CL10B224KB8NNNC - Samsung Semiconductor Division

Multilayer Ceramic Capacitor

- 1 -

■INTRODUCTION

MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used

in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the

better frequency characteristics, higher reliability, higher withstanding voltage and so on.

MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for

inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base

Metal Electrode), which reduced the total cost of MLCC.

This inner electrode is connected to outer termination for surface mounting, which is composed of

three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs

become Pb free by the environmental issue at present.

MLCC is divided into two classes. Class I(C0G, etc) is the temperature compensating type. It has

a small TCC(Temperature Coefficient of Capacitance) and a better frequency performance.

Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R,

X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit.

Especially high capacitance MLCC is replacing other capacitors (Tantalum and Aluminum

capacitor) due to the low ESR(Equivalent Series Resistance) value.

■FEATURE AND APPLICATION

●Feature

-MiniatureSize

- Wide Capacitance and Voltage Range

- Highly Reliable Performance

- Tape & Reel for Surface Mount Assembly

- Low ESR

- High Q at High Frequencies

- Stable Temperature Dependence of Capacitance

●Application

- High Frequency Circuit(Tuner, VCO, PAM etc)

- General Power Supply Circuit(SMPS etc)

- DC-DC Converter

- General Electronic Circuit

Multilayer Ceramic Capacitor

- 2 -

■STRUCTURE

Multilayer Ceramic Capacitor

- 3 -

■APPEARANCE AND DIMENSION

CODE EIA CODE DIMENSION ( mm )

L W T(MAX) BW

03 0201 0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.15±0.05

05 0402 1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.2+0.15/-0.1

10 0603 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.3 ±0.2

21 0805 2.0 ±0.1 1.25 ±0.1 1.25±0.1 0.5+0.2/-0.3

31 1206 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2 0.5+0.2/-0.3

32 1210 3.2 ±0.3 2.5 ±0.2 2.5 ±0.2 0.6 ±0.3

43 1812 4.5 ±0.4 3.2 ±0.3 3.2 ±0.3 0.8 ±0.3

55 2220 5.7 ±0.4 5.0 ±0.4 3.2 ±0.3 1.0 ±0.3

Multilayer Ceramic Capacitor

- 4 -

■PREVIOUS PART NUMBERING

Symbol EIA Code Temperature

Coefficient(PPM/℃)

※Temperature

Characteristics Operation

Temperature Range

CC0G(CH) 0±30 CΔ

-55 ~ +125℃

PP2H -150 ±60 PΔ

RR2H -220 ±60 RΔ

SS2H -330 ±60 SΔ

TT2H -470 ±60 TΔ

UU2J -750 ±120 UΔ

LS2L +350 ~ -1000 SL

▶CLASS Ⅰ(Temperature Compensation)

Temperature

Characteristics below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF

CΔC0G C0G C0G C0G

PΔ-P2J P2H P2H

RΔ-R2J R2H R2H

SΔ-S2J S2H S2H

TΔ-T2J T2H T2H

UΔ-U2J U2J U2J

Symbol EIA Code Capacitance Change

(ΔC:%) Operation

Temperature Range

AX5R ±15 -55 ~ +85℃

BX7R ±15 -55 ~ +125℃

FY5V +22 ~ -82 -30 ~ +85℃

▶CLASS Ⅱ(High Dielectric Constant)

SAMSUNG Multilayer Ceramic Capacitor

Type(Size)

Capacitance Temperature Characteristics

Nominal Capacitance

Capacitance Tolerance

Rated Voltage

Thickness Option

Packaging Type

CL10C101JBNC

CAPACITANCE TEMPERATURE CHARACTERISTICS

※Temperature Characteristics

☞K:±250 PPM/℃

J:±120 PPM/℃

H:±60 PPM/℃

G:±30 PPM/℃

●

2●

●

3●

4●

5●

7●

●

Multilayer Ceramic Capacitor

- 5 -

Temperature

Characteristics Symbol Tolerance Applicable Capacitance & Range

C0G(NPO)

T.C Series

B±0.1pF 0.5 ~ 3pF

C±0.25pF 0.5 ~ 10pF

D±0.5pF

F±1pF 6 ~ 10pF

G±2%

E-24 Series for over 10pFJ±5%

K±10%

A(X5R)

B(X7R)

J±5%

E-12 SeriesK±10%

M±20%

F(Y5V) Z-20% ~ +80% E-6 Series

CAPACITANCE TOLERANCE

The nominal capacitance value is expressed in pico-Farad(pF) and identified by three-

digit number, first two digits represent significant figures and last digit specifies the

number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal

point and the last digit becomes significant.

example)

100 : 10 ×10o=10pF

102 : 10 ×102= 1000pF

020 : 2 ×10o=2pF

1R5 : 1.5pF

NOMINAL CAPACITANCE

●

※Please consult us for special tolerances.

Symbol Rated Voltage(Vdc) Symbol Rated Voltage(Vdc)

Q6.3V D200V

P10V G500V

O16V I1000V

A25V J2000V

B50V K3000V

C100V

RATED VOLTAGE

●

Multilayer Ceramic Capacitor

- 6 -

Symbol Packaging Symbol Packaging

BBulk FEmbossed Tape, 13" Reel

PCassette LPaper 13" Reel

CPaper Tape, 7" Reel OPaper 10" Reel

DPaper Tape, 13" Reel SEmbossed Tape, 10" Reel

EEmbossed Tape, 7" Reel

PACKAGING TYPE

THICKNESS OPTION

Symbol Description of the Code

NStandard thickness (please refer to standard thickness table on next page)

AThinner than standard thickness

BThicker than standard thickness

CStandard Thickness High Q ( Low ` D.F ` )

DSn-100% (High-Q)

ESn-100% (General)

※Please Consult us for other termination type.

●

Series Capacitance Step

E- 3 1.0 2.2 4.7

E- 6 1.0 1.5 2.2 3.3 4.7 6.8

E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2

E-24 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2

1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1

※Standard Capacitance is " Each step ×10n"

▶STANDARD CAPACITANCE STEP

Multilayer Ceramic Capacitor

- 7 -

■NEW PART NUMBERING

CL10C101JB8NNNC

●

1●

2●

3●

4●

5●

6●

7●

8●

9●

10 ●

●

1PRODUCT ABBREVIATION

Symbol Product Abbreviation

CL SAMSUNG Multilayer Ceramic Capacitor

●

2SIZE(mm)

Symbol Size(mm)

Length Width

03 0.6 0.3

05 1.0 0.5

10 1.6 0.8

21 2.0 1.2

31 3.2 1.6

32 3.2 2.5

43 4.5 3.2

55 5.7 5.0

SAMSUNG Multilayer Ceramic Capacitor

Size(mm)

Capacitance Temperature Characteristic

Nominal Capacitance

Capacitance Tolerance

Rated Voltage

Thickness Option

Product & Plating Method

Samsung Control Code

Reserved For Future Use

Packaging Type

●

Multilayer Ceramic Capacitor

- 8 -

●

3CAPACITANCE TEMPERATURE CHARACTERISTIC

Symbol Temperature Characteristics Temperature

Range

Class Ⅰ

COG C△0±30(ppm/℃)

-55 ~ +125℃

PP2H P△-150±60

RR2H R△-220±60

SS2H S△-330±60

TT2H T△-470±60

UU2J U△-750±60

LS2L S△+350 ~ -1000

Class Ⅱ

X5R X5R ±15% -55 ~ +85℃

BX7R X7R ±15% -55 ~ +125℃

FY5V Y5V +22 ~ -82% -30 ~ +85℃

※Temperature Characteristic

Temperature

Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF

CΔC0G C0G C0G C0G

PΔ-P2J P2H P2H

RΔ-R2J R2H R2H

SΔ-S2J S2H S2H

TΔ-T2J T2H T2H

UΔ-U2J U2J U2J

J:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃

●

4NOMINAL CAPACITANCE

Nominal capacitance is identified by 3 digits.

