SHARP ELECTRONIC COMPONENTS GROUP SHARP CORPORATIO SPECIFICATION / DEVICE SPECIFICATION VOLTAGE MODEL OlT'O-ELECI'RONIC D Applied model name FOR REGIJIX-OR No. PQ***EZO 12 1. These spectication sheets include materials protected Please do not reproduce or cause anyone to reproduce under copyright of Sharp Corporation them without Sharp's consent. Wharp"). 2. When using this product, please observe the absolute maximum ratings and the instructtons for use outlined in these specitkation sheets, as well as the precautions mentioned below. Sharp assumes no responsibthty for any damage resulting from use of the product which does not comply with the absolute mardmum ratings and the instructions included in these speciflcatton sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : Home appliances OA equipment . Audio visual equipment Measuring equipment * TelecommuntcaUon equipment (Terminal) Computers [ Tooling machines l l l l l 1 If the use of the product tn the above application areas is for equipment h&d in paragraphs (2) or [3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment whtch demands htgh relfabtltty and safety in functfon and precision, such as : l l [ l Transportation control and safety equipment (atrcraft, tram, automobile etc.) Gas leakage sensor breakers Rescue and securlly equipment Other safety equipment Traffic signals l l 1 13) Please do not use this product for equipment which require extremely high relfabthty . and safety in function and precision. such as : i, TelecommunicaUon equipment (for trunk lines> * Space equipment * Medical equipment [ * Nuclear power control equipment 1 l (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER'S DATE BY APPROVAL DATE PRESENTED BY K. Hachimura, Department General Manager Engineering Dept..11 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION of SHARP CORPORATION 1. AppIication This specification appkes to the outbne and characteristics of tape packing type series regulator (linear type), Model No. PQ***EZOlZ. AppIied Model name PQO15EZOlZZ. PQO15EZOlZP. PQO18EZOlZZ. PQO18EZOlZP, PQO25EZOlZZ. PQO25EZOlZP, PQO3OEZOlZZ. PQO3OEZOlZP, PQO33EzolZZ PQO33EZOlZP usage PQ++*EZOlZ are the device for stabikzation of DC positive output voltage with built-in ON/OFF function, the over current protection function, the overheat protection function and low consumpUon current at OFF-state (stand-by). These devices are possible to use in power supply circuit up to current capacity IA. Block diagram . . DC input 0 . ..-..______....1.-.-...- DC output ( ON/OFF (`Vo) control , (`Vcl . . . ..~~~~.I GND 2. Outline : Refer to the attached 3. Ratings and characteristics sheet, Page 3. : Refer to the attached 3.1 Absolute maximum 3.2 Electrical characteristics 3.3 Electrical characterisUcs sheet, Page 4 to 7. ratings a 3.4 Pd-Ta 4. ReIiability 5. Outgoing rating (Typical (, measuring valuel : Refer to the attached inspection circuit sheet, Page 8.9. : Refer to the attached sheet, Page 9. i SHRRP CORPORATION : Refer to the attached 6. Supplement 6.1 Example 6.2 Taping 6.3 sheet, Page 10 to 15. of application and reel packaging Sleeve packaging (PQ***EZOlZP) (PQ***EZO 122) 6.4 ODS materials This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials for ODS 6.5 Brominated : CFC,. Halon. Carbon 1.1.1 -`Mchloroethane tetrachloride, (Methylchloroform flame retardants Specitk brominated flame retardants in this device at all. 6.6 This product is not designed 7. Notes : Refer to the attached 7.1 External connection 7.2 Thermal protection 7.3 Static process such as the PBBOs as electromagnetic and PBB, and ionized-particle sheet, Page 16 to 18. design electricity 7.4 Soldering 7.5 For cleaning I (. are not used radiation resistant. SHARP CORPORATlON 2. Outline 6.6 i'4AX 52~0.5 I ;,!. _." 2.3to.s I . /- I -#I / Model No.% I / Lot /(DIN No. standard) . (. II Applied model No. PQO15EZOlZZ PQ018E20122 WO25EzO1ZZ W030EZOlZZ P6033EZOlZZ Pii015E20127 PQ018EzOIzz PQ025EZO 1 ZZ PQO3OEzO 1ZZ x33E7fi 172 PQC----_-- 1 I V~ t 1 t . 