SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 D 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V, and Adjustable D D DRJ (QFN) PACKAGE (TOP VIEW) DCY (SOT-223) PACKAGE (TOP VIEW) INPUT OUTPUT Current Levels 0.2% Line Regulation Maximum 0.4% Load Regulation Maximum OUTPUT ADJ/GND ADJ 1 VIN 2 VIN 3 VIN 4 VOUT KCS (TO-220) PACKAGE (TOP VIEW) 8 NC 7 VOUT 6 VOUT 5 VOUT OUTPUT D D D Specified Dropout Voltage at Multiple Output Voltage Options Output Current of 800 mA Operates Down to 1.1-V Dropout INPUT OUTPUT ADJ/GND VIN pins (2, 3, 4) must be connected together. VOUT pins (5, 6, 7) must be connected together. IN OUT ADJ/GND INPUT OUTPUT ADJ/GND KTT (TO-263) PACKAGE (TOP VIEW) OUTPUT KTP (PowerFLEXE/TO-252) PACKAGE (TOP VIEW) OUTPUT OUTPUT KTE (PowerFLEXE) PACKAGE (TOP VIEW) INPUT OUTPUT ADJ/GND description/ordering information The TLV1117 is a positive low-dropout voltage regulator, designed to provide up to 800 mA of output current. The device is available in 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V, and adjustable output voltage options. All internal circuitry is designed to operate down to 1-V input-to-output differential. Dropout voltage is specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents. The low-profile surface-mount KTP package allows the device to be used in applications where space is limited. The TLV1117 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or larger normally are included in most regulator designs. Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent current of the TLV1117 flows into the load, increasing efficiency. The TLV1117C device is characterized for operation over the virtual junction temperature range of 0C to 125C, and the TLV1117I device is characterized for operation over the virtual junction temperature range of -40C to 125C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments. Copyright 2005, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 description/ordering information (continued) TLV1117C ORDERING INFORMATION TJ VO TYP (V) 1.5 V 1.8 V 2.5 V 0C to 125C 3.3 V 5V ADJ ORDERABLE PART NUMBER PACKAGE TOP-SIDE MARKING QFN (DRJ) Reel of 1000 TLV1117-15CDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-15CDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-15CKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-18CDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-18CDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-18CKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-25CDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-25CDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-25CKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-33CDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-33CDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-33CKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-50CDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-50CDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-50CKTTR PREVIEW PowerFLEX (KTE) Reel of 2000 TLV1117CKTER TLV1117C PowerFLEX/TO-252 (KTP) Reel of 2000 TLV1117CKTPR TV1117 QFN (DRJ) Reel of 1000 TLV1117CDRJR PREVIEW Tube of 80 TLV1117CDCY Reel of 2500 TLV1117CDCYR TO-220 (KCS) Tube of 50 TLV1117CKCS TO-263 (KTT) Reel of 2000 TLV1117CKTTR SOT-223 (DCY) V4 TLV1117C PREVIEW Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Complies with TO-252, variation AC. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TLV1117I ORDERING INFORMATION TJ VO TYP (V) 1.5 V 1.8 V 2.5 V -40C to 125C 3.3 V 5V ORDERABLE PART NUMBER PACKAGE TOP-SIDE MARKING QFN (DRJ) Reel of 1000 TLV1117-15IDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-15IDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-15IKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-18IDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-18IDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-18IKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-25IDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-25IDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-25IKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-33IDRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-33IDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-33IKTTR PREVIEW QFN (DRJ) Reel of 1000 TLV1117-50DRJR PREVIEW SOT-223 (DCY) Reel of 2500 TLV1117-50IDCYR PREVIEW TO-263 (KTT) Reel of 2000 TLV1117-50IKTTR PREVIEW PowerFLEX (KTE) Reel of 2000 TLV1117IKTER TLV1117I PowerFLEX/TO-252 (KTP) Reel of 2000 TLV1117IKTPR TY1117 QFN (DRJ) Reel of 1000 TLV1117IDRJR PREVIEW Tube of 80 TLV1117IDCY Reel of 2500 TLV1117IDCYR TO-220 (KCS) Tube of 50 TLV1117IKCS TO-263 (KTT) Reel of 2000 TLV1117IKTTR ADJ SOT-223 (DCY) V2 TLV1117I PREVIEW Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Complies with TO-252, variation AC. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 functional block diagram VIN Thermal Limit _ + Current Limit + _ VOUT GND/ADJ (Fixed-Voltage Version) GND/ADJ (Adjustable Version) absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Continuous input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V Operating virtual junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 package thermal data (see Note 1) PowerFLEX (KTE) High K, JESD 51-5 qJP 2.7C/W PowerFLEX/TO-252 (KTP) High K, JESD 51-5 3C/W 28C/W QFN (DRJ) High K, JESD 51-5 TBD TBD SOT (DCY) High K, JESD 51-7 TO-263 (KTT) High K, JESD 51-5 PACKAGE BOARD qJC qJA 23C/W 4C/W 53C/W TBD TBD TO-220 (KCS) High K, JESD 51-5 3C/W 19C/W For packages with exposed thermal pads, such as QFN, PowerPAD, and PowerFLEX, JP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. NOTE 1: Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. recommended operating conditions VIN IOUT Input voltage MIN MAX TLV1117 2.7 15 TLV1117-15 2.9 15 TLV1117-18 3.2 15 TLV1117-25 3.9 15 TLV1117-33 4.7 15 TLV1117-50 6.4 15 0 125 -40 125 Output current 0.8 TLV1117C TJ Operating virtual junction temperature range TLV1117I UNIT V A C The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout (for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following: VIN(min) = VOUT(max) + VDO(max @ rated current) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TLV1117C electrical characteristics, TJ = 0C to 125C, all typical values are at TJ = 25C (unless otherwise noted) TEST CONDITIONS PARAMETER VIN - VOUT = 2 V, IOUT = 10 mA, TJ = 25C IOUT = 10 mA to 800 mA, VIN - VOUT = 1.4 V to 10 V Output voltage, VOUT VIN = 3.5 V, IOUT = 10 mA, TJ = 25C VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA TLV1117-15 VIN = 3.8 V, IOUT = 10 mA, TJ = 25C VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA TLV1117-18 VIN = 4.5 V, IOUT = 10 mA, TJ = 25C VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA TLV1117-25 VIN = 5 V, IOUT = 10 mA, TJ = 25C VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA VIN = 7 V, IOUT = 10 mA, TJ = 25C VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA Line regulation Load regulation TLV1117 TLV1117-33 TLV1117-50 MIN TYP MAX 1.238 1.25 1.262 1.225 1.25 1.27 1.485 1.5 1.515 1.47 1.5 1.53 1.782 1.8 1.818 1.764 1.8 1.836 2.475 2.5 2.525 2.45 2.5 2.55 3.267 3.3 3.333 3.235 3.3 3.365 4.95 5 5.05 4.9 5 5.1 IOUT = 10 mA, VIN - VOUT = 1.5 V to 13.75 V IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117 0.035 0.2 TLV1117-15 1 6 IOUT = 0 mA, VIN = 3.2 V to 10 V IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-18 1 6 TLV1117-25 1 6 IOUT = 0 mA, VIN = 4.75 V to 15 V IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-33 1 6 TLV1117-50 1 10 IOUT = 10 mA to 800 mA, VIN - VOUT = 3 V IOUT = 0 to 800 mA, VIN = 2.9 V TLV1117 0.2 0.4 TLV1117-15 1 10 IOUT = 0 to 800 mA, VIN = 3.2 V IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-18 1 10 TLV1117-25 1 10 IOUT = 0 to 800 mA, VIN = 4.75 V IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-33 1 10 TLV1117-50 Dropout voltage, VDO (see Note 2) IOUT = 100 mA IOUT = 500 mA Current limit IOUT = 800 mA VIN - VOUT = 5 V, TJ = 25C Minimum load current VIN = 15 V TLV1117 Quiescent current VIN 15 V All fixed-voltage options Thermal regulation 30 ms pulse, TA = 25C 0.8 UNIT V % mV % mV 1 15 1.1 1.2 1.15 1.25 1.2 1.3 1.2 1.5 1.7 5 mA 5 10 mA 0.01 0.1 %/W V A Ripple rejection VIN - VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz 60 78 dB All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Current limit test specified under recommended operating conditions NOTE 2: Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V. 