SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DState-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static Power
Dissipation
DSupport Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
DSupport Unregulated Battery Operation
Down to 2.7 V
DTypical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
DESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model
(C = 200 pF, R = 0)
DLatch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
DBus-Hold Data Inputs Eliminate the Need
for External Pullup Resistors
DSupport Live Insertion
DPackage Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Packages, and Ceramic
(J) DIPs
description
These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to
provide a TTL interface to a 5-V system environment.
The eight latches of the ’LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the
Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up
at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus
lines without need for interface or pullup components. OE does not affect the internal operations of the latches.
Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT573 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count
and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT573 is characterized for operation over the full military temperature range of −55°C to 125°C. The
SN74LVT573 is characterized for operation from −40°C to 85°C.
Copyright © 1995, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
LE
SN54LVT573 ...J OR W PACKAGE
SN74LVT573 . . . DB, DW, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
2Q
3Q
4Q
5Q
6Q
3D
4D
5D
6D
7D
2D
1D
OE
8Q
7Q 1Q
8D
GND
LE
V
CC
SN54LVT573 . . . FK PACKAGE
(TOP VIEW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FUNCTION TABLE
(each latch)
INPUTS OUTPUT
OE LE D
OUTPUT
Q
L H H H
LHL L
LLX Q
0
H X X Z
logic symbollogic diagram (positive logic)
OE
1D
2
1D 3
2D 4
3D 5
4D 6
5D
C1
11
LE
1Q
19
2Q
18
3Q
17
4Q
16
5Q
15
6Q
14
7Q
13
8Q
12
7
6D 8
7D 9
8D
EN
1
OE
LE
1D
1Q
1
11
2
19
To Seven Other Channels
C1
1D
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC 0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state or power-off state, VO (see Note 1) 0.5 V to 7 V. . . .
Current into any output in the low state, IO: SN54LVT573 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74LVT573 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the high state, IO (see Note 2): SN54LVT573 48 mA. . . . . . . . . . . . . . . . . . . . . . . . .
SN74LVT573 64 mA. . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DB package 0.6 W. . . . . . . . . . . . . . . . . . . .
DW package 1.6 W. . . . . . . . . . . . . . . . . . .
PW package 0.7 W. . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology
Data Book, literature number SCBD002B.
SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions (see Note 4)
SN54LVT573 SN74LVT573
UNIT
MIN MAX MIN MAX UNIT
VCC Supply voltage 2.7 3.6 2.7 3.6 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 5.5 5.5 V
IOH High-level output current −24 −32 mA
IOL Low-level output current 48 64 mA
Δt/ΔvInput transition rise or fall rate Outputs enabled 10 10 ns / V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 4: Unused control inputs must be held high or low to prevent them from floating.
SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54LVT573 SN74LVT573
UNIT
PARAMETER TEST CONDITIONS MIN TYPMAX MIN TYPMAX UNIT
VIK VCC = 2.7 V, II = −18 mA −1.2 −1.2 V
VCC = MIN to MAX, IOH = −100 μA VCC 0.2 VCC 0.2
V
VCC = 2.7 V, IOH = − 8 mA 2.4 2.4
V
VOH
V3V
IOH = − 24 mA 2V
VCC = 3 V IOH = −32 mA 2
V27V
IOL = 100 μA 0.2 0.2
VCC = 2.7 V IOL = 24 mA 0.5 0.5
V
IOL = 16 mA 0.4 0.4
V
VOL
V3V
IOL = 32 mA 0.5 0.5 V
VCC = 3 V IOL = 48 mA 0.55
IOL = 64 mA 0.55
VCC = 0 or MAX, VI = 5.5 V 50 10
II
V36V
VI = VCC or GND Control
inputs ±1±1
μ
A
II
VCC = 3.6 V VI = VCC
Data inputs
1 1
μA
VI = 0 Data inputs −5 −5
Ioff VCC = 0, VI or VO = 0 to 4.5 V ±100 μA
I
V3V
VI = 0.8 V
Data inputs
75 75
A
II(hold) VCC = 3 V VI = 2 V Data inputs −75 −75 μA
IOZH VCC = 3.6 V, VO = 3 V 1 1 μA
IOZL VCC = 3.6 V, VO = 0.5 V −1 −1 μA
Outputs high 0.13 0.39 0.13 0.19
ICC
VCC = 3.6 V, IO = 0, Outputs low 8.6 14 8.6 12
mA
I
CC
VCC
3.6
V, IO
0,
VI = VCC or GND Outputs
disabled 0.13 0.39 0.13 0.19
m
A
ΔICC§VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,
Other inputs at VCC or GND 0.3 0.2 mA
CiVI = 3 V or 0 4 4 pF
CoVO = 3 V or 0 8 8 pF
All typical values are at VCC = 3.3 V, TA = 25°C.
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
§This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
SN54LVT573 SN74LVT573
VCC = 3.3 V
± 0.3 V VCC = 2.7 V VCC = 3.3 V
± 0.3 V VCC = 2.7 V UNIT
MIN MAX MIN MAX MIN MAX MIN MAX
twPulse duration, LE high 3.3 3.3 3.3 3.3 ns
tsu Setup time, data before LE1 0.9 0.7 0.6 ns
thHold time, data after LE1.8 2 1.6 1.8 ns
SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
SN54LVT573 SN74LVT573
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC = 3.3 V
± 0.3 V VCC = 2.7 V VCC = 3.3 V
± 0.3 V VCC = 2.7 V UNIT
(INPUT)
(OUTPUT)
MIN MAX MIN MAX MIN TYPMAX MIN MAX
tPLH
D
Q
0.5 4.7 4.9 1 2.5 4.2 4.7
ns
tPHL
D Q 0.5 4.9 5.4 1 2.7 4.3 5.2 ns
tPLH
LE
Q
1 6 6.9 1.6 3.5 5.6 6.3
ns
tPHL
LE Q 1.4 6.9 7.6 2.5 4.3 6.5 7.2 ns
tPZH
OE
Q
0.5 5.3 6.4 1 2.8 5.1 6.2
ns
tPZL
OE Q0.7 5.7 7.2 1.3 3.3 5.5 6.6 ns
tPHZ
OE
Q
1.2 5.9 6.9 2 3.7 5.7 6.7
ns
tPLZ
OE Q1 5.4 5.5 1.5 3 4.6 5.1 ns
All typical values are at VCC = 3.3 V, TA = 25°C.
SN54LVT573, SN74LVT573
3.3-V ABT OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCBS138D − MAY 1992 − REVISED JULY 1995
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT FOR OUTPUTS
S1
6 V
Open
GND
500 Ω
500 Ω
Data Input
Timing Input 1.5 V
2.7 V
0 V
1.5 V 1.5 V
2.7 V
0 V
2.7 V
0 V
1.5 V 1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V
2.7 V
0 V
1.5 V1.5 V
Input
1.5 V
Output
Control
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
3 V
0 V
1.5 V VOL + 0.3 V
1.5 V VOH − 0.3 V
[ 0 V
2.7 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6 V
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, tr 2.5 ns, tf 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVT573DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LVT573DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74LVT573PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVT573DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74LVT573DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74LVT573PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated