Agilent HSMx-C120/C177/C197/C265
High Performance Chip LEDs
Data Sheet
Features
• High brightness AlInGaP material
• 0805 or 0603 industry standard
footprint with 0.4 mm height for
top emitting packages
• Also available in right angle
emitting and reverse mounting
packages
• Diffused optics
• Operating temperature range of
–30°C to +85°C
• Compatible with IR soldering
• Available in 4 colors
• Available in 8 mm tape on 7"
diameter reel
• Reel sealed in zip locked
moisture barrier bags
Applications
• Membrane switch indicator
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol backlighting
• Keypad backlighting
• Microdisplays
• Small message panel signage
Description
These chip type LEDs utilize
Aluminium Indium Galium
Phosphide (AlInGaP) material
technology. The AlInGaP material
has a very high luminous
efficiency, capable of producing
high light output over a wide
range of drive currents. The
available colors in this surface
mount series are 592 nm Amber,
605 nm Orange, 626 nm Red and
639 nm Deep Red.
All packages are binned by both
color and intensity, except for red
and deep red color.
These ChipLEDs come either in
low profile top emitting packages
(HSMx-C177/C197), in a side
emitting package (HSMx-C120)
or in a reverse mount package
(HSMx-C265). The right angle
ChipLED is suitable for applica-
tions such as LCD back lighting.
The top emitting ChipLEDs with
wide viewing angle are suitable
for light piping and direct back-
lighting of keypads and panels.
The reverse mount ChipLED is
suitable for space saving.
In order to facilitate pick and
place operation, these ChipLEDs
are shipped in tape and reel, with
4000 units per reel for HSMx-
C120/C177/C197 and 3000 units
per reel for HSMx-C265.
These packages are compatible
with IR soldering process.
Device Selection Guide
Dimensions (mm)[1,2] Amber Red Orange Deep Red Package Description
1.6 x 0.6 x 1.0 HSMA-C120 HSMC-C120 HSML-C120 – Untinted, Non-diffused
2.0 x 1.25 x 0.4 HSMA-C177 HSMC-C177 HSML-C177 HSMT-C177 Untinted, Diffused
1.6 x 0.8 x 0.4 HSMA-C197 HSMC-C197 HSML-C197 HSMT-C197 Untinted, Diffused
3.4 x 1.25 x 1.1 HSMA-C265 HSMC-C265 HSML-C265 HSMT-C265 Untinted, Non-diffused
2
Package Dimensions
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
1.10 (0.043) MIN.
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
HSMx-C177
0.80
(0.031) 1.60
(0.063) POLARITY
0.70 (0.028) MIN.
CATHODE LINE
0.30 ± 0.15
(0.012 ± 0.006)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
SOLDERING
TERMINAL
0.40
(0.016)
CATHODE MARK
LED DIE
HSMx-C197
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK (ETCHED)
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
1.25 (0.049)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
GREEN SOLDER MASK
CATHODE LINE
HSMx-C265
1.6 (0.063)
0.5 (0.020)
POLARITY
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
HSMx-C120
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Absolute Maximum Ratings at TA = 25˚C
Parameter HSMx-Cxxx Units
DC Forward Current [1] 25 mA
Peak Pulsing Current[2] 100 mA
Power Dissipation 60 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figures 8 & 9)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 ms width.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMA-C120 1.9 2.4 5 11 400
HSMA-C177/197 1.9 2.4 5 11 300
HSMA-C265 1.9 2.4 5 11 550
HSMC-C120 1.9 2.4 5 15 400
HSMC-C177/197 1.9 2.4 5 15 300
HSMC-C265 1.9 2.4 5 15 550
HSML-C120 1.9 2.4 5 20 400
HSML-C177/197 1.9 2.4 5 20 300
HSML-C265 1.9 2.4 5 20 550
HSMT-C177/197 1.9 2.4 5 15 300
HSMT-C265 1.9 2.4 5 15 550
VF Tolerance: ± 0.1 V
4
Optical Characteristics at TA = 25˚C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2 θ1/2 ηV
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Part Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMA-C120 Amber 28.5 90 595 592 155 480
HSMA-C177/197 Amber 28.5 90 595 592 130 480
HSMA-C265 Amber 28.5 75 595 592 150 480
HSMC-C120 Red 28.5 90 637 626 155 155
HSMC-C177/197 Red 28.5 90 637 626 130 155
HSMC-C265 Red 28.5 75 637 626 150 155
HSML-C120 Orange 28.5 90 609 605 155 370
HSML-C177/197 Orange 28.5 90 609 605 130 370
HSML-C265 Orange 28.5 75 609 605 150 370
HSMT-C177/197 Deep Red 11.2 30 660 639 130 70
HSMT-C265 Deep Red 11.2 25 660 639 150 70
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
5
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID Min. Max.
