Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 LM2705 Micropower Step-Up DC-DC Converter With 150-mA Peak Current Limit 1 Features 3 Description * * * * * * * The LM2705 is a micropower step-up DC-DC converter in a small 5-pin SOT-23 package. A current-limited, fixed-off-time control scheme conserves operating current, which results in high efficiency over a wide range of load conditions. The 21-V switch allows for output voltages as high as 20 V. The low 400-ns off-time permits the use of tiny, low-profile inductors and capacitors to minimize footprint and cost in space-conscious portable applications. The LM2705 is ideal for LCD panels requiring low current and high efficiency as well as white-LED applications for cellular phone backlighting. The LM2705 device can drive up to 3 white LEDs from a single Li-Ion battery. The low peakinductor current of the LM2705 makes it ideal for USB applications. 1 2.2-V to 7-V Input Range 150-mA, 0.7- Internal Switch Adjustable Output Voltage up to 20 V Input Undervoltage Lockout 0.01-A Shutdown Current Uses Small Surface-Mount Components Small 5-Pin SOT-23 Package 2 Applications * * * * * LCD Bias Supplies White-LED Backlighting Handheld Devices Digital Cameras Portable Applications Device Information(1) PART NUMBER LM2705 PACKAGE SOT-23 (5) BODY SIZE (NOM) 2.90 mm x 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space space space Typical 20-V Application L 68 PH VIN = Li-Ion CIN 4.7 PF 20 V 6 mA D 5 1 VIN SW R1 510 kY LM2705 4 SHDN FB GND COUT 1 PF 3 R2 33 kY 2 Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 8 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Application ................................................... 9 8.3 Additional Applications ............................................ 12 9 Power Supply Recommendations...................... 15 10 Layout................................................................... 15 10.1 Layout Guidelines ................................................. 15 10.2 Layout Example .................................................... 15 11 Device and Documentation Support ................. 16 11.1 11.2 11.3 11.4 11.5 11.6 Device Support...................................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 16 12 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (May 2013) to Revision F Page * Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections................................................................................................................................................................ 1 * Deleted pin definition list - added content to Pin Functions .................................................................................................. 3 * Changed RJA value from "220C/W" to "164.9C/W" ........................................................................................................... 4 Changes from Revision D (May 2013) to Revision E * 2 Page Changed layout of National Semiconductor data sheet to TI format.................................................................................... 14 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 5 Pin Configuration and Functions DBV Package 5-Pin SOT-23 Top View VIN SW GND FB SHDN Pin Functions PIN NO. 1 2 3 4 5 NAME TYPE DESCRIPTION Power switch input. This is the drain of the internal NMOS power switch. Minimize the metal trace area connected to this pin to minimize EMI. SW Input GND -- FB Input Output voltage feedback input -- set the output voltage by selecting values for R1 and R2 using: R1 = R2 x (VOUT / 1.237 V) -1 SHDN Input Active low shutdown - drive this pin to > 1.1 V to enable the device. Drive this pin to < 0.3 V to lace the device in a low-power shutdown. VIN Input Analog and power input supply pin Ground - tie directly to ground plane. Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 3 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MAX UNIT VIN MIN 7.5 V SW voltage 21 V FB voltage 2 V 7.5 V SHDN voltage Maximum junction temperature, TJ (3) Lead temperature 150 C Soldering (10 seconds) 300 C Vapor phase (60 seconds) 215 C 220 C 150 C Infrared (15 seconds) Storage temperature, Tstg (1) (2) (3) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, RJA, and the ambient temperature, TA. See Thermal Information for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) - TA) / RJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 2000 Machine model (2) 200 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. ESD susceptibility using the machine model is 150 V for SW pin. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN Supply voltage NOM MAX 2.2 7 SW voltage, maximum Junction temperature (1) (1) UNIT V 20.5 V 125 C -40 All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested or specified through statistical analysis. All limits at temperature extremes are specified via correlation using standard statistical quality control (SQC) methods. All limits are used to calculate average outgoing quality level (AOQL). 