The first and second digits identify the first and second significant figures of the capacitance.

The third digit identifies the multiplier. 'R' identifies a decimal point.

●Example

Symbol Nominal Capacitance

1R5 1.5pF

103 10,000pF, 10nF, 0.01μF

104 100,000pF, 100nF, 0.1μF

Multilayer Ceramic Capacitor

- 9 -

●

5CAPACITANCE TOLERANCE

Symbol Tolerance Nominal Capacitance

A±0.05pF

Less than 10pF

(Including 10pF)

B±0.1pF

C±0.25pF

D±0.5pF

F±1pF

F±1%

More than 10pF

G±2%

J±5%

K±10%

M±20%

Z+80, -20%

●

6RATED VOLTAGE

Symbol Rated Voltage Symbol Rated Voltage

Q6.3V E250V

P10V G500V

O16V H630V

A25V I1,000V

B50V J2,000V

C100V K3,000V

D200V

Multilayer Ceramic Capacitor

- 10 -

●

7THICKNESS OPTION

Type Symbol Thickness(T) Spec

0603 30.30 ±0.03

1005 50.50 ±0.05

1608 80.80 ±0.10

2012

A0.65 ±0.10

C0.85

F1.25 ±0.10

3216

C0.85 ±0.15

F1.25 ±0.15

H1.6 ±0.20

3225

F1.25

±0.20

H1.6

I2.0

J2.5

4532

F1.25

±0.20

H1.6

I2.0

J2.5

L3.2 ±0.30

5750

F1.25

±0.20

H1.6

I2.0

J2.5

L3.2 ±0.30

Multilayer Ceramic Capacitor

- 11 -

●

8PRODUCT & PLATING METHOD

Symbol Electrode Termination Plating Type

APd Ag Sn_100%

NNi Cu Sn_100%

GCu Cu Sn_100%

●

9SAMSUNG CONTROL CODE

Symbol Description of the code Symbol Description of the code

AArray (2-element) NNormal

BArray (4-element) PAutomotive

CHigh - Q W3 Terminal EMI Filter

LLICC

●

10 RESERVED FOR FUTURE USE

Symbol Description of the code

NReserved for future use

●

11 PACKAGING TYPE

Symbol Packaging Type Symbol Packaging Type

BBulk FEmbossing 13" (10,000EA)

PBulk Case LPaper 13" (15,000EA)

CPaper 7" OPaper 10"

DPaper 13" (10,000EA) SEmbossing 10"

EEmbossing 7"

Multilayer Ceramic Capacitor

- 12 -

▶CAPACITANCE vs CHIP THICKNESS STANDARD

Description 0603

(0201) 1005

(0402) 1608

(0603) 2012 Type

(0805) 3216 Type

(1206) 3225 Type

(1210) 4532 Type

(1812) 5750 Type

(2220)

Dimension

(mm)

L0.6

±0.03 1.0

±0.05 1.6

±0.1 2.0±0.1 3.2±0.15 3.2

±0.2 3.2±0.3 4.5±0.4 5.7±0.4

W0.3

±0.03 0.5

±0.05 0.8

±0.1 1.25±0.1 1.6±0.15 1.6

±0.2 2.5±0.2 3.2±0.3 5.0±0.4

T0.3

±0.03 0.5~

±0.05 0.8

±0.1 0.65

±0.1 0.85

±0.1 1.25

±0.1 0.85

±0.15 1.25

±0.15 1.6

±0.2 1.25

±0.2 1.6

±0.2 2.0

±0.2 2.5

±0.2 1.25

±0.2 1.6

±0.2 2.0

±0.2 2.5

±0.2 1.6

±0.2 2.0

±0.2 2.5

±0.2

(

)

SL 50V -0.5~

240 0.5 ~

1000 0.5

~1000 1100 ~

1500 1600~

2700 0.5 ~

2700 3000~

5600 6200~

8200 - - - - - - - - - - -

C, TC

(Except

SL,UJ)

25V 0.5~

47 0.5~

220 0.5 ~

1000 - - 3300~

8200 1500~

3600 3900~

6800 7500~

10000 - - - - - 100000 - - - - -

50V -0.5 ~

180 0.5 ~

1000 0.5 ~

560 620~

1000 1100~

3300 0.5 ~

2200 2400~

4700 -560~

10000 11000

22000 24000~

47000 -1000~

13000 15000~

22000 24000~

47000 62000~

68000 43000 93000 130000

(

)

(X5R)

6.3V 10 220 2200 - - 10000 - - 10000 - - - 22000 - - - 47000 - - 47000

10V 10 100 1000 - - 2200 - - 4700~

10000 - - - 22000 - - - - - - 47000

16V -47 330~

470 - - 1000 - - 4700 - - - 6800~

10000 - - - - - - -

25V - - - - - - - - - - - - - - - - - - - -

50V -6.8~

10 - - - - - - - - - - - - - - - - - -

(X7R)

6.3V 0.1~

10 47~

100 470~

1000 - - 1000 - - 6800~

10000 - - - 22000 - - - - - - -

10V 0.1~

10 33~

100 220~

470 220~

270 330~

470 560~

1000 -1000~

3300 4700 1500~

2200 3300 3900~

4700 - - - - 22000 - - -

16V 0.1~

110~

33 100~

220 68~

200 220~

330 390~

1000 330~

680 1000~

1500 2200~

3300 1500~

2200 3300 3900~

4700 ---2200 - - - -

25V -4.7~

10 47~

100 39~

68 82~

100 150~

470 100~

330 470~

620 680~

1000 680~

1500 1800 2200 ---1000 - - - 10000

50V -0.22~

4.7 0.22~

100 0.22~

39 47~

100 220 1~

150 220 390~

1000 2.2~

680 820~

1000 - - 10~

1000 - - - - - 3300~

4700

(Y5V)