1 1 I II Marked model No. 015EZO1 018EzOl 025EZO 1 030E: zol 033EZOl Ol! SE20 1 018EZ01 025EZO I 030EZO I 033EZOl --~~ I I 0 @I 0 @I (3 of the marking DC input (Vinl ON/OFF control DC output (Vo) NC GND (Vc) *( ) :TYP. Unit : mm -Scale: 5/l l 1I Lead finish : Solder plating Lead material : Cu - Product mass : 0.3g l l % (Example i in case of the PQ***EZO 12) SHARP CORPORflTION 3. Ratings and characteristics 3.1 Absolute maximum ratings Ta=25C Parameter Input voltage Output (`1) control Output current Symbol (`1) voltage Power dissipation Junction temperature Operating Storage Soldering (*2) (*3) temperature temperature temperature Conditions unit R-x! Vin 10 V VC 10 V 10 1 A Pd 8 W T1 150 c Topr -40 to +85 c Tstg -40 to +150 c Tsol 260 c (+l) All are open except GND and applicable terminals. (*2) Pd : With infinite heat sink (*3) There is case that over heat protection operates at the condition Refer to Fig. 1 For 10 s Tj= 125% to 15OC Fig. I Pd - Ta rating 10 8 i Power dissipation Pd WI Ambient temperature Pd : With infinite heat sink (Note) There is case that over heat protection Ta (C) function operates at oblique line portion. SHRRP CORPORATION 3.2 EIectrlcal characteristics Unless otherwise specified condition shall be Wn=Vo(TYP)+lV. Io=O.SmA. Vc=2.7V. Ta=25'c Parameter Symbol MIN. TYP. MAX. unit Input voltage ViIl 2.35 - 10 v Output voltage vo Load regulation RegL Line regulation Temperature coefacient of output voltage Conditions Refer to list 1 V - 0.2 2.0 % RegI - 0.1 1.0. ow-v vin=vo(TYP)+ 1v to Vo(TYP)+6v 10=5mA TcVo - fO.01 - %/C Io=SmA Tj=O to 125C Ripple rejection RR 45 60 - dl3 Refer to Fig.3 Dropout voltage vi-o - 0.2 0.5 v (`5). 10=0.5A On-state voltage for control Vc (on) 2.0 - - V On-state current for control Ic (on) - - 200 PA Off-state voltage for control Vc (ofi) - - 0.8 V Off-state current for control Ic (off) - - 2 PA vc=o.4v Quiescent current h - 1 2 mA Io=OA Output off-state consumption current Iqs - - 5 PA Io=OA vc=o,4v a 10=5mA to 1A (*4) Applied to PQO30EZOlZ and PQO33EZOlZ. (`5) Input voltage when output voltage falls 0.95Vo by input voltage falling down, (+6) In case that the control terminal (0 pin) is non-connection, output voltage should be OFF state. List 1 Output voltage SHflRP CORPORATION 3.3 Electrical characteristics measuring circuit Fig. 2 Standard measuring circuit of Regulator Fig. 3 Standard measuring circuit of critkal f=lZOHz sine wave ei(rms)=0.5V vin=vo(TYFq+ 1v 10=0.3A RR=20 log (ei(rms)/eo(rmsll portion rate of ripple rejection SHflRP CORPORfiTION 3.4 Pd - Ta rating (Typical value) Power dissipation Pd WI 1 0 20 40 60 80 Ambient temperature Ta (C) (, Mounting PCB I I =-T PCB Copper foil Material : Glass-cloth epoxy resin Size: 5OX50X1.6mm Thickness of copper : 35 p m i, SHfiRP CORPOMTION The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10%/20% Test Items Test Conditions Failure Judgement Criteria Temperature cycung 1 cycle -4OC to +15OC (3(hninl (3Omfm 20 cycles test Vo<LXO.8 n=22. C=O Humidity (Steady State) +6OC .9O%RH. lOOOh vo>UX1.2 n=22, C=O 1 cycle : -20C to 7OC (2hl (2h) Transfer time between high and low temp. is 1h. 40 cycles test, 9O%RH RegLxJx High temp. storage +150%. lOOOh RKLXO.8 Low temp. storage -40-C, lOOOh Damp Heat cyclic 1.2 n=22. C=O RegI>UX 1.2 n=22, C=O n=22, C=O - vi-o>UX1.2 `4 Operation life Ta=25C, Pd=0.8W. lOOOh n=22. C=O Mechanical shock 15km/s*. 0.5ms 3 times/ *X *Y. *Z n=ll. Vibration [variable frequency) 200m/s2 100 to 2000 to lOOHz/4 mm 4 times/ X. Y. 2 directton Electrostatic discharge -+25OV. 2OOpF. 00 Between GND and each tee/ 3 times Soldering heat 260%. 10 s. Dip up to 0.5mm from resin portion l l Robustness of Termination (Tensile test) Weight: 1ON 10 s/ each terminal l2 Robustness of Termination (Bending test] Weight: 2.5N 0' -go= -0' --go= -0' each terminal l 3 Solderablllty 230+5C. 5+0.5 s Userogtnflux l1 C=O n=ll, C=O U: Upper spe&catton limit L: Lower n=ll. specffication i limit .' ' n=ll. C=O n=ll, C=O n=ll. C=O Failure if it has breakdown and loosened pin. 5 Failure if solder shall not be adhere at the area of 95% or more dipped portion. +6 C=O ' n=l1. C=O SHRRP CORPORfllION l 1 Soldering below. `2 Terminal tensile direction is shown below. area is shown O.Smm CI /p\ c *3 Terminal bending is shown below. direction 'i Weight l 4 Applied to PQO3OEZO 12 and PQ033EZO l 5 Except for the bending of terminal. *6 Except for the portion within 