6.4 Thermal Information LM2705 THERMAL METRIC (1) DBV (SOT-23) UNIT 5 PINS RJA Junction-to-ambient thermal resistance 164.9 C/W RJC(top) Junction-to-case (top) thermal resistance 116.8 C/W RJB Junction-to-board thermal resistance 27.8 C/W JT Junction-to-top characterization parameter 13.6 C/W JB Junction-to-board characterization parameter 27.3 C/W (1) 4 For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 6.5 Electrical Characteristics Unless otherwise specified, specifications apply for TJ = 25C and VIN = 2.2 V. PARAMETER Device disabled IQ Device enabled Shutdown VFB Feedback trip point ICL Switch current limit IB FB pin bias current VIN Input voltage RDSON Switch RDSON TOFF Switch off time ISD SHDN pin current MIN (1) TEST CONDITIONS FB = 1.3 V 235 FB = 1.2 V, -40C to 125C 0.01 -40C to 125C 1.189 -40C to 125C 100 FB = 1.23 V (3) 1.269 180 30 (3) -40C to 125C 120 2.2 7 0.7 -40C to 125C 1.6 400 SHDN = VIN, TJ = 25C 0 SHDN = VIN, TJ = 125C 15 VSW = 20 V Input undervoltage lockout ON/OFF threshold VFB hysteresis Feedback hysteresis (2) (3) 2.5 150 Switch leakage current (1) A 1.237 FB = 1.23 V, -40C to 125C UNIT 300 SHDN = 0 V UVP SHDN high (1) 70 FB = 1.2 V IL SHDN threshold MAX 40 FB = 1.3 V, -40C to 125C SHDN = GND SHDN low TYP (2) V mA nA V ns 80 nA 0 0.05 5 1.8 A V 8 mV 0.7 -40C to 125C 0.3 0.7 -40C to 125C V 1.1 All limits specified at room temperature and at temperature extremes. All room temperature limits are 100% production tested or specified through statistical analysis. All limits at temperature extremes are specified via correlation using standard statistical quality control (SQC) methods. all limits are used to calculate average outgoing quality level (AOQL). Typical numbers are at 25C and represent the most likely norm. Feedback current flows into the pin. Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 5 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com 6.6 Typical Characteristics Figure 1. Enable Current vs VIN (Device Switching) Figure 2. Disable Current vs VIN (Device Not Switching) Figure 3. SHDN Threshold vs VIN Figure 4. Switch Current Limit vs VIN 55 1.25 FEEDBACK TRIP POINT (V) 45 40 1.23 35 1.22 30 nA 25 1.21 FEEDBACK BIAS CURRENT (nA) 50 V 1.24 20 1.20 -40 -20 0 20 40 60 15 80 100 120 JUNCTION TEMPERATURE (C) Figure 5. Switch RDSON vs VIN 6 Figure 6. FB Trip Point and FB Pin Current vs Temperature Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 Typical Characteristics (continued) Figure 8. Off Time vs Temperature Figure 7. Output Voltage vs Load Current 1) Load: 0.5 mA to 5 mA to 0.5 mA, DC 2) VOUT: 200 mV/div, AC 3. IL: 100 mA/div, DC VOUT = 20 V VIN = 3 V T = 100 s/div 1) SHDN: 1 V/div, DC 2) VOUT: 10 V/div, AC 3. IL: 100 mA/div, DC Figure 9. Step Response 1. VSW: 20 V/div, DC 2. Inductor Current: 100 mA/div, DC 3. VOUT, 200 mV/div, AC VIN = 3 V T = 100 s/div VOUT = 20 V RL = 3.9 k Figure 10. Start-Up and Shutdown VIN = 2.7 V IOUT = 2.5 mA VOUT = 20 V Figure 11. Typical Switching Waveform Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 7 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The LM2705 is a small boost converter utilizing a constant off time architecture. The device can provide up to 20.5 V at the output with up to 150 mA of peak switch current. 7.2 Functional Block Diagram D L VIN VOUT VIN SW 5 CIN R2 50 NY R1 50 NY VOUT 3 Enable Q1 Q2 10x + FB COUT Enable Comp + RF1 1 RF2 CL Comp - R3 30 NY CL Adjust R4 140 NY Current Sensing Circuitry 400ns One Shot Driver Logic Undervoltage Lockout 4 2 GND SHDN Copyright (c) 2016, Texas Instruments Incorporated 7.3 Feature Description The LM2705 device features a constant off-time control scheme. Operation can be best understood by referring to Functional Block Diagram and Figure 11. Transistors Q1 and Q2 and resistors R3 and R4 of Functional Block Diagram form a bandgap reference used to control the output voltage. When the voltage at the FB pin is less than 1.237 V, the Enable Comp in Functional Block Diagram enables the device, and the NMOS switch is turned on pulling the SW pin to ground. When the NMOS switch is on, current begins to flow through inductor L while the load current is supplied by the output capacitor COUT. Once the current in the inductor reaches the current limit, the CL comp trips, and the 400-ns one shot turns off the NMOS switch.The SW voltage then rises to the output voltage plus a diode drop, and the inductor current begins to decrease as shown in Figure 11. During this time the energy stored in the inductor is transferred to COUT and the load. After the 400-ns off-time the NMOS switch is turned on, and energy is stored in the inductor again. This energy transfer from the inductor to the output causes a stepping effect in the output ripple as shown in Figure 11. This cycle is continued until the voltage at FB reaches 1.237 V. When FB reaches this voltage, the Enable Comp disables the device, turning off the NMOS switch and reducing the IQ of the device to 40 A. The load current is then supplied solely by COUT indicated by the gradually decreasing slope at the output as shown in Figure 11. When the FB pin drops slightly below 1.237 V, the Enable Comp enables the device and begins the cycle described previously. 