RClamp3331ZA Ultra Small RailClamp(R) 1-Line, 3.3V ESD Protection PROTECTION PRODUCTS Description Features RailClamp(R) TVS diodes are ultra low capacitance devices designed to protect sensitive electronics from damage or latch-up due to ESD, EFT, and EOS. They are designed for use on high speed ports in applications such as cell phones, notebook computers, and other portable electronics. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. * High ESD withstand Voltage: 20kV (air), 18kV (contact) per IEC 61000-4-2 * Able to withstand over 1000 ESD strikes per IEC 61000-4-2 Level 4 * Ultra-small 0201 package * Protects one high speed data line * Working voltage: 3.3V * Low capacitance: 0.35 pF (Typical) * Extremely low dynamic resistance: 0.20 ohms (Typical) * Low ESD clamping voltage * Solid-state silicon-avalanche technology RClamp(R)3331ZA features extremely good ESD protection characteristics including a low typical dynamic resistance of 0.20 Ohms, low peak ESD clamping voltage, and high ESD withstand voltage (18kV contact per IEC 61000-42). Low typical capacitance (0.35pF at VR=0V) allows the RClamp3331ZA to be used in applications operating in excess of 5GHz without appreciable signal attenuation. Each device will protect one high speed data line operating at 3.3 Volts. Mechanical Characteristics * * * * * * SLP0603P2X3F package Pb-Free, Halogen Free, RoHS/WEEE compliant Nominal Dimensions: 0.6 x 0.3 x 0.25 mm Lead Finish: NiAu Marking: Marking code Packaging: Tape and Reel RClamp3331ZA is in a 2-pin SLP0603P2X3F package measuring 0.6 x 0.3 mm with a nominal height of 0.25mm. Leads are finished with lead-free NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of low peak ESD clamping, low dynamic resistance, and low capacitance makes this device suitable for applications such as USB 3.0, MIPI and V-By-One interfaces in portable devices. Applications Package Dimension Schematic & Pin Configuration * * * * * * USB2.0 / USB 3.0 MIPI/MDDI V-By-One eDP MHL LVDS 0.600 0.220 1 0.300 0.160 0.355 BSC 2 0.250 SLP0603P2X3F (Bottom View) RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 www.semtech.com 1 of 8 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20s) PPK 30 W Peak Pulse Current (tp = 8/20s) IPP 4 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact)(1) VESD 20 18 kV Operating Temperature TJ -40 to +85 O Storage Temperature TSTG -55 to +150 O (1) C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to 2 or 2 to 1 Reverse Breakdown Voltage VBR IBR = 10 A Reverse Leakage Current IR VRWM = 3.3V, Pin 1 to 2 or 2 to 1 Clamping Voltage VC Min. 5.5 Typ. Max. Units 3.3 V 8 10.5 V <1 50 nA tp = 8/20s, Pin 1 to 2 or 2 to 1 IPP = 1A 3.8 5.5 tp = 8/20s, Pin 1 to 2 or 2 to 1 IPP = 4A 5.5 7.5 tp = 0.2/100ns I= 4A 4.5 tp = 0.2/100ns I=16A 7 V ESD Clamping Voltage2 VC Dynamic Resistance2,3 RDYN tp = 0.2/100ns 0.20 Junction Capacitance CJ VR = 0V, f = 1MHz 0.35 0.45 pF Notes 1) ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 www.semtech.com 2 of 8 Semtech Typical Characteristics Clamping Voltage (tp = 1.2/50 s) Non-Repetitive Peak Pulse Power vs. Pulse time 12 TA = 25OC TA = 25OC Waveform: tp= 1.2x50us Rs = 2 Ohms 10 100 8 Clamping Votlage (V) Peak Pulse Power - PPP (W) 1000 10 6 4 2 DR040412-30 1 0.1 1 10 100 0 1000 -5 5 15 Pulse Duration - tp (s) 0 -5 TLP Current (A) TLP Current (A) 20 15 10 5 -10 -15 -20 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -25 0 -5 -30 0 2 4 6 8 10 12 -35 -12 -10 -8 -6 -4 -2 0 Clamping Voltage (V) Clamping Voltage (V) ESD Clamping (+8kV Contact per IEC 61000-4-2) ESD Clamping (-8kV Contact per IEC 61000-4-2) 10 60 TA = 25OC. Waveform IEC61000-4-2 8kV contact discharge. Measured with and corrected for 50, 20dB Attenuator. 