ensure the proper operation of
the device.
4: RB3 should not be allowed to float if LVP
is enabled. An external pull-down device
should be used to default the device to
normal operating mode. If RB3 floats
high, the PIC16F882/883/884/886/887
device will enter Programming mode.
5: LVP mode is enabled by default on all
device s shi pped from Microchi p. It can b e
disabled by clearing the LVP bit in the
CONFIG register.
© 2009 Microchip Technology Inc. DS41291F-page 229
PIC16F882/883/884/886/887
14.11 In-Circuit Debugger
The PIC16F882/883/884/886/887-ICD can be used in
any of the package types. The device will be mounted
on the ta rget appl ication boa rd, which in turn ha s a 3 or
4 wire connection to the ICD tool.
When the debug bit in the Configuration Word
(CONFIG<13>) is programmed to a ‘0’, the In-Circuit
Debug ger fun ct ion ali t y is enabled. This fun ct ion allo w s
simple debugging functions when used with MPLAB®
ICD 2. When the microcontroller has this feature
enabled, some of the resources are not available for
general use. See Table 14-9 for more detail.
For more information, see “Using MPLAB® ICD 2”
(DS51265), available on Microchip’s web site
(www.microchip.com).
14.11.1 ICD PINOUT
The devices in the PIC16F88X family carry the
circuitry for the In-Circuit Debugger on-chip and on
existing device pins. This eliminates the need for a
sepa rate di e or p acka ge for th e ICD d evice . The pi nout
for the ICD device is the same as the devices (see
Section 1.0 “Device Overview” for complete pinout
and pin descriptions). Table 14-9 shows the location
and function of the ICD related pins on the 28 and 40
pin devices.
TABLE 14-9: PIC16F883/884/886/887-ICD PIN DESCRIPTIONS
Note: The users application must have the
circuitry required to support ICD
functionality. Once the ICD circuitry is
enabled, normal device pin functions on
RB6/ICSPCLK and RB7/ICSPDAT will not
be usab le. The IC D circuitry uses the se pins
for communication with the ICD2 external
debugger.
Pin (PDIP)
Name Type Pull-up Description
PIC16F884/887 PIC16F882/883/
886
40 28 ICDDATA TTL In-Circuit Debugger Bidirectional data
39 27 ICDCLK ST In-Circuit Debugger Bidirectional clock
11MCLR
/VPP HV Programming voltage
11,32 20 VDD P—
12,31 8,19 VSS P—
Legend: TTL = TTL input buffer, ST = Schmitt Trigger input buffer, P = Power, HV = High Voltage
PIC16F882/883/884/886/887
DS41291F-page 230 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 231
PIC16F882/883/884/886/887
15.0 INSTRUCTION SET SUMMARY
The PIC16F882/883/884/886/887 instruction set is
highly orthogo nal and is co mp rised o f three b asic cate-
gories:
Byte-oriented operations
Bit-oriented operations
Literal and cont rol operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instruction type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
is presented in Figure 15-1, while the various opcode
fields are sum m ariz ed in Table 15-1.
Table 15-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The desti nation designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W regis ter . If ‘d’ is one, the res ult is place d
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instr uction cycle co nsists of four os cillator periods ;
for an oscillator frequency o f 4 MHz, t his gives a normal
instruction execution time of 1 μs. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
change d as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
15.1 Read-M odify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF PORTA instruction will read
PORTA, clear all th e data bit s, then write the result b ack
to PORTA. This example would have the unintended
consequence of clearing the condition that set the RAIF
flag.
TABLE 15-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 15-1: GENERAL FORMAT FOR
INSTRUCTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral fie ld, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result i n W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
Byte-oriented file registe r operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriente d file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (li te r a l )
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16F882/883/884/886/887
DS41291F-page 232 © 2009 Microchip Technology Inc.
TABLE 15-2: PIC16F882/883/884/886/887 INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
k
k
k
k
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move litera l to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external
device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
© 2009 Microchip Technology Inc. DS41291F-page 233
PIC16F882/883/884/886/887
15.2 Instruction Descriptions
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal ‘k’
and the result is placed in the
W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d ∈ [0,1]
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Desc ription: Add the contents o f the W regis ter
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W registe r . I f
‘d’ is ‘1’, the result is stored back
in register ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal
‘k’. The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d ∈ [0,1]
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is 1’, the
result is sto r ed bac k in regi ste r ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
St at us Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
St at us Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
St at us Af fe cte d: None
Descr iption: If bit ‘b’ in reg ister ‘f’ is ‘1’, t he ne xt
instruction is executed.
If bit ‘b’ in reg ister ‘f’ is ‘0’, t he ne xt
instruction is discarded, and a NOP
is exec uted ins tea d, m ak ing thi s a
two-cycle instruction.
PIC16F882/883/884/886/887
DS41291F-page 234 © 2009 Microchip Technology Inc.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Desc ription: If bit ‘b’ in regi ster ‘f’ is ‘0’, the ne xt
instructi on is exec uted .
If bit ‘b’ is ‘1’, then the next
instructi on is dis ca rded an d a NOP
is exec ute d i nst ead, making thi s a
two -cycle instruc tion.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits <10:0>. The upper bits of
the PC are loa ded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Desc ript ion : The conten t s of regi ste r ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
St at us Af fe cte d: T O, PD
Description: CLRWDT instruction resets the
W atchdog T imer . It also resets the
prescaler of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
St at us Af fe cte d: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
St at us Af fe cte d: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is 1’, the result is
stored back in register ‘f’.
© 2009 Microchip Technology Inc. DS41291F-page 235
PIC16F882/883/884/886/887
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decrem ented. If ‘d’ is ‘0’, th e result
is placed in the W register. If ‘d’ is
1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
resu lt is ‘0’, then a NOP is
executed instead, making it a
two-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The e le ven -bi t im me dia t e v al ue i s
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
incremen ted. If ‘ d’ is 0’, th e result
is placed in the W register. If ‘d’ is
1’, the result is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
St at us Af fe cte d: None
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is0’, a NOP is executed
instead, making it a two-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
St at us Af fe cte d: Z
Descr iption: T he content s of the W reg ister are
OR’ed with the eight-bit literal ‘k’.
The result is placed in the
W registe r.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
St at us Af fe cte d: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ is 0’, the result is
placed in the W register. If ‘d’ is
1’, the result is pla ce d back in
register ‘f’.
PIC16F882/883/884/886/887
DS41291F-page 236 © 2009 Microchip Technology Inc.
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Desc ript ion : The conten t s of regi ste r ‘f’ is
moved to a destination dependent
upon the status of ‘d’. If d = 0,
destination is W register. If d = 1,
the destination is file register ‘f’
itself. d = 1 is useful to test a file
register since status flag Z is
affected.
Words: 1
Cycles: 1
Example:MOVF FSR, 0
After Instruction
W= value in FSR
register
Z= 1
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Desc ription: The e ight-bit literal ‘k’ is loa ded into
W register. The “don’t cares” will
assemble as 0’s.
Words: 1
Cycles: 1
Example:MOVLW 0x5A
After Instruction
W= 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
St at us Af fe cte d: None
Description: Move data from W register to
register ‘f’.
Words: 1
Cycles: 1
Example:MOVW
FOPTION
Before Instruction
OPTION= 0xFF
W = 0x4F
After Instruction
OPTION= 0x4F
W = 0x4F
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
St at us Af fe cte d: None
Description: No operation.
Words: 1
Cycles: 1
Example:NOP
© 2009 Microchip Technology Inc. DS41291F-page 237
PIC16F882/883/884/886/887
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is
POPed an d Top-of-S t ack (TOS) is
loaded in the PC. Interrupts are
enabled by setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example:RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
St at us Af fe cte d: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains
table ;offset value
;W now has
;table value
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
RETLW kn ;End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
St at us Af fe cte d: None
Description: Return from subroutine. The stack
is POPed an d t he top of th e s tack
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
PIC16F882/883/884/886/887
DS41291F-page 238 © 2009 Microchip Technology Inc.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is1’, the result is stored
back in register ‘f’.
Words: 1
Cycles: 1
Example:RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Desc ript ion : The contents of register ‘f’ are
rotat ed one bit to the r ight throug h
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is place d
back in register f’.
Register fC
Register fC
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
St at us Af fe cte d: TO, PD
Descripti on: The power-down S tatus bit, PD is
cleared. Time-out Status bit, TO
is set. Watchdog Timer an d its
prescaler are cleared.
The processor is put into Sleep
mode with th e oscillat or stopped.
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) → (W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
C = 0W > k
C = 1W k
DC = 0W<3:0> > k<3:0>
DC = 1W<3:0> k<3:0>
© 2009 Microchip Technology Inc. DS41291F-page 239
PIC16F882/883/884/886/887
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) → (destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If ‘d’ is
0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
0’, the result is placed in the W
register. If ‘d’ is 1’, the result is
placed in register ‘f’.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k (W)
Status Affected: Z
Description: The contents of the W register
are XOR’ed with the eight-b it
literal ‘k’. The result is placed in
the W register.
C = 0W > f
C = 1W f
DC = 0W<3:0> > f<3:0>
DC = 1W<3:0> f<3:0>
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) → (destination)
St at us Af fe cte d: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
0’, the result is stored in the W
register. If ‘d’ is 1’, the result is
stored back in register ‘f’.
PIC16F882/883/884/886/887
DS41291F-page 240 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 241
PIC16F882/883/884/886/887
16.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
Integrated Development Environment
- MPLAB® IDE Software
Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Devic e Progra mm ers
- PICSTART® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
Low-Cost Demonstration and Development
Boards and Evaluation Kits
16.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit micro-
controller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold sep ara tel y)
- I n-Ci rcuit Debugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Visual device initializer for easy register
initialization
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Ex ten si ve on-l ine help
Integrat ion of select thir d party tool s, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
Edit your s ource file s (either assembl y or C)
One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
Deb ug us ing :
- Source file s (asse mbly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC16F882/883/884/886/887
DS41291F-page 242 © 2009 Microchip Technology Inc.
16.2 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assemb ler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly co de
Conditional assembly for multi-purpose
sour ce fil es
Directives that allow complete control over the
assembly process
16.3 MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 and PIC24 families of microcon-
trollers and the dsPIC30 and dsPIC33 family of digital
signal controllers. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use not found with other compilers.
For easy source level debugging, the compil ers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
16.4 MPLINK Object Linker/
MPLIB Object Librari an
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manag es the cre ation an d
modification of library files of precompiled code. When
a routine from a library is called from a source file , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and ex traction
16.5 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linke d with other relocatable ob ject files and
arch ives to c rea te an e xecu tabl e fil e. N otab le fe atu res
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Ric h dire cti ve set
Flexible macro language
MPLAB IDE compatibility
16.6 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most periph erals and inte rnal regi sters.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
© 2009 Microchip Technology Inc. DS41291F-page 243
PIC16F882/883/884/886/887
16.7 MPLAB ICE 2000
High-Performance
In-Circuit Emulator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data monitor-
ing feat ures. Interc hangeabl e proces sor modul es allow
the system to be easily reconfigured for emulation of
different processors. The architecture of the MPLAB
ICE 2000 In-Circuit Emulator allows expansion to
support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
16.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash D SC® and MCU devic es. It debugs and
programs PIC® and dsPIC® Flash microcontrollers with
the easy-to-use, powerful graphical user interface of the
MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE pro be is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high speed, noise tolerant, low-
voltage differential signal (LVDS) interconnection
(CAT5).
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB ID E, new devic es w ill be supported,
and new features will be added, suc h as software break-
points and assembly code trace. MPLAB REAL ICE
offers significant advantages ov er competitive emulators
including low-cost, full-speed emulation, real-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables .
16.9 MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers cost-
effective, in-circuit Flash debugging from the graphical
user interface of the MPLAB Integrated Development
Environment. This enables a designer to develop and
debug sou rce code by s etting bre akpoi nts , singl e step -
ping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
16.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for men us an d error m essages and a m odu-
lar, detachable socket assembly to support various
pack age types. The ICSP™ cable assembly is incl uded
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer ca n read, verif y and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 h as high-spe ed co mmunicat ions an d
optimized algorithms for quick programming of large
memory devices and in corporates an SD/MMC card for
file storage and secure data applications.
PIC16F882/883/884/886/887
DS41291F-page 244 © 2009 Microchip Technology Inc.
16.11 PICSTART Plus Development
Programmer
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Inte grated D evelopm ent Envir onment software m akes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76 X, may be sup ported with an a dapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
16.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’s baseline, mid-range and PIC18F families of
Flash m emory microcon trollers. The PICkit 2 S tarter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler , and is desig ned to hel p get up to s peed
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
16.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards includ e prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s suppo rt a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart® battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Check the Microchip web page (www.microchip.com)
and the latest “Product Selector Guide” (DS00148) for
the complete list of demonstration, development and
evaluation kits.
© 2009 Microchip Technology Inc. DS41291F-page 245
PIC16F882/883/884/886/887
17.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature........................................................................................................................ -65°C to +150°C
Vo lt a ge on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V
Vo lt a ge on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total power dissipation(1) ...............................................................................................................................800 mW
Maximum curr ent out of VSS pin ...................................................................................................................... 95 mA
Maximum curr ent into VDD pin......................................................................................................................... 95 mA
Input clamp current, IIK (VI < 0 or VI > VDD)...............................................................................................................± 20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD).........................................................................................................± 20 mA
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin..............................................................................................25 mA
Maximum current sunk by all ports (combined)(2)............................................................................................ 90 mA
Maximum current sourced by all ports (combined)(2)....................................................................................... 90 mA
Note 1: Power diss ip ation is ca lcula ted as follo ws: PDIS = VDD x {IDD IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
2: PORTD and PORTE are implemented on PIC16F886/PIC16F887 only.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC16F882/883/884/886/887
DS41291F-page 246 © 2009 Microchip Technology Inc.
