product brief
Non-Volatile Memory Storage Solutions
Consistently Amazing
Make the Switch to Faster Data
Deliver breakthrough performance with Intel PCIe Solid State Drives.
Breakthrough Performance1
The Intel® Solid State Drive (SSD) Data
Center Family for PCIe brings extreme
data throughput directly to Intel® Xeon®
processors with up to six times faster
data transfer speed than 6 Gbps SAS/
SATA SSDs.The Intel SSD Data Center
Family for PCIe is capable of reading data
up to 2.8GB/s and 460k Input/Output
Operations Per Second (IOPS) and writ-
ing up to 2.0GB/s and 175k IOPS.
The performance of a single drive from
the Intel SSD Data Center Family for
PCIe, specically the Intel® SSD DC
P3700 Series (460K IOPS), can replace
the performance of 7 SATA SSDs
aggregated through an HBA (~500K
IOPS). At 200 IOPS per Hard Disk Drive
(HDD), 2,300 15K HDDs would be needed
to match the performance of one Intel
SSD Data Center Family for PCIe device.
Intel SSD Data Center Family for PCIe’s
consistently amazing performance
provides fast, unwavering data streams
directly to Intel Xeon processors mak-
ing server data transfers ecient. SSD
performance consistency provides
scalable throughput when multiple SSDs
are unied into a single storage volume.
The massive storage bandwidth increase
feeds Intel Xeon processor systems giv-
ing data center servers a performance
boost.
Proven Quality and Reliability
Intel SSD Data Center Family for PCIe
devices are based on Intel-developed
controller, rmware, and leading manu-
facturing process NAND ash memory.
Rigorous qualication and compatibility
testing ensures a highly reliable SSD.
By combin-ing SSD NAND management
techniques and NAND silicon enhance-
ments, High Endurance Technology
(HET) enables the Intel DC P3700 Series to
achieve 17 drive writes per day over a ve
year drive life.
Modernize Data Center Storage
NVMe is engineered for current and future
Non-Volatile Memory (NVM) technologies,
unlike SAS/SATA SSDs. NVMe overcomes
SAS/SATA SSD performance limitations
by optimizing hardware and software to
take full advantage of NVM SSD technol-
ogy. Intel Xeon processors eciently
transfer data in fewer clock cycles with the
NVMe optimized software stack compared
to the legacy Advance Host Controller
Interface (AHCI) stack, reducing latency
and overhead. Direct CPU connection also
eliminates Host-Bus-Adapter (HBA) cards,
further reducing latency and TCO.
Comprehensive Solution
Intel‘s product line enables extensive
system compatibility, completes
numerous industry standard compliance
certications, and delivers Intel drivers,
supporting industry driver development.
The Intel SSD Data Center Family for
PCIe includes the Intel Solid State Drive
DC P3700, P3600, and P3500 Series
providing a full range of endurance up to
17 full-capacity writes per day, capacity
up to 2TB, and 2.5-inch and Add-in-
Card (AIC) form factors. Intel-enabled
NVMe software drivers are provided
by major operating system vendors
including Microsoft* Server 2012 and
2008, Windows* 7, 8, and 8.1 Red Hat*
7.0/6.6/6.5, SLES* 11 SP3, UEFI* 2.3.1,
and the Linux* Open Source development
community. The new 2.5-inch form
factor with hot-swap capability provides
convenient front panel serviceability
allowing quick, uninterrupted installation.
The AIC form factor conveniently ts in
half-height, half-length (HHHL) slots.
Intel® Solid State Drive Data Center Family for PCIe®
Servers can now support more
users simultaneously, compute on
larger data sets, and address high-
performance computing at lower
Total Cost of Ownership (TCO).1
Intel® SSD Data Center Tool provides
a powerful set of management
capabilities.
Intel led the industry in creation of a
new Non-Volatile Memory Express*
(NVMe™) storage interface standard.
Intel is driving transition to NVMe
SSDs by providing a comprehensive
product line.