A 0.11 0.18
B 0.18 0.29
C 0.29 0.45
D 0.45 0.72
E 0.72 1.10
F 1.10 1.80
G 1.80 2.80
H 2.80 4.50
J 4.50 7.20
K 7.20 11.20
L 11.20 18.00
M 18.00 28.50
N 28.50 45.00
P 45.00 71.50
Q 71.50 112.50
R 112.50 180.00
S 180.00 285.00
T 285.00 450.00
U 450.00 715.00
V 715.00 1125.00
W 1125.00 1800.00
X 1800.00 2850.00
Y 2850.00 4500.00
Note:
1. Bin categories are established for classifica-
tion of products. Products may not be avail-
able in all categories. Please contact your
Agilent representative for information on
currently available bins.
Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Tolerance: ± 0.5 nm
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Tolerance: ± 1 nm
Tolerance: ± 15%
Color Bin Limits
6
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 3. Luminous intensity vs. forward current.
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 30
1.4
25
1.2
AS AMBER
AS ORANGE, RED,
and DEEP RED
Figure 2. Forward current vs. forward voltage.Figure 1. Relative intensity vs. wavelength.
100
90
80
70
60
50
40
30
20
10
0
WAVELENGTH – nm
RELATIVE INTENSITY – %
500 550 600 650 700
AS
AMBER
AS
ORANGE
AS
RED
AS
DEEP
RED
100
10
1
01.5 1.7 1.9 2.1 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
1.6 1.8 2.0 2.2
AS AlInGaP
0
020 60 80 90
5
IF MAX – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
15
30
10
20
HSMx-C120/177/197
HSMx-C265
25
10 30 50 70
Figure 5. Relative intensity vs. angle for HSMx-C120.
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
7
Figure 6. Relative intensity vs. angle for HSMx-C177/197.
Figure 9. Recommended Pb-free reflow soldering profile.
Figure 10. Recommended soldering pattern
for HSMx-C177.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
CENTERING
BOARD
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
CENTERING
BOARD
Figure 11. Recommended soldering pattern
for HSMx-C197.
Figure 7. Relative intensity vs. angle for HSMx-C265.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
8
Figure 14. Reeling orientation.
Figure 15. Reel dimensions.
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
Figure 12. Recommended soldering pattern for HSMx-C120. Figure 13. Recommended soldering pattern for HSMx-C265.
0.7 (0.028)
0.8
(0.031) 0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
1.25 (0.049)
1.4
(0.055) 2.3
(0.091) 1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
Figure 16. Tape dimensions.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059) CATHODE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
HSMx-C120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
HSMx-C120 SERIES
HSMx-C177 SERIES
HSMx-C197 SERIES
HSMx-C120
R 0.5 ± 0.05
(0.020 ± 0.002)
0.80 (0.031)
0.60 (0.024)
0.60 (0.024)
1.90 (0.075)
2.30 (0.091)
1.80 (0.071)
1.15 (0.045)
1.40 (0.055)
0.95 (0.037)
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
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distributors, please go to our web site.
For technical assistance call:
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(916) 788-6763
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-5501EN
April 22, 2004
5989-0551EN
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
Figure 17. Tape leader and trailer dimensions.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