FIGURE 17-1: PIC16F883/884/886/887 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
FIGURE 17-2: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
5.5
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
125
25
2.0
0
60
85
VDD (V)
4.0 5.04.5
Temperature (°C)
2.5 3.0 3.5 5.5
± 1%
± 2%
± 5%
© 2009 Microchip Technology Inc. DS41291F-page 247
PIC16F882/883/884/886/887
17.1 DC Characteristics: PIC16F883/884/886/887-I (Industrial)
PIC16F883/884/886/887-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwis e stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
D001
D001C
D001D
VDD Supply Voltage 2.0
2.0
3.0
4.5
5.5
5.5
5.5
5.5
V
V
V
V
FOSC < = 8 MHz: HFINTOSC, EC
FOSC < = 4 MHz
FOSC < = 10 MHz
FOSC < = 20 MHz
D002* VDR RAM Data Retention
Voltage(1) 1.5 V Device in Sleep mode
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
—VSS —VSee Section 14.2.1 “Power-on Reset
(POR)” for details.
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 V/ms See Section 14.2.1 “Power-on Reset
(POR)” for details.
* These parameters are characterized but not tested.
Data in “Typ” colum n i s at 5.0 V, 25°C unles s othe rwis e s t ate d. These p ara me ters are for d es ign gu ida nc e
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
PIC16F882/883/884/886/887
DS41291F-page 248 © 2009 Microchip Technology Inc.
17.2 DC Characteristics: PIC16F883/884/886/887-I (Industrial)
PIC16F883/884/886/887-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Char ac teri st ics Min. Typ† Max. Units Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) —1319μA2.0FOSC = 32 kHz
LP Oscillator mode
—2230μA3.0
—3360μA5.0
D011* 180 250 μA2.0F
OSC = 1 MHz
XT Oscillator mode
290 400 μA3.0
490 650 μA5.0
D012 280 380 μA2.0F
OSC = 4 MHz
XT Oscillator mode
480 670 μA3.0
—0.91.4mA5.0
D013* 170 295 μA2.0F
OSC = 1 MHz
EC Osci llator mode
280 480 μA3.0
470 690 μA5.0
D014 290 450 μA2.0F
OSC = 4 MHz
EC Osci llator mode
490 720 μA3.0
—0.851.3 mA 5.0
D015 8 20 μA2.0F
OSC = 31 kHz
LFINTOSC mode
—1640μA3.0
—3165μA5.0
D016* 416 520 μA2.0F
OSC = 4 MHz
HFINTOSC mode
640 840 μA3.0
—1.131.6 mA 5.0
D017 0.65 0.9 mA 2.0 FOSC = 8 MHz
HFINTOSC mode
1.01 1.3 mA 3.0
1.86 2.3 mA 5.0
D018 340 580 μA2.0F
OSC = 4 MHz
EXTRC mode(3)
550 900 μA3.0
—0.921.4 mA 5.0
D019 3.8 4.7 mA 4.5 FOSC = 20 MHz
HS Osci llator mode
—4.04.8mA5.0
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unl es s o the rw ise stated. Th ese parameters are for des ign gui da nce
only and are not tested.
Note 1: The test condit ions for all IDD meas uremen ts in a ctive opera tion m ode a re: O SC1 = exte rnal squ are w ave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loadin g and swi tchin g rate, osci llator type, int erna l code exe cutio n patte rn and temp erature, al so have
an impact on the current consumption.
3: For RC oscil lator configurat ions, current throu gh REXT is not incl uded. The current t hrough the resisto r can
be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ.
© 2009 Microchip Technology Inc. DS41291F-page 249
PIC16F882/883/884/886/887
17.3 DC Characteristics: PIC16F883/884/88 6/887-I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
Param
No. Device Characteristics Min. Typ† Max. Units Conditions
VDD Note
D020 Power-down Base
Current(IPD)(2) 0.05 1.2 μA 2.0 WDT, BOR, Comparators, VREF and
T1OSC dis ab led
0.15 1.5 μA3.0
0.35 1.8 μA5.0
150 500 nA 3.0 -40°C TA +25°C
D021 1.0 2.2 μA 2.0 WDT Current(1)
—2.04.0μA3.0
—3.07.0μA5.0
D022 42 60 μA 3.0 BOR Current(1)
85 122 μA5.0
D023 32 45 μA 2.0 Comparator Current(1), both
comparator s enabl ed
—6078μA3.0
120 160 μA5.0
D024 30 36 μA2.0CV
REF Current(1) (high range)
—4555μA3.0
—7595μA5.0
D025* 39 47 μA2.0CV
REF Current(1) (low range)
—5972μA3.0
98 124 μA5.0
D026 2.0 5.0 μA 2.0 T1OSC Current(1), 32.768 kHz
—2.55.5μA3.0
—3.07.0μA5.0
D027 0.30 1.6 μA 3.0 A/D Current(1), no conversion in
progress
0.36 1.9 μA5.0
D028 90 125 μA 3.0 VP6 Reference Current
125 162 μA5.0
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unl es s o the rw ise stated. Th ese parameters are for des ign gui da nce
only and are not tested.
Note 1: The peripheral c urre nt is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral Δ current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
PIC16F882/883/884/886/887
DS41291F-page 250 © 2009 Microchip Technology Inc.
17.4 DC Characteristics: PIC16F883/884/886/887-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max. Units Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2) —0.05 9μA 2.0 WDT, BOR, Comparators, VREF and
T1OSC disabled
—0.1511 μA3.0
—0.3515 μA5.0
D021E 1 28 μA 2.0 WDT Current(1)
—230μA3.0
—335μA5.0
D022E 42 65 μA 3.0 BOR Current(1)
—85127μA5.0
D023E 32 45 μA 2.0 Comp ara tor Curren t(1), both
comparators enabled
—6078μA3.0
—120160μA5.0
D024E 30 70 μA2.0CV
REF Current(1) (high range)
—4590μA3.0
—75120μA5.0
D025E* 39 91 μA2.0CV
REF Current(1) (low range)
—59117μA3.0
—98156μA5.0
D026E 3.5 18 μA 2.0 T1OSC Current(1), 32.768 kHz
—4.021 μA3.0
—5.024 μA5.0
D027E 0.30 12 μA 3.0 A/D Current(1), no conversion in
progress
—0.3616 μA5.0
D028E 90 130 μA 3.0 VP6 Reference Current
—125170μA5.0
* These parameters are characterized but not tested.
Data in “Typ” column is at 5 .0V, 25°C unle ss oth erwis e s t at ed. These p ara me ters are for design gui dan ce
only and are not tested.
Note 1: The peripheral c urre nt is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. Th e periph eral Δ current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
© 2009 Microchip Technology Inc. DS41291F-page 251
PIC16F882/883/884/886/887
17.5 DC Characteristics: PIC16F883/884/886/887-I (Industrial)
PIC16F883/884/886/887-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industr ial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O Port:
D030 with TTL buffer Vss 0.8 V 4.5V VDD 5.5V
D030A Vss 0.15 VDD V2.0V VDD 4.5V
D031 with Schmitt Trigger buffer Vss 0.2 VDD V2.0V VDD 5.5V
D032 MCLR, OSC1 (RC mode)(1) VSS —0.2 VDD V
D033 OSC1 (XT and LP modes) VSS —0.3V
D033A OSC1 (HS mode) VSS —0.3 VDD V
VIH Input High Voltage
I/O ports:
D040 with TTL buffer 2.0 VDD V4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 VDD V2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD —VDD V2.0V VDD 5.5V
D042 MCLR 0.8 VDD —VDD V
D043 OSC1 (XT and LP modes) 1.6 VDD V
D043A OSC1 (HS mode) 0. 7 VDD —VDD V
D043B OSC1 (RC mode) 0.9 VDD —VDD V(Note 1)
IIL Input Leakage Current(2)
D060 I/O ports ± 0.1 ± 1μAVSS VPIN VDD,
Pin at high-impedance
D061 MCLR(3) ± 0.1 ± 5μAVSS VPIN VDD
D063 OSC1 ± 0.1 ± 5μAVSS VPIN VDD, XT, HS and
LP oscillator configuration
D070* IPUR PORTB Weak Pull-up C urrent 50 250 4 00 μAVDD = 5.0V, VPIN = VSS
VOL Output Low Voltage(5)
D080 I/O ports 0.6 V IOL = 8.5 mA, VDD = 4.5V (Ind.)
VOH Output High Voltage(5)
D090 I/O ports V DD – 0.7 V IOH = -3.0 mA, VDD = 4.5V (Ind.)
* These paramet ers are charact erized but not tested.
Data in “T yp” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the O SC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: See Section 10.3.1 “Using the Data EEPROM for additional information.
5: Including OSC2 in CLKOUT mode.
PIC16F882/883/884/886/887
DS41291F-page 252 © 2009 Microchip Technology Inc.
D100 IULP Ultra Low-Power Wake-Up
Current 200 nA See Application Note AN879,
Using the Microchip Ultra
Low-Power Wake-up Module
(DS00879)
Capacitive Loading S pecs on
Output Pins
D101* COSC2 OSC2 pin 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins 50 pF
Data EEPROM Memory
D120 EDByte Endurance 100K 1M E/W -40°C TA +85°C
D120A EDByte Endurance 10K 100K E/ W +85°C TA +125°C
D121 VDRW VDD for Read/Write VMIN 5.5 V Using EECON1 to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time 5 6 ms
D123 TRETD Characteristic Retention 40 Year Provided no other specifications
are violated
D124 TREF Number of Total Erase/Write
Cycles before Refresh(4) 1M 10M E/W -40°C TA +85°C
Program Flash Memory
D130 EPCell Endurance 10K 100K E/W -40°C TA +85°C
D130A EDCell Endurance 1K 10K E/W +85°C TA +125°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VPEW VDD for Row Erase/Write VMIN —5.5V
VDD for Bulk Erase Operations 4.5 5.5 V
D133 TPEW Erase/Write cycle time 2 2.5 ms
D134 TRETD Characteristic Retention 40 Year Provided no other specifications
are violated
17.5 DC Characteristics: PIC16F883/884/886/887-I (Industrial)
PIC16F883/884/886/887-E (Extended) (Continued)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industr ial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
* These paramet ers are charact erized but not tested.
Data in “T yp” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: See Section 10.3.1 “Using the Data EEPROM for additional information.
5: Including OSC2 in CLKOUT mode.
© 2009 Microchip Technology Inc. DS41291F-page 253
PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym. Characteristic Typ. Units Conditions
TH01 θJA Thermal Resistance
Junction to Ambient 47.2 C/W 40-pin PDIP package
24.4 C/W 44 -pin QFN package
45.8 C/W 44-pin TQFP package
60.2 C/W 28-pin PDIP package
80.2 C/W 28-pin SOIC package
89.4 C/W 28-pin SSOP package
29 C/W 28-pin QFN package
TH02 θJC Thermal Resistance
Junction to Case 24.7 C/ W 40-pin PDIP package
20.0 C/W 44 -pin QFN package
14.5 C/W 44-pin TQFP package
29 C/W 28-pin PDIP package
23.8 C/W 28-pin SOIC package
23.9 C/W 28-pin SSOP package
20.0 C/W 28-pin QFN package
TH03 TJJunction Temperature 150 C For derated power calculations
TH04 PD Power Dissipation W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/OI/O Power Dissipation W PI/O = Σ (IOL * V OL) + Σ (IOH * (VDD - V OH))
TH07 PDER Derated Power W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
PIC16F882/883/884/886/887
DS41291F-page 254 © 2009 Microchip Technology Inc.
17.7 Ti ming Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 17-3: LOAD CONDITIONS
1. TppS2ppS
2. TppS
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O PORT t1 T1CKI
mc MCLR wr WR
Uppe rcase lett ers and their meanings:
SFFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
V
SS
C
L
Legend: CL= 50 pF for all pins
15 pF for OSC2 output
Load Con dition
Pin
© 2009 Microchip Technology Inc. DS41291F-page 255
PIC16F882/883/884/886/887
17.8 AC Characteristics: PIC16F883/884/886/887 (Industrial, Extended)
FIGURE 17-4: CLOCK TIMING
TABLE 17-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Opera ting C ondition s (u nl ess o th erwise stated)
Oper ati ng t em peratur e -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ Max. Units Conditions
OS01 FOSC Externa l CLKIN Freq uency(1) DC 37 k Hz LP Oscillat or m ode
DC 4 MHz XT Oscillator mode
DC 20 MHz HS Oscillator mode
DC 20 MHz EC Oscillator mode
Oscillator Frequency (1) 32.768 kHz LP Oscillator mode
0.1 4 MHz XT Oscillator mode
1 2 0 MHz HS Oscillator mode
DC 4 MHz RC Oscillator mode
OS02 TOSC External CLKIN Period(1) 27 μs LP Oscillator m ode
250 ns XT Oscillator mode
50 ns HS Osc illat or mo de
50 ns EC Oscillator mo de
Oscillator Period(1) —30.5 μs LP Osc i llator m ode
250 10,000 ns XT Oscillator m ode
50 1,000 ns HS O scillator mo de
250 ns RC Oscillator mode
OS03 TCY Instruction Cyc l e Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TosH,
TosL External CLKIN High,
External CLKIN Low 2—μs LP oscillator
100 ns XT oscillator
20 ns H S osc i llator
OS05* TosR,
TosF External CLKIN Rise,
External CLKIN Fall 0 ns LP oscillator
0 ns XT oscillator
0 ns HS oscillator
* T hes e parameter s ar e characte rized but no t test ed.
Data in “T yp” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are no t tested.
Note 1: Instruct io n cycle peri od (TCY) equals four tim es the input os ci lla to r time base per iod. Al l spec i fied val ues are
based on chara ct er izat i on data for that particular oscilla to r type under standard operating condit io ns w it h th e
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
highe r than expect ed current co nsumpti on. Al l devi ces are test ed to oper at e at “min” va lu es with an ext er nal
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for
all devi ces.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
PIC16F882/883/884/886/887
DS41291F-page 256 © 2009 Microchip Technology Inc.
TABLE 17-2: OSCILLATOR PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Freq.