0.5mm from the interface between the heat sink and the resin portion, and the side surface of heat sink. '! ?I 1 5. Outgoing Weight inspecti on . ; i TABLE II-A single sampling plans for normal inspection based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Defect Major defect Inspection Electrical items AQL (OhI Judgement criteria characteristics 0.1 Unreadable marking Depend on the spectication Minor defect Appearance 0.4 Dimensions 12. SHflRP CORPORATION 6. Supplement 6.1 Example of application \rb I1 47IT CO+ + 1 High : Output or Open : Output ON-OFF s@nal i T' i ON OFF I SHARP CORPORflTION 6.2 Packing 6.2.1 specifications Packing (PQ**+EZOlEP) conditions ( 1) Tape structure and Dimensions (Refer to Fig. A) The tape shall have a structure in whtch a cover tape is sealed heatpressed on the carrier tape of polystyrene emboss protect against static electricity. Dimensions are shown Fig. A (2) Reel structure and Dimensions (Refer to Fig.B) The reel shall be made of polystyrene. (3) Direction of product insertton Product direction in carrier the hole side on the tape. 6.2.2 Dimensions are shown Fig. B. (Refer to Fig. C) tape shall direct to the radiate fin of product at Tape characteristics (1) Adhesiveness of cover tape The peel-back force between carrier tape and cover tape shaU be O.lN to 0.8N for the angle from 160' to 180' . (Tape speed : 5mm/s) (2) Bending strength Sealed tape : Bended tape radius shall be more than 30mm. if bended tape radius is less than 3Omm. there is case that cover tape come off carrier tape. Carrier 6.2.3 Rolling (1) Rolling tape : Bended method tape radius &all be more than 15mm. and quantity (. method iI Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20 pitch of empty cavities to the trailer and attach more than 10 pitch of empty cavities to the leader of the tape and fix the both ends with adhesive tape. One reel shall`contain 3000 PCS. SHARP CORPORflTION 6.2.4 Indication (1) -1 The reel shall be pasted label with following l Model (2) Package No. l Number 6.2.5 Model Storage l Production date case The outer packaging l of pieces contained information. No. l case shall be marked Number of pieces contained with following l information. Inspection date condition Taped products shall be stored at the temperature lo&r than 5 to 30'6 and the humidities lower than 7O%RH. If taped products aren't used longer than for lodays, Please rewind the tape pulled out and storage. 6.2.6 Others (1) joint of tape The cover tape and carrier (2) The way to repair tape in one reel shall be jointless. taped failure devices The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. Fig. A Tape structure and Dimensions Dimensions : WP. Unit : mm value SHARP CORPORflTION Fig. B Reel structure and Dimensions Dimensions : TYP. value Unit : mm Fig. C Direction of product insertion li ;. Pull-out i direction SHARP CORPORRTION 6.3 Sleeve packaging 6.3.1 Packing (PQ'+*Eu)lZ) conditions (1) Sleeve structure and Dimensions (Refer to Fig. D) The sleeve shall be made of high inpuct polethylene (Plastics with preventing static electricity). Dimensions are shown Fig. D. (2) The packfng case shall be made of corrugated Dimensions are shown Fig. F. (3) Stopper cardboard. structure The stopper shall be made of styrene butadiene 6.3.2 Packaging method (1) Packaging rubber. and quantity method Max. 75pcs. of products shaIl be packaged in a sleeve and both of Fix the packing case by kraft tape. sleeve edges shall be fixed by stoppers. (2) Quantity (Refer to Fig. E) One package 6.3.3 shall contain 3OOOpcs./package. Indication (1) Packing case The packing l Model No. case shall be marked l Number with following of pieces contained information. l Inspection 1 date (. i1 . SHHHY CUHPUHHI IUN Fig. D GKtnnnor w"."