7.4 Device Functional Modes The SHDN pin can be used to turn off the LM2705 and reduce the IQ to 0.01 A. In shutdown mode the output voltage is a diode drop lower than the input voltage. 8 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM2705 is a 20-V boost designed for low power boost applications. Typical input voltage range makes this ideal for standard single cell Li+ batteries or 2 to 4 series alkaline batteries. 8.2 Typical Application Figure 12 shows a typical Li+ voltage range to 20-V application. The 68-H inductor allows for a low ripple current and high light-load efficiency. L 68 PH VIN = Li-Ion 20 V 6 mA D 5 1 VIN SW R1 510 kY LM2705 CIN 4.7 PF 4 SHDN FB GND COUT 1 PF 3 R2 33 kY 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 12. Typical 20-V Application 8.2.1 Design Requirements For typical DC-DC converter applications, use the parameters listed in Table 1. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage 2.5 V to 4.2 V Output voltage 12 V Output current up to 8 mA Inductor 33 H 8.2.2 Detailed Design Procedure 8.2.2.1 Inductor Selection - Boost Regulator The appropriate inductor for a given application is calculated using Equation 1: L= VOUT - VIN(min) + VD ICL TOFF where * * VD is the Schottky diode voltage ICL is the switch current limit found in the Typical Characteristics Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 9 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 * www.ti.com TOFF is the switch off time (1) When using this equation be sure to use the minimum input voltage for the application, such as for battery powered applications. For the LM2705 constant-off time control scheme, the NMOS power switch is turned off when the current limit is reached. There is approximately a 100-ns delay from the time the current limit is reached in the NMOS power switch and when the internal logic actually turns off the switch. During this 100-ns delay, the peak inductor current increases. This increase in inductor current demands a larger saturation current rating for the inductor. This saturation current can be approximated by Equation 2: IPK = ICL + (c) VIN(max)* 100 ns L (2) Choosing inductors with low ESR decrease power losses and increase efficiency. Take care when choosing an inductor. For applications that require an input voltage that approaches the output voltage, such as when converting a Li-Ion battery voltage to 5 V, the 400-ns off time may not be enough time to discharge the energy in the inductor and transfer the energy to the output capacitor and load. This can cause a ramping effect in the inductor current waveform and an increased ripple on the output voltage. Using a smaller inductor causes the IPK to increase and increases the output voltage ripple further. For typical curves and evaluation purposes the DT1608C series inductors from Coilcraft were used. Other acceptable inductors include, but are not limited to, the SLF6020T series from TDK, the NP05D series from Taiyo Yuden, the CDRH4D18 series from Sumida, and the P1166 series from Pulse. 8.2.2.2 Inductor Selection - SEPIC Regulator Equation 3 can be used to calculate the approximate inductor value for a SEPIC regulator: L2 = 2 VOUT + VD ICL TOFF (3) The boost inductor, L1, can be smaller or larger but is generally chosen to be the same value as L2. See Figure 23 and Figure 24 for typical SEPIC applications. 8.2.2.3 Diode Selection To maintain high efficiency, the average current rating of the Schottky diode should be larger than the peak inductor current, IPK. Schottky diodes with a low forward drop and fast switching speeds are ideal for increasing efficiency in portable applications. Choose a reverse breakdown of the Schottky diode larger than the output voltage. 8.2.2.4 Capacitor Selection Choose low equivalent series resistance (ESR) capacitors for the output to minimize output voltage ripple. Multilayer ceramic capacitors are the best choice. For most applications, a 1-F ceramic capacitor is sufficient. For some applications a reduction in output voltage ripple can be achieved by increasing the output capacitor. Output voltage ripple can further be reduced by adding a 4.7-pF feed-forward capacitor in the feedback network placed in parallel with RF1 (see Functional Block Diagram). Local bypassing for the input is needed on the LM2705. Multilayer ceramic capacitors are a good choice for this as well. A 4.7-F capacitor is sufficient for most applications. For additional bypassing, a 100-nF ceramic capacitor can be used to shunt high frequency ripple on the input. 