Operating current: 10mA@ 3.6V, 5MHz
Standby current: 10uA
Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4 mm TSOP(I)
1
PIN CONFIGURATIONS
PDIP
GENERAL DESCRIPTION
The MX27L512 is a 3V only, 512K-bit, One-Time
Programmable Read Only Memory. It is organized as
64K words by 8 bits per word, operates from a single
+3volt supply, has a static standby mode, and features
fast single address location programming. All program-
ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27L512 supports
intelligent fast programming algorithm which can result
in programming time of less than fifteen seconds.
This EPROM is packaged in industry standard 28 pin
dual-in-line packages , 32 lead PLCC, and 28 lead
TSOP(I) packages.
FEATURES
64K x 8 organization
Wide voltage range, 2.7V to 3.6V
+12.5V programming voltage
Fast access time: 120/150/200/250ns
Totally static operation
Completely TTL compatible
P/N: PM0256 REV. 2.4, APR. 24, 2002
BLOCK DIAGRAM
PIN DESCRIPTION
PLCC
8 x 13.4mm 28TSOP(I)
SYMBOL PIN NAME
A0~A15 Address Input
Q0~Q7 Data Input/Output
CE Chip Enable Input
OE/VPP Output Enable Input/Program Supply Voltage
NC No Internal Connection
VCC Power Supply Pin
GND Ground Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A14
A13
A8
A9
A11
OE/VPP
A10
CE
Q7
Q6
Q5
Q4
Q3
MX27L512
1
4
5
9
13
14 17 20
21
25
29
32 30 A8
A9
A11
NC
OE/VPP
A10
CE
Q7
Q6
A6
A5
A4
A3
A2
A1
A0
NC
Q0
Q1
Q2
GND
NC
Q3
Q4
Q5
A7
A12
A15
NC
VCC
A14
A13
MX27L512
OE/VPP
A11
A9
A8
A13
A14
VCC
A15
A12
A7
A6
A5
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
21
20
19
18
17
16
15
14
13
12
11
10
9
8
MX27L512
MX27L512
512K-BIT [64K x 8] CMOS EPROM
CONTROL
LOGIC OUTPUT
BUFFERS Q0~Q7
CE
OE/VPP
A0~A15
ADDRESS
INPUTS
Y-DECODER
X-DECODER
Y-SELECT
512K BIT
CELL
MAXTRIX
VCC
GND
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27L512.
To activate this mode, the programming equipment
must force 12.0 ± 0.5(VH) on address line A9 of the
device. Two identifier bytes may then be sequenced
from the device outputs by toggling address line A0 from
VIL to VIH. All other address lines must be held at VIL
during auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27L512, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
READ MODE
The MX27L512 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
STANDBY MODE
The MX27L512 has a CMOS standby mode which
reduces the maximum VCC current to 10 uA. It is placed
in CMOS standby when CE is at VCC ± 0.3 V. The
MX27L512 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27L512
When the MX27L512 is delivered, or it is erased, the
chip has all 512K bits in the "ONE", or HIGH state.
"ZEROs" are loaded into the MX27L512 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage OE/VPP = 12.75V is applied,
with VCC = 6.25 V, (Algorithm is shown in Figure 1). The
programming is achieved by applying a single TTL low
level 100us pulse to the CE input after addresses and
data line are stable. If the data is not verified, an
additional pulse is applied for a maximum of 25 pulses.
This process is repeated while sequencing through each
address of the device. When the programming mode is
completed, the data in all address is verified at VCC = 5V
± 10%.
PROGRAM INHIBIT MODE
Programming of multiple MX27L512s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L512 may be common. A TTL
low-level program pulse applied to an MX27L512 CE
input with OE/VPP = 12.5 ± 0.5V will program that
MX27L512. A high-level CE input inhibits the other
MX27L512s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE/VPP and
CE, at VIL. Data should be verified tDV after the falling
edge of CE.