~~r. (Without @See ye @Stopper pulled potion) (With pulled portion) 4 0 sleeves ( 1 0 IineX 4 stairs) Fig. F ():Typ. unit: mm Mass per packaged Inspection date case: 1.6kg TYP SHARP CORPORfiTION 7. Notes 7.1 External connection C-MOS or TIL (1) Please perform shortest wiring for connection between Cm, Co and the individual terminal. There is case that oscillation occurs easily by kinds of capacitor and capacity. Before you use this device, you should confirm output voltage on your use mounting state. (2) The input terminal for ON/OFF output control ; @ is compatible with IS-`ITI+ and direct driving by `ITL or C-MOS standard logic (RCA 4000 series) is also available. In case that ON/OFF terminal is not used, we recommend to connect the ON/OFF terminal dire&Q to the input terminal ; @ input voltage. (3) As voltage application under conditions that the device pin is inserted divergently or reversely, may occur the degradation of characteristics or breakdown of the device. please avoid it absolutely. 7.2 Thermal protection I design Internal power dissipation following equation. (. (Pd) of device is obtained i\ by the Pd=IoX(Vin-Vo)+VinXIq If the maximum operating temperature and Pd (MAX.) when the device is operating are determined. use such a heat sink as allows the device to operate within the safety operation area specified by the derating curve in para. 3.4. Insufhcient radiation gives an unfavorable infIuence to the normal operation and reliabihty of the device. In the case of no passage within the safety operational territory fflustrated by the derating curve, the overheat protectton circuit operates to let output fall down, please avoid keeping such condition for a long time. SHARP CORPORATION 7.3 Static electricity Good caution must be exercised against static electricity since this device consists of a bipolar IC. Following are some examples of preventive measures against excessive voltages such as caused by static electricity. (al frytibody must be grounded to discharge the static electricity from the body . (b) Anything inserter, that is in contact with the device such as workbench, or measuring instrument must be grounded. (cl Use a solder dip basin with a minimum leak current (isolation resistance 10MQ or more] from the commercial power supply. Also the solder dip basin must be grounded. 7.4 Soldering (1) Reflow soldering It is and (The It is room recommended that within two times soldering be done at the temperature the time within the temperature profile as shown in the figure. temperature shown in the figure is fin portion temperature of the device.) recommended that the second reflow become at the device which is the temperature. (a) An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. The temperature of resin portion should be with in the temperature proffle below. (bl The temperature sloping when soldering-reflow is 4E/s or less. 240.X 200C 180C 25X, < 2 min > < < 1 min ' 80s !+-iGiPd `i SHARP CORPORATION (2) Dip soldering We recommend that solder dip should be 260F or less (Solder temp.) within and 1 time only. Please obey the note items below concerning solder reflow. (a) Atter solder dip, please do cooling (b) Please shall not give the mechanical naturally. stress or the impact In advance, please confirm fully the dip soldering in order to avoid any soldering bridge. (3) Hand 10s conditions stress to the device. etc. in the actual application soldering This device is basically designed for the soldering such as reflow soldering or dip soldering. In case when hand soldering is reluctantly needed for m-cation etc., it is recommended that only one hand soldering should be done at 26O'c or less of soldering iron edge temperature, for 10s or less. Please be careful not to touch soldering iron edge to leads directly etc. in order not to give any stress to the leads. Even within the above conditfons regarding solder reflow, solder dip or hand soldering there is the possibility that the stress given to the terminals by the deformation of PCB makes the wire in the device package cut. In advance, please con&m fully at the actual application. 7.5 For cleaning (1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 mm or less (2) Ultrasonic cleaning (3) Applicable solvent : The effect to device byL ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time. PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn`t occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol, Isopropyl. alcohol i In case when the other solvent is used, there are cases'& p the packaging resin is eroded. Please use the other solvent . after thorough con&nation is performed in actual using condition.