EMI/EMC-Compliant, ±15 kV, ESD-Protected
RS-232 Line Drivers/Receivers
ADM202E/ADM1181A
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.326.8703 © 2005 Analog Devices, Inc. All rights reserved.
FEATURES
Complies with 89/336/EEC EMC directive
ESD protection to IEC1000-4-2 (801.2)
±8 kV: contact discharge
±15 kV: air-gap discharge
±15 kV: human body model
EFT fast transient/burst immunity (IEC1000-4-4)
Low EMI emissions (EN55022)
230 kbits/s data rate guaranteed
TSSOP package option
Upgrade for MAX202E, 232E, LT1181A
APPLICATIONS
General-purpose RS-232 data link
Portable instruments
PDAs
GENERAL DESCRIPTION
The ADM202E and ADM1181A are robust, high speed,
2-channel RS-232/V.28 interface devices that operate from a
single 5 V power supply. Both products are suitable for operation
in harsh electrical environments and are compliant with the EU
directive on EMC (89/336/EEC). Both the level of electromagnetic
emissions and immunity are in compliance. EM immunity
includes ESD protection in excess of ±15 kV on all I/O lines,
fast transient/burst protection (1000-4-4), and radiated
immunity (1000-4-3). EM emissions include radiated and
conducted emissions as required by Information Technology
Equipment EN55022, CISPR22.
The ADM202E and ADM1181A conform to the EIA-232E
and CCITT V.28 specifications and operate at data rates up
to 230 kbps.
Four external 0.1 µF charge-pump capacitors are used for the
voltage doubler/inverter, permitting operation from a single
5 V supply.
FUNCTIONAL BLOCK DIAGRAMS
*
INTERNAL 5kΩPULL-DOWN RESISTOR ON EACH RS-232 INPUT
C1+
C1–
C2+
C2–
V
CC
10V
10V
V+
V–
+5V TO +10V
VOLTAGE
DOUBLER
5V INPUT
C3
6.3V
+10V TO –10V
VOLTAGE
INVERTER
C4
10V
T1
OUT
T1
IN
C5
T2
OUT
T2
IN
ADM202E
R1
OUT
R2
OUT
R1
IN
R2
IN
CMOS
INPUTS
CMOS
O
UTPUTS
EIA/TIA-232
OUTPUTS
EIA/TIA-232
INPUTS
*
GND
T1
T2
R1
R2
0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
00066-001
Figure 1.
*
INTERNAL 5kΩPULL-DOWN RESISTOR ON EACH RS-232 INPUT
C1+
C1–
C2+
C2–
V
CC
0.1µF
10V
10V
V+
V–
+5V TO +10V
VOLTAGE
DOUBLER
5V INPUT
C3
10V
+10V TO –10V
VOLTAGE
INVERTER
C4
0.1µF
10V
T1
OUT
T1
IN
C5
0.1µF
10V
T2
OUT
T2
IN
ADM1181A
R1
OUT
R2
OUT
R1
IN
R2
IN
CMOS
INPUTS
CMOS
O
UTPUTS
EIA/TIA-232
OUTPUTS
EIA/TIA-232
INPUTS
*
GND
T1
T2
R1
R2
0.1µF0.1µF
00066-002
Figure 2.
The ADM202E provides a robust pin-compatible upgrade for
existing ADM202, ADM232L, or MAX202E/MAX232E sockets.
It is available in a 16-lead PDIP, a wide SOIC, a narrow SOIC,
and a space-saving TSSOP package that is 44% smaller than the
SOIC package.
The ADM1181A provides a robust pin-compatible upgrade for
the LTC1181A, and it is available in a 16-lead PDIP package
and a wide 16-lead SOIC package.
ADM202E/ADM1181A
Rev. C | Page 2 of 16
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
General Description ......................................................................... 6
Circuit Description....................................................................... 6
Charge-Pump DC-to-DC Voltage Converter....................... 6
Transmitter (Driver) Section .................................................. 6
Receiver Section ....................................................................... 6
High Baud Rate............................................................................. 6
ESD/EFT Transient Protection Scheme .................................... 7
Typical Performance Characteristics ..............................................8
ESD Testing (IEC1000-4-2) ...................................................... 10
Fast Transient/Burst Testing (IEC1000-4-4)........................... 11
IEC1000-4-3 Radiated Immunity ............................................ 12
Emissions/Interference.............................................................. 12
Conducted Emissions ................................................................ 12
Radiated Emissions.................................................................... 13
Outline Dimensions....................................................................... 14
Ordering Guide .......................................................................... 15
REVISION HISTORY
2/05—Rev. B to Rev. C.
