GBPC12, 15, 25 and 35
Document Number 88612
08-Jul-05
Vishay General Semiconductor
www.vishay.com
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GBPCGBPC-W
Glass Passivated Single-Phase Bridge Rectifier
Major Ratings and Characteristics
IF(AV) 12 A, 15 A, 25 A, 35 A
VRRM 50 V to 1000 V
IFSM 200 A, 300 A, 300 A, 400 A
IR5 µA
VF1.1 V
Tj max. 150 °C
Features
• UL Recognition file number E54214
• Universal 3-way terminals: snap-on, wire wrap-
around, or P.C.B. mounting
• Typical IR less than 0.3 µA
• High surge current capability
• Low thermal resistance
• Solder Dip 260 °C, 40 seconds
Typical Applications
General purpose use in ac-to-dc bridge full wave rec-
tification for Power Supply, Home Appliances, Office
Equipment, Industrial Automation applications
Mechanical Data
Case: GBPC, GBPC-W
Epoxy meets UL-94V-0 Flammability rating
Terminals: Nickel plated on faston lugs or Silver
plated on wire leads (E4 Suffix), solderable per
J-STD-002B and JESD22-B102D. Suffix letter "W"
added to indicate wire leads (e.g.
GBPC12005W)
Polarity: As marked, Positive lead by belevled corner
Mounting Torque: 20 inches-lbs. max.
Maximum Ratings
Ratings at 25 °C ambient temperature unless otherwise specified.
Parameter Symbols GBPC12, 15, 25, 35 Units
005 01 02 04 06 08 10
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Maximum average forward rectified output
current (See Fig.1)
GBPC12
GBPC15
GBPC25
GBPC35
IF(AV) 12
15
25
35
A
Peak forward surge current single sine-
wave superimposed on rated load
GBPC12
GBPC15
GBPC25
GBPC35
IFSM 200
300
300
400
A
Rating (non-repetitive, for t greater than
1 ms and less than 8.3 ms) for fusing
GBPC12
GBPC15
GBPC25
GBPC35
I2t 160
375
375
660
A2 sec
RMS isolation voltage from case to leads VISO 2500 V
Operating junction storage temperature range TJ, TSTG - 55 to + 150 °C
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Document Number 88612
08-Jul-05
GBPC12, 15, 25 and 35
Vishay General Semiconductor
Electrical Characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Thermal Characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Notes:
(1) Thermal resistance from junction to case per leg
(2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
Ratings and Characteristics Curves
(TA = 25 °C unless otherwise noted)
Parameter Test condition Symbols GBPC12, 15, 25, 35 Units
005 01 02 04 06 08 10
Maximum instantaneous
forward drop per leg
GBPC12
GBPC15
GBPC25
GBPC35
IF = 6.0 A
IF = 7.5 A
IF = 12.5 A
IF = 17.5 A
VF1.1 V
Maximum reverse DC current at rated DC
blocking voltage per leg
TA = 25 °C
TA = 125 °C
IR5.0
500
µA
Typical junction capacitance per leg at 4 V, 1 MHz CJ 300 pF
Parameter Symbols GBPC12, 15, 25, 35 Units
005 01 02 04 06 08 10
Typical thermal resistance per leg (1) GBPC12-25
GBPC35
RθJC 1.9
1.4
°C/W
Figure 1. Maximum Output Rectified Current
Case Temperature (°C)
Average Forward Current (A)
025 50 75 100 125 150 175 200
0
5
10
15
20
25
30
35
40
Bridges Mounted on
9.5 x 3.5 x 4.6"
(22.9 x 8.9 x 11.7 cm)
AL. Finned Plate
5x6x4.9"
AL, Finned Plate
5x4x3"
AL. Finned Plate
6 x 2.2 x 2.2"
AL. Finned Plate
60 H
Z
Resistive or
Inductive Load
Figure 2. Maximum Output Rectified Current
Ambient Temperature (°C)
Average Forward Current (A)
010 20 30 40 50 60 70 80 90 100
0
5
10
15
20
25
30
35
40
60 H
Z
Resistive or
Inductive Load
GBPC35
RthS-A = 0.5°C/W
GBPC25
RthS-A = 0.5°C/W
GBPC15
RthS-A = 1.0°C/W
GBPC12
RthS-A = 1.0°C/W
GBPC12, 15, 25 and 35
Document Number 88612
08-Jul-05
Vishay General Semiconductor
www.vishay.com
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Figure 3. Maximum Power Dissipation
Figure 4. Maximum Non-Repetitive Peak Forward Surge Current
Per Leg
Figure 5. Typical Instantaneous Forward Characteristics Per Leg
Average Output Current (A)
Average Power Dissipation of Bridge (W)
010 20 30 40
0
10
20
30
40
50
60
70
80
Capacitive Load
T
J
=T
J
max.
Resistive or
Inductive Load
Number of Cycles at 60 H
Z
Peak Forward Surge Current (A)
110 100
100
500
1.0 Cycle
GBPC35
T
J
=T
J
max.
0.5 Single Sine-Wave
GBPC15
GBPC25
GBPC12
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
0.4 0.6 0.8 11.2 1.4 1.6
0.01
0.1
1
10
100
T
J
=25°C
Pulse Width = 300 µs
1% Duty Cycle
Figure 6. Typical Reverse Leakage Characteristics Per Leg
Figure 7. Typical Junction Capacitance Per Leg
Figure 8. Typical Transient Thermal Impedance Per Leg
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Leakage
Current (µA)
020 40 60 80 100
0.01
0.1
1
10
100
50 - 400 V
600 - 1000 V
T
J
= 150°C
T
J
= 125°C
T
J
=25°C
Reverse Voltage (V)
Junction Capacitance (pF)
110 100
50
100
600
TJ=25°C
f = 1.0 MH
Z
Vsig = 50MVp-p
t, Heating Time (sec.)
Transient Thermal Impedance (°CW)
0.01 0.1 110 100
1
10
100
1,000
TJ=25 C
f = 1.0 MH
Z
Vsig = 50MVp-p
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Document Number 88612
08-Jul-05
GBPC12, 15, 25 and 35
Vishay General Semiconductor
Package outline dimensions in inches (millimeters)
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
0.470 (11.9)
0.430 (10.9)
0.042 (1.07)
0.038 (0.97)
DIA.
0.310 (7.62)
0.290 (7.36)
1.25
(31.8)
MIN.
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08) DIA. 0.24 (6.0)
0.18 (4.6)
0.50 (12.7)
0.44 (11.7)
0.24 (6.0)
0.18 (4.6)
GBPC-W
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
0.732 (18.6)
0.692 (17.6)
0.094 (2.4)
DIA.
0.034 (0.86)
0.030 (0.76)
0.25
(6.35)
AC
0.840 (21.3)
0.740 (18.8)
0.582 (14.8)
0.542 (13.8)
0.672 (17.1)
0.632 (16.1)
1.135 (28.8)
1.115 (28.3)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)
DIA.
0.310 (7.62)
0.290 (7.36)
GBPC
0.034 (0.86)
0.030 (0.76)
Legal Disclaimer Notice
Vishay
Document Number: 91000 www.vishay.com
Revision: 08-Apr-05 1
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
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