1/8
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Stepping Motor Driver series
High Performance, High Reliability
36V Stepping Motor Driver Series
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
Description
BD6387EFV, BD6385EFV, BD6383EFV, BD6389FM are the high-grade type that provides the highest function and highest
reliance in the ROHM stepping motor driver series. This series has the perfect various protection circuits and reduces IC’s
generation of heat by adopting low-ON resistance DMOS and high heat-radiation power package.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supplys rated
voltage of 36V and rated output current of 1.0A2.2A. For the input interface, the CLK-IN drive mode and the parallel IN
drive mode are compatible with each other, so please choose an input mode according to needs of application. There are
excitation modes of FULL STEP & HALF STEP (2 kinds), QUARTER STEP mode, and for current decay mode, the ratio of
FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In
addition, being able to drive with one system of power supply makes contribution to the set design’s getting easy.
Feature
1) Power supply: one system drive (rated voltage of 36V)
2) Rated output current: 1.0A, 1.5A, 2.0A, 2.2A
3) Low ON resistance DMOS output
4) CLK-IN drive mode (built-in translator circuit)
5) Parallel IN drive mode
6) Stepping motorDC motor(×2) drives are selectable
7) PWM constant current control (self oscillation)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) FULL STEP & HALF STEP (two kinds), applicable to QUARTER STEP
10) Applicable to the μSTEP drive
11) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)
12) Normal rotation & reverse rotation switching function
13) Power save function
14) Built-in logic input pull-down resistor
15) Power-on reset function
16) Thermal shutdown circuit (TSD)
17) Over current protection circuit (OCP)
18) Under voltage lock out circuit (UVLO)
19) Over voltage lock out circuit (OVLO)
20) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)
21) Electrostatic discharge: 6kV (HBM specification)
22) Adjacent pins short protection
23) Inverted mounting protection
24) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package
(BD6387EFV/BD6385EFV/BD6383EFV)
25) FIN heat-radiating type HSOP package (BD6389FM)
26) Pin-compatible line-up (BD6387EFV/BD6385EFV/BD6383EFV or BD6389FM)
Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
No.12009EAT04
Technical Note
2/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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Absolute maximum ratings(Ta=25)
Item Symbol BD6387EFV BD6385EFV BD6383EFV BD6389FM Unit
Supply voltage VCC0,1,2 -0.2+36.0 V
Power dissipation Pd 1.61 2.83 W
4.72 5.24 W
Input voltage for control pin VIN -0.2+5.5 V
RNF maximum voltage VRNF 0.5 V
Maximum output current IOUT 2.05 1.55 1.05 2.25 A/phas
e
Operating temperature range Topr -25+75
Storage temperature range Tstg -55+150
Junction temperature Tjmax 150
1 70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/ for operating above Ta=25.
2 4-layer recommended board. Derating in done at 37.6mW/ for operating above Ta=25.
3 70mm×70mm×1.6mm glass epoxy board. Derating in done at 22.4mW/ for operating above Ta=25.
4 4-layer recommended board. Derating in done at 41.6mW/ for operating above Ta=25.
5 Do not, however exceed Pd, ASO and Tjmax=150.
Operating conditions(Ta= -25+75)
Item Symbol BD6387EFV BD6385EFV BD6383EFV BD6389FM Unit
Supply voltage VCC0,1,2 1028 V
Output current(DC) IOUT 1.76 1.26 0.76 1.96 A/phas
e
6 Do not however exceed Pd, ASO.
Electrical characteristics
Applicable to all the series (Unless otherwise specified Ta=25, Vcc0,1,2=24V)
Item Symbol Limit Unit Condition
Min. Typ. Max.
