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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DSingle-Chip and Single-Supply Interface for
IBM PC/AT Serial Port
DRS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
DMeets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
DOperates With 3-V to 5.5-V VCC Supply
DThree Drivers and Five Receivers
DOperates Up To 250 kbit/s
DDesigned to Transmit at a Data Rate of
250 kbit/s
DLow Standby Current...1 µA Typical
DExternal Capacitors ...4 × 0.1 µF
DAccepts 5-V Logic Input With 3.3-V Supply
DAlways-Active Noninverting Receiver
Output (ROUT2B)
DAlternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3243
DSerial-Mouse Driveability
DAuto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
DApplications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3243 consists o f three line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial
port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output
(ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down.
The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
DB, DW, OR PW PACKAGE
(TOP VIEW)
AT, IBM, and PC are trademarks of International Business Machines Corporation.
!"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(,
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"()
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SLLS350L − APRIL 1999 − REVISED MARCH 2004
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description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF
is set low, both drivers and receivers (except ROUT2B) are shut of f, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than −2.7 V
or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC (DW)
Tube of 20 MAX3243CDW
MAX3243C
SOIC (DW) Reel of 1000 MAX3243CDWR MAX3243C
0°C to 70°C
SSOP (DB)
Tube of 50 MAX3243CDB
MAX3243C
0°C to 70°CSSOP (DB) Reel of 2000 MAX3243CDBR MAX3243C
TSSOP (PW)
Tube of 50 MAX3243CPW
MA3243C
TSSOP (PW) Reel of 2000 MAX3243CPWR MA3243C
SOIC (DW)
Tube of 20 MAX3243IDW
MAX3243I
SOIC (DW) Reel of 1000 MAX3243IDWR MAX3243I
−40°C to 85°C
SSOP (DB)
Tube of 50 MAX3243IDB
MAX3243I
−40°C to 85°CSSOP (DB) Reel of 2000 MAX3243IDBR MAX3243I
TSSOP (PW)
Tube of 50 MAX3243IPW
MB3243I
TSSOP (PW)
Reel of 2000 MAX3243IPWR
MB3243I
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DIN FORCEON FORCEOFF VALID RIN
RS-232 LEVEL
OUTPUT
DOUT DRIVER STATUS
X X L X Z Powered off
L H H X H
Normal operation with
HHH XL
Normal operation with
auto-powerdown disabled
L L H Yes H
Normal operation with
HLHYesL
Normal operation with
auto-powerdown enabled
L L H No Z
Powered off by
H L H No Z
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
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EACH RECEIVER
INPUTS OUTPUTS
RIN2 RIN1,
RIN3−RIN5 FORCEOFF VALID RIN
RS-232 LEVEL ROUT2B ROUT RECEIVER STATUS
L X L X L Z
Powered off while
HXL XH Z
Powered off while
ROUT2B is active
L L H Yes L H
LHH YesL L
Normal operation with
HLHYesH H
Normal operation with
auto-powerdown
disabled/enabled
HHH YesH L
auto-powerdown
disabled/enabled
Open Open H No L H
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected
driver off
logic diagram (positive logic)
DIN3
DIN2
DIN1
DOUT3
DOUT2
DOUT1
Auto-powerdown INVALID
RIN1
RIN2
RIN3
RIN4
RIN5
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
ROUT3
ROUT4
ROUT5
14
13
12
22
23
19
20
18
17
16
15
9
10
11
21
4
5
6
7
8
5 k
5 k
5 k
5 k
5 k
Ω
Ω
Ω
Ω
Ω
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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive output supply voltage range, V+ (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative output supply voltage range, V− (see Note 1) 0.3 V to −7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage difference, V+ − V− (see Note 1) 13 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver (FORCEOFF, FORCEON) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver −25 V to 25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO: Driver −13.2 V to 13.2 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver (INVALID) −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): DB package 62°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 46°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 62°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
MIN NOM MAX UNIT
Supply voltage
VCC = 3.3 V 3 3.3 3.6
V
Supply voltage VCC = 5 V 4.5 5 5.5 V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VCC = 3.3 V 2
V
VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VCC = 5 V 2.4 V
VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON 0.8 V
VIDriver and control input voltage DIN, FORCEOFF, FORCEON 0 5.5 V
VIReceiver input voltage −25 25 V
TA
Operating free-air temperature
MAX3243C 0 70
°C
T
A
Operating free-air temperature
MAX3243I −40 85 °
C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
IIInput leakage
current FORCEOFF,
FORCEON ±0.01 ±1µA
Auto-powerdown
disabled
No load,
FORCEOFF and
FORCEON at VCC 0.3 1 mA
ICC
Supply current
Powered off V
CC
= 3.3 V or 5 V,
T = 25 C
No load, FORCEOFF at GND 1 10
ICC
Supply current
Auto-powerdown
enabled
VCC = 3.3 V or 5 V,
TA = 25°CNo load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
1 10 µA
‡All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 V
VOL Low-level output voltage All DOUT at RL = 3 kΩ to GND −5 −5.4 V
VOOutput voltage
(mouse driveability) DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA ±5 V
IIH High-level input current VI = VCC ±0.01 ±1µA
IIL Low-level input current VI at GND ±0.01 ±1µA
IOS
Short-circuit output current‡
VCC = 3.6 V, VO = 0 V
±35
±60
mA
IOS Short-circuit output current
‡
VCC = 5.5 V, VO = 0 V ±35 ±60 mA
roOutput resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M Ω
Ioff
Output leakage current
FORCEOFF = GND
VO = ±12 V, VCC = 3 V to 3.6 V ±25
µA
I
off
Output leakage current
FORCEOFF = GND
VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 µ
A
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
Maximum data rate CL = 1000 pF,