6.3V 10~

100 -2200 - - 10000 - - - - - 47000 - - - - - - - -

10V -220~

330 100~

1000 - - 4700 -4700 10000~

22000 - - - 22000 - - - - - - 100000

16V -10~

220 100~

1000 10~

680 820~

1000 1200~

2200 1000~

2200 2700~

4700 10000 3300~

6800 10000 15000 ---22000 - - - -

25V -10~

33 22~

330 10~

220 270~

470 560~

1000 470~

1000 1200~

2200 2700~

3300 1000~

3300 4700~

10000 - - - - - 10000 - - -

50V -2.2~

10 2.2~

100 2.2~

68 82~

150 180~

1000 10~

470 560~

1000 -100~

1000 - - - - - - 10000 - - -

Multilayer Ceramic Capacitor

- 13 -

■PACKAGING

●CARDBOARD PAPER TAPE

Symbol W F E P1 P2 P0 D t A B

Type

8.0

±0.3 3.5

±0.05 1.75

±0.1

2.0

±0.05

2.0

±0.05 4.0

±0.1 Φ1.5

+0.1/-0

0.37

±0.03 0.38

±0.03 0.68

±0.03

05 0.6

±0.05 0.65

+0.05/-0.1 1.15

+0.05/-0.1

4.0

±0.1 1.1

MAX

1.1

±0.2 1.9

±0.2

21 1.6

±0.2 2.4

±0.2

31 2.0

±0.2 3.6

±0.2

unit:mm

●EMBOSSED PLASTIC TAPE

Symbol W F E P1 P2 P0 Dt0 t1 A B

Type

8.0

±0.3 3.5

±0.05 1.75

±0.1 4.0

±0.1 2.0

±0.05 4.0

±0.1 Φ1.5

+0.1/-0 0.6

max 2.5

max

1.45

±0.2 2.3

±0.2

31 2.0

±0.2 3.6

±0.2

32 2.9

±0.2 3.6

±0.2

43 3.6

±0.2 4.9

±0.2

55 5.4

±0.2 6.0

±0.2

unit : mm

Feeding round holes Perforated square

holes for inserting a chip D

P0 P1P2

Feeding round holes Perforated square

holes for inserting a chip

P0 P1P2

Multilayer Ceramic Capacitor

- 14 -

●TAPING SIZE

Empty Section

45 Pitch Packed Part Empty Section

50 Pitch

Loading Section

35 Pitch

STARTEND

●REEL DIMENSION

Symbol A B C D E W t R

7" Reel φ178±2.0 min.φ50

φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.8±0.2 1.0

13"

Reel φ330±2.0 min.φ70

unit:mm

Symbol Cardboard Paper Tape Embossed Plastic Tape

7" Reel 4000 2000

13" Reel 15000 -

unit:pcs

Multilayer Ceramic Capacitor

- 15 -

Size 05(0402) 10(0603) 21(0805)

T≤0.85mm T≥1.0mm

Quantity 50,000 10,000~15,000* 10,000 5,000

●BULK CASE PACKAGING

- Bulk case packaging can reduce the stock space and transportation costs.

- The bulk feeding system can increase the productivity.

- It can eliminate the components loss.

ABT

CDE

Symbol A B T C D E

Dimension 6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 4.7±0.1

Symbol F W G H L I

Dimension 31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35

●QUANTITY

*Option

Multilayer Ceramic Capacitor

- 16 -

■CHARACTERISTIC MAP

●CLASS Ⅰ

Temperature

Characteristics Size Voltage Capacitance Range (㎊)

SL,UJ

(0402) 50V

(0603) 50V

(0805) 50V

(1206) 50V

C(COG) &

TC Series

(0201) 25V

(0402)

25V

50V

(0603)

25V

50V

(0805)

25V

50V

(1206)

25V

50V 　

(1210)

50V

100V

(1812)

25V

50V

(2220) 50V

10 100 1000 10000 100000 1000000 10000000 100000000

0.5

240

2700

8200

1000

10000

1500

3300

4700

1000

180

220

8200

3300

18000

4700

560 47000

680001000

100000

130000

43000

Multilayer Ceramic Capacitor

- 17 -

●CLASS Ⅱ,A(X5R)

Temperature

Characteristics Size Voltage Capacitance Range (㎊)

A(X5R)

0603

(0201)

6.3V

10V

1005

(0402)

6.3V

10V

16V

50V

1608

(0603)

6.3V

10V

16V

2012

(0805)

6.3V

10V

16V

3216

(1206)

6.3V

10V

16V

3225

(1210)

6.3V

10V

16V

4532

(1812) 6.3V

5750

(2220)

6.3V

10V

10 100 1000 10000 100000 1000000 10000000 100000000

10000

100000

10000

10000000

4700000

22000000

2200000

10000000

4700000

22000000

47000000

47000

10000

6800

1000000

2200000

1000000

470000

330000

10000000

6800000

47000000

220000

Multilayer Ceramic Capacitor

- 18 -

●CLASS Ⅱ,B(X7R)

Temperature

Characteristics Size Voltage Capacitance Range (㎊)

B(X7R)

(0201)

6.3V

10V

16V

(0402)

6.3V

10V

16V

25V

50V

(0603)

6.3V

10V

16V

25V

50V

(0805)

6.3V

10V

16V

25V

50V

(1206)

6.3V

10V

16V 　

25V

50V

10 100 1000 10000 100000 1000000 10000000 100000000

100000

47000

4700000

470000

100000

1000000

470000

220000

1000000

3300000

1000000

100 10000

10000000

100000

100 10000

100 1000

6800000

33000

10000 33000

100004700

4700220

470000

220000

100000

47000

220

220000

100000068000

39000

220

1000000

330000

100000

10000001000

Multilayer Ceramic Capacitor

- 19 -

●CLASS Ⅱ,B(X7R)

Temperature

Characteristics Size Voltage Capacitance Range (㎊)

B(X7R)

(1210)

6.3V

10V

16V

25V

50V

(1812)

10V

16V

25V

50V

(2220)

25V

50V

10 100 1000 10000 100000 1000000 10000000 100000000

22000000

100000010000

4700000

1500000

22000000

1000000

10000000

4700000

3300000

47000001500000

2200000

680000

10000002200

2200000

Multilayer Ceramic Capacitor

- 20 -

●CLASS Ⅱ,F(Y5V)

Temperature

Characteristics Size Voltage Capacitance Range (㎊)

F(Y5V)

(0201) 6.3V

(0402)

10 V

16 V

25 V

50 V

(0603)

6.3V

10 V

16 V

25 V

50 V

(0805)

6.3V

10 V

16 V

25 V

50 V

(1206)

10 V

16 V 　

25 V

50 V

(1210)

6.3V

10 V

16 V

25 V

50 V

(1812)

16V

25 V

50 V

(2220) 10 V

330000

33000

10000

220000

10000

2200

1000000

330000

100000

22000

2200

1000000

2200000

10000

22000000

4700000

10000000

3300000

1000000

470000

10000

4700000

1000000

15000000

3300000

1000000

100000

10000000

22000000

10000 220000

10000000

100000000

2200000

10000000

10000010000

1000000

100000

1000000

2200

47000000

22000000

10 100 1000 10000 100000 1000000 10000000 100000000

Multilayer Ceramic Capacitor

- 21 -

■RELIABILITY TEST DATA

NO ITEM PERFORMANCE TEST CONDITION

1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)

2INSULATION

RESISTANCE

10,000㏁OR 500㏁·㎌ PRODUCT WHICHEVER IS

SMALLER

(RATED VOLTAGE IS BELOW 16V

: 10,000㏁OR 100㏁·㎌)

RATED VOLTAGE SHALL BE APPLIED.

MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE

TIME 60 SEC.

3WITHSTANDING

VOLTAGE

NO DIELECTRIC BREAKDOWN OR

MECHANICAL BREAKDOWN

CLASSⅠ: 300% OF THE RATED VOLTAGE FOR 1~5 SEC,

CLASSⅡ:250% OF THE RATED VOLTAGE FOR 1~5 SEC

IS APPLIED WITH LESS THAN 50㎃CURRENT

4CAPACIT

ANCE

CLASS

Ⅰ

WITHIN THE SPECIFIED

TOLERANCE

CAPACITANCE FREQUENCY VOLTAGE

1,000㎊AND

BELOW 1㎒±10%

0.5 ~ 5 Vrms

MORE THAN

1,000㎊1㎑±10%

CLASS

Ⅱ

WITHIN THE SPECIFIED

TOLERANCE

CAPACITANCE FREQUENCY VOLTAGE

10㎌AND BELOW 1㎑±10% 1.0±0.2Vrms

MORE THAN

10㎌120㎐±20% 0.5±0.1Vrms

5 Q CLASS

Ⅰ

OVER 30㎊:Q≥1,000

LESS THAN 30㎊:Q≥400 +20C

( C : CAPACITANCE )

CAPACITANCE FREQUENCY VOLTAGE

1,000㎊AND

BELOW 1㎒±10%

0.5 ~ 5 Vrms

MORE THAN

1,000㎊1㎑±10%

6TanδCLASS

Ⅱ

1. CHAR : B

2. CHAR : F

CAPACITANCE FREQUENCY VOLTAGE

10㎌AND BELOW 1㎑±10% 1.0±0.2Vrms

MORE THAN 10㎌120㎐±20% 0.5±0.1Vrms

RATED VOLTAGE DF SPEC

6.3V 0.05 max

10V 0.05 max

16V 0.035 max

25V 0.025 max

50V 이상 0.025 max

6.3V 10V 16V 25V 50V

1005 -0.125max 0.09max (C＜220nF)

0.125max (C≥220nF) 0.05max 0.05max

1608 0.16max 0.125max 0.09max 0.05max(C≤100nF)

0.07max(C>100nF) 0.05max

2012 0.16max 0.125max 0.09max 0.07max 0.05max

3216 0.16max 0.125max 0.09max 0.07max 0.05max

3225 0.16max 0.125max 0.09max 0.07max(C≤6.8㎌)

0.09max(C>6.8㎌)0.05max

4532 0.16max 0.16max 0.09max - -

5750 0.125max - - -

Multilayer Ceramic Capacitor

- 22 -

NO ITEM PERFORMANCE TEST CONDITION

CAPACITANCE

TEMPERATURE

COEFFICIENT

CLASS

Ⅰ

THESE SYMMETRICAL TOLERANCE APPLY TO

2 POINT MEASUREMENT OF TEMPERATURE

COEFFICIENT: ONE AT 25℃AND AT 85℃

TEMPERATURE

CHARACTERISTIC

CLASS

Ⅱ

CAPACITANCE CHANGE

The change of capacitance should be got from

the capacitance at 25℃.

After capacitance measured from Min. Temp. to

Max. Temp.,

itshouldbecalculatedfromtheformulabelow.

C2 - C1

C1 : CAPACITANCE AT STANDARD

TEMPERATURE(25℃)

C2 : CAPACITANCE AT EACH

TEMPERATURE

9ADHESIVE STRENGTH

OF TERMINATION

NO INDICATION OF PEELING SHALL

OCCUR ON THE TERMINAL

ELECTRODE.

A 500g.f PRESSURE SHALL BE

APPLIED FOR 10±1 SECOND.

SEE (FIG.1)

10 BENDING

STRENGTH

APPEARANCE NO MECHANICAL DAMAGE SHALL

OCCUR.

BENDING SHALL BE APPLIED TO

THE LIMIT(1mm) WITH 0.3mm/SEC.

KEEP THE TEST BOARD AT THE LIMIT POINT

IN 5 SEC., THEN MEASURE CAPACITANCE.

SEE (FIG.2)

CAPACITANCE

CHARACTER CHANGE OF

CAPACITANCE

CLASS I

WITHIN ±5%

OR ±0.5 pF

WHICHEVER IS

LARGER

CLASS II

A,B WITHIN ±12.5%

FWITHIN ±30%

CHAR. CAP. CHANGE(%)

A,B ±15%

F+22% ~ -82%

500g.f

×100 %

○○

R=340

45±145

±1BENDING

LIMIT

CHARACTER LIMIT

C, A, B, F 1mm

CHARACTERISTIC TEMP. COEFFICIENT

(PPM/℃)

C0G 0±30

PH -150 ±60

RH -220 ±60

SH -330 ±60

TH -470 ±60

UL -750 ±120

SL +350 ~ -1000

STEP TEMPERATURE

125 ±2

2MIN RATED TEMP ±2

325 ±2

4MAX RATED TEMP ±2

525 ±2

Multilayer Ceramic Capacitor

- 23 -

*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED

AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.

NO ITEM PERFORMANCE TEST CONDITION

11 SOLDERABILITY

MORE THAN 75% OF THE TERMINAL

SURFACEISTOBESOLDEREDNEWLY,

SO METAL PART DOES NOT COME

OUT OR DISSOLVE

IN PB--FREE PART, MORE THAN 95%

OF THE TERMINAL SURFACE IS TO BE

SOLDERED NEWLY

SOLDER TEMPERATURE : 230±5℃

DIP TIME : 3±1Sec

SOLDER : H63A

FLUX : RMA TYPE

*PB-FREE

SOLDER TEMPERATURE : 260±5℃

SOLDER : Sn96.5-3Ag-0.5Cu

Flux : RMA TYPE

DIPTIME:3

±0.1Sec

* PRE-HEATING : AT 80~120℃FOR 10~30SEC.

RESISTANCE

TO SOLDERING

HEAT

APPEARANCE NO MECHANICAL DAMAGE

SHALL OCCUR

DIP : SOLDER TEMPERATURE OF

270±5℃

DIPTIME:10

±1 SEC.

EACH TERMINATION SHALL BE FULLY

IMMERSED AND PREHEATED

AS FOLLOWING:

MEASURE AT ROOM TEMP. AFTER

COOLING FOR

CLASSⅠ:24±2 HOURS

CLASSⅡ:48±4 HOURS

CAPACITANCE

CHARACTERISTIC CAP. CHANGE

CLASSⅠ

WITHIN ±2.5% OR

±0.25㎊WHICHEVER

IS LARGER

CLASSⅡA,B WITHIN ±7.5%

FWITHIN ±20%

CLASS Ⅰ

30㎊AND OVER : Q≥1000

LESS THAN 30㎊:Q

≥400+20×C

Tanδ

CLASS Ⅱ

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

WITHSTANDING

VOLTAGE

TO SATISFY THE SPECIFIED

INITIAL VALUE

13 VIBRATION

TEST

APPEARANCE NO MECHANICAL DAMAGE SHALL

OCCUR.