Updated Format..................................................................Universal
Changed Hysteresis Level..................................................Universal
Change to Specifications.................................................................. 3
Added ESD Caution ......................................................................... 4
Change to Receiver Section............................................................. 6
Updated Outline Dimensions ....................................................... 14
Changes to Ordering Guide .......................................................... 15
2/01—Rev. A to Rev. B.
Deletion of one ESD Rating in
ABSOLUTE MAXIMUM RATINGS............................................. 4
Removal of one column in Table II................................................ 8
ADM202E/ADM1181A
Rev. C | Page 3 of 16
SPECIFICATIONS
VCC = 5.0 V ± 10%, C1 to C4 = 0.1 µF. All specifications TMIN to TMAX, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DC CHARACTERISTICS
Operating Voltage Range 4.5 5.0 5.5 V
VCC Power Supply Current 2.5 6.0 mA No load
13 18 mA RL = 3 kΩ to GND
LOGIC
Input Logic Threshold Low, VINL 0.8 V TIN
Input Logic Threshold High, VINH 2.4 V TIN
CMOS Output Voltage Low, VOL 0.4 V IOUT = 3.2 mA
CMOS Output Voltage High, VOH 3.5 V IOUT = −1 mA
Logic Pull-Up Current +12 ±25 µA TIN = 0 V
RS-232 RECEIVER
EIA-232 Input Voltage Range −30 +30 V
EIA-232 Input Threshold Low 0.4 1.2 V
EIA-232 Input Threshold High 1.6 2.4 V
EIA-232 Input Hysteresis 0.65 V
EIA-232 Input Resistance 3 5 7 kΩ TA = 0°C to 85°C
RS-232 TRANSMITTER
Output Voltage Swing ±5.0 ±9.0 V All transmitter outputs loaded with 3 kΩ to
ground
Transmitter Output Resistance 300 Ω VCC = 0 V, VOUT = ±2 V
RS-232 Output Short-Circuit Current ±10 ±60 mA
TIMING CHARACTERISTICS
Maximum Data Rate 230
kbps RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF
Receiver Propagation Delay
TPHL 0.1 1 µs
TPLH 0.3 1 µs
Transmitter Propagation Delay 1.0 1.5 µs RL = 3 kΩ, CL = 1000 pF
Transition Region Slew Rate 3 8 30 V/µs RL = 3 kΩ, CL = 1000 pF
Measured from +3 V to −3 V, or −3 V to +3 V
EM IMMUNITY
ESD Protection (I/O Pins) ±15 kV Human body model
±15 kV IEC1000-4-2 air discharge
±8 kV kV IEC1000-4-2 contact discharge
EFT Protection (I/O Pins) ±2 kV IEC1000-4-4
EMI Immunity 10 V/m IEC1000-4-3
ADM202E/ADM1181A
Rev. C | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Values
VCC −0.3 V to +6 V
V+ (VCC − 0.3 V) to +14 V
V– +0.3 V to −14 V
Input Voltages
TIN 0.3 V to (V+, +0.3 V)
RIN ±30 V
Output Voltages
TOUT ±15 V
ROUT –0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT Continuous
Power Dissipation N-16 450 mW
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance 117°C/W
Power Dissipation R-16 450 mW
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance 158°C/W
Power Dissipation RU-16 500 mW
(Derate 6 mW/°C Above 50°C)
θJA, Thermal Impedance 158°C/W
Operating Temperature Range
Industrial (A Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Lead Temperature (Soldering, 10 sec) 300°C
ESD Rating (MIL-STD-883B) (I/O Pins) ±15 kV
ESD Rating (IEC1000-4-2 Air) (I/O Pins) ±15 kV
ESD Rating (IEC1000-4-2 Contact)
(I/O Pins)
±8 kV
EFT Rating (IEC1000-4-4) (I/O Pins) ±2 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ADM202E/ADM1181A
Rev. C | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
14
13
12
11
16
15
10
98
1
2
3
4
7
6
5TOP VIEW
(Not to Scale)