10 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 8.2.3 Application Curves Figure 13. Efficiency vs Load Current Figure 14. Efficiency vs Load Current Figure 15. Output Ripple Voltage Copt, Ropt Included Figure 16. Output Ripple Voltage Copt, Ropt Excluded Figure 17. Two White-LED Efficiency Figure 18. Three White-LED Efficiency Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 11 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com 8.3 Additional Applications L 33 PH VIN 2.5V-4.2V 5 D 1 SW VIN COUT 1 PF CIN 4.7 PF Ceramic Ceramic LM2705 >1.1 V 4 SHDN 0V FB GND 3 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 19. Two White-LED Application L 33 PH VIN 2.5 V - 4.2 V CIN 4.7 PF Ceramic D 5 1 VIN SW COUT 1 PF Ceramic LM2705 >1.1 V 0V 4 SHDN GND FB 3 2 R2 82 Y Copyright (c) 2016, Texas Instruments Incorporated Figure 20. Three White-LED Application 12 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 Additional Applications (continued) L 33 H VIN 2.5 V 4.2 V 5 VIN CIN 4.7 F 12 V 8 mA D 1 SW R1 240 NY LM2705 4 SHDN COUT 1 F 3 FB R2 27 NY GND 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 21. Li-Ion 12-V Application L 33 H VIN 5V 5 VIN CIN 4.7 F 1 SW R1 240 NY LM2705 4 SHDN 12 V 18 mA D FB COUT 1 F 3 R2 27 NY GND 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 22. 5-V to 12-V Application Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 13 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com Additional Applications (continued) CSEPIC 1 F L1 22 H VIN 2.5 V - 5.5 V 1 SW 5 VIN 3.3 V 30 mA D R1 180 NY L2 22 H LM2705 CIN 4.7 F 4 SHDN FB COUT 10 F 3 R2 110 NY GND 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 23. 3.3-V SEPIC Application 1 SW 5 VIN CIN 4.7 F CSEPIC 1 F L1 33 H VIN 2.5 V 7 V 4 SHDN LM2705 FB 5V 20 mA D L2 33 H R1 1 0Y COUT 10 F 3 R2 330 NY GND 2 Copyright (c) 2016, Texas Instruments Incorporated Figure 24. 5-V SEPIC Application 14 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 LM2705 www.ti.com SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 9 Power Supply Recommendations The LM2705 is designed to operate from an input voltage supply range from 2.2 V to 7 V. This input supply must be well regulated and capable to supply the required input current. If the input supply is located far from the LM2705, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. 10 Layout 10.1 Layout Guidelines The input bypass capacitor CIN, as shown in Figure 25, must be placed close to the device. This reduces copper trace resistance, which effects input voltage ripple of the LM2705 device. For additional input voltage filtering, a 100-nF bypass capacitor can be placed in parallel with CIN to shunt any high frequency noise to ground. The output capacitor, COUT, must also be placed close to the device. Any copper trace connections for the COUT capacitor can increase the series resistance, which directly effects output voltage ripple. Keep the feedback network, resistors R1 and R2, close to the FB pin to minimize copper trace connections that can inject noise into the system. The ground connection for the feedback resistor network must connect directly to an analog ground plane. Tie the analog ground plane directly to the GND pin. If no analog ground plane is available, the ground connection for the feedback network must tie directly to the GND pin. Minimize trace connections made to the inductor and Schottky diode to reduce power dissipation and increase overall efficiency. 10.2 Layout Example Inductor Schottky SW COUT VIN LM2705 CIN GND FB R1 SHDN R2 Figure 25. LM2705 Layout Example Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 15 LM2705 SNVS191F - NOVEMBER 2002 - REVISED OCTOBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright (c) 2002-2016, Texas Instruments Incorporated Product Folder Links: LM2705 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2705MF-ADJ NRND SOT-23 DBV 5 TBD Call TI Call TI -40 to 85 S59B LM2705MF-ADJ/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S59B LM2705MFX-ADJ/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S59B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2017 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM2705MF-ADJ/NOPB SOT-23 DBV 5 1000 178.0 8.4 LM2705MFX-ADJ/NOPB SOT-23 DBV 5 3000 178.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2705MF-ADJ/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM2705MFX-ADJ/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM2705MF-ADJ LM2705MF-ADJ/NOPB LM2705MFX-ADJ LM2705MFX-ADJ/NOPB