Whole
Circuit current at standby ICCST - 1.0 3.0 mA PS=L
Circuit current ICC - 4.5 10 mA PS=H, VREFX=2V
Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)
H level input voltage VINH 2.0 - - V
L level input voltage VINL - - 0.8 V
H level input current IINH 35 50 85 μA VIN=5V
L level input current IINL -10 0 - μA VIN=0V
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance (BD6387EFV) RON - 0.8 1.04 Ω IOUT =±1.5A,
Sum of upper and lower
Output ON resistance (BD6385EFV) RON - 1.0 1.3 Ω IOUT =±1.0A,
Sum of upper and lower
Output ON resistance (BD6383EFV) RON - 1.5 1.95 Ω IOUT =±0.5A,
Sum of upper and lower
Output ON resistance (BD6389FM) RON - 0.7 0.91 Ω IOUT =±1.7A,
Sum of upper and lower
Output leak current ILEAK - - 10 μA
Current control
RNFXS input current IRNFS -2.0 -0.2 - μA RNFXS =0V
RNFX input current IRNF -40 -20 - μA RNFX=0V
VREFX input current IVREF -2.0 -0.1 - μA VREFX=0V
VREFX input voltage range VREF 0 - 2.0 V
MTHX input current IMTH -2.0 -0.1 - μA MTHX=0V
MTHX input voltage range VMTH 0 - 3.5 V
Comparator threshold VCTH 0.36 0.4 0.44 V VREFX=2V
Minimum on time tONMIN 0.3 0.7 1.2 μs R=39kΩ,C=1000pF
Technical Note
3/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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Terminal function
1) BD6387EFV / BD6385EFV / BD6383EFV
Pin
No.
Pin name Function Pin
No.
Pin name Function
1 NC Non connection 21 VCC0 Power supply terminal
2 RNF1
Connection terminal of resistor for output
current detection 22 NC
Non connection
3 RNF1S Input terminal of current limit comparator 23 GND Ground terminal
4 NC Non connection 24 MODE0 Motor excitation mode setting terminal
5 OUT1B H bridge output terminal 25 MODE1 Motor excitation mode setting terminal
6 NC Non connection 26 ENABLE Output enable terminal
7 OUT1A H bridge output terminal 27 VREF2 Output current value setting terminal
8 NC Non connection 28 MTH2 Current decay mode setting terminal
9 VCC1 Power supply terminal 29 NC Non connection
10 NC
Non connection 30 CR2
Connection terminal of CR for setting PWM
frequency
11 CR1
Connection terminal of CR for setting PWM
frequency 31 NC
Non connection
12 NC Non connection 32 VCC2 Power supply terminal
13 MTH1 Current decay mode setting terminal 33 NC Non connection
14 VREF1 Output current value setting terminal 34 OUT2A H bridge output terminal
15 SELECT Input mode select terminal 35 NC Non connection
16 CW_CCW Motor rotating direction setting terminal 36 OUT2B H bridge output terminal
17 NC Non connection 37 NC Non connection
18 CLK
Clock input terminal
for advancing the electrical angle. 38 RNF2S Input terminal of current limit comparator
19 PS
Power save terminal 39 RNF2
Connection terminal of resistor for output
current detection
20 TEST
Terminal for testing
(used by connecting with GND) 40 GND
Ground terminal
2) BD6389FM
Pin
No.
Pin name Function Pin
No.
Pin name Function
1 NC Non connection 19 VCC2 Power supply terminal
2 CR1
Connection terminal of CR for setting PWM
frequency 20 NC Non connection
3 MTH1 Current decay mode setting terminal 21 NC Non connection
4 VREF1 Output current value setting terminal 22 OUT2A H bridge output terminal
5 SELECT Input mode select terminal 23 NC Non connection
6 CW_CCW Motor rotating direction setting terminal 24 OUT2B H bridge output terminal
7 CLK
Clock input terminal
for advancing the electrical angle. 25 NC Non connection
8 PS Power save terminal 26 RNF2S Input terminal of current limit comparator
9 TEST
Terminal for testing
(used by connecting with GND) 27 RNF2
Connection terminal of resistor for output
current detection
FIN FIN
Fin terminal
(used by connecting with GND) FIN FIN Fin terminal
(used by connecting with GND)
10 GND Ground terminal 28 RNF1
Connection terminal of resistor for output
current detection
11 MODE0 Motor excitation mode setting terminal 29 RNF1S Input terminal of current limit comparator
12 MODE1 Motor excitation mode setting terminal 30 NC Non connection
13 ENABLE Output enable terminal 31 OUT1B H bridge output terminal
14 VREF2 Output current value setting terminal 32 NC Non connection
15 MTH2 Current decay mode setting terminal 33 OUT1A H bridge output terminal
16 CR2
Connection terminal of CR for setting PWM
frequency 34 NC Non connection
17 NC
Non connection 35 VCC1
Power supply terminal
18 NC
Non connection 36 VCC0
Power supply terminal
Technical Note
4/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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Block diagramApplication circuit diagramInput output equivalent circuit diagram
Fig.1 Block diagram & Application circuit diagram of BD6387EFV/BD6385EFV/BD6383EFV/BD6389FM
Points to notice for terminal description
CLKClock input terminal for advancing the electrical angle
CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise plunging.
MODE0,MODE1Motor excitation mode setting terminal
Set the motor excitation mode.
MODE0 MODE1 Excitation mode
L L FULL STEP
H L HALF STEP A
L H HALF STEP B
H H QUARTER STEP
CW_CCW TerminalMotor rotating direction setting terminal
Set the motor’s rotating direction. Change in setting is reflected at the CLK’s rising edge immediately after the change
in setting
CW_CCW Rotating direction
L Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
H Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)
ENABLE TerminalOutput enable terminal
Turn off forcibly all the output transistors (motor output is open).
At the time of ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
Please be careful because the electrical angle at the time of ENABLE being released (ENABLE=LH) is different from
the released occasion at the section of CLK=H and from the released occasion at the section of CLKL.
ENABLE Motor output
L OPEN (electrical angle maintained)
H ACTIVE
VCC1
Resistor for current. detecting
Setting range is
0.1Ω~0.3Ω.
Bypass capacitor.
Setting range is
100uF470uF(electrolytic)
0.01uF0.1uF(multilayer ceramic etc.)
Be sure to short VCC0, VCC1 &
Terminal for testing.
Pleaseconnect to GND.
Set the PWM frequency.
Setting range is
C:470pF4700pF
R:10kΩ~100kΩ.
Predriver
OCP
Current Limit Comp.
Buffer
CR
Timer
Buffer Current Limit Comp.
Logic
Translator
DAC
OCP
CR
Timer
Predriver
DAC
Logic
TSD
UVLO
OVLO
Reg
RESET
GND
VREF2
CR2
MTH2
VCC0
PS
CL
K
MODE0
MODE1
CR1
MTH1
CW_CCW
ENABLE
SELECT
VREF1
OUT1B
RNF1S
RNF1
VCC2
OUT2A
RNF2S
OUT2B
RNF2
39kΩ 1000pF
39kΩ 1000pF
TEST
OUT1A
0.2Ω
0.2Ω
100uF 0.1uF
Resistor for current. detecting.
Setting range is
0.1Ω~0.3Ω.
Set the PWM frequency.
Setting range is
C:470pF4700pF
R:10kΩ~100kΩ.
Technical Note
5/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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PSPower save terminal
PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and
the motor output becomes ACTIVE.
PS State
L Standby state (RESET)
H ACTIVE
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.
Please be careful because the initial state at the time of FULL STEP is different from those of other excitation modes.
Excitation mode Initial electrical angle
FULL STEP 45°
HALFSTEP A 0°
HALFSTEP B 0°
QUARTER
STEP 0°
SELECT TerminalInput mode switching terminal
This is the terminal to set the input mode.