Tolerance Min. Typ† Max. Units Conditions
OS06 TWARM Internal Oscillator Switch
when running(3) ——2TOSC Slo w est clock
OS07 TSC Fail-Safe Sample Clock
Period(1) —21—msLFINTOSC/64
OS08 HFOSC Internal Calibrated
HFINTOSC Frequency(2) ±1% 7.92 8.0 8.08 MHz VDD = 3.5V, 25°C
±2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V,
0°C TA +85°C
±5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS09* LFOSC Internal Uncalibrat ed
LFINTOSC Frequency 153145kHz
OS10* TIOSC
ST HFINTOSC Oscillator
W ake-up from Sleep
Start-up Time
5.5 12 24 μsVDD = 2.0V, -4C to +85°C
—3.5714μsVDD = 3.0V, -40°C to +85°C
—3611μsV
DD = 5.0V, -40°C to +85°C
* These parameters are characterized but not tested.
D ata in “Typ” column is at 5. 0V, 25°C unless oth er w i se s tated. T hes e parameter s ar e f or desi g n gui dance only
and are not test ed.
Note 1: Instruction cycle per iod (TCY) equals four times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the
device e xecuting co de. Exceedi ng these specified lim its may r esult in an unstab le oscillator operation and/or
higher tha n expected current co nsumption. All devic es are tested t o operate at “mi n” v al ues w ith an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devi ces .
2: To ensur e t hese oscilla tor frequenc y t olerances, VDD and VSS must be capaci tiv e ly decoupl ed as cl ose to the
device a s possible. 0. 1 μF and 0. 01 μF values in parallel are recommended.
3: By design .
© 2009 Microchip Technology Inc. DS41291F-page 257
PIC16F882/883/884/886/887
FIGURE 17-5: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pi n
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17 OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
TABLE 17-3: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS11 TOSH2CKLFOSC to CLKOUT (1) 70 ns VDD = 5.0V
OS12 TOSH2CKHFOSC to CLKOUT (1) 72 ns VDD = 5.0V
OS13 TCKL2IOVCLKOUT to Port out valid(1) 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns ns
OS15* TOSH2IOVFOSC (Q1 cycle) to Port out valid 50 70 ns VDD = 5.0V
OS16 TOSH2IOIFOSC (Q2 cycle) to Port input invalid
(I/O in hold time) 50 ns VDD = 5.0V
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle)
(I/O in setup time) 20 ns
OS18 TIOR Port output rise time(2)
15
40 72
32 ns VDD = 2.0V
VDD = 5.0V
OS19 TIOF Port output fall time(2)
28
15 55
30 ns VDD = 2.0V
VDD = 5.0V
OS20* TINP INT pin input high or low time 25 ns
OS21* TRAP PORT A interrupt-on-change new input
level time TCY ——ns
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
2: Includes OSC2 in CLKOUT mode.
PIC16F882/883/884/886/887
DS41291F-page 258 © 2009 Microchip Technology Inc.
FIGURE 17-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 17-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Wat c hdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33*
37
* 64 ms delay only if PWRTE bit in the Configuration Word Register 1 is programmed to ‘0’.
Reset
(due to BOR)
VBOR + VHYST
© 2009 Microchip Technology Inc. DS41291F-page 259
PIC16F882/883/884/886/887
TABLE 17-4: RESET, WATCHDOG TI MER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
30 TMCLMCLR Puls e Width (low) 2
5
μs
μsVDD = 5V, -40°C to +85°C
VDD = 5V
31 TWDT Watchdog Timer Time-out
Period (No Prescaler) 10
10 16
16 29
31 ms
ms VDD = 5V, -40°C to +85°C
VDD = 5V
32 TOST Oscillation Start-up Timer
Period(1, 2) —1024TOSC (NOTE 3)
33* TPWRT Power-up Timer P eriod 40 65 140 ms
34* TIOZ I/O High-impedance from
MCLR Low or W atchdog Timer
Reset
——2.0μs
35 VBOR Brown-out Reset Vo ltage 2.0 2.2 V BOR4V bit = 0 (NOTE 4)
3.6 4.0 4.4 V BOR4V bit = 1, -40°C to +85°C
(NOTE 4)
3.6 4.0 4.5 V BOR4V bit = 1, -40°C to +125°C
(NOTE 4)
36* VHYST Brow n-out Reset Hysteresis 50 mV
37* TBOR Brown- out Reset Minimum
Detection Period 100 μsVDD VBOR
* These parameters are characterized but not tested.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Instruction cy cle period (TCY) equals four times the input oscillator time base period. All specified values
are based on charac teri za tion data for that part ic ular oscillator typ e unde r st andard operating con di tions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-
ation and/or higher than expected current consumption. All devices are tested to operate at “min” values
with an e xte rna l c loc k app lie d to th e O SC 1 p in. When an exter nal clock inpu t is us ed , th e “m ax ” cy c le t im e
limit is “DC” (no clock) for all devices.
2: By design.
3: Period of the slow er clock.
4: To ensure these v oltag e tolerance s, VDD and VSS m ust be ca paciti vely dec oupled as close to the device a s
possible. 0.1 μF and 0.01 μF values in parallel are recommended.
PIC16F882/883/884/886/887
DS41291F-page 260 © 2009 Microchip Technology Inc.
FIGURE 17-8: TIMER0 AND TIMER1 EX TERNAL CLOCK TIMINGS
TABLE 17-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
41* TT0L T0CK I Low Pulse Width No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
42* TT0P T 0CK I Period Greater of:
20 or TCY + 40
N
ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time Synchronous, No Prescaler 0.5 TCY + 20 ns
Synchronous,
with Pr escaler 15 ns
Asynchronous 30 ns
46* TT1L T1CKI Low
Time Synchronous, No Prescaler 0.5 TCY + 20 ns
Synchronous,
with Pr escaler 15 ns
Asynchronous 30 ns
47* TT1P T1CKI Input
Period S ync hronous Greater of:
30 or TCY + 40
N
ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN) 32.768 — kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment 2 TOSC —7 TOSC Timers in Sync
mode
* These parameters are characterized but not tested.
Data in “T yp” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
© 2009 Microchip Technology Inc. DS41291F-page 261
PIC16F882/883/884/886/887
FIGURE 17-9: CAPTURE/COMPARE/PWM TIMINGS (ECCP)
TABLE 17-6: CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP)
Standard Operating Conditi ons (unle ss otherw is e stated )
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 ns
With Prescaler 20 ns
CC02* TccH CCP1 Input High Time No Prescaler 0.5TCY + 20 ns
With Prescaler 20 ns
CC03* TccP CCP1 I nput Period 3TCY + 40
N ns N = prescale
value (1, 4 or
16)
* These parameters are characterized but not tested.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note: Refer to Figure 17-3 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP1
PIC16F882/883/884/886/887
DS41291F-page 262 © 2009 Microchip Technology Inc.
TABLE 17-7: COMPARATOR SPECIFICATIONS
TABLE 17-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS
TABLE 17-9: VOLTAGE (VR) REFERENCE SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operati ng Tem per ature -40°C TA +125°C
Param
No. Sym. Characteristics Min. Typ† Max. Units Comments
CM01 VOS Input Offset Voltage ± 5.0 ± 10 mV (VDD - 1.5)/2
CM02 VCM Input Co mmon Mode Voltage 0 VDD - 1.5 V
CM03* CMRR Common Mode Rejection Ratio +55 dB
CM04* TRT Response Time Falling 150 600 ns (NOTE 1)
Rising 200 1000 ns
CM05* TMC2COV Comparator Mode Change to
Output Valid —— 10 μs
* These parameters are characterized but not tested.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Respons e time is me as ured with one com p ara tor in put at (VDD - 1.5)/2 - 100 mV to (VDD -1.5)/2+20mV.
S tandard Operating Conditi ons (unle ss othe rwis e stated)
Operati ng tem pera ture -40°C TA +125°C
Param
No. Sym. Characteristics Min. Typ† Max. Units Comments
CV01* CLSB Step Size(2)
VDD/24
VDD/32
V
VLow Range (VRR = 1)
High Range (VRR = 0)
CV02* CACC Absolute Accuracy
± 1/2
± 1/2 LSb
LSb Low Range (VRR = 1)
High Range (VRR = 0)
CV03* CRUnit Resistor Value (R) 2k Ω
CV04* CST Settli ng Time(1) ——10μs
* These parameters are characterized but not tested.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design
guidance only and are not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.
2: See Section 8.10 “Comparator Voltage Reference” for more information.
VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Symbol Characteristics Min. Typ. Max. Units Comments
VR01 VROUT VR voltage output 0.5 0.6 0.7 V
VR02* TSTABLE Settling Time 10 100* μs
* These parameters are characterized but not tested.
© 2009 Microchip Technology Inc. DS41291F-page 263
PIC16F882/883/884/886/887
TABLE 17-10: PIC16F883/884/886/887 A/D CONVERTER (ADC) CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ Max. Units Conditions
AD01 NRResolution 10 bits bit
AD02 EIL Integral Error ±1 LSb VREF = 5.12V
AD03 EDL Different ial Error ±1 LSb No missi ng codes to 10 bits
VREF = 5.12V
AD04 EOFF Offset Error 0 +1.5 +3.0 LSb VREF = 5.12V
AD07 EGN Gain Error ±1 LSb VREF = 5.12V
AD06
AD06A VREF Reference Voltage(3) 2.2
2.7 ——
VDD VAbsolute minimum to ensure 1 LSb
accuracy
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended
Impedance of Analog
Voltage Source
—— 10kΩ
AD09* IREF VREF Input Current(3) 10 1000 μADuring VAIN acquisition.
Based on differential of VHOLD to VAIN.
—— 50μA During A/D conversion cycle.
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current
specific ati on inc ludes any such lea ka ge from the AD C module.
PIC16F882/883/884/886/887
DS41291F-page 264 © 2009 Microchip Technology Inc.
TABLE 17-11: PIC16F883/884/886/887 A/D CONVERSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Ope rati ng temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD130* TAD A/D C lock Period 1.6 9.0 μsTOSC-base d, VREF 3.0V
3.0 9.0 μsTOSC-based, VREF full range
A/D Internal RC
Oscillator Period 3.0 6.0 9.0 μsADCS<1:0> = 11 (ADRC mode)
At V DD = 2.5V
1.6 4.0 6.0 μsAt VDD = 5.0V
AD131 TCNV C onversion Time
(not includin g
Acquisiti on Time)(1)
—11—TAD Set GO/DONE bit to new data i n A/D
Result register
AD132* TACQ Acquis iti on Tim e 11.5 μs
AD133* TAMP Amplifier Settling Time 5 μs
AD134 TGO Q4 to A/D Clock Start
TOSC/2
TOSC/2 + TCY
If the A/D clock source is selected as
RC, a time of TCY is added before the
A/D clock st art s. This allo ws the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
2: See Section 9.3 “A/D Acquisition Requirements” for mini mum con ditions.
© 2009 Microchip Technology Inc. DS41291F-page 265
PIC16F882/883/884/886/887
FIGURE 17-10: PIC16F883/884/886/887 A/D CONVERSION TIMING (NORMAL MODE)
FIGURE 17-11: PIC16F883/884/886/887 A/D CONVERSION TIMING (SLEEP MODE)
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
987 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
6
AD134 (TOSC/2(1))
1 TCY
AD132
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be execut ed.
AD134
6
8
1 TCY
(TOSC/2 + TCY(1))
1 TCY
PIC16F882/883/884/886/887
DS41291F-page 266 © 2009 Microchip Technology Inc.
FIGURE 17-12: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 17-12: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 17-13: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 17-13: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
120 TCKH2DTV SYNC XMIT (Master & Slave)
Clock high to data-o ut valid —40ns
121 TCKRF Clock out rise time and fall time (Master mode) 20 ns
122 TDTRF Data-out rise time and fall time 20 ns
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
125 TDTV2CKL SYNC RCV (Master & Slave)
Data-hold before CK (DT hold time) 10 ns
126 TCKL2DTL Data-hold after CK (DT hold time) 15 ns
Note: Refer to Figure 17-3 for load conditio ns.
121 121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 17-3 for load conditions.
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
© 2009 Microchip Technology Inc. DS41291F-page 267
PIC16F882/883/884/886/887
FIGURE 17-14 : SP I MAST ER MODE TIMING (CKE = 0, SMP = 0)
FIGURE 17-15 : SP I MAST ER MODE TIMING (CKE = 1, SMP = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73 74
75, 76
78
79
80
79
78
MSb LSb
bit 6 - - - - - -1
MSb In LSb In
bit 6 - - - -1
Note: Refer to Figure 17-3 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
75, 76
78
80
MSb
79
73
bit 6 - - - - - -1 LSb
Note: Refer to Figure 17-3 for load conditions.
73 74
MSb In LSb In
bit 6 - - - -1
PIC16F882/883/884/886/887
DS41291F-page 268 © 2009 Microchip Technology Inc.
FIGURE 17-16 : SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 17-17 : SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73 74
75, 76 77
78
79
80
79
78
MSb LSb
bit 6 - - - - - -1
MSb In bit 6 - - - -1 LSb In
83
Note: Refer to Figure 17-3 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
74
75, 76
MSb bit 6 - - - - - -1 LSb
77
MSb In bit 6 - - - -1 LSb In
80
83
Note: Refer to Figure 17-3 for load conditions.
© 2009 Microchip Technology Inc. DS41291F-page 269
PIC16F882/883/884/886/887
TABLE 17-14: SPI MODE REQUIREMENTS
FIGURE 17-18 : I2C™ BUS START/STOP BITS TIMING
Param
No. Symbol Characteristic Min. Typ† Max. Units Conditions
70* TSSL2SCH,
TSSL2SCLSS to SCK or SCK input TCY ——ns
71* TSCH SCK input high time (Slave mode) TCY + 20 ns
72* TSCL SCK input low time (Slave mode) TCY + 20 ns
73* TDIV2SCH,
TDIV2SCLSetup time of SD I data input to SCK edge 100 ns
74* TSCH2DIL,
TSCL2DILHold time of SDI data input to SCK edge 100 ns
75* TDOR SDO data output rise time 3.0-5.5V 10 25 ns
2.0-5.5V 25 50 ns
76* TDOF SDO data output fall time 10 2 5 ns
77* TSSH2DOZSS to SDO output high-impedance 10 50 ns
78* TSCR SCK output rise time
(Master mode) 3.0-5.5V 10 25 ns
2.0-5.5V 25 50 ns
79* TSCF SCK output fall time (Master mode) 10 25 ns
80* TSCH2DOV,
TSCL2DOVSDO data output valid after
SCK edge 3.0-5.5V 50 ns
2.0-5.5V 145 ns
81* TDOV2SCH,
TDOV2SCLSDO data output setup to SCK edge Tcy ns
82* TSSL2DOV SDO data output valid after SS edge 50 ns
83* TSCH2SSH,
TSCL2SSHSS after SCK edge 1.5TCY + 40 ns
* These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note: Refer to Figure 17-3 for load conditions.