C1+
R1
IN
T1
OUT
GND
V
CC
V+
C1–
C2+
T2
IN
T1
IN
R1
OUT
C2–
V–
T2
OUT
R2
IN
R2
OUT
ADM202E
ADM1181A
00066-003
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
16 VCC Power Supply Input: 5 V ± 10%.
2 V+ Internally Generated Positive Supply (+9 V nominal).
6 V− Internally Generated Negative Supply (−9 V nominal).
15 GND Ground Pin. Must be connected to 0 V.
1, 3 C1+, C1− External Capacitor 1 is connected between these pins. A 0.1 µF capacitor is recommended, but larger
capacitors of up to 47 µF can be used.
4, 5 C2+, C2− External Capacitor 2 is connected between these pins. A 0.1 µF capacitor is recommended, but larger
capacitors of up to 47 µF can be used.
10, 11 TIN Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels.
7, 14 TOUT Transmitter (Driver) Outputs. These are RS-232 signal levels (typically ±9 V).
8, 13 RIN Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is
connected on each input.
9, 12 ROUT Receiver Outputs. These are CMOS output logic levels.
*
INTERNAL 5kΩPULL-DOWN RESISTOR ON EACH RS-232 INPUT
C1+
C1–
C2+
C2–
V
CC
10V
10V
V+
V–
+5V TO +10V
VOLTAGE
DOUBLER
5V INPUT
C3
6.3V
+10V TO –10V
VOLTAGE
INVERTER
C4
10V
T1
OUT
T1
IN
C5
T2
OUT
T2
IN
ADM202E
R1
OUT
R2
OUT
R1
IN
R2
IN
CMOS
INPUTS
CMOS
O
UTPUTS
EIA/TIA-232
OUTPUTS
EIA/TIA-232
INPUTS
*
GND
T1
T2
R1
R2
0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
13
1
3
4
5
11
10
12
9
15
8
7
14
6
2
16
00066-004
Figure 4. ADM202E Typical Operating Circuit
*
INTERNAL 5kΩPULL-DOWN RESISTOR ON EACH RS-232 INPUT
C1+
C1–
C2+
C2–
V
CC
0.1µF
10V
10V
V+
V–
+5V TO +10V
VOLTAGE
DOUBLER
5V INPUT
C3
10V
+10V TO –10V
VOLTAGE
INVERTER
C4
0.1µF
10V
T1
OUT
T1
IN
C5
0.1µF
10V
T2
OUT
T2
IN
ADM1181A
R1
OUT
R2
OUT
R1
IN
R2
IN
CMOS
INPUTS
CMOS
O
UTPUTS
EIA/TIA-232
OUTPUTS
EIA/TIA-232
INPUTS
*
GND
T1
T2
R1
R2
0.1µF0.1µF
13
1
3
4
5
11
10
12
9
15
8
7
14
6
2
16
00066-005
Figure 5. ADM1181A Typical Operating Circuit
ADM202E/ADM1181A
Rev. C | Page 6 of 16
GENERAL DESCRIPTION
The ADM202E/ADM1181E are rugged RS-232 line
drivers/receivers. Step-up voltage converters coupled with level-
shifting transmitters and receivers allow RS-232 levels to be
developed while operating from a single 5 V supply.
Features include low power consumption, high transmission
rates, and compliance with the EU directive on electromagnetic
compatibility. EM compatibility includes protection against
radiated and conducted interference, including high levels of
electrostatic discharge.
All inputs and outputs contain protection against electrostatic
discharges of up to ±15 kV and electrical fast transients of up
to ±2 kV. This ensures compliance to IEC1000-4-2 and
IEC1000-4-4 requirements.
The devices are ideally suited for operation in electrically harsh
environments or where RS-232 cables are frequently being
plugged/unplugged. They are also immune to high RF field
strengths without special shielding precautions.
CMOS technology is used to minimize the power dissipation,
allowing maximum battery life in portable applications.
The ADM202E/ADM1181A serve as a modification,
enhancement, and improvement to the ADM230–ADM241
family and its derivatives. It is essentially plug-in compatible
and do not have materially different applications.