50 Scope Input Impedance, 2GHz BW. ESD Gun Return connected to ESD Ground Plane. 50 0 -10 40 Clamping Votlage (V) Clamping Voltage (V) 45 5 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns 25 35 TLP Characteristic (Negative Pulse) TLP Characteristic (Positive Pulse) 30 25 Time (us) 30 20 10 -20 -30 -40 TA = 25OC. Waveform IEC61000-4-2 -8kV contact discharge. Measured with and corrected for 50, 20dB Attenuator. 50 Scope Input Impedance, 2GHz BW. ESD Gun Return connected to ESD Ground Plane. -50 -60 0 -10 0 RClamp3331ZA Final Datasheet Revision Date 10 20 Rev 3.1 4/19/2018 30 40 Time (ns) 50 60 70 80 -10 www.semtech.com 10 30 Time (ns) 50 70 3 of 8 Semtech Typical Characteristics (Continued) Junction Capacitance vs. Reverse Voltage Insertion Loss - S21 0 0.8 0.7 -0.5 Insertion Loss (dB) Junction Capacitance - CJ (pF) 0.6 0.5 0.4 0.3 -1 -1.5 -2 0.2 -2.5 0.1 0 f = 1MHz 0 0.5 1 1.5 Voltage (V) RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 2 2.5 3 3.5 RC3331ZA IL SPCD -3 0.01 www.semtech.com 0.1 Frequency (GHz) 1 10 4 of 8 Semtech Application Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech's recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech's recommended mounting pattern is based on the following design guidelines: Recommended Mounting Pattern Stencil Aperture Mounting Pad Package 0.175 0.272 Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 - 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: 0.298 0.270 Assembly Parameter Laser cut, Electro-polished Aperture shape Rectangular with rounded corners Solder Stencil Thickness Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Solder Paste Type RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 Recommendation Solder Stencil Design Area Ratio = (L * W )/ (2 * (L + W) * T) Solder Reflow Profile Semtech recommends a stencil thickness of 0.100mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. For small pitch components, Semtech recommends a square aperture with rounded corners for consistent solder release. Due to the small aperture size, a solder paste with Type 4 or smaller particles are recommended. 0.250 PCB Solder Pad Design PCB Pad Finish www.semtech.com 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 Non-Solder mask defined OSP OR NiAu 5 of 8 Semtech Outline Drawing - SLP0603P2X3F A B D DIM A A1 b D E e L N aaa bbb E TOP VIEW A DIMENSIONS MILLIMETERS MIN NOM MAX 0.235 0.250 0.265 0.000 0.010 0.050 0.200 0.220 0.240 0.580 0.600 0.620 0.280 0.300 0.320 0.355 BSC 0.140 0.160 0.180 2 0.08 0.10 SEATING PLANE aaa C C A1 e/2 R0.025 TYP bxN C A B bbb 2X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP0603P2X3F DIMENSIONS (C) Z G Y DIM (C) G X Y Z MILLIMETERS (0.425) 0.175 0.270 0.250 0.675 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 www.semtech.com 6 of 8 Semtech Marking Code m Note: Device is electrically symmetrical. Tape and Reel Specification m m m Device Orientation in Tape Ordering Information Part Number Qty per Reel Reel Size RClamp3331ZATFT 15,000 7" RClamp3331ZA Final Datasheet Revision Date Rev 3.1 4/19/2018 www.semtech.com 7 of 8 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech's standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER'S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. (c) Semtech 2018 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp3331ZA Final Datasheet Revision Date 3.1 4/19/2018 8 of 8 Semtech