One DOUT switching, RL = 3 kΩ,
See Figure 1 150 250 kbit/s
tsk(p) Pulse skew§CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ,
See Figure 2 100 ns
SR(tr)
Slew rate, transition region
VCC = 3.3 V
,CL = 150 pF to 1000 pF 6 30
V/µs
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V
,
RL = 3 kΩ to 7 kΩCL = 150 pF to 2500 pF 4 30
V/
µ
s
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage IOH = −1 mA VCC−0.6 V VCC−0.1 V V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+
Positive-going input threshold voltage
VCC = 3.3 V 1.6 2.4
V
VIT+ Positive-going input threshold voltage VCC = 5 V 1.9 2.4 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V 0.6 1.1
V
VIT− Negative-going input threshold voltage VCC = 5 V 0.8 1.4 V
Vhys Input hysteresis (VIT+ − VIT−) 0.5 V
Ioff Output leakage current (except ROUT2B) FORCEOFF = 0 V ±0.05 ±10 µA
riInput resistance VI = ±3 V to ±25 V 3 5 7 kΩ
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
tPLH Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150 ns
tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns
ten Output enable time
CL = 150 pF, RL = 3 kΩSee Figure 4
200 ns
tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns
tsk(p) Pulse skew‡See Figure 3 50 ns
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VT+(valid) Receiver input threshold
for INVALID high-level output voltage FORCEON = GND,
FORCEOFF = VCC 2.7 V
VT−(valid) Receiver input threshold
for INVALID high-level output voltage FORCEON = GND,
FORCEOFF = VCC −2.7 V
VT(invalid) Receiver input threshold
for INVALID low-level output voltage FORCEON = GND,
FORCEOFF = VCC −0.3 0.3 V
VOH INVALID high-level output voltage IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC VCC−0.6 V
VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC 0.4 V
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER MIN TYP†MAX UNIT
tvalid Propagation delay time, low- to high-level output 1µs
tinvalid Propagation delay time, high- to low-level output 30 µs
ten Supply enable time 100 µs
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
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PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤10 ns, t
f
≤ 10 ns.
50% 50%
1.5 V 1.5 V
Figure 2. Driver Pulse Skew
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
3 V or 0 V
FORCEON
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
3 V
FORCEOFF
1.5 V 1.5 V
50% 50%
Figure 3. Receiver Propagation Delay Times
TEST CIRCUIT
50 Ω
Generator
(see Note B)
3 V or 0 V
3 V or 0 V
FORCEON
FORCEOFF
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis.
D. tPZL and tPZH are the same as ten.
RL
S1
VCC GND
CL
(see Note A)
Output
VOLTAGE WAVEFORMS
Output
VOL
VOH
tPZH
(S1 at GND)
3 V
0 V
0.3 V
Output
Input
0.3 V
1.5 V 1.5 V
50%
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
50%
tPZL
(S1 at VCC)
Figure 4. Receiver Enable and Disable Times
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PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
3 V
2.7 V
−2.7 V
INVALID
Output
Receiver
Input
Generator
(see Note B)
FORCEOFF
tvalid
ROUT
FORCEON
Auto-
powerdown INVALID
DOUT
0 V
0 V
−3 V
DIN
CL = 30 pF
(see Note A)
VCC
0 V
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Valid RS-232 Level, INVALID High
†Auto-powerdown disables drivers and reduces
supply current to 1 µA.
≈V+
0 V
≈V−
V+
VCC
ten
V−
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤ 10 ns, t
f
≤ 10 ns.
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
tinvalid
Supply
Voltages
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
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10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
RIN4
DOUT2
DOUT3
ROUT1
FORCEOFF
RIN5 INVALID
ROUT2
DOUT1 ROUT2B
DIN3
DIN2
ROUT3
ROUT4
DIN1 ROUT5
C4 +
−
+
−
C3†
VCC
C2+
C2− C1
C1+
GND
V−
C1−
FORCEON
C2 +
−
CBYPASS
= 0.1 µF
V+
+
−
+
−
RIN1
RIN2
RIN3
RS-232 Inputs
Logic Outputs
Logic Inputs
RS-232 Outputs
VCC C1 C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized
tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
Auto-
powerdown
1
2
4
5
6
7
8
9
10
11
12
13
14
3
28
27
26
25
24
23
22
21
20
19
18
17
16
15
5 kΩ
5 kΩ
5 kΩ
5 kΩ
5 kΩ
Figure 6. Typical Operating Circuit and Capacitor Values
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3243CDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDBE4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDWE4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243CPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDB ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDBE4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDBG4 ACTIVE SSOP DB 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDBR ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDW ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDWG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Aug-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3243IDWR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDWRE4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3243IPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3243 :
•Enhanced Product: MAX3243-EP
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 25-Aug-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3243CDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3243CDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243CPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
MAX3243IDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MAX3243IDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
MAX3243IPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3243CDBR SSOP DB 28 2000 346.0 346.0 33.0
MAX3243CDWR SOIC DW 28 1000 346.0 346.0 49.0
MAX3243CPWR TSSOP PW 28 2000 346.0 346.0 33.0
MAX3243IDBR SSOP DB 28 2000 346.0 346.0 33.0
MAX3243IDWR SOIC DW 28 1000 346.0 346.0 49.0
MAX3243IPWR TSSOP PW 28 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Jul-2011
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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