DIM200PKM33-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/6
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FEATURES
■10µs Short Circuit Withstand
■High Thermal Cycling Capability
■Non Punch Through Silicon
■Isolated MMC Base with AlN Substrates
APPLICATIONS
■Choppers
■Traction Auxiliaries
The Powerline range of high power modules includes half
bridge, chopper, dual, single and bi-directional switch
configurations covering voltages from 600V to 3300V and
currents up to 2400A.
The DIM200PKM33-A000 is a 3300V, n channel
enhancement mode insulated gate bipolar transistor (IGBT)
chopper module configured with the upper arm of the bridge
controlled. The IGBT has a wide reverse bias safe operating
area (RBSOA) plus full 10µs short circuit withstand. This device
is optimised for applications requiring high thermal cycling
capability.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM200PKM33-A000
Note: When ordering, please use the whole part number.
KEY PARAMETERS
VCES 3300V
VCE(sat) * (typ) 3.2V
IC(max) 200A
IC(PK) (max) 400A
*(measured at the power busbars and not the auxiliary terminals)
DIM200PKM33-A000
IGBT Chopper Module
Preliminary Information
DS5598-1.1 April 2003
Fig. 1 Chopper circuit diagram - upper arm control
Fig. 2 Electrical connections - (not to scale)
Outline type code: P
(See package details for further information)
3(A)
2(C1)
1(E1/K)
8(C
1)
5(E
1)
4(G
1)
DIM200PKM33-A000
2/6 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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ABSOLUTE MAXIMUM RATINGS - IGBT ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise
THERMAL AND MECHANICAL RATINGS
Internal insulation material: AlN
Baseplate material: AlSiC
Creepage distance: 33mm
Clearance: 20mm
CTI (Critical Tracking Index): 175
Test Conditions
VGE = 0V
-
Tcase = 85˚C
1ms, Tcase = 115˚C
Tcase = 25˚C, Tj = 150˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
IEC1287. V1 = 2450V, V2 = 1800V, 50Hz RMS
Symbol
VCES
VGES
IC
IC(PK)
Pmax
Visol
QPD
Units
V
V
A
A
W
V
pC
Max.
3300
±20
200
400
2608
6000
10
Parameter
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Isolation voltage - per module
Partial discharge - per module
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M5
Parameter
Thermal resistance - transistor (IGBT arm)
Thermal resistance - diode (IGBT arm)
Thermal resistance - diode (diode arm)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
Symbol
Rth(j-c)
Rth(j-c)
Rth(c-h)
Tj
Tstg
-
Units
˚C/kW
˚C/kW
˚C/kW
˚C/kW
˚C
˚C
˚C
Nm
Nm
Max.
48
96
96
16
150
125
125
5
4
Typ.
-
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
-
–40
-
-
DIM200PKM33-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/6
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Note:
† Measured at the power busbars and not the auxiliary terminals)
L* is the circuit inductance + LM
ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise.
Test Conditions
VGE = 0V, VCE = VCES
VGE = 0V, VCE = VCES, Tcase = 125˚C
VGE = ±20V, VCE = 0V
IC =20mA, VGE = VCE
VGE = 15V, IC = 200A
VGE = 15V, IC = 200A, , Tcase = 125˚C
DC
DC
tp = 1ms
tp = 1ms
IF = 200A (IGBT arm)
IF = 200A (Diode arm)
IF = 200A, Tcase = 125˚C (IGBT arm)
IF = 200A, Tcase = 125˚C (diode arm)
VCE = 25V, VGE = 0V, f = 1MHz
VCE = 25V, VGE = 0V, f = 1MHz
-
-
T
j
= 125˚C, V
CC
= 2500V,
I1
t
p
≤ 10µs,
V
CE(max)
= V
CES
– L*. di/dt
I2
IEC 60747-9
Parameter
Collector cut-off current
(IGBT arm)
Gate leakage current
(IGBT arm)
Gate threshold voltage
(IGBT arm)
Collector-emitter saturation voltage
(IGBT arm)
Diode forward current (IGBT arm)
Diode forward current (diode arm)
Diode maximum forward current
(IGBT arm)
Diode maximum forward current
(diode arm)
Diode forward voltage
Input capacitance
(IGBT arm)
Reverse transfer capacitance
(IGBT arm)
Module inductance - per switch
Internal transistor resistance
(IGBT arm)
Short circuit. ISC
Symbol
ICES
IGES
VGE(TH)
VCE(sat)
†
IF
IFM
VF
†
Cies
Cres
LM
RINT
SCData
Units
mA
mA
µA
V
V
V
A
A
A
A
V
V
V
V
nF
nF
nH
mΩ
A
A
Max.
1
15
2
6.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
-
5.5
3.2
4.0
200
200
400
400
2.5
2.5
2.5
2.5
45
2.5
30
0.54
1300
1100
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DIM200PKM33-A000
4/6 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Units
ns
ns
mJ
ns
ns
mJ
µC
µC
A
mJ
Max.
-
-
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
-
-
-
-
-
Test Conditions
IC = 200A
VGE = ±15V
VCE = 1800V
RG(ON) = RG(OFF) =10Ω
Cge = 33nF
L ~ 100nH
IF = 200A, VR = 1800V,
dIF/dt = 1100A/µs
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Gate charge
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
ELECTRICAL CHARACTERISTICS - IGBT ARM
Tcase = 25˚C unless stated otherwise
Symbol
td(off)
tf
EOFF
td(on)
tr
EON
Qg
Qrr
Irr
EREC
Tcase = 125˚C unless stated otherwise
Units
ns
ns
mJ
ns
ns
mJ
µC
A
mJ
Max.
-
-
-
-
-
-
-
-
-
Typ.
1600
250
240
640
300
420
190
185
220
Min.
-
-
-
-
-
-
-
-
-
Test Conditions
IC = 200A
VGE = ±15V
VCE = 1800V
RG(ON) = RG(OFF) =10Ω
Cge = 33nF
L ~ 100nH
IF = 200A, VR = 1800V,
dIF/dt = 1000A/µs
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
Symbol
td(off)
tf
EOFF
td(on)
tr
EON
Qrr
Irr
EREC
Typ.
1300
200
170
640
250
290
6
115
165
130
DIM200PKM33-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 5/6
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PACKAGE DETAILS
For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Nominal weight: 750g
Module outline type code: P
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
SALES OFFICES
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee
that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure
that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
