1
FEATURES
1
2
3
4
8
7
6
5
NC
NC
NC
ANODE
CATHODE
NC
CATHODE
ADJ
D OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
ANODE
CATHODE
ADJ
LP PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
NC
NC
ANODE
CATHODE
NC
CATHODE
ADJ
D OR PW PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
ANODE CATHODE
ADJ
LT1009
www.ti.com
................................................................................................................................................................. SLVS013N – MAY 1987 – REVISED MAY 2009
2.5-V INTEGRATED REFERENCE CIRCUIT
•Excellent Temperature Stability •Wide Operating Current Range•Initial Tolerance: 0.2% Max •Directly Interchangeable With LM136•Dynamic Impedance: 0.6 ΩMax •Needs No Adjustment for MinimumTemperature Coefficient
The LT1009 reference circuit is a precision-trimmed 2.5-V shunt regulator featuring low dynamic impedance anda wide operating current range. The maximum initial tolerance is ± 5 mV in the LP package and ± 10 mV in the Dand PW packages. The reference tolerance is achieved by on-chip trimming, which minimizes the initial voltagetolerance and the temperature coefficient, α
VZ
.
Although the LT1009 needs no adjustments, a third terminal (ADJ) allows the reference voltage to be adjusted± 5% to eliminate system errors. In many applications, the LT1009 can be used as a terminal-for-terminalreplacement for the LM136-2.5, which eliminates the external trim network.
The LT1009 uses include 5-V system references, 8-bit analog-to-digital converter (ADC) and digital-to-analogconverter (DAC) references, and power-supply monitors. The device also can be used in applications such asdigital voltmeters and current-loop measurement and control systems.
The LT1009C is characterized for operation from 0 ° C to 70 ° C. The LT1009I is characterized for operation from– 40 ° C to 85 ° C.
SYMBOL
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1987 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
Q14 Q11
Q13
Q12
Q9
Q10
Q8
Q7
Q2
Q1
Q3
Q4
Q5
Q6
ANODE
CATHODE
ADJ
30 kΩ
500 Ω
720 Ω
10 kΩ
20 pF
30 pF
24 kΩ24 kΩ6.6 kΩ
6.6 kΩ
LT1009
SLVS013N – MAY 1987 – REVISED MAY 2009 .................................................................................................................................................................
www.ti.com
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 75 LT1009CDSOIC – D 1009CReel of 2500 LT1009CDRBulk of 1000 LT1009CLP0 ° C to 70 ° C TO-226/TO-92 – LP Ammo of 2000 LT1009CLPM LT1009CReel of 2000 LT1009CLPRTube of 150 LT1009CPWTSSOP – PW 1009CReel of 2000 LT1009CPWRTube of 75 LT1009IDSOIC – D 1009IReel of 2500 LT1009IDRBulk of 1000 LT1009ILP– 40 ° C to 85 ° C TO-226/TO-92 – LP Ammo of 2000 LT1009ILPM LT1009IReel of 2000 LT1009ILPRTube of 150 LT1009IPWTSSOP – PW 1009IReel of 2000 LT1009IPWR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
SCHEMATIC
NOTE: All component values shown are nominal.
2Submit Documentation Feedback Copyright © 1987 – 2009, Texas Instruments Incorporated
Product Folder Link(s): LT1009
ABSOLUTE MAXIMUM RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
LT1009
www.ti.com
................................................................................................................................................................. SLVS013N – MAY 1987 – REVISED MAY 2009
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
I
R
Reverse current 20 mAI
F
Forward current 10 mAD package 97θ
JA
Package thermal impedance
(2) (3)
LP package 140 ° C/WPW package 149T
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
LT1009C 0 70T
A
Operating free-air temperature range ° CLT1009I – 40 85
Copyright © 1987 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): LT1009
ELECTRICAL CHARACTERISTICS
Maximum VZ
Minimum VZ
V at I = 1 mA
Z(dev) Z
DTA
DTA
× 106
VZ(dev)
V at 25°C
Z
=
| V |aZ
ppm
°C
70°C
× 106
4 mV
2500 mV
| V | =aZ
ppm
°C
»23
LT1009
SLVS013N – MAY 1987 – REVISED MAY 2009 .................................................................................................................................................................