CIRCUIT DESCRIPTION
The internal circuitry consists of four main sections:
• A charge-pump voltage converter
• 5 V logic to EIA-232 transmitters
• EIA-232 to 5 V logic receivers.
• Transient protection circuit on all I/O lines
Charge-Pump DC-to-DC Voltage Converter
The charge-pump voltage converter consists of a 200 kHz
oscillator and a switching matrix. The converter generates a
±10 V supply from the input 5 V level. This is done in two stages,
using a switched capacitor technique, as illustrated in Figure 6
and Figure 7. First, the 5 V input supply is doubled to 10 V, using
Capacitor C1 as the charge storage element. The 10 V level is
then inverted to generate −10 V, using C2 as the storage element.
Capacitor C3 and Capacitor C4 are used to reduce the output
ripple. Their values are not critical and can be increased if
desired. On the ADM202E, Capacitor C3 is shown connected
between V+ and VCC, whereas it is connected between V+ and
GND on the ADM1181A. It is acceptable to use either
configuration with both the ADM202E and ADM1181A. If
desired, larger capacitors (up to 47 µF) can be used for
Capacitor C1 to Capacitor C4. This facilitates direct substitution
with older generation charge-pump RS-232 transceivers.
S1
S2 C1 S4
S3
C3
V+ = 2V
CC
V
CC
V
CC
GND
INTERNAL
OSCILLATOR
NOTE: C3 CONNECTS BETWEEN V+ AND GND ON THE ADM1181A
00066-006
Figure 6. Charge-Pump Voltage Doubler
S1
S2 C2 S4
S3
C4
V– = –(V+)
V+ GND
INTERNAL
OSCILLATOR
GND
FROM
VOLTAGE
DOUBLER
00066-007
Figure 7. Charge-Pump Voltage Inverter
Transmitter (Driver) Section
The drivers convert 5 V logic input levels into RS-232 output
levels. When driving an RS-232 load with VCC = 5 V, the output
voltage swing is typically ±9 V.
Receiver Section
The receivers are inverting level shifters that accept RS-232
input levels and translate them into 5 V logic output levels. The
inputs have internal 5 kΩ pull-down resistors to ground and are
also protected against overvoltages of up to ±30 V. Unconnected
inputs are pulled to 0 V by the internal 5 kΩ pull-down resistor.
Therefore, unconnected inputs and those connected to GND
have a Logic 1 output level.
The receivers have Schmitt-trigger inputs with a hysteresis level
of 0.65 V. This ensures error-free reception for both noisy
inputs and inputs with slow transition times.
HIGH BAUD RATE
The ADM202E/ADM1181A feature high slew rates, permitting
data transmission at rates well in excess of the EIA/RS-232-E
specifications. RS-232 voltage levels are maintained at data rates
of up to 230 kbps, even under worst case loading conditions.
This allows for high speed data links between two terminals and
is also suitable for the new generation ISDN modem standards,
which require data rates of 230 kbps. The slew rate is internally
controlled to less than 30 V/µs to minimize EMI interference.
ADM202E/ADM1181A
Rev. C | Page 7 of 16
ESD/EFT TRANSIENT PROTECTION SCHEME
The ADM202E/ADM1181A use protective clamping structures
on all inputs and outputs to clamp the voltage to a safe level and
dissipate the energy present in electrostatic (ESD) and electrical
fast transients (EFT) discharges. A simplified schematic of the
protection structure is shown in Figure 8 and Figure 9. Each
input and output contains two back-to-back high speed
clamping diodes. During normal operation with maximum
RS-232 signal levels, the diodes have no effect because one or
the other is reverse biased depending on the polarity of the signal.
However, if the voltage exceeds about 50 V in either direction,
reverse breakdown occurs and the voltage is clamped at this level.
The diodes are large p-n junctions that are designed to handle
instantaneous current surges that exceed several amperes.
The transmitter outputs and receiver inputs have a similar
protection structure. The receiver inputs can dissipate some of
the energy through the internal 5 kΩ resistor to GND, as well as
through the protection diodes.
The protection structure achieves ESD protection up to ±15 kV
and EFT protection up to ±2 kV on all RS-232 I/O lines. The
methods used to test the protection scheme are discussed in the
ESD Testing (IEC1000-4-2) and Fast Transient/Burst Testing
(IEC1000-4-4) sections.