91
92
93
SCL
SDA
Start
Condition Stop
Condition
90
PIC16F882/883/884/886/887
DS41291F-page 270 © 2009 Microchip Technology Inc.
TABLE 17-15: I2C™ BUS START/STOP BITS REQUIREMENTS
FIGURE 17-19 : I2C™ BUS DATA TIMING
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
90* TSU:STA Start condition 100 kHz mode 4700 ns Only relevant for Repeated
Start condition
Setup time 400 kHz mode 600
91* THD:STA Start condition 100 kHz mode 4000 ns After this period, the first
clo ck pulse is generated
Hold time 400 kHz mode 600
92* TSU:STO Stop conditio n 100 kHz mode 4700 ns
Setup time 400 kHz mode 600
93 THD:STO Stop condition 100 kHz mode 4000 ns
Hold time 400 kHz mode 600
* These parameters are characterized but not tested.
Note: Refer to Figure 17-3 for load conditions.
90
91 92
100 101
103
106 107
109 109 110
102
SCL
SDA
In
SDA
Out
© 2009 Microchip Technology Inc. DS41291F-page 271
PIC16F882/883/884/886/887
TABLE 17-16: I2C™ BUS DATA REQUIREMENTS
Param.
No. Symbol Characteristic Min. Max. Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 μs Device must operate at a
minimum of 10 MHz
SSP Module 1.5TCY
101* TLOW Clock low tim e 100 kHz mode 4.7 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 μs Device must operate at a
minimum of 10 MHz
SSP Module 1.5TCY
102* TRSDA and SCL rise
time 100 kHz mode 1000 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
103* TFSDA and SCL fall
time 100 kHz mode 300 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
90* TSU:STA Start condition
setup time 100 kHz mode 4.7 μs O nly releva nt for
Repeat ed Start condition
400 kHz mode 0.6 μs
91* THD:STA Start condition hold
time 100 kHz mode 4.0 μs Af te r this period the firs t
clock pulse is generated
400 kHz mode 0.6 μs
106* THD:DAT Data input hold time 100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
107* TSU:DAT Data input setup
time 100 kHz mode 250 ns (Note 2)
400 kHz mode 100 ns
92* TSU:STO Stop condition
setup time 100 kHz mode 4.7 μs
400 kHz mode 0.6 μs
109* TAA Output valid from
clock 100 kHz mode 3500 ns (Note 1)
400 kHz mode ns
110* TBUF Bus free time 100 kHz mode 4.7 μs T ime th e bus m ust be fre e
before a new transmission
can start
400 kHz mode 1.3 μs
CBBus capacitive loading 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode (400 kHz) I2C bus de vice ca n be us ed in a St andard mode (100 kHz) I2C bus syste m, but the
requiremen t TSU:DAT 250 ns mus t the n be m et. Th is wi ll auto mat ic all y be the c as e if the dev ic e do es not
stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it
must outpu t the nex t da ta bit to the SDA l ine TR max. + TSU:DAT = 1000 + 25 0 = 12 50 ns (a cc ord ing to th e
Standard mode I2C bu s specificati on), before the SCL line is released.
PIC16F882/883/884/886/887
DS41291F-page 272 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 273
PIC16F882/883/884/886/887
18.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
“Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents
(mean + 3σ) or (mean - 3σ) respectively , where σ is a standard deviation, over each temperature range.
FIGURE 18-1: TYP ICAL IDD vs. FOSC OVER VDD (EC MODE)
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only . The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
Typical 2V 3V 4V 5V 5.5V
1Mhz 0.086 0.153 0.220 0.277 0.310
2Mhz 0.150 0.2596 0.3718 0.4681 0.5236
4Mhz 0.279 0.472 0.675 0.850 0.951
6Mhz 0.382 0.635 0.903 1.135 1.269
8Mhz 0.486 0.798 1.132 1.420 1.587
10Mhz 0.589 0.961 1.360 1.706 1.905
12Mhz 0.696 1.126 1.596 2.005 2.241
14Mhz 0.802 1.291 1.832 2.304 2.577
16Mhz 0.908 1.457 2.068 2.603 2.913
18Mhz 1.017 1.602 2.268 2.848 3.185
20Mhz 1.126 1.748 2.469 3.093 3.458
Max 2V 3V 4V 5V 5.5V
1Mhz 0.168 0.236 0.315 0.412 0.452
2Mhz 0.261 0.394 0.537 0.704 0.780
4Mhz 0.449 0.710 0.981 1.287 1.435
6Mhz 0.577 0.972 1.331 1.739 1.950
8Mhz 0.705 1.233 1.682 2.191 2.465
10Mhz 0.833 1.495 2.032 2.642 2.979
12Mhz 0.956 1.711 2.372 3.101 3.506
14Mhz 1.078 1.926 2.713 3.560 4.032
16Mhz 1.201 2.142 3.054 4.018 4.558
18Mhz 1.305 2.326 3.295 4.324 4.887
20Mhz 1.409 2.510 3.536 4.630
EC Mode
3V
4V
5V
5.5V
2V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz
VDD (V)
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -cas e Tem p) + 3σ
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291F-page 274 © 2009 Microchip Technology Inc.
FIGURE 18-2: MAXIMUM IDD vs. FOSC OVER VDD (EC MODE)
FIGURE 18-3: TYP ICAL IDD vs. FOSC OVER VDD (HS MODE)
3V
4V
5V
5.5V
2V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz
VDD (V)
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-case Tem p) + 3σ
(-40°C to 125°C)
3V 3.5V 4V 4.5V 5V 5.5V
0.567660978 0.6909750.8211857610.9883470541.0462473761.119615457
1.1610564131.4069334781.6664380432.0030751092.1193190652.268818804
2.883088587 3.03554863 3.23775
3.741393.967407543
HS Mode
3V
3.5V
4V
4.5V
5V
5.5V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4 MHz 10 MHz 16 MHz 20 Mhz
FOSC
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 275
PIC16F882/883/884/886/887
FIGURE 18-4: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE)
FIGURE 18-5: TYP ICAL IDD vs. VDD OVER FOSC (XT MODE)
3V 3.5V 4V 4.5V 5V 5.5V
0.8868608641.0693043161.2645617521.4868166111.5076394231.520959608
1.6176371031.9623642592.3355493582.7630868222.8139211682.849632041
3.8375797553.9157601913.967889512
4.685048474 4.78069621
HS Mode
3V
3.5V
4V
4.5V
5V
5.5V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
4 MHz 10 MHz 16 MHz 20 MHz
FOSC
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (W ors t-case Tem p ) + 3σ
(-40°C to 125°C)
2 2.5 3 3.5 4 4.5 5 5.5
180.1774 235.0683 289.9592 337.753 385.547 436.866 488.184 554.8964
283.7333 382.484 481.2347 577.923 674.6106 783.831 893.052 1033.15
Vdd 2 2.5 3 3.5 4 4.5 5 5.5
244.8837 320.7132 396.5426 461.707 526.8719 587.642 648.412 724.0755
375.529 522.3721 669.2152 822.619 976.0232 1163.67 1351.32
XT Mode
1 MHz
4 MHz
0
200
400
600
800
1,000
1,200
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
DD
(V)
I
DD
(uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Temp) + 3
(-40×C to 12C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291F-page 276 © 2009 Microchip Technology Inc.
FIGURE 18-6: MAXIMUM IDD vs. VDD OVER FOSC (XT MODE)
FIGURE 18-7: TYP ICAL IDD vs. VDD OVER FOSC (EXTRC MODE)
XT Mode
4 MHz
1 MHz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Me an (Wors t-c ase Temp ) + 3σ
(-40°C to 125°C)
(EXTR C Mo d e )
1 Mhz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
4 Mhz
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 277
PIC16F882/883/884/886/887
FIGURE 18-8: MAXIMUM IDD vs. VDD (EXTRC MODE)
FIGURE 18-9: IDD vs. VDD OVER FOSC (LFINTOSC MODE, 31 kHz)
1 Mhz
4 Mhz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2,000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Temp) + 3
(-40×C to 125×C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
LFINTOSC Mode, 31KHZ
Typical
Maximum
0
10
20
30
40
50
60
70
80
VDD (V)
IDD (μA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
PIC16F882/883/884/886/887
DS41291F-page 278 © 2009 Microchip Technology Inc.
FIGURE 18-10 : IDD vs. VDD (LP MODE)
FIGURE 18-11: TYPICAL IDD vs. FOSC OVER VDD (HFINTOSC MODE)
0
10
20
30
40
50
60
70
80
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-cas e Temp) + 3σ
(-40°C to 125°C)
32 kHz Maximum
32 kHz Typical
4V 5V 5.5V
197.9192604299.82617395.019 496.999 574.901
210.9124688 324.4079431.721 544.182 620.66
239.9707708369.77809491.538 623.314 717.723
298.6634479460.30461619.714 793.635 901.409
414.3997292639.99889 878.13 1127.53 1275.6
649.86985881014.40021421.21 1858.97 2097.71
2V 3V 4V 5V 5.5V
HFINTOSC
2V
3V
4V
5V
5.5V
0
500
1,000
1,500
2,000
2,500
125 kHz 25 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz
VDD (V)
IDD (uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Tem p) + 3
(-40×C to 125×C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 279
PIC16F882/883/884/886/887
FIGURE 18-12 : MAXIMU M IDD vs. FOSC OVER VDD (HFINTOSC MODE)
FIGURE 18-13: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED)
HFINTOSC
2V
3V
4V
5V
5.5V
0
500
1,000
1,500
2,000
2,500
3,000
125 kHz 250 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -c ase Tem p) + 3σ
(-40°C to 125°C)
Typical
(Sleep M od e all Peripherals Disabled)
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
DD
(V)
I
PD
(uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
0.00
PIC16F882/883/884/886/887
DS41291F-page 280 © 2009 Microchip Technology Inc.
FIGURE 18-14 : MAXIMU M IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED)
FIGURE 18-15 : CO MPARATOR IPD vs. VDD (BOTH COMPARATORS ENABLED)
Maximum
(Sleep Mode all Peripherals Disabled)
Max. 125°C
Max. 85°C
0
2
4
6
8
10
12
14
16
18
2.02.5 3.03.5 4.04.5 5.05.5
VDD (V)
IPD (μA)
Maximum: Mean + 3σ
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
Typical Max
31.9 43.9
45.6 60.8
59.3 77.7
73.0 95.8
86.7 113.8
100.4 131.8
114.1 149.9
127.7
Typical
Maximum
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 281
PIC16F882/883/884/886/887
FIGURE 18-16 : BO R IPD vs. VDD OVER TEMPERATURE
FIGURE 18-17: TYPICAL WDT IPD vs. VDD (25°C)
0
20
40
60
80
100
120
140
160
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (μA)
Typical: Statistical Mean @25°C
Maximum: Me an (Wors t-case Te mp) + 3σ
(-40°C to 125°C)
Maximum
Typical
Typical Max 85×C Max 125×C
21.007 2.140 27.702
2.51.146 2.711 29.079
31.285 3.282 30.08
3.51.449 3.899 31.347
41.612 4.515 32.238
4.51.924 5.401 33.129
52.237 6.288 34.02
5.52.764 7.776
0.0
0.5
1.0
1.5
2.0
2.5
3.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
PIC16F882/883/884/886/887
DS41291F-page 282 © 2009 Microchip Technology Inc.
FIGURE 18-18: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE
FIGURE 18-19 : WD T PERIO D vs. VDD OVER TEMPERATURE
Max. 125°C
Max. 85°C
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Maximum: Mean + 3
Maximum: Mean + 3σ
WDT Time-out Period
Typical
10
12
14
16
18
20
22
24
26
28
30
32
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (ms)
Maximum: Mean + 3σ (-40°C to 125°C)
Max. (125°C)
Max. (85°C)
Minimum
© 2009 Microchip Technology Inc. DS41291F-page 283
PIC16F882/883/884/886/887
FIGURE 18-20: WDT PERIOD vs. TEMPERATURE (VDD = 5.0V )
FIGURE 18-21 : CVREF IPD vs. VDD OVER TEMPERATURE (HIGH RANGE)
Vdd = 5V
Maximum
Typical
Minimum
10
12
14
16
18
20
22
24
26
28
30
-40°C 25°C 85°C 125°C
Temperature (°C)
Time (m s )
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-c ase Tem p) + 3σ
Max 85×C M ax 125×C
35.8 68.0
44.8 77.3
53.8 86.5
62.8 94.3
71.8 102.1
81.0 109.8
90.1 117.6
99.2 125.1
Max 85×C M ax 125×C
46.5 86.4
58.3 98.1
70.0 109.9
High Range
Typical
Max. 85°C
0
20
40
60
80
100
120
140
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
Max. 125°C
PIC16F882/883/884/886/887
DS41291F-page 284 © 2009 Microchip Technology Inc.
