MinitekTM Unshrouded Stacking Headers 2,00 mm CUSTOMISABLE: Wide variety of stack heights in 0.13 mm increments Custom sizes to meet your specific design requirements High temperature plastic Technical Data Mating Data Page Physical Operating Temperature MinitekTM ctw contacts and housings Housing: High-temperature, black thermoplastic Flammability rating: UL 94 V-0 Pin: Phosphor-bronze Plating: Gold over 1.27 m nickel -55C to +125C MinitekTMVertical receptacles Packaging MinitekTMShunts Electrical Performance Current rating: 2 A continuous Insulation resistance: 1000 M min. Contact resistance: 25 m max. Dielectric withstanding voltage: 650 V Voltage rating: 200 V Mechanical Performance Standard: TMT in bags SMT in Tape-and-reel Optional: Tubes (see drawing) 48 50 52 Processing Information Compatible with wave, vapor-phase, and IR reflow soldering processes Reference Information File no. E66906 File no. LR46923 Product drawing: 59112, 59132, or 59202 Product specification: DPS-12-011 Specifications subject to change without notice. Mating cycles (durability): 100 Typical Applications Receptacle Mating side Mating side Mating side Board Space OAL Stack OAL Height Solder side OAL Stack Height Solder side OAL Stack Height Solder side Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics 42 MinitekTM Unshrouded Stacking Headers 2,00 mm Part Number 5 9 Lead Solder Side Option 1 = Through Mount (TMT) 2 = Surface Mount (SMT) 2 Plating Pin Style G = 0,76 m Gold on mating area, 2-6 m Tin-Lead on solder side F = Gold flash Positions Per Row Stack Height 02 to 25 (TMT) 02 to 25 (SMT) XX.X = mm Specify mm [i.e., 037 = 03.7 mm] in 0.1 mm increments 1 = 2.50 3 = 3.00 0 = SMT Pin Style 22 24 26 28 30 32 34 36 38 40 OAL (TMT) mm 8.20 9.55 10.19 11.79 13.54 14.10 15.60 17.09 19.08 21.08 Height (SMT) mm 6.53 7.87 8.51 10.11 11.86 12.42 13.92 15.42 17.40 19.41 PACKING: = Bags (TMT) A = Tape-and-reel (SMT) Step-by-Step Design 1. Determine desired board spacing 2. Select receptacle and calculate stack height Stack Height = Board Spacing - Receptacle Height 3. Find the insertion depth from the chart below. Calculate max./ min. OAL OAL = Stack Height + Tail + Insertion Depth 4. Select the Pin Style with OAL between max. and min. values Height (mm) Insertion Depth (max.) Insertion Depth (min.) RECEPTACLES TMT SMT 4.50 2.30 4.30 2.20 3.03 1.43 Example: Recommended PCB Layout 1. Application requires a board spacing of 14.1 2. Select the appropriate receptacle, in this case 3.0 height (SMT) The Header Stack Height is 14.1 - 3.0 = 11.1 3. For 1,6 mm board application (TMT), the 2.5 Solder side is selected OAL (max.) = 14.1 + 2.5 + 3.4 = 20.0 OAL (min.) = 14.1 + 2.5 + 1.28 = 17.88 4. Select Pin Style 38 with OAL = 19.07 5. Part Number is 59112-G38-10-141 Dimensions in mm Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics 43