RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Semtech
PROTECTION PRODUCTS
Features
• High ESD withstand Voltage: ±20kV (air), ±18kV
(contact) per IEC 61000-4-2
• Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
• Ultra-small 0201 package
• Protects one high speed data line
• Working voltage: ± 3.3V
• Low capacitance: 0.35 pF (Typical)
• Extremely low dynamic resistance: 0.20 ohms (Typical)
• Low ESD clamping voltage
• Solid-state silicon-avalanche technology
Mechanical Characteristics
• SLP0603P2X3F package
• Pb-Free, Halogen Free, RoHS/WEEE compliant
• Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
• Lead Finish: NiAu
• Marking: Marking code
• Packaging: Tape and Reel
Applications
• USB2.0 / USB 3.0
• MIPI/MDDI
• V-By-One
• eDP
• MHL
• LVDS
RClamp3331ZA
Ultra Small RailClamp®
1-Line, 3.3V ESD Protection
Description
RailClamp® TVS diodes are ultra low capacitance devices
designed to protect sensitive electronics from damage
or latch-up due to ESD, EFT, and EOS. They are designed
for use on high speed ports in applications such as cell
phones, notebook computers, and other portable
electronics. These devices oer desirable characteristics
for board level protection including fast response time,
low operating and clamping voltage, and no device
degradation.
RClamp®3331ZA features extremely good ESD protection
characteristics including a low typical dynamic resistance
of 0.20 Ohms, low peak ESD clamping voltage, and high
ESD withstand voltage (±18kV contact per IEC 61000-4-
2). Low typical capacitance (0.35pF at VR=0V) allows the
RClamp3331ZA to be used in applications operating in
excess of 5GHz without appreciable signal attenuation.
Each device will protect one high speed data line
operating at 3.3 Volts.
RClamp3331ZA is in a 2-pin SLP0603P2X3F package
measuring 0.6 x 0.3 mm with a nominal height of
0.25mm. Leads are nished with lead-free NiAu. The
small package gives the designer the exibility to
protect single lines in applications where arrays are not
practical. The combination of low peak ESD clamping,
low dynamic resistance, and low capacitance makes
this device suitable for applications such as USB 3.0,
MIPI and V-By-One interfaces in portable devices.
0.300
0.600
0.250
0.160
0.355 BSC
0.220 1
2
Package Dimension Schematic & Pin Conguration
SLP0603P2X3F (Bottom View)
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Absolute Maximum Rating
Rating Symbol Value Units
Peak Pulse Power (tp = 8/20µs) PPK 30 W
Peak Pulse Current (tp = 8/20µs) IPP 4 A
ESD per IEC 61000-4-2 (Air)(1)
ESD per IEC 61000-4-2 (Contact)(1) VESD
±20
±18 kV
Operating Temperature TJ-40 to +85 OC
Storage Temperature TSTG -55 to +150 OC
Electrical Characteristics (T=25OC unless otherwise specied)
Parameter Symbol Conditions Min. Typ. Max. Units
Reverse Stand-O Voltage VRWM Pin 1 to 2 or 2 to 1 3.3 V
Reverse Breakdown Voltage VBR IBR = 10 μA 5.5 8 10.5 V
Reverse Leakage Current IR
VRWM = 3.3V,
Pin 1 to 2 or 2 to 1 <1 50 nA
Clamping Voltage VC
tp = 8/20µs,
Pin 1 to 2 or 2 to 1 IPP = 1A 3.8 5.5
V
tp = 8/20µs,
Pin 1 to 2 or 2 to 1 IPP = 4A 5.5 7.5
ESD Clamping Voltage2VC
tp = 0.2/100ns I= 4A 4.5
tp = 0.2/100ns I=16A 7
Dynamic Resistance2,3 RDYN tp = 0.2/100ns 0.20 Ω
Junction Capacitance CJVR = 0V, f = 1MHz 0.35 0.45 pF
Notes
1) ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Semtech
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse time Clamping Voltage (tp = 1.2/50 µs)
TLP Characteristic (Positive Pulse)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
-5
0
5
10
15
20
25
30
0 2 4 6 8 10 12
TLP Current (A)
Clamping Voltage (V)
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
ITLP and VTLP averaging window:
t1 = 70ns to t2 = 90ns
0
10
20
30
40
50
60
-10 0 10 20 30 40 50 60 70 80
Clamping Voltage (V)
Time (ns)
TA = 25OC.
Waveform IEC61000-4-2 8kV contact discharge.
Measured with and corrected for 50Ω, 20dB Attenuator.
50Ω Scope Input Impedance, ≥2GHz BW.
ESD Gun Return connected to ESD Ground Plane.