R
IN
R
X
D1
D2
RECEIVER
INPUT
R1
00066-008
Figure 8. Receiver Input Protection Scheme
RX
D1
D2
TRANSMITTER
OUTPUT
TOUT
00066-009
Figure 9. Transmitter Output Protection Scheme
ADM202E/ADM1181A
Rev. C | Page 8 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
START 30.0MHz STOP 200.0MHz
LIMIT
dBµV
80
70
60
50
40
30
20
10
0
00066-010
Figure 10. EMC Radiated Emissions
LOG FREQUENCY (MHz)
80
70
00.3 300.6 1
60
50
10
40
30
20
dBµV
LIMIT
3610
00066-011
Figure 11. EMC Conducted Emissions
LOAD CAPACITANCE (pF)
9
7
–9 0 2500
500
T
X
O/P (V)
1000 1500 2000
1
–3
–5
–7
5
3
–1
3000
115KBPS
230KBPS
460KBPS
230KBPS
115KBPS
460KBPS
00066-012
Figure 12. Transmitter Output Voltage High/Low vs. Load Capacitance
@ 115 kbps, 230 kbps, and 460 kbps
V
CC
(V)
15
10
–15 5.5
T
X
O/P (V)
4 4.5 5
5
0
–5
–10 T
X
O/P LO
T
X
O/P LO LOADED
T
X
O/P HI LOADED
T
X
O/P HI
00066-013
Figure 13. Transmitter Output Voltage High/Low vs. VCC
ILOAD (mA)
15
–15
V+, V– (V)
10 15 20 25
10
–5
–10
5
0
3050
00066-014
Figure 14. Charge Pump V+ and V− vs. Current
I
LOAD
(mA)
15
–15
T
X
O/P (V)
10
5
0
–5
–10
02468101214
T
X
O/P LO
T
X
O/P HI
00066-015
Figure 15. Transmitter Output Voltage Low/High vs. Load Current
ADM202E/ADM1181A
Rev. C | Page 9 of 16
Ch2
–400mV
2
1
T
T
Ch1M2.00µs5.00V5.00VCh1
00066-016
Figure 16. 230 kbps Data Transmission
V
CC
(V)
06.04.0
IMPEDANCE (Ω)
4.5 5.0 5.5
200
150
100
50
300
250
V+
V–
00066-017
Figure 17. Charge-Pump Impedance vs. VCC
ADM202E/ADM1181A
Rev. C | Page 10 of 16
ESD TESTING (IEC1000-4-2)
IEC1000-4-2 (previously 801-2) specifies compliance testing
using two coupling methods, contact discharge and air-gap
discharge. Contact discharge calls for a direct connection to the
unit being tested. Air-gap discharge uses a higher test voltage,
but does not make direct contact with the unit being tested.
With air-gap discharge, the discharge gun is moved toward the
unit being tested, developing an arc across the air gap. This
method is influenced by humidity, temperature, barometric
pressure, distance, and rate of closure of the discharge gun.
Although less realistic, the contact-discharge method is more
repeatable and is gaining preference to the air-gap method.
Although very little energy is contained within an ESD pulse,
the extremely fast rise time coupled with high voltages can
cause failures in unprotected semiconductors. Catastrophic
destruction can occur immediately as a result of arcing or
heating. Even if catastrophic failure does not occur immediately,
the device might suffer from parametric degradation, which can
result in degraded performance. The cumulative effects of
continuous exposure can eventually lead to complete failure.
I/O lines are particularly vulnerable to ESD damage. Simply
touching or plugging in an I/O cable can result in a static
discharge, which can damage or completely destroy the
interface product connected to the I/O port. Traditional ESD
test methods, such as the MIL-STD-883B method 3015.7, do
not fully test a product’s susceptibility to this type of discharge.
This test was intended to test a product’s susceptibility to ESD
damage during handling. Each pin is tested with respect to all
other pins. There are some important differences between the
traditional test and the IEC test:
• The IEC test is much more stringent in terms of discharge
energy. The injected peak current is over four times greater.
• The current rise time is significantly faster in the IEC test.
• The IEC test is carried out while power is applied to
the device.
It is possible that the ESD discharge could induce latch-up in the
device being tested. Therefore, this test is more representative of a
real-world I/O discharge where the equipment is operating
normally with power applied. For peace of mind, however, both
tests should be performed to ensure maximum protection
during both handling and field service.
R1 R2
C1 DEVICE
UNDER TEST
HIGH
VOLTAGE
GENERATOR
ESD TEST METHOD R2 C1
H. BODY MIL-STD883B 1.5kΩ100pF
IEC1000-4-2 330Ω150pF
00066-018
Figure 18. ESD Test Standards
100
I
PEAK
(%)
90
36.8
10
tDL
tRL
TIME t
00066-019
Figure 19. Human Body Model ESD Current Waveform
100
I
PEAK
(%)
90
10
TIME t
30ns 60ns
0.1 TO 1ns
00066-020
Figure 20. IEC1000-4-2 ESD Current Waveform
The ADM202E/ADM1181E products are tested using both of
the previously mentioned test methods. Pins are tested with
respect to all other pins as per the MIL-STD-883B specification.
In addition, I/O pins are tested as per the IEC test specification.
The products were tested under the following conditions:
• Power-On
• Power-Off
There are four levels of compliance defined by IEC1000-4-2. The
ADM202E/ADM1181A products meet the most stringent level
of compliance both for contact and for air-gap discharge. This
means that the products are able to withstand contact discharges
in excess of 8 kV and air-gap discharges in excess of 15 kV.
ADM202E/ADM1181A
Rev. C | Page 11 of 16
Table 4. IEC1000-4-2 Compliance Levels
Level Contact Discharge Air Discharge
1 2 kV 2 kV
2 4 kV 4 kV
3 6 kV 8 kV
4 8 kV 15 kV
Table 5. ADM202E/ADM1181A ESD Test Results
ESD Test Method I/O Pins
MIL-STD-883B ±15 kV
IEC1000-4-2
Contact ±8 kV
Air ±15 kV
FAST TRANSIENT/BURST TESTING (IEC1000-4-4)
IEC1000-4-4 (previously 801-4) covers electrical fast transient
(EFT)/burst immunity. Electrical fast transients occur as a result
of arcing contacts in switches and relays. The tests simulate the
interference generated when, for example, a power relay
disconnects an inductive load. A spark is generated due to the
well-known back EMF effect. In fact, the spark consists of a
burst of sparks as the relay contacts separate. The voltage
appearing on the line, therefore, consists of a burst of extremely
fast transient impulses. A similar effect occurs when switching
on fluorescent lights.
The fast transient/burst test defined in IEC1000-4-4 simulates
this arcing, and its waveform is illustrated in Figure 17. It
consists of a burst of 2.5 kHz to 5 kHz transients repeating at
300 ms intervals. It is specified for both power and data lines.
300ms 15ms
t
V
5ns
0.2/0.4ms
50ns
V
t
00066-021
Figure 21. IEC1000-4-4 Fast Transient Waveform
A simplified circuit diagram of the actual EFT generator is
illustrated in Figure 22.
The transients are coupled onto the signal lines using an EFT
coupling clamp. The clamp, which is 1 m long, completely
surrounds the cable, providing maximum coupling capacitance
(50 pF to 200 pF typ) between the clamp and the cable. High
energy transients are capacitively coupled to the signal lines.
Fast rise times (5 ns), as specified by the standard, result in very
effective coupling. This test is very strenuous because high voltages
are coupled onto the signal lines. The repetitive transients often
cause problems where single pulses do not. Destructive latch-up
can be induced due to the high energy content of the transients.
Note that this stress is applied while the interface products are
powered up and transmitting data. The EFT test applies
hundreds of pulses with higher energy than ESD. Worst-case
transient current on an I/O line can be as high as 40 A.
R
C
R
M
C
C
HIGH
VOLTAGE
SOURCE
L
Z
S
C
D
50Ω
OUTPUT
00066-022
Figure 22. IEC1000-4-4 Fast Transient Generator
Test results are classified according to the following:
• Classification 1: Normal performance within specifi-
cation limits
• Classification 2: Temporary degradation or loss of
performance that is self-recoverable
• Classification 3: Temporary degradation or loss of function
or performance that requires operator intervention or
system reset
• Classification 4: Degradation or loss of function that is not
recoverable due to damage
The ADM202E/ADM1181A meet Classification 2 and have
been tested under worst-case conditions using unshielded
cables. Data transmission during the transient condition is
corrupted, but can resume immediately following the EFT event
without user intervention.