FIGURE 18-22 : CVREF IPD vs. VDD OVER TEMPERATURE (LOW RANGE)
FIGURE 18-23: TYPICAL VP6 REFERENCE IPD vs. VDD (25°C)
low Range
Typical
Max. 85°C
Max. 125°C
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Me an (Wors t-c ase Te mp) + 3σ
(-40°C to 125°C)
VP6 Reference IPD vs. VDD (25×C)
0
20
40
60
80
100
120
140
160
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical
© 2009 Microchip Technology Inc. DS41291F-page 285
PIC16F882/883/884/886/887
FIGURE 18-24: MAXIMUM VP6 REFERENCE IPD vs. VDD OVER TEMPERATURE
FIGURE 18-25 : T1O SC IPD vs. VDD OVER TEMPERATURE (32 kHz)
Max VP6 Reference IPD vs. VDD Over Temperature
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Max 125°C
Max 85°C
Typ 25×C Max 85×C Max 125×C
2 2.022 4.98 17.54
2.5 2.247 5.23 19.02
3 2.472 5.49 20.29
3.5 2.453 5.79 21.50
4 2.433 6.08 22.45
4.5 2.711 6.54 23.30
5 2.989 7.00 24.00
5.5 3.112 7.34 Typ. 25°C
Max. 85°C
Max. 125°C
0
5
10
15
20
25
30
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291F-page 286 © 2009 Microchip Technology Inc.
FIGURE 18-26 : VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V)
FIGURE 18-27 : VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V)
(VDD = 3V, -40×C TO 125×C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (m A)
VOL (V)
Max. 85°C
Max. 125°C
Typical 25°C
Min. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean + 3σ
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Typical: Statistical Mean
Maximum: Means + 3
Typical: Statistical Mean @25°C
Maximum: Mean + 3σ
Max. 85°C
Typ. 25°C
Min. -40°C
Max. 125°C
© 2009 Microchip Technology Inc. DS41291F-page 287
PIC16F882/883/884/886/887
FIGURE 18-28 : VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V)
FIGURE 18-29 : VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0 IOH (mA)
VOH (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst -cas e Tem p) + 3σ
(-40°C to 125°C)
(, )
3.0
3.5
4.0
4.5
5.0
5.5
-5.0-4.5-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0 IOH (mA)
VOH (V)
Max. -40°C
Typ. 25°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291F-page 288 © 2009 Microchip Technology Inc.
FIGURE 18-30: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
FIGURE 18-31: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
(TTL Input, -40×C TO 125×C)
0.5
0.7
0.9
1.1
1.3
1.5
1.7
2.02.5 3.03.5 4.04.5 5.05.5
VDD (V)
VIN (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-c ase Tem p) + 3σ
(-40°C to 125°C)
(ST Input, -40×C TO 125×C)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max. 125°C
VIH Min. -40°C
VIL Min. 125°C
VIL Max. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Wors t-case Tem p) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 289
PIC16F882/883/884/886/887
FIGURE 18-32: COMPARATOR RESPO NSE TIME (RISING EDGE)
FIGURE 18-33 : CO MPARATOR RESP ONSE TIME (FALLING EDGE)
V- input = Transition from VCM + 100MV to VCM - 20MV
V+ input = VCM
4 200 278 639 846
5.5 140 202 531
0
100
200
300
400
500
600
700
800
900
1,000
2.0 2.5 4.0 5.5
VDD (Volts)
Response Time (nS)
Max. (85°C)
Typ. (25°C)
Min. (-40°C)
Max. (125°C)
Note:
V- input = Transition from VCM + 100MV to VCM - 20MV
V+ input = VCM
VCM = VDD - 1.5V )/2
Vdd -40×C 25×C 85×C 125×C
2 279 327 547 557
2.5 226 267 425 440
4 172 204 304 319
5.5 119 142 182
0
100
200
300
400
500
600
2.0 2.5 4.0 5.5
VDD (Volts)
Response Time (nS)
Max. (85°C)
Typ. (25°C)
Min. (-40°C)
Note:
V- input = Transition from VCM - 100MV to V CM + 20MV
V+ input = VCM
VCM = VDD - 1.5V)/2
Max. (125°C)
PIC16F882/883/884/886/887
DS41291F-page 290 © 2009 Microchip Technology Inc.
FIGURE 18-34: LFINTOSC FREQUENCY vs. VDD OVER TEMPERATURE (31 kHz)
FIGURE 18-35: ADC CLOCK PERIOD vs. VDD OVER TEMPERATURE
LFINTOSC 31Khz
0
5,000
10,000
15,000
20,000
25,000
30,000
35,000
40,000
45,000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Frequency (Hz)
Max. -40°C
Typ. 25°C
Min. 85°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3σ
0
2
4
6
8
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
25°C
85°C
125°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
(-40°C to 125°C)
© 2009 Microchip Technology Inc. DS41291F-page 291
PIC16F882/883/884/886/887
FIGURE 18-36: TYP ICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
FIGURE 18-37: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0
2
4
6
8
10
12
14
16
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
85°C
25°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3σ
-40C to +85C
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
-40°C
85°C
25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3σ
PIC16F882/883/884/886/887
DS41291F-page 292 © 2009 Microchip Technology Inc.
FIGURE 18-38: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
FIGURE 18-39: TYP ICAL HFINTOSC FREQUENCY CHANGE vs. VDD ( 25°C)
-40C to +85C
0
1
2
3
4
5
6
7
8
9
10
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (μs)
-40°C
25°C
85°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3σ
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Cha n ge f r o m C a librat i on (%)
© 2009 Microchip Technology Inc. DS41291F-page 293
PIC16F882/883/884/886/887
FIGURE 18-40: TYP ICAL HFINTOSC FREQUENCY CHANGE OVER DEVICE VDD (85°C)
FIGURE 18-41: TYP ICAL HFINTOSC FREQUENCY CHANGE vs. VDD (125°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change fr om Calibration (%)
PIC16F882/883/884/886/887
DS41291F-page 294 © 2009 Microchip Technology Inc.
FIGURE 18-42: TYP ICAL HFINTOSC FREQUENCY CHANGE vs. VDD ( -40°C)
FIGURE 18-43: TYPICAL VP6 REFERENCE VOLTAGE vs. VDD (25°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change fr om Calibration (%)
VP6 Reference Voltage vs. VDD (25×C)
0.55
0.56
0.57
0.58
0.59
0.60
0.61
0.62
0.63
0.64
0.65
23455.5
VDD (V)
VP6 (V)
Typical
© 2009 Microchip Technology Inc. DS41291F-page 295
PIC16F882/883/884/886/887
FIGURE 18-44 : VP6 DRIFT OV ER TE MP ERATURE NORMALIZED AT 25°C (VDD 5V)
FIGURE 18-45 : VP6 DR IFT OVER TEMP ERATURE NORMALIZED AT 25°C (VDD 3V)
-1
0
1
2
3
4
-40 025 85 125
Temperature in Degrees C
Change fro m Nomin al in %
-2
-1
0
1
2
3
4
-40 025 85 125
Temperature in Degrees C
Change from Nominal in %
-2
PIC16F882/883/884/886/887
DS41291F-page 296 © 2009 Microchip Technology Inc.
FIGURE 18-46: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 25°C)
FIGURE 18-47: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 85°C)
Typical VP6 Reference Voltage Distribution (VDD=3V, 25×C)
0
5
10
15
20
25
30
35
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=3V, 85×C)
0
5
10
15
20
25
30
35
40
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
© 2009 Microchip Technology Inc. DS41291F-page 297
PIC16F882/883/884/886/887
FIGURE 18-48: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 125°C)
FIGURE 18-49: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, -40°C)
Typical VP6 Reference Voltage Distribution (VDD=3V, 125×C)
0
5
10
15
20
25
30
35
40
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=3V, -40×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
PIC16F882/883/884/886/887
DS41291F-page 298 © 2009 Microchip Technology Inc.
FIGURE 18-50: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 25°C)
FIGURE 18-51: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 85°C)
Typical VP6 Reference Voltage Distribution (VDD=5V, 25×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=5V, 85×C)
0
5
10
15
20
25
30
35
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
© 2009 Microchip Technology Inc. DS41291F-page 299
PIC16F882/883/884/886/887
FIGURE 18-52: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 125°C)
FIGURE 18-53: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, -40°C)
Typical VP6 Reference Voltage Distribution (VDD=5V, 25×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=5V, -40×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
PIC16F882/883/884/886/887
DS41291F-page 300 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 301
PIC16F882/883/884/886/887
19.0 PACKAGING INFORMATION
19.1 Package Mark ing Information
3
e
28-Lead QF N
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
16F886
/ML
0710017
28-Lead SOIC (7.50 mm)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16F886/SO
0710017
28-Lead PDIP
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXXXX
Example
PIC16F883
0710017
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
PIC16F883
-I/SS 0710017
-I/P
3
e
3
e
3
e
Legend: XX...X Cust om er-s pec ifi c info rma tio n
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the eve nt the full Microc hip p art number c annot be marked on one lin e, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
PIC16F882/883/884/886/887
DS41291F-page 302 © 2009 Microchip Technology Inc.
19.1 Package Mark ing Information (Continue d)
3
e
40-Lead PDIP
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC16F885
0710017
XXXXXXXXXX
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC16F887
Example
-I/ML
0710017
44-Lead TQFP
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
PIC16F887
-I/PT0710017
3
e
3
e
-I/P
Legend: XX...X Cust om er-s pec ifi c info rma tio n
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the eve nt the full Microc hip p art number c annot be marked on one lin e, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
© 2009 Microchip Technology Inc. DS41291F-page 303
PIC16F882/883/884/886/887
19.2 Package Details
The following sections give the technical details of the packages.
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- '!!#.#&"#'#%!&"!!#%!&"!!!&$#/!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 7,8.
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
&& = = 
##44!!   - 
1!&&   = =
"#&"#>#& .  - --
##4>#& .  < 
: 9& - -? 
&& 9  - 
9#4!! <  
69#>#& )   
9*9#>#& )  < 
: *+ 1 = = -
NOTE 1
N
12
D
E1
eB
c
E
L
A2
eb
b1
A1
A
3
  * ,1
PIC16F882/883/884/886/887
DS41291F-page 304 © 2009 Microchip Technology Inc.
##$%&'(#)
!"
  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
: 8& = = ?
##44!!   = =
&#%%+   = -
: >#& . -1,
##4>#& . 1,
: 9& 1,
,'%@&A  = 
3&9& 9  = 
3&& 9 .3
3& IB = <B
9#4!! < = --
9#>#& ) - = 
#%& DB = B
#%&1&&' EB = B
c
h
h
L
L1
A2
A1
A
NOTE 1
123
b
e
E
E1
D
φ
β
α
N
  * ,1
© 2009 Microchip Technology Inc. DS41291F-page 305
PIC16F882/883/884/886/887
*+#('#
!"
  !"#$%&"' ()"&'"!&)&#*&&&#
 '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
- '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& ?1,
: 8& = = 
##44!!  ?  <
&#%%   = =
: >#& .  < <
##4>#& .  - ?
: 9&   
3&9& 9   
3&& 9 .3
9#4!!  = 
3& B B <B
9#>#& )  = -<
L
L1
c
A2
A1
A
E
E1
D
N
12
NOTE 1
b
e
φ
  * ,-1
PIC16F882/883/884/886/887
DS41291F-page 306 © 2009 Microchip Technology Inc.
,-%!./010,-!
2*'(().*
!"
  !"#$%&"' ()"&'"!&)&#*&&&#
 4!!*!"&#
- '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& ?1,
: 8& <  
&#%%    
,&&4!! - .3
: >#& . ?1,
.$!##>#& . -? - 
: 9& ?1,
.$!##9&  -? - 
,&&>#& ) - - -
,&&9& 9   
,&&&.$!## C  = =
DEXPOSED D2
e
b
K
E2
E
L
N
NOTE 1
1
2
2
1
N
A
A1
A3
TOP VIEW BOTTOM VIEW
PAD
  * ,1
© 2009 Microchip Technology Inc. DS41291F-page 307
PIC16F882/883/884/886/887
,-%!./010,-!
2*'(().*
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
PIC16F882/883/884/886/887
DS41291F-page 308 © 2009 Microchip Technology Inc.
30
!"
  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#/!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 7,8.
'!9'&! 7 7: ;
7"')%! 7 
& 1,
&& = = 
##44!!   = 
1!&&   = =
"#&"#>#& .  = ?
##4>#& . < = <
: 9& < = 
&& 9  = 
9#4!! < = 
69#>#& ) - = 
9*9#>#& )  = -
: *+ 1 = = 
N
NOTE 1
E1
D
123
A
A1 b1
be
c
eB
E
L
A2
  * ,?1
© 2009 Microchip Technology Inc. DS41291F-page 309
PIC16F882/883/884/886/887
33,-%!./1,-!
!"
  !"#$%&"' ()"&'"!&)&#*&&&#
 4!!*!"&#
- '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 
& ?1,
: 8& <  
&#%%    
,&&4!! - .3
: >#& . <1,
.$!##>#& . ?- ? ?<
: 9& <1,
.$!##9&  ?- ? ?<
,&&>#& )  - -<
,&&9& 9 -  
,&&&.$!## C  = =
DEXPOSED
PAD
D2
e
b
K
L
E2
2
1
N
NOTE 1
2
1
E
N
BOTTOM VIEW
TOP VIEW
A3 A1
A
  * ,-1
PIC16F882/883/884/886/887
DS41291F-page 310 © 2009 Microchip Technology Inc.
33,-%!./1,-!
!" 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
© 2009 Microchip Technology Inc. DS41291F-page 311
PIC16F882/883/884/886/887
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: 8& = = 
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A
E
E1
D
D1
e
b
NOTE 1 NOTE 2
N
123
c
A1
L
A2
L1
α
φ
β
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PIC16F882/883/884/886/887
DS41291F-page 312 © 2009 Microchip Technology Inc.
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© 2009 Microchip Technology Inc. DS41291F-page 313
PIC16F882/883/884/886/887
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (5/2006)
Initial release of this data sheet.
Revision B (7/2006)
Pin Diagrams (44-Pin QFN drawing); Revised Table
2-1, Addr. 1DH (CCP2CON); Section 3.0, 3.1; Section
3.4.4.6; Table 3; Table 3-1 (ANSEL); Table 3-3
(CCP2CON); Register 3-1; Register 3.2; Register 3-3;
Register 3-4; Register 3-9; Register 3-10; Register
3-11; Register 3 -12; R egist er 3-14; Table 3-5 (ANS EL);
Figure 3-5; Figure 3-11; Figure 8-2; Figure 8-3; Figure
9-1; Register 9-1; Section 9.1.4; Example 10-4; Figure
11-5; Table 11-5 (P1M); Sectio n 11.5.2; Section 11.5.7,
Number 4; Table 11-7 (CCP2CON); Section 12.3.1
(Para. 3); Figure 12-6 (Title); Sections 14.2, 14.3 and
14.4 DC Chara cteristic s (Max); Table 14-4 (OSCC ON);
Section 14.3 (TMR0); Section 14.3.2 (TMR0).
