1SS361LP3
Document number: DS35233 Rev. 5 - 2 1 of 4
www.diodes.com January 2012
© Diodes Incorporated
1SS361LP3
NEW PRODUCT
ULTRA-SMALL LEADLESS SURFACE MOUNT SWITCHING DIODE
Features
Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm)
Ultra-Low Profile Package (0.3mm)
Fast Switching Speed
Low Forward Voltage
Fast Reverse Recovery
Low Capacitance
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Mechanical Data
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Bar
Terminals: Finish Matte Tin Finish over Copper Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Weight: 0.0002 grams (Approximate)
Ordering Information (Note 3)
Part Number Case Packaging
1SS361LP3-7 X3-DFN0603-2 10,000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
S3 = Product Type Marking Code
Bar Denotes Cathode Side
Top View Bottom View
S3
1SS361LP3
Document number: DS35233 Rev. 5 - 2 2 of 4
www.diodes.com January 2012
© Diodes Incorporated
1SS361LP3
NEW PRODUCT
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage VRM 85 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 80 V
RMS Reverse Voltage VR
(
RMS
)
57 V
Forward Continuous Current IFM 300 mA
Average Rectified Output Current IO 100 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0µs IFSM 2.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) PD 250 mW
Thermal Resistance Junction to Ambient Air (Note 4) R
θ
JA 500 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5) V
(
BR
)
R 80 V IR = 100μA
Forward Voltage VF
0.61
0.75
0.95
1.23 V IF = 1.0mA
IF = 10mA
IF = 100mA
Leakage Current (Note 5) IR
0.5
1.0 µA
µA VR = 30V
VR = 80V
Total Capacitance CT 0.37 3.0 pF
VR = 0, f = 1.0MHz
Reverse Recovery Time trr 1.7 4.0 ns
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
00 25 50 75 100 125 150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
T , AMBIENT TEMPERAT URE (°C)
Fig. 1 Powe r De r at ing C ur ve, Total Package
A
50
100
150
200
250
300
I , INSTANTANEOUS FORWARD CURRENT (mA)
F
V , IN STANTAN EOUS FO RW ARD VOLTAGE (V)
Fig. 2 Ty pi cal Forward Ch ar acterist ic s
F
0 0.4 0.8 1.2 1.6
1SS361LP3
Document number: DS35233 Rev. 5 - 2 3 of 4
www.diodes.com January 2012
© Diodes Incorporated
1SS361LP3
NEW PRODUCT
0.0001
0.1
0.01
0.001
1
10
100
V , INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 T y pical Reverse Characteristics
R
I , INSTANT A NEOUS REVERSE CURRENT ( A)
R
μ
0 1020304050607080
V , DC REVERSE VOL TAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
R
C , TOTAL CAPACIT A NCE (pF)
T
0.2
0.4
0.6
0.8
110100
f = 1 M H z
0
1
Package Outline Dimensions
Suggested Pad Layout
X3-DFN0603-2
Dim Min Max Typ
A 0.27 0.35 0.30
A1 0.00 0.03 0.02
b 0.19 0.29 0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e - - 0.355
L 0.14 0.24 0.19
All Dimensions in mm
Dimensions Value (in mm)
C 0.355
X 0.230
Y 0.300
Z 0.610
Z
Y (2x)
X (2x )
C
L (2x)
Eb (2x)
D
A1 (2x)
A
e
Bottom View
1SS361LP3
Document number: DS35233 Rev. 5 - 2 4 of 4
www.diodes.com January 2012
© Diodes Incorporated
1SS361LP3
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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