ADM202E/ADM1181A
Rev. C | Page 12 of 16
IEC1000-4-3 RADIATED IMMUNITY
IEC1000-4-3 (previously IEC801-3) describes the measure-
ment method and defines the levels of immunity to radiated
electromagnetic fields. It was originally intended to simulate the
electromagnetic fields generated by portable radio transceivers
and other devices that generate continuous wave-radiated
electromagnetic energy. Its scope has since been broadened to
include spurious EM energy, which can be radiated from
fluorescent lights, thyristor drives, inductive loads, and
other sources.
Testing for immunity involves irradiating the device with an
EM field. There are various methods of achieving this, including
use of anechoic chamber, stripline cell, TEM cell, and GTEM
cell. A stripline cell consists of two parallel plates with an electric
field developed between them. The device being tested is placed
within the cell and exposed to the electric field. There are three
severity levels that have field strengths ranging from 1 V to
10 V/m. Results are classified in a similar fashion to those for
IEC1000-4-2.
• Classification 1: Normal operation
• Classification 2: Temporary degradation or loss of
function that is self-recoverable when the interfering
signal is removed
• Classification 3: Temporary degradation or loss of function
that requires operator intervention or system reset when
the interfering signal is removed
• Classification 4: Degradation or loss of function that is not
recoverable due to damage
The ADM202E/ADM1181A products easily meet Classification 1
at the most stringent (Level 3) requirement. In fact, field strengths
of up to 30 V/m showed no performance degradation, and error-
free data transmission continued even during irradiation.
Table 6. Test Severity Levels (IEC1000-4-3)
Level Field Strength V/m
1 1
2 3
3 10
EMISSIONS/INTERFERENCE
EN55 022 and CISPR22 define the permitted limits of radiated
and conducted interference from information technology (IT)
equipment. The objective of the standard is to minimize the
level of emissions, both conducted and radiated. For ease of
measurement and analysis, conducted emissions are assumed to
predominate below 30 MHz, and radiated emissions are
assumed to predominate above 30 MHz.
CONDUCTED EMISSIONS
Conducted emissions is a measure of noise conducted onto the
mains power supply. Switching transients from the charge pump
that are 20 V in magnitude and that contain significant energy
can lead to conducted emissions. Another source of conducted
emissions is the overlap in switch-on times in the charge-pump
voltage converter. In the voltage doubler shown in Figure 23, if
S2 is not fully turned off before S4 turns on, a transient current
glitch occurs between VCC and GND that results in conducted
emissions. Therefore, it is important that the switches in the
charge pump guarantee break-before-make switching under all
conditions to prevent instantaneous short-circuit conditions.
The ADM202E is designed to minimize the switching transients
and ensure break-before-make switching, thereby minimizing
conducted emissions. This results in emission levels well below
the specified limits. No additional filtering or decoupling, other
than the recommended 0.1 µF capacitor, is required.
Conducted emissions are measured by monitoring the mains
line. The equipment used consists of a spectrum analyzer and a
LISN (line impedance stabilizing network) that essentially
presents a fixed impedance at RF. The spectrum analyzer scans
for emissions of up to 30 MHz; a plot for the ADM202E is
shown in Figure 25.
S1
S2 C1 S4
S3
C3
V+ = 2V
CC
V
CC
INTERNAL
OSCILLATOR
GND V
CC
00066-023
Figure 23. Charge-Pump Voltage Doubler
∅2
SWITCHING GLITCHES
∅1
00066-024
Figure 24. Switching Glitches
ADM202E/ADM1181A
Rev. C | Page 13 of 16
LOG FREQUENCY (MHz)
80
70
00.3 300.6 1
60
50
10
40
30
20
10
dB
µ
V
LIMIT
36
00066-025
Figure 25. ADM202E Conducted Emissions
RADIATED EMISSIONS
Radiated emissions are measured at frequencies in excess of
30 MHz. RS-232 outputs are designed for operation at high
baud rates, while driving cables can radiate high frequency EM
energy. The previously described causes of conducted emissions
can also cause radiated emissions. Fast RS-232 output transitions
can radiate interference, especially when lightly loaded and
driving unshielded cables. Charge-pump devices are also prone
to radiating noise due to the high frequency oscillator and the
high voltages being switched by the charge pump. The move
toward smaller capacitors to conserve board space has resulted
in higher frequency oscillators in the charge-pump design,
causing higher levels of conducted and radiated emissions.
The RS-232 outputs on the ADM202E feature a controlled slew
rate to minimize the level of radiated emissions, yet they are fast
enough to support data rates of up to 230 kBaud.
Figure 27 shows radiated emissions vs. frequency. The levels of
emissions are well within specifications without the need for
additional shielding or filtering components. The ADM202E
was operated at maximum baud rates and configured like a
typical RS-232 interface. Testing for radiated emissions was
carried out in a shielded anechoic chamber.
TURNTABLE
DUT
RADIATED NOISE
ADJUSTABLE
ANTENNA
TO
RECEIVER
00066-026
Figure 26. Radiated Emissions Test Setup
START 30.0MHz STOP 200.0MHz
LIMIT
dB
µ
V
80
70
60
50
40
30
20
10
0
00066-027
Figure 27. ADM202E Radiated Emissions vs. Frequency
ADM202E/ADM1181A
Rev. C | Page 14 of 16
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
16 9
8
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
10.50 (0.4134)
10.10 (0.3976)
8°
0°
0.75 (0.0295)
0.25 (0.0098) × 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COPLANARITY
0.10
Figure 28. 16-Lead Standard Small Outline Package [SOIC]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AC
16 9
8
1
4.00 (0.1575)
3.80 (0.1496)
10.00 (0.3937)
9.80 (0.3858)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
× 45°
Figure 29. 16-Lead Standard Small Outline Package [SOIC]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
16 9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX 0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
16
18
9
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.100 (2.54)
BSC
SEATING
PLANE
0.015 (0.38)
MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79) 0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.785 (19.94)
0.765 (19.43)
0.745 (18.92)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AC
Figure 31. 16-Lead Plastic Dual In-Line Package [PDIP]
(N-16)
Dimensions shown in inches and (millimeters)
ADM202E/ADM1181A
Rev. C | Page 15 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADM202EAN −40°C to +85°C Plastic DIP N-16
ADM202EANZ1 −40°C to +85°C Plastic DIP N-16
ADM202EARW −40°C to +85°C Wide SOIC R-16W
ADM202EARW-REEL −40°C to +85°C Wide SOIC R-16W
ADM202EARWZ1 −40°C to +85°C Wide SOIC R-16W
ADM202EARWZ-REEL1 −40°C to +85°C Wide SOIC R-16W
ADM202EARN −40°C to +85°C Narrow SOIC R-16N
ADM202EARN-REEL −40°C to +85°C Narrow SOIC R-16N
ADM202EARN-REEL7 −40°C to +85°C Narrow SOIC R-16N
ADM202EARNZ1 −40°C to +85°C Narrow SOIC R-16N
ADM202EARNZ-REEL1 −40°C to +85°C Narrow SOIC R-16N
ADM202EARNZ-REEL71 −40°C to +85°C Narrow SOIC R-16N
ADM202EARU −40°C to +85°C TSSOP RU-16
ADM202EARU-REEL −40°C to +85°C TSSOP RU-16
ADM202EARU-REEL7 −40°C to +85°C TSSOP RU-16
ADM202EARUZ1 −40°C to +85°C TSSOP RU-16
ADM202EARUZ-REEL1 −40°C to +85°C TSSOP RU-16
ADM202EARUZ-REEL71 −40°C to +85°C TSSOP RU-16
ADM1181AAN −40°C to +85°C Plastic DIP N-16
ADM1181AARW −40°C to +85°C Wide SOIC R-16W
ADM1181AARW-REEL −40°C to +85°C Wide SOIC R-16W
ADM1181AARWZ1 −40°C to +85°C Wide SOIC R-16W
ADM1181AARWZ-REEL1 −40°C to +85°C Wide SOIC R-16W
1 Z = Pb-free part.
ADM202E/ADM1181A
Rev. C | Page 16 of 16
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00066-0-2/05(C)