MOTOROLA = SEMICONDUCTOR TECHNICAL DATA MCM6810 128 x 8-Bit Random-Access Memory The MCM6810 is a byte-organized memory designed for use in bus-organized systems. It is fabri- cated with N-channel silicon-gate technology. For ease of use, the device operates from a single power supply, has compatibility with TTL and DTL, and needs no clocks or refreshing because of static operation. The memory is compatible with the M6800 Microcontroller Family, providing random storage in byte increments. Memory expansion is provided through multiple Chip Select inputs. Organized as 128 Bytes of 8 Bits @ Static Operation Bidirectional Three-State Data Input/Output Six Chip Select Inputs (Four Active Low, Two Active High} @ Single 5-Vol Power Supply @ TTL Compatible Maximum Access Time = 450 ns MCM6810 360 ns MCM68A10 250 ns MCM68B10 This document contains information on a new product. Specifications and information herein are subject to change without notice: MOTOROLA MICROPROCESSOR DATA 3-1432MC6810 MCM6810 RANDOM ACCESS MEMORY BLOCK DIAGRAM M6800 MICROCOMPUTER FAMILY BLOCK DIAGRAM mMcesoo Microprocessor Memory o Matrix eutters PT Bus (128 X 8) Read ony | + Memory | MCM6810 | Random test Selection LL and Control H4 Interface ps Memory Address interface and Control >| Adapter Modem ' ' Address Data Bus Bus MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage Voc =0.3 to +7.0 Vv This device contains circuitry to protect the in- Input Voltage Vin 0.3 to +7.0 Vv puts against damage due to high static voltages Operating Temperature Range TL toTy or electric fields; however, it is advised that nor MCM6810, MCM68A10, MCM68B10 Ta Oto +70 cc mal precautions be taken to avoid application of MCM6810C, MCM68A10C -40 to +85 any voltage higher than maximum rated voltages Storage Temperature Range Tstg 65 to + 150 C to this high impedance circuit operation is enhanced if unused inputs are tied to an appropnate logic voltage le g Vee} THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance QA C'W Plastic 120 Cerdip 65 POWER CONSIDERATIONS The average chip-junction temperature, Ty, in C can be obtained from: Ty=Ta+ (Pp * ya) where: Ta = Ambient Temperature, C 8A = Package Thermal Resistance, Junction-to-Ambient, C/W PD = PinttPport ; Pint =!ecxVec, Watts Chip Internal Power Pport = Port Power Dissipation, Watts User Determined Reliability of either Vs ar (1) For most applications Ppgrt