BENDING SHALL BE APPLIED TO

THE LIMIT(1mm) WITH 0.3mm/SEC.

KEEP THE TEST BOARD AT THE LIMIT POINT

IN 5 SEC., THEN MEASURE CAPACITANCE.

THE ENTIRE FREQUENCY RANGE,

FROM 10 TO 55Hz AND RETURN

TO 10Hz, SHALL BE TRAVERSED

IN 1 MINUTE.

THIS CYCLE SHALL BE PERFORMED

2 HOURS IN EACH THERE MUTUALLY

PERPENDICULAR DIRECTION,

FOR TOTAL PERIOD OF 6 HOURS.

CAPACITANCE

CHARACTERISTIC CAP. CHANGE

CLASS Ⅰ

WITHIN ±2.5% OR

±0.25㎊

WHICHEVER

IS LARGER

CLASS

Ⅱ

A,B WITHIN ±5%

FWITHIN ±20%

CLASS Ⅰ

30㎊AND OVER : Q≥1000

LESS THAN 30㎊:Q

≥400+20×C

Tanδ

CLASS Ⅱ

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

STEP TEMP.(℃)TIME

(SEC.)

180~100 60

2150~180 60

CHAR. FREQUENCY RANGE

A,B,C,F 10Hz →55Hz →10Hz

CHAR. TRAVERSED TIME

A,B,C,F 1min

Multilayer Ceramic Capacitor

- 24 -

NO ITEM PERFORMANCE TEST CONDITION

HUMIDITY

(STEADY

STATE)

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE : 40±2℃

RELATIVE HUMIDITY:90~95 %RH

TEST TIME : 500 +12/-0 Hr.

MEASURE AT ROOM TEMPERATURE

AFTER COOLING FOR

CLASSⅠ:24

±2Hr.

CLASSⅡ:48

±4Hr.

CAPACITANCE

CHARACTERISTIC CAPACITANCE CHANGE

CLASS Ⅰ

WITHIN ±5% OR

±0.5㎊WHICHEVER

IS LARGER

CLASS

Ⅱ

A,B WITHIN ±12.5%

FWITHIN ±30%

CLASSⅠ

30㎊AND OVER : Q≥350

10 ~30㎊:Q

≥275 + 2.5×C

LESS THAN 10pF : Q≥200 + 10×C

Tanδ

CLASS Ⅱ

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

1,000 ㏁OR 50㏁·㎌ PRODUCT WHICHEVER IS

SMALLER

MOISTURE

RESISTANCE

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE :

RATED VOLTAGE

TEMPERATURE : 40±2℃

RELATIVE HUMIDITY:90~95%RH

TEST TIME : 500 +12/-0 Hr.

CURRENT APPLIED : 50㎃MAX.

CLASS ⅡSHOULD BE MEASURED

INITIAL VALUE AFTER BE HEAT-TREATED

FOR 1 HR IN 150℃+0/-10℃AND BE LEFT

FOR 48±4HR AT ROOM TEMPERATURE.

CLASSⅠSHOULD BE MEASURED AFTER

LEFT FOR 24±2 HRS IN ROOM

TEMPERATURE AND HUMIDITY.

CLASS ⅡSHOULD BE MEASURED

LATTERVALUEAFTERBE

HEAT-TREATED FOR 1 HR IN 150℃+0/-10

℃AND BE LEFT FOR 48±4HR AT ROOM

TEMPERATURE.

CAPACITANCE

CHARACTERISTIC CAPACITANCE CHANGE

CLASS Ⅰ

WITHIN ±7.5% OR

±0.75㎊WHICHEVER

IS LARGER

CLASS

Ⅱ

A,B WITHIN ±12.5%

WITHIN ±30%

WITHIN +30~－40%

1005 C>0.47μF

1608 C>1.0μF

2012 C>4.7μF

3216 C>10.0μF

3225 C>22.0μF

4532 C>47.0μF

CLASSⅠ

30㎊AND OVER : Q≥200

30㎊AND BELOW : Q≥100 + 10/3×C

Tanδ

CLASSⅡ

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

500 ㏁OR 25㏁·㎌ PRODUCT,

WHICHEVER IS SMALLER.

CHAR. 25V

AND

OVER 16V 10V 6.3V 4V

A,B 0.05 0.05 MAX 0.05

MAX 0.075

MAX 0.1

MAX

F0.075

MAX

0.1MAX

(C〈1.0㎌)

0.125

MAX

(C≥1.0㎌)

0.15

MAX 0.195

MAX 0.25

MAX

CHAR. 25V

AND

OVER 16V 10V 6.3V 4V

A,B 0.05

MAX 0.05

MAX 0.075

MAX 0.1

MAX

F0.075

MAX

0.1MAX

(C〈1.0㎌)

0.125MAX

(C≥1.0㎌)

0.15

MAX 0.195

MAX 0.25

MAX

6.3V

Tanδ0.125 MAX *Condition

CLASSⅡ

(A,B)

1005 C ≥0.22㎌

1608 C ≥2.2㎌

2012 C ≥4.7㎌

3216 C ≥10.0㎌

3225 C ≥22.0㎌

4532 C ≥47.0㎌

5750 C ≥100.0㎌

6.3V Tanδ0.125 MAX *Condition

CLASSⅡ

(A,B)

1005 C ≥0.22㎌

1608 C ≥2.2㎌

2012 C ≥4.7㎌

3216 C ≥10.0㎌

3225 C ≥22.0㎌

4532 C ≥47.0㎌

5750 C ≥100.0㎌

Multilayer Ceramic Capacitor

- 25 -

NO ITEM PERFORMANCE TEST CONDITION

HIGH

TEMPERATURE

RESISTANCE

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR

APPLIED VOLTAGE :

150%, 200% OF RATED VOLTAGE

TEST TIME : 1000 +48/-0 Hr.

CURRENT APPLIED : 50㎃MAX.

CLASS ⅡSHOULD BE MEASURED INITIAL

VALUE AFTER BE HEAT-TREATED FOR 1

HR IN 150℃+0/-10℃AND BE LEFT FOR 48±

4HR AT ROOM TEMPERATURE.

CLASSⅠSHOULD BE MEASURED AFTER

LEFT FOR 24±2 HRS IN ROOM

TEMPERATURE AND HUMIDITY.

CLASS ⅡSHOULD BE MEASURED LATTER

VALUE AFTER BE HEAT-TREATED FOR 1

HR IN 150℃+0/-10℃AND BE LEFT FOR 48±

4HR AT ROOM TEMPERATURE.

