MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 Available Surface Mount 3000 Watt Transient Voltage Suppressor Screening in reference to MIL-PRF-19500 available DESCRIPTION The MSMLG(J)5.0A through MXLSMLG(J)170A series of high-reliability Transient Voltage Suppressors (TVSs) protect circuits from voltage spikes containing up to 3000 W (10/1000 s model pulse. The SMLG gull-wing design in the DO-215AB package allows for visible solder connections. The SMLJ J-bend design in the DO-214AB package allows for greater PC board mounting density. Selections include unidirectional and bidirectional as well as RoHS compliant versions. These are available with a variety of upscreening options for enhanced reliability. They protect against the secondary effects of lightning per IEC61000-4-5 and against voltage pulses from inductive switching environments and induced by RF radiation. Since their response time is virtually instantaneous, they can also be used in protection from ESD and EFT per IEC61000-4-2 and IEC61000-4-4. DO-215AB Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * * * * * * * * High reliability devices with fabrication and assembly lot traceability for all M prefix devices All devices are 100% surge tested 3 lot norm screening performed on standby current (I D ) for all M prefix devices Available in both unidirectional and bidirectional versions Moisture classification is "Level 1" with no dry pack required per IPC/JEDEC J-STD-020B for all M prefix devices. Enhanced reliability screening options with M prefix are available in reference to MIL-PRF-19500. Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening options. (See part nomenclature for all available options.) RoHS compliant versions available Axial-lead equivalent packages for thru-hole mounting are available as M5KP5.0A to M5KP110CA with 5000 W rating (contact Microsemi for other surface mount options). DO-214AB Package APPLICATIONS / BENEFITS * * * * * * * Suppresses transients up to 3000 watts (10/1000 us test pulse - see Figure 2) Selections for 5.0 to 170 volts standoff voltages (V WM ) Protection from switching transients and induced RF Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4 Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1 & 2: SML 5.0A to SML 170A or CA Class 3: SML 5.0A to SML 150A or CA Class 4: SML 5.0A to SML 75A or CA Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: SML 5.0A to SML 170A or CA Class 2: SML 5.0A to SML 90A or CA Class 3: SML 5.0A to SML 48A or CA Class 4: SML 5.0A to SML 24A or CA Secondary lightning protection per IEC61000-4-5 with 2 ohms source impedance: Class 2: SML 5.0A to SML 43A or CA Class 3: SML 5.0A to SML 22A or CA Class 4: SML 5.0A to SML10A or CA RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead (1) Thermal Resistance Junction-to-Ambient Peak Pulse Power Dissipation @ 25 C (at 10/1000 s, see Figures 1, 2, and 3) Impulse Repetition Rate (duty factor) t clamping (0 volts to V (BR) min.) Unidirectional Bidirectional Rated Average Power Dissipation T L = +45 C T A = +25 C (2) Maximum Forward Surge Current Solder Temperature @ 10 s Symbol T J and T STG R JL R JA P PP Value -65 to +150 17.5 77.5 3000 Unit C C/W C/W W df 0.01 or less <100 <5 6 (1) 1.61 200 260 % ps ns W t clamping P M(AV) I FSM T SP A (pk) o C Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page) 2. Peak impulse of 8.3 ms half-sine wave at 25 C (unidirectional only) MECHANICAL and PACKAGING * * * * * * * CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026. MARKING: Part number marked on package POLARITY: Cathode indicated by band. No cathode band on bi-directional devices TAPE & REEL option: Standard per EIA-481-B with 16 mm tape (add "TR" suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.25 grams See Package Dimensions on last page. PART NOMENCLATURE MX SM L G 5.0 C A e3 Reliability Level* M (controlled product) MA (Avionics grade) MX (reference JANTX) MXL (MX Lite) Blank = commercial *(see High Reliability Up-Screened Plastic Products Portfolio) RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant Surface Mount Package Reverse Stand-Off Voltage (see Electrical Characteristics table) +/- 5% Tolerance Level Uni/Bidirectional C = Bidirectional Blank = Unidirectional 3000 W Power Level Gull-wing Lead Frame G = Gull-Wing J = J-Bend RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 2 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 SYMBOLS & DEFINITIONS Definition Symbol I (BR) ID IF Breakdown Current: The current used for measuring breakdown voltage V (BR) . Standby Current: The current at the rated standoff voltage (V WM ). Forward Current: The forward current dc value, no alternating component. Average Rectified Output Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180 degree conduction angle. Peak Impulse Current: The peak current during the impulse. Peak Pulse Power: The peak power dissipation resulting from the peak impulse current I PP . Clamping Voltage: Maximum clamping voltage at specified I PP (Peak Pulse Current) at the specified pulse conditions. Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Voltage: The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as standoff voltage. IO I PP P PP VC V (BR) V WM ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated PART NUMBER Gull-Wing SMLG5.0A SMLG6.0A SMLG6.5A SMLG7.0A SMLG7.5A SMLG8.0A SMLG8.5A SMLG9.0A SMLG10A SMLG11A SMLG12A SMLG13A SMLG14A SMLG15A SMLG16A SMLG17A SMLG18A SMLG20A SMLG22A SMLG24A SMLG26A SMLG28A SMLG30A SMLG33A SMLG36A SMLG40A SMLG43A SMLG45A SMLG48A SMLG51A SMLG54A SMLG58A SMLG60A SMLG64A SMLG70A SMLG75A J-Bend SMLJ5.0A SMLJ6.0A SMLJ6.5A SMLJ7.0A SMLJ7.5A SMLJ8.0A SMLJ8.5A SMLJ9.0A SMLJ10A SMLJ11A SMLJ12A SMLJ13A SMLJ14A SMLJ15A SMLJ16A SMLJ17A SMLJ18A SMLJ20A SMLJ22A SMLJ24A SMLJ26A SMLJ28A SMLJ30A SMLJ33A SMLJ36A SMLJ40A SMLJ43A SMLJ45A SMLJ48A SMLJ51A SMLJ54A SMLJ58A SMLJ60A SMLJ64A SMLJ70A SMLJ75A REVERSE STAND-OFF VOLTAGE V WM Volts 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 BREAKDOWN VOLTAGE V (BR) @ I (BR) Volts I (BR) MIN. MAX. mA 6.40 - 7.00 10 6.67 - 7.37 10 7.22 - 7.98 10 7.78 - 8.60 10 8.33 - 9.21 1 8.89 - 9.83 1 9.44 - 10.4 1 10.0 - 11.1 1 11.1 - 12.3 1 12.2 - 13.5 1 13.3 - 14.7 1 14.4 - 15.9 1 15.6 - 17.2 1 16.7 - 18.5 1 17.8 - 19.7 1 18.9 - 20.9 1 20.0 - 22.1 1 22.2 - 24.5 1 24.4 - 26.9 1 26.7 - 29.5 1 28.9 - 31.9 1 31.1 - 34.4 1 33.3 - 36.8 1 36.7 - 40.6 1 40.0 - 44.2 1 44.4 - 49.1 1 47.8 - 52.8 1 50.0 - 55.3 1 53.3 - 58.9 1 56.7 - 62.7 1 60.0 - 66.3 1 64.4 - 71.2 1 66.7 - 73.7 1 71.1 - 78.6 1 77.8 - 86.0 1 83.3 - 92.1 1 MAXIMUM CLAMPING VOLTAGE @ I PP PEAK PULSE