TDA7266MA 7W MONO BRIDGE AMPLIFIER WIDE SUPPLY VOLTAGE RANGE (3-18V) MINIMUM EXTERNAL COMPONENTS - NO SWR CAPACITOR TECHNOLOGY BI20II - NO BOOTSTRAP - NO BOUCHEROT CELLS - INTERNALLY FIXED GAIN STAND-BY & MUTE FUNCTIONS SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION SIP9 ORDERING NUMBER: TDA7266MA DESCRIPTION The TDA7266MA is a mono bridge amplifier specially designed for TV and Portable Radio applications. Pin to pin compatible with: TDA7266S, TDA7266, TDA7266M, TDA7266MA, TDA7266B, TDA7297SA & TDA7297. Figure 1. Block and Application Diagram VCC C1 0.22F 4 IN ST-BY/ MUTE 470F C5 3 + 1 100nF C6 OUT1+ - R1 10k 5 C2 10F 7 S-GND 6 Vref - 2 PW-GND OUT1- + D03AU1459_mod June 2003 1/9 TDA7266MA ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit Vs Supply Voltage 20 V IO Output Peak Current (internally limited) 2 A Top Operating Temperature 0 to 70 C -40 to 150 C Value Unit 9 C/W Tstg, Tj Storage and Junction Temperature THERMAL DATA Symbol Rth j-case Parameter Thermal Resistance Junction-case PIN CONNECTION (Top view) 9 N.C. 8 N.C. 7 PGND 6 SGND 5 STBY/MUTE 4 IN 3 VCC 2 OUT- 1 OUT+ D03AU1460 ELECTRICAL CHARACTERISTCS (VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified) Symbol VCC Iq VOS PO THD Parameter Test Condition Supply Range Min. Typ. Max. 3 11 18 V 50 65 mA 120 mV Total Quiescent Current Output Offset Voltage Output Power THD 10% Total Harmonic Distortion PO = 1W 6.3 7 0.05 PO = 0.1W to 2W f = 100Hz to 15KHz SVR AMUTE 2/9 Supply Voltage Rejection Mute Attenuation f = 100Hz, VR =0.5V 40 60 Unit W 0.2 % 1 % 56 dB 80 dB 150 C Tw Thermal Threshold GV Closed Loop Voltage Gain 25 26 Ri Input Resistance 25 30 27 dB K TDA7266MA ELECTRICAL CHARACTERISTCS (continued) (VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified) Symbol VTMUTE VTST-BY IST-BY eN Parameter Test Condition Mute Threshold Min. Typ. Max. Unit for VCC > 6.4V; Vo = -30dB 2.3 2.9 4.1 V for VCC < 6.4V; Vo = -30dB VCC/2 -1 VCC/2 -075 VCC/2 -0.5 V 0.8 1.3 St-by Threshold St-by Current V6 = GND Total Output Voltage A Curve; f = 20Hzto 20KHz 150 1.8 V 100 A V APPLICATION SUGGESTION STAND-BY AND MUTE FUNCTIONS Figure 2. Microprocessor Driving Signals +VS(V) +18 VIN (mV) VMUTE/ STBY pin 5 4.1 2.9 2.3 1.0 0.75 0.5 Iq (mA) VOUT (V) OFF ST-BY PLAY MUTE MUTE ST-BY OFF D03AU1461 The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider. The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by and mute threshold exceeding, avoiding "Popping" problems. 3/9 TDA7266MA Figure 3. Stand-alone low-cost Application VCC C3 0.22F R1 47K IN1 ST-BY/MUTE R2 47K 3 4 + 1 C2 100nF 15 C4 10F 7 S-GND C1 470F OUT1+ PW-GND 6 - Vref 2 OUT1- + D03AU1462 Figure 4. Distortion vs Ouput Power Figure 6. Distortion vs. Frequency THD (%) THD(%) 10 10 Vcc = 11 V Rl = 8 ohm Vcc = 11 V Rl = 8 ohm 1 1 f = 15 KHz 0.1 Pout = 100mW 0.1 f = 5 KHz Pout = 2W f = 1 KHz 0.010 0.010 0.1 1 100 10 1k 10k 20k frequency (Hz) Pout (W) Figure 5. Distortion vs Ouput Power Figure 7. Gain vs Frequency Level(dBr) THD(%) 5.0000 10 4.0000 Vcc = 9V Rl= 8 ohm Vcc = 11V Rl = 8 ohm Pout = 1W 3.0000 2.0000 1 1.0000 f = 15KHz 0.0 -1.000 0.1 -2.000 f = 5 KHz -3.000 f = 1KHz -4.000 0.010 0.1 1 Pout (W) 4/9 10 -5.000 10 100 1k frequency (Hz) 10k 100k TDA7266MA Figure 8. Output Power vs. Supply Voltage Figure 10. Mute & Stand-By Attenuation vs Vpin. 5 Po (W) A tte n u atio n (d B ) 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 -10 0 -11 0 -12 0 10.000 8.0000 Rl = 8 ohm f = 1kHz d = 10% 6.0000 4.0000 d = 1% 2.0000 0.0 2.000 4.000 6.000 8.000 10.00 1 12.00 1 .5 2 2 .5 Vs (V) Figure 9. Ptot Dissipation & Efficiency vs. Pout 4 70 70 65 60 60 50 55 40 50 30 45 1 20 40 0.5 10 35 0 30 Pd 3 2.5 1.5 4 4 .5 5 Iq (mA) 80 2 3.5 Figure 11. Quiescent Current vs. Supply Voltage (%) Pd (W) 3.5 3 V pin.5 (V ) Vcc = 11V Rl = 8ohm f = 1KHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 Pout(W) 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Vsupply(V) 5/9 TDA7266MA Figure 12. PC Board Component Layout Figure 13. Evaluation Board Top Layer Layout Figure 14. Evaluation Board Bottom Layer Layout 6/9 TDA7266MA HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 11V, Rload = 8ohm, RTh j-c = 9 C/W , Tamb max = 50C 2 Vc c - + Iq Vc c Pdmax = (N channels) * -------------------------2 R loa d -------------2 Pdmax = 1 * ( 3 ) + 0.5 = 3.5W 150 - T am b max 150 - 50- - 9 = 19.5C /W - - R T h j-c = --------------------(Heat Sinker) R Th c-a = ---------------------------------------3.5 P d max In figure 15 is shown the Power derating curve for the device. Figure 15. Power derating curve 10 8 (a) Pd (W) 6 (c) (b) 4 a) Infinite Heatsink b) 10 C/ W c) 15 C/ W d) 20 C/ W (d) 2 0 0 40 80 120 160 Tamb (C) 7/9 TDA7266MA mm DIM. MIN. TYP. A inch MAX. MIN. TYP. 7.1 a1 2.7 3 B 0.280 0.106 0.118 23 B3 0.90 24.8 b1 0.976 0.5 b3 0.85 0.020 1.6 0.033 0.063 C 3.3 0.130 c1 0.43 0.017 c2 1.32 0.052 D 21.2 d1 0.835 14.5 0.571 e 2.54 0.100 e3 20.32 0.800 L 3.1 0.122 L1 3 0.118 L2 17.6 0.693 L3 0.25 L4 OUTLINE AND MECHANICAL DATA MAX. 17.4 17.85 0.010 0.685 0,702 M 3.2 0.126 N 1 0.039 P 0.15 SIP9 0.006 C D L1 L3 c2 N P 1 9 L a1 L2 L4 A d1 M b1 b3 e 1 c e3 B B3 8/9 SIP9 TDA7266MA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - All Rights Reserved Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 9/9