6N136
θ
(Ta=25˚C)
IF25 mA
IF50 mA
IFM 1A
VR5V
P45 mW
VCC V
VOV
VEBO 5V
IO8mA
IOP 16 mA
IB5mA
PO100 mW
Viso(rms)
Topr ˚C
Tstg ˚C
Tso1 260 ˚C
0.8
0.5 TYP.
1234
5
6
7
8
1234
5678
1 NC
4 NC
5 GND
kV
7 VB
8 VCC
6.5±0.5
1.2±0.3
0.85±0.3
9.22±0.5
7.62±0.3
3.5±0.5
3.7±0.5
0.5±0.1 2.54±0.25 0.26±0.1
■ Features
■ Applications
θ=0 to 13˚
■ Absolute Maximum Ratings
Rating
Input
Output
−0.5 to +15
−0.5 to +15
−55 to +100
−55 to +125
*1
*2
*3
*4
■ Outline Dimensions ( Unit : mm )
Internal connection
diagram
2 Anode
3 Cathode 6 VO
Primary side mark (Sunken place)
2.5
UnitSymbolParameter
6N136
Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
General Purpose Type
*OPIC Photocoupler
6N136
1. High speed response
( tPHL, tPLH : MAX.0.8µs at RL=1.9kΩ )
2. High common mode rejection voltage
( CMH : TYP. 1kV/µs )
3. Standard dual-in-line package
4. Recognized by UL, file No. E64380
1. Computers, measuring instruments, control
equipment
2. High speed line receivers, high speed logic
3. Telephone sets
4. Signal transmission between circuits of
different potentials and impedances
Forward current
Peak forward current
Peak transient forward current
Reverse voltage
Power dissipation
Supply voltage
Output voltage
Emitter-base reverse with-
stand voltage (Pin 5 to 7)
Average output current
Peak output current
Base current (Pin 7)
Power dissipation
Isolation voltage
Operating temperature
Storage temperature
Soldering temperature
*1 50% duty cycle, Pulse width=1ms
Decreases at the rate of 1.6mA/˚C if the external temperature is 70˚C or more.
*2 Pulse width≤1µs, 300pulse/s
*3 40 to 60% RH, AC for 1 minute
*4 For 10 seconds
* "OPIC" (Optical IC) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signal-
processing circuit integrated onto a single chip.
■ Electro-optical Characteristics (Ta=0 to 70˚C unless otherwise specified)
*6
*6
*6
MIN. TYP. MAX.
19 40 −%
15 43 −%
VOL −0.1 0.4 V
−3.0 500 nA
−0.01 1.0 µA
−−50 µA
ICCL −200 −µA
−0.02 1.0 µA
−−2.0 µA
VF−1.7 1.95 V
∆VF/∆Ta−−1.9 −mV / ˚C
BVR5.0 −−V
CIN −60 −pF
II-O −−1.0 µA
RI-O −1012 −Ω
CI-O f=1MHz −0.6 −pF
hFE −70 −
*5
Symbol Unit
CTR(1)
CTR(2)
IOH(1)
IOH(2)
IOH(3)
ICCH(1)
Parameter Conditions
Ta=25˚C, IF=16mA
VO=0.4V, VCC=4.5V
IF=16mA, VO=0.5V
VCC=4.5V
IF=16mA, VCC=4.5V, IO=2.4mA
Ta=25˚C, IF=0
VCC=VO=5.5V
Ta=25˚C, IF=0
VCC=VO=15V
IF=0, VCC=VO=15V
IF=16mA, VCC=15V
VO=open
Ta=25˚C, VCC=15V
VF=open, IO=0
VCC=15V
VO=open, IF=0
Ta=25˚C, IF=16mA
IF=16mA
Ta=25˚C, IR=10mA
VF=0, f=1MHz
Ta=25˚C, 45%RH, t=5s
VI-O=3kVDC
VI-O=500VDC
VO=5V, IO=3mA
ICCH(2)
6N136
*5 Current transfer ratio is the ratio of input current and output current expressed in %.