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
NOTES: 1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL 3. A1 - A8 = A10 - A15 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during
programming.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
MODE SELECT TABLE
PINS
MODE CE OE/VPP A0 A9 OUTPUTS
Read VIL VIL X X DOUT
Output Disable VIL VIH X X High Z
Standby (TTL) VIH X X X High Z
Standby (CMOS) VCC±0.3V X X X High Z
Program VIL VPP X X DIN
Program Verify VIL VIL X X DOUT
Program Inhibit VIH VPP X X High Z
Manufacturer Code(3) VIL VIL VIL VH C2H
Device Code(3) VIL VIL VIH VH 91H
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
Figure1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
OE/VPP = 12.75V
PROGRAM ONE 100us PULSE
X = 0
LAST
ADDRESS ?
VERIFY BYTE
VCC = 5.25V
DEVICE PASSED
COMPARE
ALL BYTES
TO ORIGINAL
DATA
DEVICE FAILED
INCREMENT ADDRESS
FAIL
PASS
NO
NO
YES
YES
ADDRESS = FIRST LOCATION
LAST
ADDRESS ?
INCREMENT ADDRESS
FAIL
PASS INCREMENT X
X = 25 ?
NO
OE/VPP = VIL
YES
PROGRAM ONE 100us PULSE
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
SWITCHING TEST CIRCUITS
SWITCHING TEST WAVEFORMS
DEVICE
UNDER
TEST
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance
6.2K ohm
1.8K ohm +5V
CL
2.0V
0.8V TEST POINTS
INPUT
2.0V
0.8V
OUTPUT
AC TESTING: AC driving levels are 2.4V/0.4V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
AC driving levels
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
NOTICE:
Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to
change.
DC CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
RATING VALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature -65oC to 125oC
Applied Input Voltage -0.5V to 7.0V
Applied Output Voltage -0.5V to VCC + 0.5V
VCC to Ground Potential -0.5V to 7.0V
A9 & Vpp -0.5V to 13.5V
DC/AC Operating Conditions for Read Operation
MX27L512
-12 -15 -20 -25
Operating Commercial 0°C to 70°C0°C to 70°C0°C to 70°C0°C to 70°C
Temperature Industrial -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
Vcc Power Supply 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage Vcc-0 .3 V IOH = -100uA, VCC = 3.0V
VOL Output Low Voltage 0.3 V IOL = 2.1mA, VCC = 3.0V
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.6 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 3.6V
ILO Output Leakage Current -10 10 uA VOUT = 0 to 3.6V
ICC3 VCC Power-Down Current 10 uA CE = VCC ± 0.3V
ICC2 VCC Standby Current 0.25 mA CE = VIH
ICC1 VCC Active Current 10 mA CE = VIL, f=5MHz, Iout = 0mA, Vcc=3.6V
IPP VPP Supply Current Read 10 uA CE = VIL, VPP = VCC
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
CIN Input Capacitance 8 12 pF VIN = 0V
COUT Output Capacitance 8 12 pF VOUT = 0V
Vpp VPP Capacitance 18 25 pF VPP = 0V
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
tAS Address Setup Time 2 us
tDS Data Setup Time 2 us
tAH Address Hold Time 0 us
tDH Data Hold Time 2 us
tDFP Chip Enable to Output Float Delay 0 130 ns
tVPS VPP Setup Time 2 us
tPW CE Program Pulse Width 95 105 us
tVCS Vcc Setup Time 2 us
tDV Data Valid from CE 150 ns
tOEH OE/VPP Hold Time 2 ns
tVR OE/VPP Recovery Time 2 ns
27L512-12 27L512-15 27L512-20 27L512-25
SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 120 150 200 250 ns CE = OE = VIL
tCE Chip Enable to Output Delay 120 150 200 250 ns OE = VIL
tOE Output Enable to Output 60 65 100 120 ns CE = VIL
Delay
tDF OE High to Output Float, 0 40 0 50 0 60 0 70 ns
