Features
x Improved brightness
x Improved color performance
x Available in popular T-1 and T-13/4 packages
x New sturdy leads
x IC compatible/low current capability
x Reliable and rugged
x Choice of 3 bright colors
- High Eciency Red
- High Brightness Yellow
- High Performance Green
Applications
x Lighted switches
x Backlighting front panels
x Light pipe sources
x Keyboard indicators
Description
These non-diused lamps out-perform conventional
LED lamps. By utilizing new higher intensity material, we
achieve superior product performance.
The HLMP-3750/-3390/-1340 Series Lamps are Gallium
Arsenide Phosphide on Gallium Phosphide red light emit-
ting diodes. The HLMP-3850/-3490/-1440 Series are Gal-
lium Arsenide Phosphide on Gallium Phosphide yellow
light emitting diodes. The HLMP-3950/3590/3960/1540/
K640 Series Lamps are Gallium Phosphide green light
emitting diodes.
HLMP-3707, HLMP-3907, HLMP-3750, HLMP-3850,
HLMP-3950, HLMP-3960, HLMP-3390, HLMP-3490,
HLMP-3590, HLMP-1340, HLMP-1440, HLMP-1540,
HLMP-K640
T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps
Data Sheet
2
Selection Guide
Luminous Intensity Iv (mcd) @ 20mA
Package Device Package
Description Color HLMP- Min. Typ. Max. 2q1/2 Degree Outline
T-13/4 Red 3707-L00xx 90.2 - - 24 F
3750 90.2 125.0 - 24 A
3750-L00xx 90.2 125.0 - 24 A
Yellow 3850 96.2 140.0 - 24 A
3850-K00xx 96.2 140.0 - 24 A
3850-KL0xx 96.2 150.0 294.0 24 A
Green 3907-K00xx 111.7 - - 24 F
3914-K00xx 111.7 - - 24 D
3950 111.7 265.0 - 24 A
3950-K00xx 111.7 265.0 - 24 A
3950-LM0xx 170.0 300.0 490.0 24 A
3960-K0xxx 111.7 265.0 - 24 E
T-13/4 Low Prole Red 3390 35.2 55.0 - 32 B
Yellow 3490 37.6 55.0 - 32 B
Green 3590 43.6 55.0 - 32 B
T-1 Red 1340 35.2 55.0 - 45 C
1340-H00xx 13.8 - - 45 C
1340-J00xx 35.2 55.0 - 45 C
Yellow 1440 23.5 45.0 - 45 C
1440-H00xx 23.5 45.0 - 45 C
Green 1540 27.3 45.0 - 45 C
1540-H00xx 27.3 45.0 - 45 C
1540-IJ0xx 43.6 60.0 139.6 45 C
Emerald Green K640 4.2 21.0 - 45 C
K640-FGNxx 10.6 20.0 34.0 45 C
3
Package Dimensions
25.40
(1.00) MIN.
6.10 (0.240)
5.59 (0.220)
2.54 (0.100)
NOM.
9.19 (0.362)
8.43 (0.332)
5.08 (0.200)
4.57 (0.180)
CATHODE
LEAD
(NOTE 1)
0.89 (0.035)
0.64 (0.025)
1.27 (0.050)
NOM.
0.102 (0.004)
MAX. TYP.
0.46 (0.018)
SQUARE
NOMINAL
PACKAGE OUTLINE "D"
HLMP-3914
22.86
(0.900) MIN.
6.10 (0.240)
5.60 (0.220)
2.54 (0.100)
NOM.
9.07 (0.357)
8.56 (0.337)
5.08 (0.200)
4.78 (0.188)
0.89 (0.035)
0.64 (0.025)
1.52 (0.060)
1.02 (0.040)
0.10 (0.004)
MAX.
0.74 (0.029)
0.58 (0.023)
SQUARE
12.47 (0.491)
11.71 (0.461)
1.02 (0.040)
MAX.
CATHODE
FLAT
PACKAGE OUTLINE "E"
HLMP-3960
23.0
(0.900) MIN.
6.10 (0.240)
5.60 (0.220)
9.07 (0.357)
8.56 (0.337)
5.08 (0.200)
4.78 (0.188)
0.89 (0.035)
0.64 (0.025)
1.52 (0.060)
1.02 (0.040)
0.53 (0.021)
0.43 (0.017)
13.11 (0.516)
12.34 (0.486)
1.02 (0.040) MAX.
EPOXY
MENISCUS
CATHODE
FLAT
PACKAGE OUTLINE "F"
HLMP-3707/3907
SQ.
