Multilayer Ceramic Capacitors Approval Sheet
Page 11 of 17 ASC_Soft termination_(SH_6.3V to 100V)_020N_DS Dec. 2018
No.
Item Test Condition Requirements
6.
Temperature
Coefficient
With no electrical load.
T.C. Operating Temp
NPO -55~125°C at 25°C
X7R -55~125°C at 25°C
X7S -55 ~ 125°C at 25°C
X5R -55~ 85°C at 25°C
X6S -55~105°C at 25°C
Y5V -25~ 85°C at 20°C
*Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24±2 hrs
at room temp.
* Measurement voltage for Class II:
01005 0201
Cap≤0.01µF: 0.5V Cap<0.1µF:1V
Cap>0.01µF: 0.2V 0.1µF*≤Cap<1µF: 0.2V
Cap≥1µF: 0.1V
*0201X104/16V: 0.5V
0402 0603
Cap<1µF: 1V Cap≤1µF: 1V
Cap=1µF: 0.5V 1µF<Cap≤4.7µF: 0.5V
1µF<Cap<10µF: 0.2V Cap>4.7µF: 0.2V
Cap≥10µF: 0.1V
0805 1206/1210
Cap<10µF: 1V Cap≤10µF: 1V
Cap=10µF: 0.5V 10µF<Cap≤100µF: 0.5V
Cap>10µF: 0.2V Cap>100µF: 0.2V
T.C. Capacitance Change
NPO Within ±30ppm/°C
X7R Within ±15%
X7S Within ±22%
X5R Within ±15%
X6S Within ±22%
Y5V Within +30%/-80%
7.
Adhesive Strength
of Termination
* Pressurizing force:
2N (0201) and 5N (≤0603) and 10N (>0603)
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
*Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24±2 hrs
at room temp.
*Cap./DF(Q) Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
75% min. coverage of all metalized area.
10.
Bending Test * The middle part of substrate shall be pressurized by
means of the pressurizing rod at a rate of about 1 mm per
second until the deflection becomes 5 mm and then the
pressure shall be maintained for 5±1 sec.
*Before initial measurement (Class II only):
To apply de-aging at 150°C for 1hr then set for 24±2 hrs
at room temp.
* Measurement to be made after keeping at room temp.
for 24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±5% or 0.5pF whichever is larger
X7R, X5R, X6S, X7S: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse
the capacitor in a eutectic solder.
*Before initial measurement (Class II only): To apply
de-aging at 150°C for 1hr then set for 24±2 hrs at room
temp.
*Cap. / DF(Q) / I.R. Measurement to be made after
de-aging at 150°C for 1hr then set for 24±2 hrs at room
temp.
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or 0.25pF whichever is larger
X7R, X5R, X6S, X7S: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
Temperature Cycle * Conduct the five cycles according to the temperatures
and time.
2 Room temp. 2~3
4 Room temp. 2~3
*Before initial measurement (Class II only): To apply
de-aging at 150°C for 1hr then set for 24±2 hrs at room
temp.
* Cap. / DF(Q) / I.R. Measurement to be made after
de-aging at 150°C for 1hr then set for 24±2 hrs at room
temp.
:
NP0: within ±2.5% or 0.25pF whichever is larger
X7R, X5R, X6S, X7S: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.