© Semiconductor Components Industries, LLC, 2007
October, 2007 − Rev. 3 1Publication Order Number:
MBRS140LT3/D
MBRS140LT3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
•Compact Package with J−Bend Leads Ideal for Automated Handling
•Highly Stable Oxide Passivated Junction
•Guardring for Over−Voltage Protection
•Low Forward Voltage Drop
•Pb−Free Package is Available
Mechanical Characteristics:
•Case: Molded Epoxy
•Epoxy Meets UL 94 V−0 @ 0.125 in
•Weight: 95 mg (Approximately)
•Cathode Polarity Band
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
40 V
Average Rectified Forward Current
(At Rated VR, TC = 110°C) IO1.0 A
Peak Repetitive Forward Current (At Rated
VR, Square Wave, 100 kHz, TC = 110°C) IFRM 2.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 40 A
Storage / Operating Case Temperature Tstg, TC−55 to +150 °C
Operating Junction Temperature TJ−55 to +125 °C
Voltage Rate of Change
(Rated VR, TJ = 25°C) dv/dt 10,000 V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Device Package Shipping†
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
MBRS140LT3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE − 40 VOLTS
MARKING DIAGRAM
http://onsemi.com
B14L = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb−Free Package
AYWW
B14LG
G
(Note: Microdot may be in either location)
MBRS140LT3G SMB
(Pb−Free) 2500/Tape & Reel
† For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.