*6 Measured as 2-pin element (Short 1, 2, 3, 4 and 5, 6, 7, 8)
Current transfer ratio
Logic (0) output voltage
Logic (1) output current
Logic (0) supply current
Logic (1) supply current
Input forward voltage
Input forward voltage
temperature coefficient
Input reverse voltage
Input capacitance
Leak current (input-output)
Isolation resistance (input-output)
Capacitance (input-output)
Transistor current
amplification factor
tPHL RL=1.9kΩ−0.3 0.8 µs
tPLH RL=1.9kΩ−0.3 0.8 µs
CMH−−kV/µs
CML−−kV/µs
BW RL=100Ω−2.0 −MHz
100Ω
1
2
3
4
8
7
6
5
1.5V 1.5V
5V
5
6
7
8
4
3
2
1
+−
A
B
10V
0V
2V
0.8V
10%
90% 10%
90%
IF
IFCL=15pF
VO
VCC
RL
IF
0
VO
tPHL tPLH
VFF
IF
VCM
RL
VOCMH
VO
CML
VOIF=16mA
IF=0 5V
VOL
trtf
IF=0, VCM=10V , RL=1.9kΩ
P-P
V
CM
=10V
P-P
, I
F
=16mA, RL=1.9kΩ
*12
VCC=5V
(Ta=25˚C, VCC =5V, IF=16mA)
Symbol MIN. TYP. MAX. Unit
*8
*9
*8
*9
*10
*11
*10
*11
*9 Test Circuit for Propagation Delay Time
Pulse input
Duty ratio
=1/10
Pulse
Generator
monitor
*11 Test Circuit for Instantaneous Common Mode Rejection Voltage
VCM
1.0
−1.0
0.01µF
0.01µF
VOL
Parameter Conditions
6N136
■ Switching Characteristics
Propagation delay time
Output (1) → (0)
Propagation delay time
Output (0) → (1)
Instantaneous common
mode rejection voltage
" output (1) "
Instantaneous common
mode rejection voltage
" output (0) "
Bandwidth
*8 RL=1.9kΩ is equivalent to one LSTTL and 5.6kΩ pull-up resistor.
*10 Instantaneous common mode rejection voltage " output (1) " represents
a common mode voltage variation that can hold the output above (1) level (VO>2.0V)
Instantaneous common mode rejection voltage " output (0) " represents
a common mode voltage variation that can hold the output above (0) level (VO<0.8V)
*12 Bandwidth represents a point where AC input gose down by 3dB.
5
10
30
25
20
15
01251007550250−55 0
120
P
0 25 50 75 100 125
100
80
60
20
40
70
45
50˚C
25˚C
70˚C
1.0
0.01
0.1
1
10
100
1.2 1.4 1.6 1.8 2.0 2.2 0
0.1
50
100
150
1 10 100
00
2
2 4 6 8 10 12 14 16 18 20
4
6
8
10
12
14 20mA
15mA
10mA
5mA
20
16
18
80
60
70
90
100
110
0 20 40 60 80 100
−60 −40 −20
PO
Ta=0˚C
Ta=25˚C
VO=0.4V
VCC =5V
Ta=25˚C
VCC =5V
IF=25mA
IF=16mA
VO=0.4V
VCC =5V
Fig. 1 Forward Current vs.
Ambient Temperature Fig. 2 Power Dissipation vs.
Ambient Temperature
Fig. 3 Forward Current vs.
Forward Voltage Fig. 4 Relative Current Transfer Ratio vs.
Forward Current
Fig. 5 Output Current vs. Output Voltage Fig. 6 Relative Current Transfer Ratio vs.
Ambient Temperature
Relative current transfer ratio (%)
Forward current IF (mA)
Power dissipation P, PO (mW)
Ambient Temperature Ta (˚C)
Forward voltage VF (V)
CTR=100% at IF=16mA
CTR=100% at Ta=25˚C
Dotted line shows
pulse characteristics
−40
6N136
Ambient Temperature Ta (˚C)
Ambient Temperature Ta (˚C)
Forward current IF (mA)
Forward current IF (mA)
Relative current transfer ratio (%)
Output voltage VO (V)
Output current IO (mA)
−60 −20 20 60 10080400−40 −60 −40 −20 0 20 100806040
0.1 0.2 0.5 1 2 5 10
220Ω
470Ω
1kΩ
IF=16mA
Ta=25˚C
RL=100Ω
100Ω
15V
VO
560Ω
AC
20kΩRL
1.6V DC
0.25V
5V 1
2
3
4
8
7
6
5
VCC =5V
IF=16mA
tPLH
tPHL
Propagation delay time tPHL, tPLH (µs)
Test Circuit for Frequency Characteristic
Input
High level output current IOH (A)
Voltage gain AV (dB)
Frequency f (MHz)
P-PAC
RL=1.9kΩ
0.8
0.6
0.4
0.2
0
10 −5
10 −6
10 −7
10 −8
10 −9
10 −10
10 −11
VCC =V O=5V
0
−5
−10
−15
−20
−25
−30
6N136
Ambient Temperature Ta (˚C) Ambient Temperature Ta (˚C)
Fig. 7 Propagation Delay Time vs.
Ambient Temperature
Fig. 9 Frequency Response
Fig. 8 High Level Output Current vs.
Ambient Temperature
■ Precaution for use
(1) It is recommended that a by-pass capacitor of more than 0.01µF be added between VCC and GND near the
device in order to stabilize power supply line.
(2) Transistor of detector side in bipolar configuration is apt to be affected by static electricity for its minute design.
When handling them, general conterplan against static electricity should be taken to avoid breakdown of devices
or degradation of characteristics.
115
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