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TLV1117C electrical characteristics, TJ = 0C to 125C, all typical values are at TJ = 25C (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS ADJUSTMENT pin current Change in ADJUSTMENT pin current MIN TYP MAX UNIT 80 120 A 5 A IOUT = 10 mA to 800 mA, VIN - VOUT = 1.4 V to 10 V TJ = full range 0.2 Temperature stability 0.5 % Long-term stability 1000 hrs, No load, TA = 125C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TLV1117I electrical characteristics, TJ = -40C to 125C, all typical values are at TJ = 25C (unless otherwise noted) TEST CONDITIONS PARAMETER Output voltage, VOUT MIN TYP MAX VIN - VOUT = 2 V, IOUT = 10 mA, TJ = 25C TLV1117 IOUT = 10 mA to 800 mA, VIN - VOUT = 1.4 V to 10 V 1.238 1.25 1.262 1.2 1.25 1.29 VIN = 3.5 V, IOUT = 10 mA, TJ = 25C VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA 1.485 1.5 1.515 TLV1117-15 1.44 1.5 1.56 VIN = 3.8 V, IOUT = 10 mA, TJ = 25C VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA 1.782 1.8 1.818 TLV1117-18 1.728 1.8 1.872 2.475 2.5 2.525 VIN = 4.5 V, IOUT = 10 mA, TJ = 25C VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA VIN = 5 V, IOUT = 10 mA, TJ = 25C VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA VIN = 7 V, IOUT = 10 mA, TJ = 25C VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA Line regulation Load regulation TLV1117-25 TLV1117-33 TLV1117-50 2.4 2.5 2.6 3.267 3.3 3.333 3.168 3.3 3.432 4.95 5 5.05 4.8 5 5.2 IOUT = 10 mA, VIN - VOUT = 1.5 V to 13.75 V IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117 0.035 0.3 TLV1117-15 1 4.5 IOUT = 0 mA, VIN = 3.2 V to 10 V IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-18 1 5.5 TLV1117-25 1 7.5 IOUT = 0 mA, VIN = 4.75 V to 15 V IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-33 1 10 TLV1117-50 1 15 IOUT = 10 mA to 800 mA, VIN - VOUT = 3 V IOUT = 0 to 800 mA, VIN = 2.9 V TLV1117 0.2 0.5 TLV1117-15 1 7.5 IOUT = 0 to 800 mA, VIN = 3.2 V IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-18 1 9 TLV1117-25 1 12.5 IOUT = 0 to 800 mA, VIN = 4.75 V IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-33 1 15 TLV1117-50 1 20 1.1 1.3 1.15 1.35 1.2 1.4 UNIT V % mV % mV Dropout voltage, VDO (see Note 2) IOUT = 100 mA IOUT = 500 mA Current limit IOUT = 800 mA VIN - VOUT = 5 V, TJ = 25C 1.2 1.5 Minimum load current VIN = 15 V TLV1117 1.7 5 mA Quiescent current VIN 15 V All fixedvoltage options 5 15 mA Thermal regulation 30-ms pulse, TA = 25C 0.01 0.1 %/W 0.8 V A Ripple rejection VIN - VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz 60 75 dB All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Current limit test specified under recommended operating conditions NOTE 2: Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V. 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TLV1117I electrical characteristics, TJ = 40C to 125C, all typical values are at TJ = 25C (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS ADJUSTMENT pin current Change in ADJUSTMENT pin current MIN TYP MAX UNIT 80 120 A 10 A IOUT = 10 mA to 800 mA, VIN - VOUT = 1.4 V to 10 V TJ = full range 0.2 Temperature stability 0.5 % Long-term stability 1000 hrs, No load, TA = 125C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 TYPICAL CHARACTERISTICS (GRAPHS PREVIEW) Figure 1. Short-Circuit Current vs (VIN - VOUT) Figure 2. Load Regulation vs Temperature Figure 3. Ripple Rejection vs Frequency (ADJ Version) Figure 4. Ripple Rejection vs Current (ADJ Version) Figure 5. Temperature Stability Figure 6. ADJ Pin Current vs Temperature Figure 7. TLV1117-25 Load Transient Response Figure 8. TLV1117-25 Line Transient Response Figure 9. TLV1117-33 Load Transient Response Figure 10. TLV1117-33 Line Transient Response 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLVS561A - DECEMBER 2004 - REVISED MARCH 2005 APPLICATION INFORMATION 1N4002 (See Note D) TLV1117 - ADJ INPUT VI OUTPUT VO ADJ/GND 10 F (see Note C) IADJ VREF R1 100 F (see Note A) CADJ (see Note B) VOUT is calculated as: V OUT + V REF 1 ) R2 ) (I ADJ R1 R2 R2) Because IADJ typically is 55 A, it is negligible in most applications. NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-F tantalum or 50-F aluminum electrolytic, with either one having an ESR between 0.3 and 22 . Larger COUT values benefit the regulator by improving transient response and loop stability. 