2.79 (0.110)
2.29 (0.090)
1.32 (0.052)
1.02 (0.040)
4
Absolute Maximum Ratings at TA = 25°C
Parameter Red Yellow Green/Emerald Green Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 mA
Transient Forward Current[3] 500 500 500 mA
(10 μs Pulse)
Reverse Voltage (IR = 100 μA) 5 5 5 V
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
Dx, Ex: Ammo Pack, Straight Leads
FH: 2 Iv Bin Select with Inventory Control
Vx: Ammo Pack, Crimped Leads
Color Bin Options
0: Full Color Bin Distribution
N: Color Bin 6 & 7 Only
Maximum Iv Bin Options
0: Open (No. Max. Limit)
Others: Please Refer to the Iv Bin Table
Minimum Iv Bin Options
Please Refer to the Iv Bin Table
Color Options
3, 7: GaP HER
4, 8: GaP Yellow (except K4xx series)
5, 9: GaP Green
6: GaP Emerald Green
Package Option
1, K: T-1 (3 mm)
3: T-13/4 (5 mm)
Part Numbering System
5
Electrical/Optical Characteristics at TA = 25°C
T-13/4 Test
Symbol Description T-13/4 Low Dome T-1 Min. Typ. Max. Units Conditions
OPEAK Peak 37xx 3390 1340 635 nm Measurement
Wavelength 38xx 3490 1440 583 at Peak
39xx 3590 1540 565
K640 558
Od Dominant 37xx 3390 1340 626 nm Note 1
Wavelength 38xx 3490 1440 585
39xx 3590 1540 569
K640 560
'O3/4 Spectral Line 37xx 3390 1340 40 nm
Halfwidth 38xx 3490 1440 36
39xx 3590 1540 28
K640 24
Ws Speed of 37xx 3390 1340 90 ns
Respond 38xx 3490 1440 90
39xx 3590 1540 500
K640 3100
C Capacitance 37xx 3390 1340 11 pF VF = 0,
38xx 3490 1440 15 f = 1 MHz
39xx 3590 1540 18
K640 35
RTJ-PIN Thermal 37xx 3390 210 °C/W Junction to
Resistance 38xx 3490 210 Cathode Lead
39xx 3590 210
510
1340 290
1440 290
1540 290
K640 290
VF Forward 37xx 3390 1340 1.5 1.9 2.6 V IF = 20 mA
Voltage 38xx 3490 1440 1.5 2.1 2.6 (Figure 3)
39xx 3590 1540 1.5 2.2 3.0
K640 2.2 3.0
VR Reverse 37xx 3390 1340 5.0 V IF = 100 μA
Breakdown 38xx 3490 1440
Voltage 39xx 3590 1540
K640
Kv Luminous 37xx 3390 1340 145 lumens Note 2
Ecacy 38xx 3490 1440 500
watt
39xx 3590 1540 595
K640 655
Notes:
1. The dominant wavelength, Od, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/KV , where IV is the luminous intensity in candelas and KV is
the luminous ecacy in lumens/watt.
6
Figure 1. Relative intensity vs. wavelength.
Red, Yellow, and Green
Figure 4. Relative luminous intensity vs. forward current. Figure 5. Relative eciency (luminous intensity
per unit current) vs. peak current.
Figure 2. Maximum tolerable peak current vs. pulse duration.
(IDC MAX as per MAX ratings).
Figure 3. Forward current vs. forward voltage.
HIGH EFFICIENCY RED
WAVELENGTH
–
nm
RELATIVE INTENSITY
1.0
0.5
0
007056006055005
YELLOW
EMERALD GREEN
GREEN
T = 25° C
A
7
Figure 6. Relative luminous intensity vs. angular displacement.
T-13/4 lamp.
Figure 7. Relative luminous intensity vs. angular displacement.
T-13/4 low prole lamp.
Figure 8. Relative luminous intensity vs. angular displacement.
T-1 lamp.
Intensity Range (mcd)
Color Bin Min. Max.
Red G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limits
8
Lambda (nm)
Color Cat # Min. Max.
Emerald Green 9 552.5 555.5
8 555.5 558.5
7 558.5 561.5
6 561.5 564.5
Green 6 561.5 564.5
5 564.5 567.5
4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
Yellow 1 582.0 584.5
3 584.5 587.0
2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Orange 1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
Maximum tolerance for each bin limit is ±0.5 nm.
Color Categories
Intensity Range (mcd)
Color Bin Min. Max.
Yellow F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Green/ A 1.1 1.8
Emerald B 1.8 2.9
Green C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limits (continued)
9
Mechanical Option Matrix
Mechanical
Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
02 Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag
B1 T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag
BJ T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag
EG Ammo Pack, straight leads in 5 K increment
FH Devices that require inventory control and 2 Iv bin select
VR Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1
Note:
All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago repre-
sentative for further clarication/information.
10
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be eectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering prole to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with dierent size and design (component density) will
have dierent heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering prole again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
x Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment xture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
11
Example of Wave Soldering Temperature Prole for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-4254EN
AV02-1556EN - May 10, 2010
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label