(TWICE OF RATED VOLTAGE WILL BE

APPLIED TO ALL SERIES BUT ABOVE)

** HOWEVER, A/B는1005 C ≥0.22㎌

SEE (FIG.3)

CAPACITANCE

CHARACTERISTIC CAP. CHANGE

CLASS ⅠWITHIN ±3% OR ±0.3㎊,

WHICHEVER IS LARGER

CLASS

Ⅱ

A,B WITHIN ±12.5%

WITHIN ±30%

WITHIN+30~40%

1005 C>0.47μF

1608 C>1.0μF

2012 C>4.7μF

3216 C>10.0μF

3225 C>22.0μF

4532 C>47.0μF

CLASSⅠ

30㎊AND OVER : Q ≥350

10 ~ 30 ㎊:Q≥275 + 2.5×C

LESS THAN 10㎊:Q ≥200 + 10×C

Tanδ

CLASSⅡ

INSULATION

RESISTANCE

MINIMUM INSULATION RESISTANCE:

1,000 ㏁OR 50㏁·㎌ PRODUCT

WHICHEVER IS SMALLER

17 TEMPERATURE

CYCLE

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTED

TO FIVE CYCLES OF THE

TEMPERATURE CYCLE AS FOLLOWING

STEP TEMP.(℃)TIME(MIN)

1MIN.RATED

TEMP.+0/-3 30

225 2~3

3MAX.RATED

TEMP.+3/-0 30

425 2~3

MEASURE AT ROOM TEMPERATURE

AFTER COOLING FOR

CLASSⅠ:24

±2Hr.

CLASSⅡ:48

±4Hr.

CAPACITANCE

CHARACTERISTIC CAP. CHANGE

CLASS Ⅰ

WITHIN ±2.5%

OR ±0.25㎊WHICHEVER IS

LARGER

CLASS

Ⅱ

A,B WITHIN ±7.5%

FWITHIN ±20%

CLASSⅠ

30 ㎊AND OVER : Q ≥1000

LESS THAN 30㎊:Q ≥400 +20×C

Tanδ

CLASSⅡ

TO SATISFY THE SPECIFIED

INITIAL VALUE

INSULATION

RESISTANCE

TO SATISFY THE SPECIFIED

INITIAL VALUE

CHAR. 25V

AND

OVER 16V 10V 6.3V 4V

A,B 0.05

MAX 0.05

MAX 0.075

MAX 0.1

MAX

F0.075

MAX

0.1MAX

(C<1.0㎌)

0.125MAX

(C≥1.0㎌)

0.15

MAX 0.195

MAX 0.25

MAX

CHAR. TEMP.

CLASS Ⅰ125 ±3℃

CLASS

Ⅱ

A85 ±3℃

B125 ±3℃

F85 ±3℃

*150% Authorization Conditions

CLASSⅡ

(A,B,F)

1005 C>0.47μF

1608 C ≥2.2㎌

2012 C ≥4.7㎌

3216 C ≥10.0㎌

3225 C ≥22.0㎌

4532 C ≥47.0㎌

5750 C ≥100.0㎌

Multilayer Ceramic Capacitor

- 26 -

■CHARACTERISTIC GRAPH

0 50 100 1000 10000

-10

-20

-30

Time(Hr)

ΔC

C0G

X7R

Y5V

▶CAPACITANCE CHANGE - AGING

-60 1400-20 20 60 100

Temperature(℃)

ΔC

-5

-10

C0G

▶IMPEDANCE - FREQUENCY CHARACTERISTICS

▶CAPACITANCE - DC VOLTAGE CHARACTERISTICS

C0G

0.01

0.1

100

1.E+06 1.E+07 1.E+08 1.E+09 1.E+10

Ohm

1MHz 10MHz 100MHz 1GHz 10GHz

1000pF

100pF

10pF

X7R/Y5V

0.01

0.1

100

1.E+06 1.E+07 1.E+08 1.E+09

Ohm

0.1㎌

0.01㎌

0.001㎌

1MHz 10MHz 100MHz 1GHz

-100

-80

-60

-40

-20

0 5 10 15 20 25 30 35 40

DC V oltage(V dc)

C0G 50V

ΔC

X7R

50V

Y5V

50V

-60 1200-20 20 40 80

-80

-60

-40

-20

20 X7R

Y5V

Temperature(℃)

ΔC

▶CAPACITANCE - TEMPERATURE CHARACTERISTICS

●ELECTRICAL CHARACTERISTICS

Multilayer Ceramic Capacitor

- 27 -

■APPLICATION MANUAL

●Storage Condition

▶Storage Environment

The electrical characteristics of MLCCs were degraded by the environment of high temperature

or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative

humidity of less than 40℃and 70%, respectively. Guaranteed storage period is within 6 months

from the outgoing date of delivery.

▶Corrosive Gases

Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere

such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.

▶Temperature Fluctuations

Since dew condensation may occur by the differences in temperature when the MLCCs are

taken out of storage, it is important to maintain the temperature-controlled environment.

●Design of Land Pattern

When designing printed circuit boards, the shape and size of the lands must allow for the

proper amount of solder on the capacitor. The amount of solder at the end terminations has a

direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which

was due to too much amount of solder. In contrast, if too little solder is applied, the termination

strength will be insufficiently. Use the following illustrations as guidelines for proper land design.

Recommendation of Land Shape and Size

W b

Solder

Land

Solder Resist

2/3W < b < W

TSolder Resist

2/3T < a < T

●Adhesives

When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions.

▶Requirements for Adhesives

They must have enough adhesion, so that, the chips will not fall off or move during the

handling of the circuit board.

They must maintain their adhesive strength when exposed to soldering temperature.

They should not spread or run when applied to the circuit board.

They should harden quickly.

They should not corrode the circuit board or chip material.

Multilayer Ceramic Capacitor

- 28 -

They should be a good insulator.

They should be non-toxic, and not produce harmful gases, nor be harmful when touched.

▶Application Method

It is important to use the proper amount of adhesive. Too little and much adhesive will cause

poor adhesion and overflow into the land, respectively.

▶Adhesive hardening Characteristics

To prevent oxidation of the terminations, the adhesive must harden at 160℃or less, within

2 minutes or less.

●Mounting

▶Mounting Head Pressure

Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum

during mounting.

▶Bending Stress

When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side

of the board. When the MLCCs are mounted onto the other side, it is important to support the

board as shown in the illustration. If the circuit board is not supported, the crack occur to the

ready-installed MLCCs by the bending stress.

support pin

force

nozzle

●Flux

Although the solderability increased by the highly-activated flux, increase of activity in flux may

also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended

that a mildly activated rosin flux(less than 0.2% chlorine) be used.

Multilayer Ceramic Capacitor

- 29 -

●Soldering

Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during

soldering, it is exposed to potentially mechanical stress caused by the sudden temperature

change. The capacitor may also be subject to silver migration, and to contamination by the

flux. Because of these factors, soldering technique is critical.

▶Soldering Methods

Method Classification

Reflow

soldering

- Overall heating - Infrared rays

- Hot plate

- VPS(vapor phase)

- Local heating - Air heater

-Laser

- Light beam

Flow

soldering - Single wave

- Double wave -

* We recommend the reflow soldering method.

▶Soldering Profile

To avoid crack problem by sudden temperature change, follow the temperature profile in the

adjacent graph.