1 B. CADJ can be used to improve ripple rejection. Ensure that the impedance of CADJ is < R1 to X CADJ + 2pf rippleC ADJ prevent the ripple from being amplified. If CADJ is used, then a larger COUT is required (22-F tantalum or 150-F aluminum electrolytic). C. CIN is recommended if TLV1117 is not located near the power-supply filter. D. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND. Figure 11. Basic Adjustable Regulator POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) TLV1117-15CDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-15CDCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117-15CKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-15IDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-15IDCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117-15IKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-18CDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-18CDCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117-18CKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-18IDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-18IDCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117-18IKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-25CKTPR PREVIEW PFM KTP 2 3000 TBD Call TI Call TI TLV1117-33CDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-33CDCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117-33CKC PREVIEW TO-220 KC 3 50 TBD Call TI Call TI TLV1117-33CKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-33CKTT PREVIEW DDPAK/ TO-263 KTT 3 50 TBD Call TI Call TI TLV1117-33CKTTR PREVIEW DDPAK/ TO-263 KTT 3 1000 TBD Call TI Call TI TLV1117-33DCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-33IKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-50CDCY PREVIEW SOT-223 DCY 4 80 TBD Call TI Call TI TLV1117-50CKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI TLV1117-50CKTER PREVIEW PFM KTE 3 2000 TBD Call TI Call TI TLV1117-50CKTPR PREVIEW PFM KTP 2 3000 TBD Call TI Call TI TLV1117-50CKTT PREVIEW DDPAK/ TO-263 KTT 3 50 TBD Call TI Call TI TLV1117-50CKTTR PREVIEW DDPAK/ TO-263 KTT 3 TBD Call TI Call TI TLV1117-50DCYR PREVIEW SOT-223 DCY 4 2500 TBD Call TI Call TI TLV1117CDCY ACTIVE SOT-223 DCY 4 80 TBD CU Level-2-235C-1 YEAR TLV1117CDCYR ACTIVE SOT-223 DCY 4 2500 TBD CU Level-2-235C-1 YEAR TLV1117CKC PREVIEW TO-220 KC 3 50 TBD Call TI Call TI TLV1117CKCS ACTIVE TO-220 KCS 3 50 TBD Call TI Level-NC-NC-NC TLV1117CKTER ACTIVE PFM KTE 3 2000 TBD Call TI Level-1-220C-UNLIM TLV1117CKTPR ACTIVE PFM KTP 2 3000 TBD Call TI Level-1-220C-UNLIM TLV1117IDCY ACTIVE SOT-223 DCY 4 80 TBD CU Level-2-235C-1 YEAR TLV1117IDCYR ACTIVE SOT-223 DCY 4 2500 TBD CU Level-2-235C-1 YEAR TLV1117IKCS ACTIVE TO-220 KCS 3 50 TBD Call TI Level-NC-NC-NC TLV1117IKTER ACTIVE PFM KTE 3 2000 TBD Call TI Level-1-220C-UNLIM TLV1117IKTPR ACTIVE PFM KTP 2 3000 TBD Call TI Level-1-220C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS094A - APRIL 2001 - REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0-10 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPFM001E - OCTOBER 1994 - REVISED JANUARY 2001 KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT 0.375 (9,52) 0.080 (2,03) 0.070 (1,78) 0.365 (9,27) 0.360 (9,14) 0.050 (1,27) 0.040 (1,02) 0.350 (8,89) 0.220 (5,59) NOM 0.010 (0,25) NOM Thermal Tab (See Note C) 0.360 (9,14) 0.350 (8,89) 0.295 (7,49) NOM 0.320 (8,13) 0.310 (7,87) 0.420 (10,67) 0.410 (10,41) 1 3 0.025 (0,63) 0.031 (0,79) 0.100 (2,54) Seating Plane 0.004 (0,10) 0.010 (0,25) M 0.005 (0,13) 0.001 (0,03) 0.200 (5,08) 0.041 (1,04) 0.031 (0,79) 0.010 (0,25) NOM Gage Plane 3- 6 0.010 (0,25) 4073375/F 12/00 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC MO-169 PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MPSF001F - JANUARY 1996 - REVISED JANUARY 2002 KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE 0.080 (2,03) 0.070 (1,78) 0.243 (6,17) 0.233 (5,91) 0.228 (5,79) 0.218 (5,54) 0.050 (1,27) 0.040 (1,02) 0.010 (0,25) NOM 0.130 (3,30) NOM 0.215 (5,46) NOM 0.247 (6,27) 0.237 (6,02) Thermal Tab (See Note C) 0.287 (7,29) 0.277 (7,03) 0.381 (9,68) 0.371 (9,42) 0.100 (2,54) 0.090 (2,29) 0.032 (0,81) MAX Seating Plane 0.090 (2,29) 0.180 (4,57) 0.004 (0,10) 0.005 (0,13) 0.001 (0,02) 0.031 (0,79) 0.025 (0,63) 0.010 (0,25) M 0.010 (0,25) NOM Gage Plane 0.047 (1,19) 0.037 (0,94) 0.010 (0,25) 2-6 4073388/M 01/02 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC TO-252 variation AC. PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated