Continental Device India Limited
An IS/ISO 9002 and IECQ Certified Manufacturer
NPN EPITAXIAL PLANAR SILICON HIGH VOLTAGE TRANSISTOR 2N5551
TO- 92
CBE
Hi
g
h Volta
g
e NPN Transistor For General Pur
p
ose And Tele
p
hon
y
A
pp
lications.
ABSOLUTE MAXIMUM RATINGS(Ta=25deg C unless otherwise specified)
DESCRIPTION SYMBOL VALUE UNIT
Collector -Emitter Voltage VCEO 160 V
Collector -Base Voltage VCBO 180 V
Emitter -Base Voltage VEBO 6.0 V
Collector Current Continuous IC 600 mA
Power Dissipation @Ta=25 degC PD 625 mW
Derate Above 25 deg C 5.0 mw/deg C
Power Dissipation @Tc=25 degC PD 1.5 W
Derate Above 25 deg C 12 mw/deg C
Operating And Storage Junction Tj, Tstg -55 to +150 deg C
Temperature Range
THERMAL RESISTANCE
Junction to Case Rth(j-c) 125 deg C/W
Junction to Ambient Rth(j-a) (1) 357 deg C/W
(1) Rth (j-a) is measured with the device soldered into a typical printed circuit board
ELECTRICAL CHARACTERISTICS (Ta=25 deg C Unless Otherwise Specified)
DESCRIPTION SYMBOL TEST CONDITION MIN TYP MAX UNIT
Collector -Emitter Voltage VCEO IC=1mA,IB=0 160 - - V
Collector -Base Voltage VCBO IC=100uA.IE=0 180 - - V
Emitter -Base Voltage VEBO IE=10uA, IC=-0 6.0 - - V
Collector-Cut off Current ICBO VCB=160V, IE=0 - - 50 nA
Ta=100 deg C
VCB=160V, IE=0 - - 50 uA
Emitter-Cut off Current IEBO VEB=4V, IC=0 - - 50 nA
DC Current Gain hFE* IC=1mA,VCE=5V 80 - -
IC=10mA,VCE=5V 80 - 250
IC=50mA,VCE=5V 30 - -
Collector Emitter Saturation Voltage VCE(Sat)* IC=10mA,IB=1mA - - 0.15 V
IC=50mA,IB=5mA - - 0.2 V
Base Emitter Saturation Voltage VBE(Sat) * IC=10mA,IB=1mA - - 1.0 V
IC=50mA,IB=5mA - - 1.0 V
IS/ISO 9002
Lic# QSC/L- 000019.2
IS / IEC QC 700000
IS / IEC QC 750100
Continental Device India Limited Data Sheet Page 1 of 3
http://www.bocasemi.com page: 1
Boca Semiconductor Corp.
BSC
ELECTRICAL CHARACTERISTICS
(
Ta=25 de
g
C Unless Otherwise S
p
ecified
)
2N5551
DESCRIPTION SYMBOL TEST CONDITION MIN TYP MAX UNIT
D
y
namic Characteristics
Small Si
g
nal Current Gain hfe IC=1mA, VCE=10V 50 - 200
f=1KHz
Transition Fre
q
uenc
y
ft VCE=10V,IC=10mA, 100 - 300 MHz
f=100MHz
Out
p
ut Ca
p
acitance Cob VCB=10V, IE=0 - - 6.0 pF
f=1MHz
In
p
ut Ca
p
acitance Cib VEB=0.5V, IC=0 - - 20 pF
f=1MHz
Noise Fi
g
ure NF VCE=5V, IC=250uA - - 8.0 dB
R=1kohm, f=10Hz to
15.7kHz
*Pulse Test: Pulse Width=300us, Dut
y
C
y
cle=2%
TO-92 Transistors on Tape and Ammo Pack
TO-92 Plastic Package
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5.0K
2.0K
17" x 15" x 13.5"
17" x 15" x 13.5"
80.0K
32.0K
23 kgs
12.5 kgs
PACKAGE
Net Weight/Qty
Details
STANDARD PACK INNER CARTON BOX
Qty
OUTER CARTON BOX
Qty Gr WtSize Size
P
ac
ki
ng
D
eta
il
CUMULATIVE PITCH
ERROR 1.0 mm/20
PITCH
TO BE MEASURED AT
BOTTOM O F CLIN CH
AT TO P OF BODY
t1 0.3 - 0.6
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
COMPONENT ALIGNM ENT
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCEF1,
CLINCH HEIGHT
PULL - OUT FORCE
ITE M
A1
A
T
P
Po
P2
F
h
W
Wo
W1
W2
Ho
H1
L
Do
t
F2
H2
(P)
SYMBOL
SPECIFICATION
4.0
4.8
3.9
6N
MIN.
12.7
12.7
6.35
5.08
0
18
6
9
0.5
16
4
2.54
NOM.
4.8
5.2
4.2
1
23.25
11.0
1.2
3
MAX.
±1
±0.3
±0.4
+0.6
-0.2
±0.5
±0.2
+0.7
-0.5
±0.2
±0.5
±0.2
+0.4
-0.1
TOL . REMARKS
NOTES
1. MAXIMUM ALIGNMENT DEVIATION BETW EEN LEADS NOT TO BE GREATER THAN 0.2 mm.
2. MAXIMUM NON-CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1 mm IN 20
PITCHES.
3. HOLDDOW N TAPE NOT TO EXCEED BEYOND THE EDGE(S) OF CARRIER TAPE AND THERE SHALL BE NO
EXPOSURE OF ADHESIVE.
4. NO MORE THAN 3 CONSECUTIVE MISSING COMPONENTS ARE PERMITTED.
5. A TAPE TRAILER, HAVING AT LEAST THREE FEED HOLES ARE REQUIRED AFTER THE LAST COMPONENT.
6. SPLICES SHALL NOT INTERFERE WITH THE SPROCKET FEED HOLES.
All dimensions in mm unless specified otherwise
Ammo Pack
S
t
y
le
Adhesive Ta
e on To
Side
FLAT SIDE
MECHANICAL DATA
T
t1
tF1 F2
F
P2
Po
Do
(p)
W2
Wo W1
W
H1
A
A1
P
H0
L
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Am mo Pack
LABEL
Carrier
Strip
8.2"
13"
FEED
1.77"
hh
B
3 2 1
AK
E
DAA
SEC AA
G
D
FF
H
C
3 2 1
321
All diminsions in mm.
DIM MIN. MAX.
A 4.32 5.33
B 4.45 5.20
C 3.18 4.19
D 0.41 0.55
E 0.35 0.50
F5 DEG
G 1.14 1.40
H 1.14 1.53
K 12.70 —
PIN CONFIGURATION
1. COLLECTOR
2. BASE
3. EMITTER
Continental Device India Limited Data Sheet Page 2 of 3
http://www.bocasemi.com