300

250

200

150

100

℃preheating soldering cooling

60~120sec 10~20sec

Reflow Soldering

300

250

200

150

100

℃preheating soldering cooling

△T≤150℃

60~120sec 3~4sec

Flow Soldering

▶Manual Soldering

Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot

soldering iron tip comes into direct contact with the end terminations, and operator's carelessness

may cause the tip of the soldering iron to come into direct contact with the ceramic body of

the capacitor. Therefore the soldering iron must be handled carefully, and close attention must

be paid to the selection of the soldering iron tip and to temperature control of the tip.

Multilayer Ceramic Capacitor

- 30 -

▶Amount of Solder

Too much

Solder

Not enough

Solder

Cracks tend to occur due

to large stress

Weak holding force may

cause bad connections or

detaching of the capacitor

Good

▶Cooling

Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning,

the temperature difference(△T) must be less than 100℃

6-6. Cleaning

If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used,

chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip

capacitors. This means that the cleaning fluid must be carefully selected, and should always

be new.

▶Notes for Separating Multiple, Shared PC Boards.

A multi-PC board is separated into many individual circuit boards after soldering has been

completed. If the board is bent or distorted at the time of separation, cracks may occur in the

chip capacitors. Carefully choose a separation method that minimizes the bending of the

circuit board.

Multilayer Ceramic Capacitor

- 31 -

■CROSS REFERENCE

P/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHM TAIYO

- YUDEN TDK VITRAMON

①COMPANY MODEL(MLCC) CL - - C CM GRM -ECJ MCH MK CVJ

②SIZE

(EIA/JIS)

0201(0603) 03 - - - 03 33 - Z - 063 0603 -

0402(1005) 05 0402 R07 0402 05 36 0402 015 105 1005 0402

0603(1608) 10 0603 R14 0603 105 39 0603 118 107 1608 0603

0805(2012) 21 0805 R15 0805 21 40 0805 221 212 2012 0805

1206(3216) 31 1206 R18 1206 316 42-6 1206 331 316 3216 1206

1210(3225) 32 1210 S41 1210 32 42-2 1210 432 325 3225 1210

1808(4520) 42 1808 R29 1808 42 -1808 - - - 4520 1808

1812(4532) 43 1812 S43 1812 43 43-2 1812 -43 432 4532 1812

2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 -

③

TEMPERATURE

CHARACTERISTIC

COG(NPO) C A N G CG COG/CH N C A C COG/CH A

P2H(N150) P S - - P P2H - P - P PH -

R2H(N220) R 1 - - R R2H - R - R RH -

S2H(N330) S 3 - - S S2H - S - S SH -

T2H(N470) T O - - T T2H - T - T TH -

U2J(N750) U Z - - U U2J - U UJ UUJ -

S2L L Y - - SL SL - G SL SL SL -

X7R B C W R(X) X7R X7R B B C BJ X7R(B) Y(X)

Z5U E E Z U - Z5U Z - E - Z5U U

Y5V F G Y V Y5V Y5V Y F F F Y5V -

④NOMINAL CAPACITANCE EX) 103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊

⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1% G:±2% J:±5% K:±10% M:±20% Z:-20~+80%

⑥RATED

VOLTAGE

6.3V Q 6 - 9 06 6.3 -0J - J 0J -

10 V P Z 100 810 10 -1A 4 L 1A -

16 V O Y 160 416 16 160 1C 3 E 1C J

25 V A 3 250 325 25 250 1E 2 T 1E X

50 V B 5 500 550 50 500 1H 5 U 1H A

100 V C 1 101 1100 100 101 2A 1 - 2A B

200V D 2 201 2200 200 201 2D - - - C

250V E V - - 250 250 251 - - - 2E -

500V G 7 501 -500 500 501 - - - - E

630V H - - - 630 630 - - - - 2J -

1000V I A 102 -1000 1K 102 - - - 3A G

2000V J G 202 -2000 2K 202 - - - 3D -

3000V K H 302 -3000 3K 302 - - - 3F H

4000V - J - 4000 -402 - - - - -

⑦TERMINATION NICKEL BARRIER N T V C A (GRM) N - (MCH) - - X

Ag/Pd P 1 - - B (GR) P - (MC) - - F

⑧PACKAGE

BULK(VINYL) B 9 (NONE) - B PB * X - B B B

PAPER TAPING C2, 4 T, R -T, L PT TE,V,W K, L T T C, P

PLASTIC TAPING E1, 3 E, U -H, N PT -F, Y P, Q T - T, R

BULK CASE P 7 - - C PC - C C - - G

Multilayer Ceramic Capacitor

- 32 -

▶SAMSUNG : CL10B104KA8NNNC

CL 10 B 104 K A 8 N N N C

▶AVX : 06033C104KAT2A

0603 3 C 104 K A T 2 A

▶JOHANSON : 250R14W104KV6T

250 R14 W 104 K V 6 T

▶KEMET : C0603C104K3RAC

C0603C 104K 3R A C

Series Size

03 = 0201

05 = 0402

10 = 0603

21 = 0805

31 = 1206

32 = 1210

43 = 1812

55 = 2220

Dielectric

C=C0G

P=P2H

R=R2H

S=S2H

T=T2H

U=U2H

L=S2L

B=X7R

A=X5R

F=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

A=±0.05pF

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80,-20%

Voltage

Q = 6.3V

P=10V

O=16V

A=25V

B=50V

C = 100V

D = 200V

E=250V

G = 500V

H = 630V

I = 1000V

Thickness

3 = 0.30

5 = 0.50

8 = 0.80

A=0.65

C = 0.85

H = 1.60

I=2.00

J = 2.50

L = 3.20

Electrode/

Termination/

Plating

A=Pd/Ag/

Sn 100%

N=Ni/Cu/

Sn 100%

G=Cu/Cu/

Sn 100%

Products

A=Array

(2-element)

B=Array

(4-element)

C=High-Q

L=LICC

N = Normal

P=Automotive

W = 3 terminal

chip

Special

Various

Packaging

B=Bulk

P = Cassette

C=Paper7"

D=Paper13"

(10,000EA)

E = Embossing 7"

F = Embossing 13"

L = Paper 13"

(15,000EA)

O=Paper10"

S = Embossing 10"

Size

0201

0402

0603

0805

1206

1210

1812

2220

2225

Voltage

4=4V

6 = 6.3V

Z=10V

Y = 16V

3=25V

B=50V

C = 100V

D = 200V

E = 250V

G = 500V

I = 1000V

Dielectric

A=C0G

C=X7R

D=X5R

E=Z5U

G=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal

point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

P = GMV,+100,-0%

Failure Rate

A=N/A

Termination

T = Sn 100%

7=GoldPlated

1=Pd/Ag

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Cassette

9=Bulk

Special

A = Standard

T = 0.66mm

S = 0.56mm

R = 0.46mm

Voltage

significant

figures

number

of zeros

Size

R07 = 0402

R14 = 0603

R15 = 0805

R18 = 1206

S41 = 1210

S43 = 1812

S47 = 2220

S48 = 2225

S49 = 1825

S54 = 3640

Dielectric

N=C0G

W=X7R

X=X5R

Z=Z5U

Y=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Termination

V = Ni Barrier

Marking

4=NoMark

6 = Marking

Packaging

E = 7" Reel Plastic

T = 7" Reel Paper

R = 13" Reel Paper

U = 13" Reel Plastic

None = Bulk

Series Size

0402

0603

0805

1206

1210

1812

2220

2225

Specification

C = Standard

A=GR900

P = Mil-C-55681

CDR01-CDR06

N = Mil-C-55681

CDR31-CDR35

Z = Mil-C-123

E=MilEquivalent

(Group A Only)