Revision C
Section 19.0 Packaging Information: Replaced
package drawings and added note.
Added PIC16F882 part number.
Replaced PICmicro with PIC.
Revision D
Replaced Package Drawings (Rev. AM); Replaced
Development Support Section; Revised Product ID
Section.
Revision E (01/2008)
Added Char Data; Removed Preliminary status;
Revised Device Table (PIC16F882, I/O); Revised the
following: Pin Diagram 44 TQFP, pin 30; Table 5, I/O
RA7; Table 1-1, RA1 and RA4; Section 2.2.1; Register
2-3, INTCON; Example 3-1; Section 3.2.2; Example
3-2; Figure 6-1; Section 6.2.2; Section 6.6; Section
8.10.3; Table 9-1; Equation 11-1; Added Figure 11-14
and renumbered remaining Figures; Register 11-3;
Register 13-3; Section 14.0; Section 14.1; Section
14.9; Section 14.10; Section 17.0; Updated Package
Drawings.
Revision F (04/2009)
Revised Product ID: Removed ‘F’ (std. voltage range)
from part numbers; Revised Figure 6-1: Timer1 Block
Diagram; Revised Figure 8-3, Comparator C2 Block
Diagram; Added note to Section 8.10.3; Revised
Section 8.1 0.7.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This discusses some of the issues in migrating from
other PIC de vices to the PIC16F8 8X Family of devices.
B.1 PIC16F87X to PIC16F88X
TABLE B-1: FEATURE COMPARISON
Feature PIC16F87X PIC16F88X
Max Operating Speed 20 MHz 20 MHz
Max Program
Memory (Words) 8192 8192
SRAM (bytes) 368 368
A/D Resolution 10-bit 10-bit
Data EEPROM (Bytes) 256 256
Timers (8/16-bit) 2/1 2/1
Oscillator Modes 4 8
Brown-out Reset Y Y (2.1V/4V)
Software Control Option
of WDT/BOR NY
Internal Pull-ups RB<7:4> RB<7:0>,
MCLR
Interrupt-on-change RB<7:4> RB<7:0>
Comparator 2 2
References CVREF CVREF and
VP6
ECCP/CCP 0/2 1/1
Ultra Low-Power
Wake-Up NY
Extended WDT N Y
INTOSC Frequencies N 32 kHz-8 MHz
Clock Sw itching N Y
MSSP Standard w/Slave
Address Mask
USART AUSART EUSART
ADC Channels 8 14
Note: This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performan ce c harac teristi cs than it s earli er
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
PIC16F882/883/884/886/887
DS41291F-page 314 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 315
PIC16F882/883/884/886/887
INDEX
A
A/D Specifications....................................................263, 264
Absolute Maximum Ratings..............................................245
AC Characteristics
Industrial and Extended............................................255
Load Conditions.............. .. .... .. ....... .. .. .. .... .. .. ....... .. .. ..254
ACKSTAT .........................................................................198
ACKSTAT Status Flag ......................................................198
ADC ....................................................................................99
Acquisition Requirements ....................................... ..107
Associ a te d Re g i sters............ ..................... ...............109
Block Diag ram................... ............... ..................... ......99
Calculating Acquisition Time.....................................107
Channel Selection........................................ ....... .... ..100
Configuration.............................................................100
Configuring Interrupt.................................................103
Conversi o n Clo ck............ ............... ..................... ......100
Conversion Procedure ............................. .... ......... .. ..103
Internal Sampling Switch (RSS) Impedance..............107
Interrupts...................................................................101
Operation..................................................................102
Operation During Sleep ............................................102
Port Configuration.....................................................100
Reference Voltage (VREF).........................................100
Result For matting............ ............... ..................... ......102
Source Impedance................................... .... ........... ..107
Special Event Trigger................................................102
Starting an A/D Conversion ......................................102
ADCON0 Register .............................................................104
ADCON1 Register .............................................................105
ADRESH Register (ADFM = 0).........................................106
ADRESH Register (ADFM = 1).........................................106
ADRESL Register (ADFM = 0)..........................................106
ADRESL Register (ADFM = 1)..........................................106
Analog Input Connection Considerations............................90
Analog-to-Digital Converter. See AD C
ANSEL Register..................................................................40
ANSELH Register...............................................................48
Assembler
MPASM Assembler...................................................242
B
Baud Rate Generator........................................................195
BAUDCTL Register.... ......... ............... ........ .......................162
BF .....................................................................................198
BF Status Flag..................................... ........................... ..198
Block Diagrams
(CCP) Capture Mode Operation ...............................126
ADC ............................................................................99
ADC Transfer Function.............................................108
Analog Input Model.............................................90, 108
Auto-Shutdown .........................................................141
Baud Rate Generator................................................195
CCP PWM.................................................................128
Clock Source...............................................................61
Comparator C1 ................. ..................... ............... ......84
Comparator C1 and ADC Voltage Reference.............95
Comparator C2 ................. ..................... ............... ......84
Compare...................................................................127
Crystal Operation........................................................64
EUSART Receive .....................................................152
EUSART Transmit ....................................................151
External RC Mode...................................................... 65
Fail -Safe C l o ck Mon it o r (FSCM)... ...... ..... ...... ...... ...... . 71
In-Circuit Serial Programming Connections ............. 228
Interrupt Logic ........................................................... 221
MSSP (I2C Master Mode)......................................... 193
MSSP (I2C Mode)......... .. ....... .. .. .. .... .. .. ..... .... .. .. .. .. .... 189
MSSP (SPI Mode) .................................................... 183
On-Chip Res e t Circuit................ ............... ........ ........ 21 2
PIC16F883/886 .......................................................... 14
PIC16F884/887 .......................................................... 15
PWM (Enhanced)..................................................... 132
RA0 Pins..................................................................... 42
RA1 Pin ...................................................................... 43
RA2 Pin ...................................................................... 43
RA3 Pin ...................................................................... 44
RA4 Pin ...................................................................... 44
RA5 Pin ...................................................................... 45
RA6 Pin ...................................................................... 45
RA7 Pin ...................................................................... 46
RB0, R B 1, RB2 , R B3 Pi n s.... ...... ...... ..... .. ...... ...... .. ..... 50
RB4, R B 5, RB6 , R B7 Pi n s.... ...... ...... ..... .. ...... ...... .. ..... 51
RC0 Pin...................................................................... 54
RC1 Pin...................................................................... 54
RC2 Pin...................................................................... 54
RC3 Pin...................................................................... 55
RC4 Pin...................................................................... 55
RC5 Pin...................................................................... 55
RC6 Pin...................................................................... 56
RC7 Pin...................................................................... 56
RD0, RD1, RD2, RD3, RD4 Pins........................ ........ 58
RD5, RD6, RD7 Pins...... .............................. .............. 58
RE3 Pin ...................................................................... 60
Resonator Operation. ................................................. 64
Timer1 ........................................................................ 76
Timer2 ........................................................................ 81
TMR0/WDT Prescaler ................................................ 73
Watchdog Timer (WDT)............................................ 224
Break Character (12-bit) Transmit and Receive............... 169
BRG.................................................................................. 195
Brown-out Reset (BOR).................................................... 214
Associated................................................................ 215
Specifications ........................................................... 259
Timing and Characteristics......................... .... .... .. .... 258
Bus Collision During a Repeated Start Condition............. 206
Bus Collision During a Start Condition.............................. 204
Bus Collision During a Stop Condition....... ....................... 207
C
C Compilers
MPLAB C18.............................................................. 242
MPLAB C30.............................................................. 242
Capture Module. See Enhanced Capture/Compare/
PWM(ECCP)
Capture/Compare/PWM (CCP)
Associated Registers w/ Capture, Compare
and Timer1 ....................................................... 149
Associated Registers w/ PWM and Timer2 .............. 149
Capture Mode........................................................... 126
CCP Pin Configuration ............................................. 126
Compare Mode......................................................... 127
CCP Pin Configuration ..................................... 127
Software Interrupt Mode........................... 126, 127
Special Event Trigger....................................... 127
Timer1 Mode Selection............................. 126, 127
PIC16F882/883/884/886/887
DS41291F-page 316 © 2009 Microchip Technology Inc.
Prescaler...................................................................126
PWM Mode.............. ..................... ............................128
Duty Cycle.......... ..................... ............... ...........129
Effects of Reset.................................................131
Example PWM Frequencies and
Resolutions, 20 MHZ ................................130
Example PWM Frequencies and
Resolutions, 8 MHz...................................130
Operation in Sleep Mode........................... .......131
Setup for Operation................. ..................... .....131
System Clock Frequency Changes...................131
PWM Period.............................. ................................129
Setup for PWM Operation............. ..................... .......131
Timer Resources.......................................................125
CCP1CON (Enhanced) Register.......................................124
CCP2CON Regis te r.............. .............. ............... ...............125
Clock Accuracy with Asynchronous Operation .... .............160
Clock Sources
External Modes. ..........................................................63
EC.......................................................................63
HS.......................................................................64
LP........................................................................64
OST.....................................................................63
RC.......................................................................65
XT .......................................................................64
Internal Modes ............................................................65
Frequency Selection............... ....... .... .. .... .. .........67
HFINTOSC..........................................................65
HFINTOSC/LFINTOSC Switch Timing ...............67
INTOSC ..............................................................65
INTOSCIO...........................................................65
LFINTOSC..........................................................67
Clock Switching. ..................................................................69
CM1CON0 Register.............. ..................... .............. ...........88
CM2CON0 Register.............. ..................... .............. ...........89
CM2CON1 Register.............. ..................... .............. ...........91
Code Examples
A/D Conversion.......... ............... ..................... ...........103
Assign ing Prescaler to Timer0....................................74
Assign ing Prescaler to WDT....... ..................... ...........74
Changing Between Capture Prescalers....................126
Indirect Addressing.....................................................37
Initializing PORTA.......................................................39
Initializing PORTB.......................................................47
Initializing PORTC.......................................................53
Initializing PORTD.......................................................57
Initializing PORTE.......................................................59
Loading the SSPBUF Register .................................184
Saving STATUS and W Registers in RAM ...............223
Ultra L o w - Powe r Wake -u p In i tia li zatio n ...... ...... ......... .41
Write Verify ...............................................................120
Writing to Flash Program Memory............................119
Code Protection ................................................................227
Comparator
C2OUT as T1 Gate................... ............... .............77, 91
Effects of a Reset........................................................87
Operation ....................................................................83
Operation During Sleep ..............................................87
Response Time...........................................................85
Specifications............................................................262
Synchronizing COUT w/Timer1 ..................................91
Comparator Module ........... ....... .. .... .. .... .. ....... .... .. .... .. ....... ..83
Associ a te d Re g i sters............................... ...................97
C1 Output State Versus Input Conditions...................85
Comparator Voltage Reference (CVREF)
Response Time....................................................... ....85
Comparator Voltage Reference (CVREF)............................ 94
Effects of a Reset ................... ............... ..................... 87
Specifications ........................................................... 262
Compare Module. See Enhanced Capture/
Compare/PWM (ECCP)
CONFIG1 Register ........................................................... 210
CONFIG2 Register ........................................................... 211
Configuration Bits ............................................................. 210
CPU Features............................. ............... ..................... .. 209
Customer Change Notification Service............................. 323
Customer Notification Ser vice .. ......... .............. ................. 323
Custome r Support............. ........................... ..................... 323
D
Data EEPRO M Mem ory.......... ..................... ..................... 111
Associated Registers................................................ 121
Code Protection........................................................ 120
Reading .................................................................... 114
Writing ...................................................................... 114
Data Memory ...................................................................... 22
DC Characteristics
Extended .................................................................. 250
Industrial................................................................... 249
Industrial and Extended............................ 247, 248, 251
Development Support.......................................................241
Device Overview................................................................. 13
E
ECCP. See Enhanced Capture/Compare/PWM
ECCPAS Regi ster......... ..................... .............. ................. 14 2
EEADR Register............................................................... 112
EEADR Registers............................................................. 111
EEADRH Registe r s............. ............... ............................. ..111
EECON1 Regist e r.... ............... ............... ........ ........... 11 1 , 113
EECON2 Regist e r.... ............... ............... .............. ............. 111
EEDAT Register ............................................................... 112
EEDATH Register............................................................. 112
EEPROM Data Memory
Avoiding Sp u rious Write ............. ...... ...... ...... ..... ...... . 120
Write Verify............................................................... 120
Effects o f Reset
PWM mode............... ..................... ..................... ...... 131
Electrical Specifications.................................................... 245
Enhanced Capture/Compare/PWM ..................................123
Enhanced Capture/Compare/PWM (ECCP)
Enhanced PWM Mode.............................................. 132
Auto-Restart ..................................................... 143
Auto-shutdown.................................................. 141
Direction Change in Full-Bridge Output Mode.. 138
Full-Bridge Application...................................... 136
Full-Bridge Mode .............................................. 136
Half-Bridge Application..................................... 135
Half-Bridge Application Examples .................... 144
Half-Bridge Mode. ............................................. 135
Output Relationships (Active-High and
Active-Low).............................................. 133
Output Relationships Diagram.......................... 134
Programmable Dead Band Delay..................... 144
Shoot-through Current...................................... 144
Start-up Considerations.................................... 140
Specifications ........................................................... 261
Time r R e so u r ces ....... ...... ...... ..... ...... ...... ...... ..... ...... . 124
Enhanced Universal Synchronous
Asynchronous Receiver T ransm itter (EUSART ) ....... 151
Errata.................................................................................. 12
© 2009 Microchip Technology Inc. DS41291F-page 317
PIC16F882/883/884/886/887
EUSART ...........................................................................151
Associated Registers
Baud Rate Generator........................................163
Asynchronous Mode.................................................153
12-bit Break Transmit and Receive ..................169
Associated Registers
Receive.....................................................159
Transmit....................................................155
Auto-Wa ke-up on Break .................... ...............168
Baud Rate Generator (BRG) ............................163
Clock Accuracy.................................................160
Receiver............................................................156
Setting up 9-bit Mode with Address Detect .......158
Transmitter........................................................153
Baud Rate Generator (BRG)
Auto Baud Rate Detect.....................................167
Baud Rate Error, Calculating.......................... ..163
Baud Rates, Asynchronous Modes ..................164
Formulas...........................................................163
High Baud Rate Select (BRGH Bit) ..................163
Synchronous Master Mode...............................171, 175
Associated Registers
Receive.....................................................174
Transmit....................................................172
Reception..........................................................173
Requirements, Synchronous Receive ..............266
Requirements, Synchronous Transm ission......266
Timing Diagram, Synchronous Receive ...........266
Timing Diagram, Synchronous Transmission...266
Transmission ....................................................171
Synchronous Slave Mode
Associated Registers
Receive.....................................................176
Transmit....................................................175
Reception..........................................................176
Transmission ....................................................175
F
Fail-Safe Clock Monitor .......................................................71
Fail-Safe Condition Clearing.......................................71
Fail-Safe Detection .....................................................71
Fail-Safe Operation.....................................................71
Reset or Wak e -up from Sleep...... ..................... ..........71
Firmware Instructions ........................................................231
Flash Pr ogram Memory ........................... .........................111
Writing.......................................................................117
Fuses. See Configuration Bits
G
General Call Address Support ..........................................192
General Purpose Register File............................................22
I
I2C (MSSP Module)
ACK Pulse.................................... .... .. .... .... .. .....189, 190
Addressing................................................................190
Read/Write Bit Information (R/W Bit)........................190
Reception..................................................................190
Serial Clock (RC3/SCK/SCL)....................................190
Slave Mode...............................................................189
Transmission.............................................................190
I2C Master Mode Reception..............................................198
I2C Master Mode Repeated Start Condition Timing . .........197
I2C Module
Acknowledge Sequence Timing................................201