For more information, visit www.intel.com/
design/ash/nand/managessd.htm
Intel® Solid State Drive Data Center Family for PCIe® 2
TECHNICAL SPECIFICATIONS1
PRODUCT FAMILY INTEL® SOLID STATE DRIVE DATA CENTER FAMILY FOR PCIe®
SERIES NAME INTEL® SSD DC P3500 SERIES INTEL® SSD DC P3600 SERIES INTEL® SSD DC P3700 SERIES
Capacities 400GB, 1.2TB, 2TB 400GB, 800GB, 1.2TB, 1.6TB, 2TB 400GB, 800GB, 1.6TB, 2TB
Sequential Read
Sustained Write
Performance2,3 (MB/s)
Up to 2500
Up to 1700
Up to 2600
Up to 1700
Up to 2800
Up to 2000
Random I/O Read
Operations Write
70/30 Read/Write
per Second 4KB K-IOPS2, 3
Up to 450
Up to 35
Up to 85
Up to 450
Up to 56
Up to 160
Up to 460
Up to 175
Up to 265
Lifetime Endurance4 Up to: 0.3 Drive Writes Per Day 3 Drive Writes Per Day 17 Drive Writes Per Day
Latency5 Read/Write 20µs / 20µs
Interface Non-Volatile Memory express (NVMe™) PCIe 3.0 x4
Form Factor
Height / Weight
2.5-inch
15mm/up to 125 grams
AIC
Half-Height Half-Length (HHHL)/195 grams
Life Expectancy 2 million hours Mean Time Between Failures (MTBF), 230 years
Power Consumption6Active: <25W (Write) / <11W (Read) Idle: 4W Typical
NAND Flash Memory Intel® NAND Flash Memory Multi-Level Cell (MLC) 20nm
Operating Temperature72.5-inch FF: 0° C to 35° C ambient temperature with suggested airflow, 0° to 70° C case temperature
AIC: 0° C to 55° C ambient temperature with suggested airflow
RoHS Compliance Meets the requirements of European Union (EU) RoHS Compliance Directives
Software Support Intel® Solid State Drive Data Center Tool, NVMe Drivers: www.intel.com
Product Ordering Solid State Drive Computing Starts with Intel Inside®. To order visit www.intel.com/ssd
Solid State Drive Computing Starts with Intel Inside®. For more information,
visit www.intel.com/ssd
1 Based on the Intel® Solid State Drive DC P3500, P3600 and P3700 Series Product Specications. Random I/O Operations based on Thousand (K) IOPS
2 Performance varies by capacity and is measured using IOMeter* with Queue Depth 128, for sequential workload Queue Depth 128 with single worker. For Random workload Queue Depth 32, with 4 workers.
3 Measurements are performed on full span of logical block address (LBA) range on an SSD that is lled to capacity with data. IOPS setup: Intel® CoreTM i7-3770K CPU @ 3.50GHz, 8GB of system memory, Windows*
Server 2012, and IOMeter tool were used. DC P3700 system performance is conguration dependent. Random performance is collected with 4 workers each with 32 QD.
4 Using JESD218 standard with JESD219 workload, Terabytes Written (TBW)
5 Average latency measured with 4KB sequential I/O at Queue Depth1
6 Active power measured during execution of Full Sequential Workload with 128KB transfer size, idle power is measured when there is no I/O to SSD.
7 For suggested airow please refer to the product specication document.
Intel may make changes to specications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “unde-
ned.” Intel reserves these for future denition and shall have no responsibility whatsoever for conicts or incompatibilities arising from future changes to them. The information here is subject to change without
notice. Do not nalize a design with this information.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specic
computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in
fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Performance tests and ratings are measured using specic computer systems and/or components and reect the approximate performance of Intel products as measured by those tests. Any dierence in system
hardware or software design or conguration may aect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering
purchasing. For more information on performance tests and on the performance of Intel products, go to: http://www.intel.com/performance/resources/benchmark_limitations.htm.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specications. Current characterized errata are available on
request. Contact your local Intel sales oce or your distributor to obtain the latest specications and before placing your product order. Copies of documents which have an order number and are referenced in this
document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web site at www.intel.com.
Copyright © 2015 Intel Corporation. All rights reserved. Intel, Intel Xeon, the Intel logo, and Intel Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others. Printed in the USA 151203/jm/ra Please Recycle 330591-005US
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