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z=+80,-20%

P = +100, 0%

Voltage

9=6.3V

8=10V

4=16V

3=25V

5=50V

1=100V

2=200V

Dielectric

G=C0G

R=X7R

P=X5R

U=Z5U

X = BX(Mil)

V=Y5V

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

P = GMV,+100,-0%

Failure Rate

A=Standard

M=1.0(Mil)

P = 0.1 (Mil)

R=0.01(Mil)

S=0.001(Mil)

Termination

C=Niw/TinPlate

H = Ni w/Solder

T=Silver

G=GoldPlated

Multilayer Ceramic Capacitor

- 33 -

▶KYOCERA : CM105X7R104K25AT

CM 105 X7R 104 K 25 A T

▶MURATA : GRM188R71E104KA01D

GRM 18 8 R7 1E 104 K A01 D

▶NOVACAP : 0603B104K250N_TM

1206 B 104 K 250 N - T M

▶PANASONIC : ECJ1EB1E104K

ECJ 1 E B 1E 104 K

Series Size

03 = 0201

05 = 0402

105 = 0603

21 = 0805

316 = 1206

32 = 1210

42 = 1808

43 = 1812

55 = 2220

Dielectric

X8R

X7R

X5R

Z5U

Y5V

Y5U

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

P=+100,0%

Voltage

04 = 4V

06 = 6.3V

10 = 10V

16 = 16V

25 = 25V

50 = 50V

100 = 100V

250 = 250V

500 = 500V

1000 = 1000V

Termination

A = Ni Barrier

Packaging

T = 7" Reel (4mm Pitch)

L = 13" Reel (4mm Pitch)

H = 7" Reel (2mm Pitch)

N = 13" Reel (2mm Pitch)

B=Bulk(VinylBags)

C = Bulk Cassette

Series

Ni Barrier

Size

03 = 0201

15 = 0402

18 = 0603

21 = 0805

31 = 1206

32 = 1210

42 = 1808

43 = 1812

55 = 2220

Thickness

3=0.3mm

5=0.5mm

8=0.8mm

A=1.0mm

B = 1.25mm

C = 1.6mm

D = 2.0mm

E=2.5mm

F = 3.2mm

Dielectric

5C = C0G

R7 = X7R

R6 = X5R

E4 = Z5U

F5 = Y5V

Voltage

0J = 6.3V

1A = 10V

1C = 16V

1E = 25V

1H = 50V

2A = 100V

2E = 250V

2H = 500V

3A = 1000V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal

point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80,-20%

P=+100,0%

Individual

Specification

Code

Packaging

D = 7" Reel Paper

L = 7" Reel Plastic

J = 13" Reel Paper

K = 13" Reel Plastic

B=Bulk

C = Bulk Cassette

T=BulkTray

Size

0402

0603

0805

1005

1206

1210

1808

1812

2220

Dielectric

N=C0G

B=X7R

X=BX

Z=Z5U

Y=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80,-20%

P = +100,

Voltage

significant

figures

number

of zeros

Termination

P=Pd/Ag

N=NiBarrier

(Sn 100%)

Y = Ni Barrier

(Sn/Pb)

Thickness

Per Specified

Packaging

T = Reel

None = Bulk

W=WafflePack

Marking

Series Size

Z = 0201

0 = 0402

1 = 0603

2 = 0805

3 = 1206

4 = 1210

Packaging

X=Bulk

E = Paper 2mm

V = Paper 4mm

F, Y = Plastic 4mm

W = Large Reels 2mm

Z = Large Reels 4mm

C = Bulk Cassette

Dielectric

C=C0G

B = X7R, X5R

F=Y5V

Voltage

0J = 6.3V

1A = 10V

1C = 16V

1E = 25V

1H = 50V

2A = 100V

2D = 200V

Tolerance

C=±0.25pF

D=±0.5pF

F=±1%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Multilayer Ceramic Capacitor

- 34 -

▶ROHM : MCH182C104KKN

MCH 18 2 C 104 K K N

▶TAIYO-YUDEN : TMK107BJ104K_T

TM K 107BJ104 K -T

▶TDK : C1608X7R1E104KT

C 1608 X7R 1E 104 K T

▶VITRAMON : VJ0603Y104KXXMC

VJ 0603 Y 104 K X X M C

Series Size

15 = 0402

18 = 0603

21 = 0805

31 = 1206

32 = 1210

43 = 1812

Voltag

4 = 10V

3 = 16V

2 = 25V

5 = 50V

Dielectric

A=C0G

C=X7R

F=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80,-20%

P = +100, 0%

Packaging

K = 7" Reel Paper

P=7"ReelPlastic

L = 13" Reel Paper

Q = 13" Reel Plastic

B=Bulk

C = Bulk Cassette

Marking/Thickness

N=Marked

Special Thickness

Voltage

A=4V

J = 6.3V

L=10V

E=16V

T=25V

U = 50V

Type

M = Multilayer

V=HiQ

Termination

K = Ni Barrier

Size

105 = 0402

107 = 0603

212 = 0805

316 = 1206

325 = 1210

432 = 1812

550 = 2220

Dielectric

CG = C0G

CH = C0H

CJ = C0J

CK = C0K

BJ = X5R,

X7R

F=Y5V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80,-20%

Special

Various

Packaging

T = Reel

B=Bulk

Series Size

0603 = 0201

1005 = 0402

1608 = 0603

2012 = 0805

3216 = 1206

3225 = 1210

4532 = 1812

5650 = 2220

Dielectric

X7R

Z5U

Y5V

Voltage

0J = 6.3V

1A = 10V

1C = 16V

1E = 25V

1H = 50V

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

Packaging

T=Reel

B=Bulk

Series Size

0402

0603

0805

1206

1210

1812

2225

Dielectric

X=BX

A,N = C0G

Y=X7R

U=Z5U

H=X8R

Capacitance

significant

figures

number

of zeros

Use "R" for

decimal point

Tolerance

B=±0.1pF

C=±0.25pF

D=±0.5pF

F=±1%

G=±2%

J=±5%

K=±10%

M=±20%

Z = +80, -20%

P=+100,0%

Termination

X=Silver,

Ni Barrier

Tin Plated

Voltage

J=16V

X=25V

A=50V

B=100V

C = 200V

Marking

M = Marking

A = No Marking

Packaging

C = 7" Reel Paper

T = 7" Reel Plastic

P = 13" Reel Paper

R = 13" Reel Plastic

B=Bulk