or CE High to Output Float
tOH Output Hold from Address, 0 0 0 0 ns
CE or OE which ever occurred
first
AC CHARACTERISTICS
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5oC
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.40mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.2 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
VH A9 Auto Select Voltage 11.5 12.5 V
ICC3 VCC Supply Current(Program & Verify) 40 mA
IPP2 VPP Supply Current(Program) 30 m A CE = VIL
VCC1 Fast Programming Supply Voltage 6.00 6.50 V
VPP1 Fast Programming Voltage 12.5 13.0 V
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
WAVEFORMS
READ CYCLE
FAST PROGRAMMING ALGORITHM WAVEFORM
ADDRESS
INPUTS
DATA
OUT
OE
CE
DATA ADDRESS
VALID DATA
tDF
tACC
tCE
tOE tOH
Addresses
CE
OE/VPP
DATA
VCC
VIH
VIL
VPP1
VIL
VCC1
VCC
VIH
VIL
DATA OUT VALID
Hi-z
tAS
tVPS
tVCS
tDV
tPW
tDS tDH
tVR
tVPS tAH
tDFP
PROGRAM VERIFY
PROGRAM
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
PLASTIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING STANDBY OPERATING PACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE
MX27L512PC-12 120 10 10 0°C to 70°C 28 Pin DIP
MX27L512QC-12 120 10 10 0°C to 70°C 32 Pin PLCC
MX27L512TC-12 120 10 10 0°C to 70°C 28 Pin TSOP(I)
MX27L512PC-15 150 10 10 0°C to 70°C 28 Pin DIP
MX27L512QC-15 150 10 10 0°C to 70°C 32 Pin PLCC
MX27L512TC-15 150 10 10 0°C to 70°C 28 Pin TSOP(I)
MX27L512PC-20 200 10 10 0°C to 70°C 28 Pin DIP
MX27L512QC-20 200 10 10 0°C to 70°C 32 Pin PLCC
MX27L512TC-20 200 10 10 0°C to 70°C 28 Pin TSOP(I)
MX27L512PC-25 250 10 10 0°C to 70°C 28 Pin DIP
MX27L512QC-25 250 10 10 0°C to 70°C 32 Pin PLCC
MX27L512TC-25 250 10 10 0°C to 70°C 28 Pin TSOP(I)
MX27L512PI-12 120 10 10 -40°C to 85°C 28 Pin DIP
MX27L512QI-12 120 10 10 -40°C to 85°C 32 Pin PLCC
MX27L512TI-12 120 10 10 -40°C to 85°C 28 Pin TSOP(I)
MX27L512PI-15 150 10 10 -40°C to 85°C 28 Pin DIP
MX27L512QI-15 150 10 10 -40°C to 85°C 32 Pin PLCC
MX27L512TI-15 150 10 10 -40°C to 85°C 28 Pin TSOP(I)
MX27L512PI-20 200 10 10 -40°C to 85°C 28 Pin DIP
MX27L512QI-20 200 10 10 -40°C to 85°C 32 Pin PLCC
MX27L512TI-20 200 10 10 -40°C to 85°C 28 Pin TSOP(I)
MX27L512PI-25 250 10 10 -40°C to 85°C 28 Pin DIP
MX27L512QI-25 250 10 10 -40°C to 85°C 32 Pin PLCC
MX27L512TI-25 250 10 10 -40°C to 85°C 28 Pin TSOP(I)
ORDERING INFORMATION
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
PACKAGE INFORMATION
28-PIN PLASTIC DIP (600 mil)
11
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MX27L512
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
8 x 13.4mm 28-PIN PLASTIC TSOP
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P/N:PM0256 REV. 2.4, APR. 24, 2002
MX27L512
REVISION HISTORY
Revision No. Description Page Date
2.0 1)Programming Flow Chart corrected, programming verify after 6/05/1997
whole array programmed with 1 pulse.
2) Eliminate Interactive Programming Mode.
3) Add 28-TSOP(I) and 28-SOP packages offering.
4) AC driving levels are changed from 2.4V/0.3V to 2.4V/0.4V.
2.1 General description, ".... is a 5V only..." ==> "....is a 3V only...." 9/25/1998
2.2 Cancel ceramic DIP package type P1,2,9,11 MAR/02/2000
2.3 Remove 28-pin SOP Package P1,9 SEP/19/2001
Package Information format changed P10~12
2.4 Remove "ultraviolet erasable" wording P1 APR/24/2002
MX27L512
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MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.