Baud Rate Generator................................................195
BRG Bl o ck Diag ra m ...... ..... .. ...... .. ...... .. ..... ...... ...... .. . 195
BRG Reset Due to SDA Arbitration During
Start Condition.................................................. 205
BRG Timing.............................................................. 195
Bus Collision
Acknowledge.................................................... 203
Repeated Start Condition..................... .... .. .. .. .. 206
Repeated Start Condition Timing (Case1)........ 206
Repeated Start Condition Timing (Case2)........ 206
Start Condition.................................................. 204
Start Condition Timing.............................. 204, 205
Stop Condition.............................................. .... 207
Stop Condition Timing (Case 1) ............. .. .... .... 207
Stop Condition Timing (Case 2) ............. .. .... .... 207
Bus Collision timing...... ............................ ........ ........ 203
Clock Arbitration....................................................... 202
Clock Arbitration Timing (Master Transmit). ............. 202
Effect of a Reset....................................................... 202
General Call Address Support.................................. 192
Mas te r Mod e...... ...... ...... ..... ...... .......... ..... ...... ...... ..... 193
Master Mode 7-bit Reception Timing........................ 200
Master Mode Operation............................................ 194
Master Mode Start Condition Timing........................ 196
Master Mode Support............................................... 193
Master Mode Transmission ...................................... 198
Master Mode Transmit Sequence ............................ 194
Multi-Master Mode.................................................... 203
Repeat Start Condition Timing Waveform................ 197
Sleep Operation. ....................................................... 202
Stop Condition Receive or Transmit Timing............. 202
Stop Condition Timing .............................................. 201
Waveforms for 7-bit Reception................................. 191
Wave forms for 7 - b i t Trans miss i on.. ...... ..... ...... ...... ... 1 9 1
ID Locations...................................................................... 227
In-Circuit Debugger........................................................... 229
In-C i r cu i t Se rial Pro g ramm i n g (IC S P)... .. .. ..... .. ...... ...... ..... 227
Indirect Addressing, INDF and FSR registers..................... 37
Instruction Format............................................................. 231
Instruction Set................................................................... 231
ADDLW..................................................................... 233
ADDWF .................................................................... 233
ANDLW..................................................................... 233
ANDWF .................................................................... 233
BCF .......................................................................... 233
BSF........................................................................... 233
BTFSC...................................................................... 233
BTFSS...................................................................... 234
CALL......................................................................... 234
CLRF........................................................................ 234
CLRW....................................................................... 234
CLRWDT.................................................................. 234
COMF....................................................................... 234
DECF........................................................................ 234
DECFSZ................................................................... 235
GOTO....................................................................... 235
INCF......................................................................... 235
INCFSZ..................................................................... 235
IORLW...................................................................... 235
IORWF...................................................................... 235
MOVF....................................................................... 236
MOVLW.................................................................... 236
MOVWF.................................................................... 236
NOP.......................................................................... 236
RETFIE..................................................................... 237
RETLW..................................................................... 237
PIC16F882/883/884/886/887
DS41291F-page 318 © 2009 Microchip Technology Inc.
RETURN...................................................................237
RLF ...........................................................................238
RRF...........................................................................238
SLEEP ......................................................................238
SUBLW .....................................................................238
SUBWF.....................................................................239
SWAPF .....................................................................239
XORLW.....................................................................239
XORWF.....................................................................239
Summary Ta b l e...... ............................ ..................... ..232
INTCON Register................................................................31
Inter-Integrated Circuit. See I2C
Internal Oscillator Block ....................................................256
INTOSC
Specifications....................................................257
Internal Sampling Switch (RSS) Impedance......................107
Inter net Address................................ ........................... .....323
Interrupts...........................................................................220
ADC ..........................................................................103
Associ a te d Re g i sters............................... .................222
Context Saving..........................................................223
Interrupt-on-Change....................................................47
PORTB Interrupt-on-C hange ....................................221
RB0/INT ....................................................................220
Timer0.......................................................................221
TMR1 ..........................................................................78
INTOSC
Specifications............................................................256
INTOSC Specifications .............................................256, 257
IOCB Register.............. ..................... ..................... .............49
L
Load Conditions............................ .... .. .. .. ....... .. .. .... .. .. .. .....254
M
Master Mode.....................................................................193
Master Mode Support ........................................................193
Master Synchronous Serial Port. See MSSP
MCLR................................................................................213
Internal......................................................................213
Memory Organization..........................................................21
Data ............................................................................22
Program ......................................................................21
Microc h i p In ternet Web Sit e.... ........................... ...............323
Migra tin g from other PICmic ro Devices ............... .............313
MPLAB ASM30 Assembler, Linker, Librarian ...................242
MPLAB ICD 2 In-Circuit Debugger....................................243
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator....................................................243
MPLAB Integrated Development Environment Software ..241
MPLAB PM3 Device Programmer.....................................243
MPLAB REA L IC E In -Circuit Em u l a to r System........ .........243
MPLINK Object Linker/MPL IB Objec t Librarian ....... .........242
MSSP................................................................................179
Block Diagram (SPI Mode) .......................................183
I2C Mode. See I2C
SPI Mode ..................................................................183
SPI Mode. See SPI
MSSP Module
Control Reg i sters .................. ..................... ...............179
I2C Operation............................................................189
SPI Master Mode ......................................................185
SPI Slave Mode........................................................186
Multi-Master Communicati on, Bus Collision and
Bus Arbitration .............. ........................... .................203
Multi-Master Mode ............................................................203
O
OPCODE Field Descriptions............................................. 231
OPTION Register................................................................ 30
OPTION_R EG Re g i ster........................... ............... ............ 75
OSCCON Register.............................................................. 62
Oscillator
Associ a te d Re g i sters......................... ................... 72, 80
Oscillat o r Module.............. ........ ....................... ................... 61
EC............................................................................... 61
HFINTOSC ................................................................. 61
HS............................................................................... 61
INTOSC...................................................................... 61
INTOSCIO .................................................................. 61
LFINTOSC.................................................................. 61
LP ............................................................................... 61
RC .............................................................................. 61
RCIO........................................................................... 61
XT............................................................................... 61
Oscillato r Parameters............... ......... ............................... 256
Oscillato r Specifications........ ........ .................................. .. 255
Oscillator Start-up Timer (OST)
Specifications ........................................................... 259
Oscillator Switching
Fail - Safe C l o c k Mon it o r .............. .......... ...... . . ..... ...... ... 71
Two-Spe ed Clock Start-up ............... ..................... ...... 69
OSCTUNE Regis te r.................... ............... ............... .......... 66
P
P1A/P1B/P1C/P1D.See Enhanced Capture/
Com p a r e /P WM (EC CP)....... .. ..... ...... ...... ...... . ...... ..... 132
Packaging......................................................................... 301
Mar ki n g... .. ...... ..... ...... ...... ...... ......... ...... ...... ..... . 301 , 3 0 2
PDIP Details. ............................................................ 303
PCL and PCLATH ............................................................... 37
Stack........................................................................... 37
PCON Register........................................................... 36, 215
PICSTART Plus Deve lopment Program mer..................... 244
PIE1 R e g is t e r...... ...... ..... .. ...... .. ...... ..... .. ...... ...... ..... ...... .. ..... 32
PIE2 R e g is t e r...... ...... ..... .. ...... .. ...... ..... .. ...... ...... ..... ...... .. ..... 33
Pin Diagram
PIC16F883/886, 28-pin (PDIP, SOIC, SSOP).............. 3
PIC16F883/886, 28-pin (QFN).. .................................... 4
PIC16F884/887, 40-Pin (PDIP) .................................... 6
PIC16F884/887, 44-pin (QFN).. .................................... 8
PIC16F884/887, 44-pin (TQFP).................................. 10
Pinout Descriptions
PIC16F883/886 .......................................................... 16
PIC16F884/887 .......................................................... 18
PIR1 Register ..................................................................... 34
PIR2 Register ..................................................................... 35
PORTA ............................................................................... 39
Additional Pin Functions............................................. 40
ANSE L R e g i st e r .. .. ...... .. ..... ...... ...... ...... . ...... ...... . 40
Ultra Low-Power Wake-up................... ......... 40, 41
Associated Registers.................................................. 46
Pin Descriptions and Diagrams .................................. 42
RA0............................................................................. 42
RA1............................................................................. 43
RA2............................................................................. 43
RA3............................................................................. 44
RA4............................................................................. 44
RA5............................................................................. 45
RA6............................................................................. 45
RA7............................................................................. 46
Specifications ........................................................... 257
© 2009 Microchip Technology Inc. DS41291F-page 319
PIC16F882/883/884/886/887
PORTA Register.................................................................39
PORTB................................................................................47
Additional Pin Functions .............................................47
ANSELH Register...............................................47
Weak Pull-up ......................................................47
Associ a te d Re g i sters............ ..................... .................52
Interrupt-on-Change....................................................47
P1B/P1C/P1D.See Enhanced Capture/
Comp are/PWM + ( EC C P+).. ...... ...... ...... ..... ...... ...47
Pin Descriptions and Diagrams. ..................................50
RB0.............................................................................50
RB1.............................................................................50
RB2.............................................................................50
RB3.............................................................................50
RB4.............................................................................51
RB5.............................................................................51
RB6.............................................................................51
RB7.............................................................................51
PORTB Register.................................................................48
PORTC ...............................................................................53
Associ a te d Re g i sters............ ..................... .................56
P1A.See Enhanced Capture/Compare/
PWM+ (ECCP+) ................ .............. ............... ....53
RC0.............................................................................54
RC1.............................................................................54
RC2.............................................................................54
RC3.............................................................................55
RC3 Pin.....................................................................190
RC4.............................................................................55
RC5.............................................................................55
RC6.............................................................................56
RC7.............................................................................56
Specifications............................................................257
PORTC Register.................................................................53
PORTD ...............................................................................57
Associ a te d Re g i sters............ ..................... .................58
P1B/P1C/P1D.See Enhanced Capture/
Comp are/PWM + ( EC C P+).. ...... ...... ...... ..... ...... ...57
RD0, RD1, RD2, RD3, RD4................. ............... ........58
RD5.............................................................................58
RD6.............................................................................58
RD7.............................................................................58
PORTD Register.................................................................57
PORTE................................................................................59
Associ a te d Re g i sters............ ..................... .................60
RE0.............................................................................60
RE1.............................................................................60
RE2.............................................................................60
RE3.............................................................................60
PORTE Register.................................................................59
Power-Down Mode (Sleep)...............................................226
Power-on Res e t (POR)....... ..................... ............... ..........213
Power-up Timer (PWRT) .... ..................... ............... ..........213
Specifications............................................................259
Precisio n In ternal Oscilla tor Paramete rs........ ............... ....257
Prescaler
Shared WDT/Timer0............. ............... ..................... ..74
Switching Prescaler As s i g n men t....................... ..........74
Program Memory................................................................21
Map and Stack............................................................21
Map and Stack (PIC16F883/884) ...............................21
Map and Stack (PIC16F886/887) ...............................21
Programming, Device Instructions....................................231
PSTRCON Regi ster.................... ..................... .................146
Pulse Steering...................................................................146
PWM (ECCP Module)
Pulse Steering.......................................................... 146
Stee ri n g Syn chro n iz a t ion...... ...... .. ...... ..... .. ...... .. ...... . 14 8
PWM Mode. See Enh anced Captur e/Compare/ PWM...... 132
PWM1CON Register......................................................... 145
R
RCREG............................................................................. 158
RCSTA Regist e r................... ..................... ............... ........ 161
Reader Response............................................................. 324
Read-Modify-Write Operations......................................... 231
Register
RCREG Register...................................................... 167
Registers
ADCON0 (ADC Control 0)........................................ 104
ADCON1 (ADC Control 1)........................................ 105
ADRESH (ADC Result High) wi th ADFM = 0).......... 106
ADRESH (ADC Result High) wi th ADFM = 1).......... 106
ADRESL (ADC Result Low) with ADFM = 0)............ 106
ADRESL (ADC Result Low) with ADFM = 1)............ 106
ANSEL (Analog Select).............................................. 40
ANSE L H (Ana l o g Se le ct Hi g h ) ....... ...... ..... ...... ...... ..... 48
BAUDCTL (Baud Rate Control)................................ 162
CCP1CON (Enhanced CCP1 Control) ................. .... 124
CCP2CON (CCP2 Control) ...................................... 125
CM1CON0 (C1 Control) ............................................. 88
CM2CON0 (C2 Control) ............................................. 89
CM2CON1 (C2 Control) ............................................. 91
CONFIG1 (Configuration Word Register 1).............. 210
CONFIG2 (Configuration Word Register 2).............. 211
ECCPAS (Enhanced CCP Auto-shutdown Control). 142
EEADR (EEPR OM Add re ss)...... .. ...... .. ..... .. .. ...... .. .. . 112
EECON1 (EEPROM Control 1)......... ......... ........ ...... 113
EEDAT (EEPROM Data).......................................... 112
EEDA T H ( EEPRO M Dat a ) ... ...... ...... .. ..... ...... .. ...... ... 11 2
INTC ON (I n te r rupt Control) ...... ...... ...... ......... .......... ... 3 1
IOCB (Interrupt-on-Change PORTB).......................... 49
OPTION_REG (OPTION)..................................... 30, 75
OSCC ON (Osc il l a tor Con t r o l )....... ......... ...... ...... ......... 62
OSCTUNE (Oscillator Tuning ).................................. .. 66
PCON (Power Control Register)................................. 36
PCON (Power Control)............................................. 215
PIE1 (Peripheral Interrupt Enable 1) .......................... 32
PIE2 (Peripheral Interrupt Enable 2) .......................... 33
PIR1 (Peripheral Interrupt Register 1)........................ 34
PIR2 (Peripheral Interrupt Request 2)........................ 35
PORTA....................................................................... 39
PORTB....................................................................... 48
PORTC....................................................................... 53
PORTD....................................................................... 57
PORTE....................................................................... 59
PSTRCON (Pulse St eer i ng Co n trol)....... .............. .... 146
PWM1CON (Enhanced PWM Control)..................... 145
RCSTA (Receive Status and Control)...................... 161
Reset Values........ ..................... ..................... .......... 217
Rese t Val u e s ( sp e cial r e g i sters )....... ......... ...... ......... 219
Special Function Register Map
PIC16F883/884 ............................................ 23, 24
PIC16F886/887 .................................................. 25
Spec i a l Func t io n R e g i s t e r s....... ...... ...... ..... .......... ...... . 22
Special Register Summary
Bank 0 ................................................................ 26
Bank 1 ................................................................ 27
Bank 2 ................................................................ 28
Bank 3 ................................................................ 28
SRC ON (SR Lat c h C o n t r ol ).. .. ...... .. ...... ..... ...... .. ...... .. . 93
PIC16F882/883/884/886/887
DS41291F-page 320 © 2009 Microchip Technology Inc.