SELECT Input mode
L CLK-IN drive
H Parallel IN drive
Power dissipation
HTSSOP-B40 Package (BD6387EFV/BD6385EFV/BD6383EFV)
HTSSOP-B40 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
Fig.2 HTSSOP-B40 Derating Curve
Ambient Temperature:Ta[]
Power DissipationPd[W]
1.0
100 125
0
4.7W 4
3.6W 3
1.95W 2
1.6W 1
2.0
3.0
4.0
5.0
Measurement machineTH156Kuwano Electric
Measurement conditionROHM board
Board size70*70*1.6mm3
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
Board①:1-layer board(Copper foil on the back 0mm2)
Board②:2-layer board(Copper foil on the back 15*15mm2)
Board③:2-layer board(Copper foil on the back 70*70mm2)
Board④:4-layer board(Copper foil on the back 70*70mm2)
Board①:θja=78.1/W
Board②:θja=64.1/W
Board③:θja=34.7/W
Board④:θja=26.6/W
Technical Note
6/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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HSOP-M36 Package (BD6389FM/BD6388FM)
HSOP-M36 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by
taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also, this
terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any potential
other than GND.
Fig.3 HSOP-M36 Derating Curve
Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6387EFV, BD6385EFV and BD6383EFV have been designed to expose their frames at
the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation.
As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back
surface. BD6389FM and BD6388FM are both equipped with FIN heat dissipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to
take as large a dissipation pattern as possible.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
Ambient Temperature:Ta[]
Power DissipationPd[W]
1.0
100 125
0
5.2W 4
4.1W 3
3.0W 2
2.8W 1
2.0
3.0
4.0
5.0
Measurement machineTH156Kuwano Electric
Measurement conditionROHM board
Board size70*70*1.6mm3
(With through holes on the board)
Board①:1-layer board(Copper foil on the back 0mm2)
Board②:2-layer board(Copper foil on the back 15*15mm2)
Board③:2-layer board(Copper foil on the back 70*70mm2)
Board④:4-layer board(Copper foil on the back 70*70mm2)
Board①:θja=44.6/W
Board②:θja=41.6/W
Board③:θja=30.5/W
Board④:θja=24.0/W
Technical Note
7/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
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(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [] (Typ.) Hysteresis Temperature [] (Typ.)
175 25
(10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
(11) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 4,
When GND(Terminal A) at the resistance and GND(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
Also, when GND(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Fig. 4 Pattern Diagram of Parasitic Element
(12) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
(13) TEST Terminal
Be sure to connect TEST pin to GND.
Resistor Transistor (NPN)
N N N P+ P
+
P
P substrate
GND
Parasitic element
Pin A
N
N P+ P
+
P
P substrate
GND
Parasitic element
Pin B
C B
E
N
GND
Pin A
P
aras
iti
c
element
Pin B
Other adjacent elements
E
B
C
GND
P
aras
iti
c
element
Technical Note
8/8
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
www.rohm.com 2012.02 - Rev.
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© 2012 ROHM Co., Ltd. All rights reserved.
Ordering part number
B D 6 3 8 3 EF V -E 2
形名 パッケージ
EFV : HTSSOP-B40
FM : HSOP-M36
包装、フォーミング仕様
E2: リール状エンボステーピング
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2000pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
HTSSOP-B40
+6
44
S
0.08
M
0.08 S
20
1
0.625
7.8±0.2
13.6±0.1
(8.4)
(3.2)
5.4±0.1
2140
(MAX 13.95 include BURR)
0.5 ± 0.15
1.2 ± 0.2
+0.05
0.03
0.17
0.65
+0.05
0.04
0.24
0.85±0.05
0.08±0.05
1.0Max.
1PIN MARK
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
1500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
HSOP-M36
1
0.85
1936
(MAX 18.75 include BURR)
18
18.5±0.1
9.9±0.2
2.2±0.05
0.1±0.05
7.5±0.1
0.5±0.15
1.2±0.2
27
10
1PIN MARK
0.8
9
2.4MAX
2.77±0.1
28
0.27+0.055
0.045
0.37+0.05
0.04
+6
44
0.08
M
0.08 S
R1120
A
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The content specied herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specied in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specied herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specied in this document are intended to be used with general-use electronic
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nication devices, electronic appliances and amusement devices).
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Please be sure to implement in your equipment using the Products safety measures to guard
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