-35
-30
-25
-20
-15
-10
-5
0
5
-12 -10 -8 -6 -4 -2 0
TLP Current (A)
Clamping Voltage (V)
Transmission Line Pulse Test
(TLP) Settings:
t
p
= 100ns, t
r
= 0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
= 70ns to t
2
= 90ns
-60
-50
-40
-30
-20
-10
0
10
-10 10 30 50 70
Clamping Votlage (V)
Time (ns)
TA = 25OC.
Waveform IEC61000-4-2 -8kV contact discharge.
Measured with and corrected for 50Ω, 20dB Attenuator.
50Ω Scope Input Impedance, ≥2GHz BW.
ESD Gun Return connected to ESD Ground Plane.
1
10
100
1000
0.1 1 10 100 1000
Peak Pulse Power
- PPP (W)
Pulse Duration - tp (µs)
DR040412-30
TA = 25OC
0
2
4
6
8
10
12
-5 515 25 35 45
Clamping Votlage (V)
Time (us)
T
A
= 25
O
C
Waveform: tp= 1.2x50us
Rs = 2 Ohms
TLP Characteristic (Negative Pulse)
ESD Clamping (-8kV Contact per IEC 61000-4-2)
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Typical Characteristics (Continued)
Junction Capacitance vs. Reverse Voltage Insertion Loss - S21
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 0.5 1 1.5 2 2.5 3 3.5
Junction Capacitance - C
J
(pF)
Voltage (V)
f = 1MHz
RC3331ZA IL SPCD
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Semtech
Application Information
Assembly Guidelines
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The gure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 1. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that aect the assembly process. Exact manufacturing
parameters will require some experimentation to get
the desired solder application. Semtech’s recommend-
ed mounting pattern is based on the following design
guidelines:
Land Pattern
The recommended land pattern follows IPC standards
and is designed for maximum solder coverage. Detailed
dimensions are shown elsewhere in this document.
Solder Stencil
Stencil design is one of the key factors which will deter-
mine the volume of solder paste which is deposited onto
the land pad. The area ratio of the stencil aperture will
determine how well the stencil will print. The area ratio
takes into account the aperture shape, aperture size, and
stencil thickness. An area ratio of 0.70 – 0.75 is preferred
for the subject package. The area ratio of a rectangular
aperture is given as:
Area Ratio = (L * W )/ (2 * (L + W) * T)
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Semtech recommends a stencil thickness of 0.100mm for
this device. The stencil should be laser cut with electrop-
olished nish. The stencil should have a positive taper of
approximately 5 degrees. Electro polishing and tapering
the walls results in reduced surface friction and better
paste release. For small pitch components, Semtech
recommends a square aperture with rounded corners for
consistent solder release. Due to the small aperture size,
a solder paste with Type 4 or smaller particles are recom-
mended.
Assembly Parameter Recommendation
Solder Stencil Design Laser cut, Electro-polished
Aperture shape Rectangular with rounded
corners
Solder Stencil Thickness 0.100 mm (0.004")
Solder Paste Type Type 4 size sphere or smaller
Solder Reflow Profile Per JEDEC J-STD-020
PCB Solder Pad Design Non-Solder mask defined
PCB Pad Finish OSP OR NiAu
0.270
0.250
0.298
0.272
0.175
Stencil Aperture
Mounting Pad
Package
Recommended Mounting Pattern
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Semtech
Outline Drawing - SLP0603P2X3F
Land Pattern - SLP0603P2X3F
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
aaa
N
E
L
e
DIM
A
0.180
0.320
0.140
0.280
0.08
2
0.160
0.300
0.355 BSC
MILLIMETERS
MAX
0.240
0.265
DIMENSIONS
MIN
0.200
NOM
0.235
0.220
0.250
BOTTOM VIEW
b
D0.580 0.620
0.600
bbb 0.10
D
E
AB
aaa C
C
A
SEATING
PLANE
e
bbb C A B
TOP VIEW
A1 0.000 0.010 0.050
bxN
A1 e/2
2X L
R0.025
TYP
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DIM
Y
G
MILLIMETERS
0.675
0.250
0.175
DIMENSIONS
Z
X0.270
G
X
Y
Z
(C) (C) (0.425)
RClamp3331ZA
Final Datasheet Rev 3.1
Revision Date 4/19/2018
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Semtech
Marking Code
m
Tape and Reel Specication
Ordering Information
Part Number Qty per Reel Reel Size
RClamp3331ZATFT 15,000 7”
m
m
m
Note: Device is electrically symmetrical.
Device Orientation in Tape
RClamp3331ZA
Final Datasheet 3.1
Revision Date 4/19/2018
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Semtech
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its ocers, employees, subsidiaries, aliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2018