SSPCON (MSSP Control 1)......................................181
SSPCON2 (SSP Control 2).......................................182
SSPMSK (SSP Mas k)....... ..................... ...................208
SSPSTAT (SSP Status)............................................180
STATUS......................................................................29
T1CON........................................................................79
T2CON........................................................................82
TRISA (Tri-State PORTA)...........................................39
TRISB (Tri-State PORTB)...........................................48
TRISC (Tr i-State PORTC) ................... .............. .........53
TRISD (Tr i-State PORTD) ................... .............. .........57
TRISE (Tri-State PORTE)...........................................59
TXSTA (Transmit Status and Control) ......................160
VRCON (Voltage Reference Control) .........................97
WDTCON (Watchdog Tim er Contro l)........................225
WPUB (Wea k Pull-up PORTB)...................................49
Reset.................................................................................212
Revision History................................................................313
S
SCK...................................................................................183
SDI....................................................................................183
SDO ..................................................................................183
Serial Clock, SCK..............................................................183
Serial Data In, SDI ............................................................183
Serial Data Out, SDO........................................................183
Serial Peripheral Interface. See SP I
Shoot-through Current ......................................................144
Slave Mode General Call Address Sequence...................192
Slave Select Synchronization............................................186
Slave Select, SS ...............................................................183
Sleep.................................................................................226
Wake-up....................................................................226
Wake-up Using Interrupts.........................................226
Softwa re Simulator ( MP L AB SIM).................... .................242
SPBRG..............................................................................163
SPBRGH...........................................................................163
Special Event Trigger........................................................102
Special Function Registers .................................................22
SPI Master Mode.............................................................185
Serial Clock...............................................................183
Serial Data In ............................................................183
Serial Data Out .........................................................183
Slave Select..............................................................183
SPI clock...................................................................185
SPI Mode ..................................................................183
SPI Bus Modes .................................................................188
SPI Mode
Associated Registers with SPI Operation .................188
Bus Mode Compatibility........................... .. .... .. .. .. .....188
Effects of a Reset......................................................188
Enabling SPI I/O .......................................................184
Operation ..................................................................183
Sleep Operation........................................................188
SPI Module
Slave Mode...............................................................186
Slave Select Synchronization ...................................186
Slave Synchronization Timing...................................186
Slave Ti min g with CKE = 0 .................. .....................187
Slave Ti min g with CKE = 1 .................. .....................187
SRCON Register.................................................................93
SS .....................................................................................183
SSP SSPBUF....................................................................185
SSPSR......................................................................185
SSPCON Register............................................................ 181
SSPCON2 Register.......................................................... 182
SSPMSK Register ............ ..................... ..................... ...... 208
SSPOV ............................................................................. 198
SSPOV Status Flag.......................................................... 198
SSPSTAT Regi ster................... ..................... ................... 180
R/W Bit ... ...... ...... ..... .. ...... ...... ..... ...... ...... .. ..... ...... ..... 190
STATUS Regi ster........................... ..................... ............... 29
T
T1CON Registe r..................... ............... .............. ............... 79
T2CON Registe r..................... ............... .............. ............... 82
Thermal Considerations .................................................... 253
Time-out Sequence ................................. .... .... .... ......... .... 215
Timer0................................................................................. 73
Associated Registers.................................................. 75
External Clock............................................................. 74
Interrupt ...................................................................... 75
Operation.............................................................. 73, 76
Specifications ........................................................... 260
T0CKI ......................................................................... 74
Timer1................................................................................. 76
Associated Registers.................................................. 80
Asynchronous Counter Mode..................................... 77
Reading and Writing........................................... 77
Interrupt ...................................................................... 78
Modes of Operation.................................................... 76
Operation During Sleep.............................................. 78
Oscillator..................................................................... 77
Prescaler .................................................................... 77
Specifications ........................................................... 260
Timer1 Gate
Inve r t in g Gate.... ...... ...... ..... ...... ...... ......... ...... ..... 77
Selecting Source .......................................... 77, 91
SR Latch............................................................. 92
Sync h ro n i zi n g C O U T w/Timer1........ .. ..... ...... .. ... 91
TMR1H Register.........................................................76
TMR1L Register.......................................................... 76
Timer2
Associated Registers.................................................. 82
Timers
Timer1
T1CON ............................................................... 79
Timer2
T2CON ............................................................... 82
Timing Diagrams
A/D Conver sion....... ..................... .............. ...............265
A/D Conversion (Sleep Mode).................................. 265
Acknowledge Sequence Timing ............................... 201
Asynchronous Receptio n.......................................... 158
Asynchronous Tra nsmiss ion..... ................................ 154
Asynchronous Transmission (Back to Back)............ 154
Auto Wake-up Bit (WUE) During Normal Operation. 168
Auto Wa ke-up Bi t (WUE) During Sl ee p .... .. .. ........... . 169
Automatic Baud Rate Calibration.............................. 167
Baud Rate Generator with Clock Arbitration............. 195
BRG Reset Due to SDA Arbi tration....... ................... 205
Brown-out Reset (BOR)............................................ 258
Brown-out Reset Situations...................................... 214
Bus Collision
Start Condition Timing...................................... 204
Bus Collision During a Repeated Start
Condition (Case 1)............................................ 206
Bus Collision During a Repeated Start
Condition (Case2)............................................. 206
Bus Collision During a Start Condition (SCL = 0)..... 205
© 2009 Microchip Technology Inc. DS41291F-page 321
PIC16F882/883/884/886/887
Bus Collision During a Stop Condition......................207
Bus Collision for Transmit and Acknowledge............203
CLKOUT and I/O. . .....................................................257
Clock Timing.............................................................255
Comparator Output................. ..................... ...............83
Enhanced Capture/Compare/PWM (ECCP).............261
EUSART Synchronous Receiv e (Mast er/ Slave).......266
EUSART Synchronous T ransm ission
(Master/Slave) ..................................................266
Fail-Safe Clock Monitor (FSCM).................................72
Full-Bridge PWM Output...........................................137
Half-Bridge PWM Output ..................................135, 144
I2C Bus Data.............................................................270
I2C Bus Start/Stop Bits ..............................................269
I2C Master Mode First Start Bit Timing.......... ...........196
I2C Master Mode Reception Timing..........................200
I2C Master Mode Transmission Timing.....................199
I2C Module
Bus Collision
Transmit Timing............. ..................... ......203
INT Pin Interrupt........................................................222
Internal Oscillator Switch Timing.................................68
Master Mode Transmit Clock Arbitration...................202
PWM Auto-shutdown
Auto-restart Enabled.........................................143
Firmware Restart..............................................143
PWM Direction Change ............................. ......... .... ..138
PWM Direction Change at Near 100% Duty Cycle...139
PWM Output (Active-High)........... .............. ...............133
PWM Output (A ctive-Low) ............. .............. .............134
Repeat Start Condition..................... .. .. .... .. .. ....... .. ....197
Reset, WDT, OST and Power-up Timer ...................258
Send Break Character Sequenc e.............................170
Slave Synchronization ..............................................186
SPI Mast e r Mode (CKE = 1, SMP = 1) ...... ...............267
SPI Mode Timing (Master Mode) SP I Mo de
Master Mode Timing Diagram ..........................185
SPI Mode Timing (Slave Mode with CKE = 0)..........187
SPI Mode Timing (Slave Mode with CKE = 1)..........187
SPI Slave Mode (CKE = 0) .......................................268
SPI Slave Mode (CKE = 1) .......................................268
Stop Condition Receive or Transmit .........................202
Synchronous Reception (Master Mode, SREN) .......174
Synchronous Transmission.......................................172
Synchronous Transmission (T hrough TXEN) ...........172
Time-out Sequence
Case 1 ..............................................................216
Case 2 ..............................................................216
Case 3 ..............................................................216
Timer0 and Timer1 External Clock ...........................260
Timer1 Incrementing Edge..........................................78
Two Speed Start-up......................... .. .. .... .. .. ....... .. .. .. ..70
Wake-up from Interrupt.............................................227
Timing Pa rameter Symb o l o g y................................. ..........254
Timing Requirements
I2C Bus Data.............................................................271
I2C Bus Start /Stop Bits........... ..................................270
SPI Mode..................................................................269
TRISA .................................................................................39
TRISA Register...................................................................39
TRISB .................................................................................47
TRISB Register...................................................................48
TRISC.................................................................................53
TRISC Register.......... ............... ..................... .....................53
TRISD.................................................................................57
TRISD Regist e r......... .............. ............... ..................... ........ 57
TRISE................................................................................. 59
TRISE Register................................................................... 59
Two-Speed Clock Start-up Mode........................................ 69
TXREG ............................................................................. 153
TXSTA Reg ister........................... ................................. .... 160
BRGH Bit.................................................................. 163
U
Ultra Low-Power Wake-up....................... ......... 16, 18, 40, 41
V
Voltage Reference (VR)
Specifications ........................................................... 262
Voltage Reference. See Comparator
Voltage Reference (CVREF)
Voltage References
Associated Registers.................................................. 97
VP6 Stabilization ................. ........ ........ ......... .............. 94
VREF. SEE ADC Reference Voltage
W
Wake-up on Break............................................................ 168
Wake-up Using Interrupts................................................. 226
Watchdog Timer (WDT).................................................... 224
Associated Registers................................................ 225
Clock Source............................................................ 224
Modes....................................................................... 224
Period....................................................................... 224
Specifications ........................................................... 259
Waveform for Slave Mode General Call
Address Sequence ................................................... 192
WCOL.......... ..................... ..................... ........... 196, 198, 201
WCOL Statu s Flag........................... ................. 196, 198 , 201
WDTCON Register........................................................... 225
WPUB Regist e r............... ..................... ........................... .... 49
WWW Address ...................................... ........................... 323
WWW, On-Line Support..................................................... 12
PIC16F882/883/884/886/887
DS41291F-page 322 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS41291F-page 323
PIC16F882/883/884/886/887
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PIC16F882/883/884/886/887
DS41291F-page 324 © 2009 Microchip Technology Inc.
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DS41291FPIC16F882/883/884/886/887
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© 2009 Microchip Technology Inc. DS41291F-page 325
PIC16F882/883/884/886/887
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC16F883(1), PIC16F883T (1 , 2), PIC16F 88 4(1),
PIC16F884T(1, 2 ), PIC 16F886(1), PIC 1 6F 88 6T (1, 2),
PIC16F887(1), PIC16F887T (1 , 2)
VDD range 2.0V to 5.5V
Temperature
Range: I= -40°C to +85°C (Industrial)
E= -40°C to +125°C (Extended)
Package: ML = Quad Flat No Leads (QFN)
P = Plastic DIP
PT = Plastic Thin-Quad Flatpack (TQFP)
SO = Plastic Small Outline (SOIC) (7.50 mm)
SP = Skinny Plastic DIP
SS = Plastic Shrink Small Outline
Pattern: QTP, SQTP, Code or Special Requirements
(blank oth erwis e )
Examples:
a) PIC16F883-E/P 301 = Extend ed Temp., PDIP
package, 20 MHz, QTP patter n #301
b) PIC16F883-I/SO = Industrial Temp., SOIC
package, 20 MHz
Note 1: T = In tape and reel SSOP, SOIC and
QFN packages only.
DS41291F-page 326 © 2009 Microchip Technology Inc.
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03/26/09