www.ti.com
at specified free-air temperature
LT1009C LT1009IPARAMETER TEST CONDITIONS T
A
(1)
UNITMIN TYP MAX MIN TYP MAX
D/PW package 2.49 2.5 2.51 2.49 2.5 2.5125 ° CLP package 2.495 2.5 2.505 2.495 2.5 2.505V
Z
Reference voltage I
Z
= 1 mA VD/PW package 2.485 2.515 2.475 2.525Full rangeLP package 2.491 2.509 2.48 2.52V
F
Forward voltage I
F
= 2 mA 25 ° C 0.4 1 0.4 1 VI
Z
= 1 mA,
125 125V
ADJ
= GND to V
ZAdjustment range 25 ° C mVI
Z
= 1 mA,
45 45V
ADJ
= 0.6 V to V
Z
– 0.6 VChange in reference D/PW package 5 15ΔV
Z(temp)
voltage with Full range mVLP package 4 15temperature
Average temperature 0 ° C to 70 ° C 15 25 15 25
ppm/αV
Z
coefficient of I
Z
= 1 mA, V
ADJ
= open
° C– 40 ° C to 85 ° C 20 35reference voltage
(2)
25 ° C 2.6 10 2.6 6Change in referenceΔV
Z
I
Z
= 400 µA to 10 mA mVvoltage with current
Full range 12 10Long-term change in ppm/ΔV
Z
/Δt I
Z
= 1 mA 25 ° C 20 20reference voltage khr25 ° C 0.3 1 0.3 1Z
Z
Reference impedance I
Z
= 1 mA ΩFull range 1.4 1.4
(1) Full range is 0 ° C to 70 ° C for the LT1009C and – 40 ° C to 85 ° C for the LT1009I.(2) The deviation parameter V
Z(dev)
is defined as the difference between the maximum and minimum values obtained over therecommended operating temperature range, measured at I
Z
= 1 mA. The average full-range temperature coefficient of the referencevoltage ( αV
Z
) is defined as:
αV
Z
can be positive or negative, depending upon whether the minimum V
Z
or maximum V
Z
, respectively, occurs at the lowertemperature.
For example, at I
Z
= 1 mA, maximum V
Z
= 2501 mV at 30 ° C, minimum V
Z
= 2497 mV at 0 ° C, V
Z
= 2500 mV at 25 ° C, ΔT
A
= 70 ° C forLT1009C:
Because minimum V
Z
occurs at the lower temperature, the coefficient in this example is positive.
4Submit Documentation Feedback Copyright © 1987 – 2009, Texas Instruments Incorporated
Product Folder Link(s): LT1009
TYPICAL CHARACTERISTICS
VZ
2.5
2.49
2.48
2.47
−50 −25 0 25 50 75
− Reference Voltage − V
2.51
2.52
2.53
100 125
TA − Free-Air Temperature − °C
Iz = 1 mA
∆VZ
3
2
1
00 4 8 12 16 20
− Change in Reference Voltage − mV
4
5
IZ − Reference Current − mA
0.6
0.4
0.2
0
0.001 0.01 0.1 1 10
0.8
1
IF − Forward Current − mA
1.2
VF− Forward Voltage − V
TJ = 25°C
LT1009
www.ti.com
................................................................................................................................................................. SLVS013N – MAY 1987 – REVISED MAY 2009
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges ofthe various devices.
REFERENCE VOLTAGE CHANGE IN REFERENCE VOLTAGEvs vsFREE-AIR TEMPERATURE REFERENCE CURRENT
Figure 1. Figure 2.
REVERSE CURRENT FORWARD VOLTAGEvs vsREVERSE VOLTAGE FORWARD CURRENT
Figure 3. Figure 4.
Copyright © 1987 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): LT1009
1
0.110 100 1k 10k 100k
10
f − Frequency − Hz
100
ZZ− Reference Impedance − Ω
Iz = 1 mA
TJ = −55°C to 125°C
10 100 1k 10k 100k
f − Frequency − Hz
50
100
150
200
250
nV/ Hz− Noise Voltage − Vn
Iz = 1 mA
TJ = 25°C
Input
Output
5 kΩ
2.5
2
1.5
1
0.5
0
8
4
0
Input and Output Voltages − V
0 1 20
t − Time − µs
3
3.5
Output
Input
LT1009
SLVS013N – MAY 1987 – REVISED MAY 2009 .................................................................................................................................................................
www.ti.com
TYPICAL CHARACTERISTICS (continued)
REFERENCE IMPEDANCE NOISE VOLTAGEvs vsFREQUENCY FREQUENCY
Figure 5. Figure 6.
TRANSIENT RESPONSE
Figure 7.