CURRENT (See Fig. 2) I PP Volts 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103.0 113 121 Amps 326.0 291.3 267.9 250.0 232.6 220.6 208.4 194.8 176.4 164.8 150.6 139.4 129.4 123.0 115.4 106.6 102.8 92.6 84.4 77.2 71.2 66.0 62.0 56.2 51.6 46.4 43.2 41.2 38.8 36.4 34.4 32.0 31.0 29.2 26.6 24.8 MAXIMUM STANDBY CURRENT @ V WM ID A 1000 1000 500 200 100 50 25 10 5 5 5 5 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Continued. RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 3 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 ELECTRICAL CHARACTERISTICS @ 25 C unless otherwise stated (continued) MICROSEMI PART NUMBER Gull-Wing SMLG78A SMLG85A SMLG90A SMLG100A SMLG110A SMLG120A SMLG130A SMLG150A SMLG160A SMLG170A NOTE 1: J-Bend SMLJ78A SMLJ85A SMLJ90A SMLJ100A SMLJ110A SMLJ120A SMLJ130A SMLJ150A SMLJ160A SMLJ170A REVERSE STAND-OFF VOLTAGE V WM Volts 78 85 90 100 110 120 130 150 160 170 BREAKDOWN VOLTAGE V (BR) @ I (BR) Volts I (BR) MIN. MAX. mA 86.7 - 95.8 1 94.4 - 104.0 1 100 - 111 1 111 - 123 1 122 - 135 1 133 - 147 1 144 - 159 1 167 - 185 1 178 - 197 1 189 - 209 1 MAXIMUM CLAMPING VOLTAGE @ I PP PEAK PULSE CURRENT (See Fig. 2) I PP Volts 126 137 146 162 177 193 209 243 259 275 Amps 22.8 20.8 20.6 18.6 16.8 15.6 14.4 12.4 11.6 11.0 MAXIMUM STANDBY CURRENT @ V WM ID A 2 2 2 2 2 2 2 2 2 2 Bidirectional capacitance is half that shown in figure 4 at zero volts. RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 4 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 PPP - Peak Pulse Power - kW GRAPHS tp - Pulse Time - sec FIGURE 1 Peak Pulse Power vs. Pulse Time IPP - Peak Pulse Current - % IPP Test wave form parameters tr = 10 sec. tp = 1000 sec. t - Time (msec) FIGURE 2 Pulse Waveform RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 5 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 Peak Pulse Power (PPP) or continuous o Power in Percent of 25 C Rating GRAPHS (continued) o T L Lead Temperature C C - Capacitance (pF) FIGURE 3 Derating Curve B V - Breakdown Voltage (V) FIGURE 4 Typical Capacitance vs. Breakdown Voltage (unidirectional configuration) NOTE: Bidirectional capacitance is half that shown at zero volts. RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 6 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 PACKAGE DIMENSIONS SMLG (DO-215AB) Ltr A B C E F K Dimensions Inch Millimeters Min Max Min Max 0.115 0.121 2.92 3.07 0.260 0.280 6.60 7.11 0.220 0.245 5.59 6.22 0.077 0.110 1.95 2.80 0.380 0.400 9.65 10.16 0.025 0.040 0.635 1.016 NOTES: Dimension "E" exceeds the JEDEC outline as shown. Typical Standoff Height: 0.004" - 0.008" (0.1 mm - 0.2 mm). SMLJ (DO-214AB) Ltr A B C D E L Dimensions Inch Millimeters Min Max Min Max 0.115 0.121 2.92 3.07 0.260 0.280 6.60 7.11 0.220 0.245 5.59 6.22 0.305 0.320 7.75 8.13 0.077 0.110 1.95 2.80 0.030 0.060 0.760 1.52 NOTES: Dimension "E" exceeds the JEDEC outline in height as shown. Typical Standoff Height: 0.004" - 0.008" (0.1 mm - 0.2 mm). RF01003, Rev. C (7/30/13) (c)2013 Microsemi Corporation Page 7 of 8 MSMLG5.0A - MSMLG170CAe3, MSMLJ5.0 - MSMLJ170CAe3 PAD LAYOUT RF01003, Rev. C (7/30/13) Ltr A B C SMLG (DO-215AB) Inch Millimeters 0.510 12.95 0.110 2.79 0.150 3.81 Ltr A B C SMLJ (DO-214AB) Inch Millimeters 0.390 9.90 0.110 2.79 0.150 3.81 (c)2013 Microsemi Corporation Page 8 of 8