6Submit Documentation Feedback Copyright © 1987 – 2009, Texas Instruments Incorporated
Product Folder Link(s): LT1009
APPLICATION INFORMATION
Output
LT1009 10-kΩ
Trim
(see Note A)
3.6 kΩ
5 V to 35 V
LT1009
3.6 V to 40 V
LM334
V+
V−
62 Ω
10 kΩ
R
Output
LT1009
VI
374 Ω
2 kΩ
OUTIN ADJ
LT1084
1.2 kΩ
10 µF10 µF
VO
LT1009
www.ti.com
................................................................................................................................................................. SLVS013N – MAY 1987 – REVISED MAY 2009
A. This does not affect temperature coefficient. It provides ± 5% trim range.
Figure 8. 2.5-V Reference
Figure 9. Adjustable Reference With Wide Supply Range
Figure 10. Power Regulator With Low Temperature Coefficient
Copyright © 1987 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): LT1009
Output
5 V
500 Ω
9.76 kΩ
1%
5.1 kΩ
10 kΩ
1%
LT1009
5.1 kΩ
5 kΩ
−5 V
−5 V
5 V
20 µF
LT1001C
VI ≥ 6 V
+
20 µF
+
10 kΩ
1 µF
2.5 V
1 kΩ
1 kΩ10 kΩ
100 kΩ
LT1009
+
−
LT1009
SLVS013N – MAY 1987 – REVISED MAY 2009 .................................................................................................................................................................
www.ti.com
Figure 11. Switchable ± 1.25-V Bipolar Reference
Figure 12. Low-Noise 2.5-V Buffered Reference
8Submit Documentation Feedback Copyright © 1987 – 2009, Texas Instruments Incorporated
Product Folder Link(s): LT1009
PACKAGE OPTION ADDENDUM
www.ti.com 25-Feb-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LT1009CD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CLP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CLPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CLPM ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CLPME3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CLPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CLPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009CPK OBSOLETE SOT-89 PK 3 TBD Call TI Call TI Add to cart
LT1009CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
PACKAGE OPTION ADDENDUM
www.ti.com 25-Feb-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LT1009IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009ILP ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009ILPE3 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009ILPR ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009ILPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type Add to cart
LT1009IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart
LT1009QDR OBSOLETE SOIC D 8 TBD Call TI Call TI Add to cart
LT1009Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI Add to cart
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Feb-2011
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LT1009 :
•Military: LT1009M
NOTE: Qualified Version Definitions:
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LT1009CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LT1009CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LT1009IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LT1009IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LT1009CDR SOIC D 8 2500 340.5 338.1 20.6
LT1009CPWR TSSOP PW 8 2000 367.0 367.0 35.0
LT1009IDR SOIC D 8 2500 340.5 338.1 20.6
LT1009IPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-2/C 10/01
STRAIGHT LEAD OPTION
0.016 (0,41)
0.014 (0,35)
0.157 (4,00) MAX
FORMED LEAD OPTION
0.104 (2,65)
0.210 (5,34)
0.170 (4,32)
0.050 (1,27)
0.016 (0,41)
0.022 (0,56)
0.500 (12,70) MIN
Seating
Plane
0.175 (4,44)
0.205 (5,21) 0.165 (4,19)
0.125 (3,17)
DIA
D
C
0.105 (2,67)
0.095 (2,41)
0.135 (3,43) MIN
0.080 (2,03)
0.055 (1,40)
0.045 (1,14)
1
0.105 (2,67)
23
0.080 (2,03)
0.105 (2,67)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Lead dimensions are not controlled within this area
D. FAlls within JEDEC TO -226 Variation AA (TO-226 replaces TO-92)
E. Shipping Method:
Straight lead option available in bulk pack only.
Formed lead option available in tape & reel or ammo pack.
MECHANICAL DATA
MSOT002A – OCTOBER 1994 – REVISED NOVEMBER 2001
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
LP (O-PBCY-W3) PLASTIC CYLINDRICAL PACKAGE
4040001-3/C 10/01
0.094 (2,40)
0.114 (2,90)
0.460 (11,70)
0.539 (13,70)
TAPE & REEL
0.335 (8,50)
0.384 (9,75)
0.020 (0,50) MIN
0.217 (5,50)
0.748 (19,00) 0.748 (19,00)
0.689 (17,50)
0.098 (2,50)
0.433 (11,00)
0.335 (8,50)
0.610 (15,50)
0.650 (16,50)
1.260 (32,00)
0.905 (23,00)
0.234 (5,95)
0.266 (6,75)
0.512 (13,00)
0.488 (12,40)
0.114 (2,90)
0.094 (2,40) 0.146 (3,70)
0.169 (4,30) DIA
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Tape and Reel information for the Format Lead Option package.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated