R5524x Series
USB HIGH-SIDE POWER SWITCH NO.EA-188-161207
1
OUTLINE
The R5524x is a CMOS-ba sed high-side MOSF ET swi tch IC wh ich conform s to the univ ersal seri al bus (USB)
standard. The device is suitable for protecting a USB power source.
By using an Nch MOSFET with low On-resistance (Typ. 100 mΩ) as a switching transistor , the device can provide
low dropout vo ltag e.
Internally, the device consists of an overcurrent limiting circuit, a thermal shutdown circuit, an undervoltage
lockout (UVLO) circuit and a reverse current protection circuit. The device also consi sts of an internal delay circuit
to prevent the output of false flag signals caused by inrush current.
To achieve simplification of layout design, the overcurrent detection accuracy has been improved.
The R552 4x is offer ed in a 5-pin SOT-23-5 package and a 6-pin DFN(PL P)1820-6 p ackage whic h achieve the
smallest pos s ible foot pri nt s olut ion on boards wher e a rea is lim ited.
FEATURES
N-channel MOS High-Side Switch IC
Switch ON Resistance ······································· Typ. 100 mΩ at 5 V Input
Current Limit Threshold ····································· Min. 650 mA*1, Min. 1.25 A*2
Overcurrent Limit ·············································· Min. 550 mA
Flag Delay T ime ··············································· Typ. 20 ms
Under-voltage Lockout (UVLO) Circuit
Thermal Shutdown Circuit
Reverse Current Protection Circuit
Package ························································· SOT-23-5, DFN(PLP)1820-6*3
APPLICATIONS
PCs and PC Peripherals
Digital Televisions (DTV)
Set Top Boxes (STB)
Printers
PDA
Game Consoles
*1 only for R5524x001A/B, R5524x002A/B
*2 only for R5524N004A
*3 only for R5524K001x, R5524K002x
R5524x
NO.EA-188-161207
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BLOCK DIAGRAMS
R5524xxxxA Bl ock Di agram
GND
FLG
GATE
CONTROL
VIN VOUT
EN
UVLO FLG DELAY
CURRENT
LIMIT
THERMAL
SHUTDOWN
R5524xxxxB Block Diagram
V
IN
V
OUT
EN
FLG
GND
UVLO FLG DELAY
THERMAL
SHUTDOWN
CURRENT
LIMIT
GATE
CONTROL
R5524x
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SELECTI O N G UIDE
The overc urrent lim it protec tion type, the current limit threshold an d th e a uto d is char ge options*1 for the ICs are
user-selectable options.
Selection Guide
Product Name Package Quantity per Reel Pb Free Halogen Fre e
R5524N00x∗-TR-FE SOT-23-5 3,000 pcs Yes Yes
R5524K00x
∗
-TR
DFN(PLP)1820-6 5,000 pcs Yes Yes
x: Specif y the com bina tio n of Overcurrent Limit Protection type and Current Limit Threshold.
1: Latch-off Type, Current Limit Threshold: Min. 650 mA
2: Constant C urr ent T ype, C urrent Limit Threshold: Min. 650 mA
4: Cosntant Current Type, Current Limit Threshold: Min. 1. 25 A*2
∗: Specif y auto-discharge options.
A: Auto-discharge included
B: Auto-discharge not included
*1 Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the
active mode to the standby mode, by releasing the electrical charge accumulat e d in the ex ternal capac itor .
*2 only for R5524N004A
PIN DES CRIPTIONS
1
3
5
4
2
SOT-23-5 Pin Configuration
SOT23-5 Pin Description
Pin No. Symbol Description
1 VIN Input Pin
2 GND Ground Pin
3 EN Chip Enable Pin, Active-high
4 FLG Flag Pin, Open Drain Output
5 VOUT Output Pin
R5524x
NO.EA-188-161207
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DFN(PLP)1820-6 Pin Configuration
DFN(PLP)1820-6 Pin Description
Pin No. Symbol Description
1 VOUT Output Pin
2 NC No Connection
3 FLG Flag Pin, Open Drain Output
4 EN Enable Pin, Active-high
5 GND Ground Pin
6 VIN Input Pin
*1 The tab on the bot tom of the package enhances t hermal per formance and is electrically co nnected to GN D (substrate
level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating.
*1
Top View Bottom View
6
5
4
1
2
3
4
5
6
3
2
R5524x
NO.EA-188-161207
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ABSOLUTE MA XIMUM RATINGS
Absolute Maximum Ratings
Symbol Item Rating Unit
VIN Input Voltage 6.0 V
VEN Enable Pin Input Voltage −0.3 to 6.0 V
VFLG Flag Pin Voltage −0.3 to 6.0 V
IFLG Flag Pin Current 14 mA
VOUT Output Pin Voltage −0.3 to 6.0 V
IOUT Output Current Internall y Contro lled
PD Power Dissip ati on
(Standard Land Pattern)*1 SOT-23-5 420 mW
DFN(PLP)1820-6 880 mW
Ta Operating Temperature Range −40 to 85 °C
Tstg Storage Temperature Range −55 to 125 °C
*1 Refer to PACKAGE INFORMATION for detailed information.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may de grade the life time an d saf ety for bot h d ev ice and system using the dev ice in the f ield. The
functional operation at or over these absolute maximum ratings is not assured.
R5524x
NO.EA-188-161207
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ELECTRICAL CHARACTERISTICS
The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
Electrical Characteristics (Ta = 25°C)
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VIN
Input Voltage
2.7
5.5
V
IDD1
Supply Current (Active Mode)
VOUT = OPEN, EN = ”H”, VIN = 5 V
110
180
µA
IDD2
Supply Current (Standby Mode)
VOUT = OPEN, EN = ”L”, VIN = 5 V
0.1
1.0
µA
RON
Switch On Resistance
VIN = 5 V, IOUT = 500 mA
100
150
mΩ
ton
Output Turn-on Delay
VIN = 5 V, RL = 60 Ω
400
µs
toff
Output Turn-off Delay
VIN = 5V, RL = 60 Ω
50
µs
VUVLO
UVLO R el ease Volta ge
VIN Rising
2.3
2.5
2.7
V
VHYS
UVLO Hysteresis Range
VIN Falling
0.1
V
ITH Current Limit Threshold
R5524x001A/ 001B
R5524x002A/ 002B
VIN = 5 V 650 800 980 mA
R5524N004A
VIN = 5 V
1.25
1.55
1.85
A
V
IN
= 5 V,
Ta = 0 to 70°C
1.2 1.55 1.9
ILIM
Overcurrent Limit
VIN = 5 V, VOUT = 0 V, after 5 ms
550
650
800
mA
tFD Flag Delay T ime*1
V
IN
= 5 V,
starts when
overcurrent is detected
and ends when FLG = “L”
7 20 30 ms
TTSD
Thermal Shutdown
Temperature
Junction Temperature 135 °C
TTSR
Thermal Shutdown
Released Temperature
Junction Temperature 120 °C
IEN
Enable Pin Input Current
0.01
1.0
µA
VEN1
Enable Pin Input Voltage 1
VEN Rising
2.0
6.0
V
VEN2
Enable Pin Input Voltage 2
VEN Falling
−0.3
0.8
V
ILO
Output Leakage Current
0.1
1.0
µA
VLF
Flag "L" Output Voltage
ISINK = 1 mA
0.4
V
IFOF
Flag Off Current
VFLG = 5.5 V
0.01
1.0
µA
IREV
Reverse Leakage Current
VIN = 0 V, VOUT = 5.5 V
50
µA
RLOW
Nch. On-resistance for
Auto Discharge (R5524x00xA)
450 Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C) except Thermal
Shutdown Temperature and Thermal Shutdown Released Temperature.
*1 Flag Delay Time is dependent on Input Voltage.
RECOMMENDED OPERAT ING CONDITIONS (ELECTRICAL CHARACTERISTI CS )
All of el ectronic equi pment should be designed th at the mount ed semicondu ctor devices operate within the recommen ded
operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions,
even if w hen they are used over such con ditions by mo mentary electronic noi se or surg e. And the semico nductor dev ices
may receive serious damage when they continue to operate over the recommended operating conditions.
R5524x
NO.EA-188-161207
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TYPIC AL APPLICATIO N
V
IN
ON/OFF
Over Current
V
IN
USB Host Con troll e r
FLG
*1
4
1
5
R5524x
2
3
EN
GND
V
IN
V
OUT
10 kΩ ~ 100 kΩ
1 µF
V
OUT
V
BUS
USB Client
Device
47 µF
*2
R5524x Typical Application
*1 FLG pin is Nch. Open Drain Output.
*2 A 47 µF or more output cap acitor is recommended. Ac cord i ng to a USB sta ndard, a 120 µF or mor e out put cap acitor
is required.
TECHNICAL NOTES
Bypass Capacitor
A 0.1µF to 1 µF bypass capacitor between the VIN pin and the GND pin, close to the device, is recommended.
This precaution reduces power supply transients that may cause ringing on the input.
Pull-up Resistor of FLG Pin
A 10 kΩ to 100 kΩ pull-up resistor is recommended for the FLG pin.
R5524x001A/001B
The R5524x001A/001B is equipped with a latch-off function which requires initialization before start-up.
Case 1: Start-up by EN Pin Control
EN pin must be enabled with the delay of 10 µs or more against 90% of VIN voltage rising edge.
Case 2: Start-up by EN Pin Tied to VIN Pin
Slew rate of VIN must be 40 µs/V or slower.
R5524x
NO.EA-188-161207
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TIMING CHART
Output On-time and Output Off-time
50%
90%
50%
10%
tON
tOFF
VEN
VOUT
R5524x Timing Chart
Flag Delay Time
R5524x001A/001B Timing Chart (Latch-off Type)
(1) When the I
OUT
is I
TH
or less, the current is not limited.
(2) Once the I
OUT
reaches to I
TH
, the I
OUT
is limited b y I
LIM
.
(3) W hen the IOUT drops to ILIM or less within the tFD time, the current limit is
released. The current is not limited until the I
OUT
exceeds I
TH
again.
(4) When the IOUT reaches to ITH and it is limited by ILIM for tFD or more, the
switch transistor turns off and V
FLG
becomes “Low”.
<tFD
t
FD
ITH
I
LIM
0A
IOUT
(1)
(2)
(3)
(4)
0V
VIN
V
FLG
R5524x
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R5524x002A/002B and R5524N004A Timing Chart (Constant Current Type)
(1) When I
OUT
is I
TH
or less, the current is not limited.
(2) Once the I
OUT
reaches to I
TH
, the I
OUT
is limited b y I
LIM
.
(3) When the IOUT drops to ILIM or less within the tFD time, the current limit is
released. The current is not limited until the I
OUT
exceeds I
TH
again.
(4) W hen the IOUT reaches to ITH and it is limited b y ILIM for tFD or more, the VFLG
becomes “Low”.
<t
FD
t
FD
I
TH
I
LIM
0A
I
OUT
(1)
(2)
(3)
(4)
0V
VIN
VFLG
R5524x
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Overcurrent Limiting Function
The R5524x001A/001B has the built-in latch-off type over-current limit circuit. When the over-current is detected,
the protection circuit becomes active and the switch-transistor is turned OFF. The latch function is released if the
input voltage value is exceeded in the release threshold of the UVLO circuit value after when it became lower
than the d etect ion thresho l d of the UV LO cir cuit val ue; or the E N pi n set to t he e n abl ing co ndition agai n af ter s et
to the disabling condition.
If the o ver curren t condition occurr ed when the input v oltage va lue was c lose to t he minim um operatin g inpu t
voltage v alue. Under th is cond ition, the volt age desce nds by the p arasitic impedance on t he power s uppl y s ide,
and it might fall below the detection threshold of the UVLO circuit. In this case, the switch-transistor is turned OFF
and because of that the voltage drop of power line’s parasitic impedance stops; the latch function is released with
the UVLO and it becomes the over current condition again. The switch transistor k eeps continual ON and OFF
until one of the following is done; increasing the input voltage value; the setting of EN pin is disabling; or reducing
the value of load current.
Moreover, the supply-voltage changed by the load-current dramatically changed depends upon the parasitic
impedance of the wiring on the load side or the power supply side. Due to this, decreasing the parasitic impedance
by the wiring on board is recommended.
The switch transistor of the R5524x001A/001B is turned OFF when the latch-off-function opera tes under the
condition of the load of the constant current as the load device, such as the electronic load and so on, connecting
with the VOUT pin of the R5524x001A/001B. Because the load device keeps the constant current, the VOUT pin
voltage may becom e negative potential. If the VOUT pin is exceed the absolute maximum rating may cause the
permanent damages to the device, please avoid using in this situation.
The R5524x002A/002B and R5524N004A have the built-in over current protection circuit as the constant
current t ype. It det ects as t he over-cur rent cond ition, if the c urrent flo ws as t he ITH defined. Then operat ing the
switch transistor to limit the output current to be the constant current defined by the ILIM.
If the condition of the over-current limit caused by the VOUT pin clamped to the GND were continued the
temperature of the ICs would increase drastically. The s witch-transistor is turned OFF if the tem perature of the
ICs becomes over 135°C (Typ.). And after this, the switch-transistor is turned ON again when the temperature of
ICs decr eased appr oximat ely 15°C. The s witch-trans istor k eeps continu al ON and O FF until either the s witch is
turned OFF or the VOUT pin is removed from GND.
R5524x
NO.EA-188-161207
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Power D is s ipat io n P
D
(mW)
600
500
400
300
200
100
0
0
25
50 75
100 125 150
Ambient Temperature (°C)
85
Free Air
Standard Land Pattern
250
420
PACK AGE INFO RMATION
Power Dissipation (SOT-23-5)
Power Dissipation (PD) of the package is dependent on PCB material, layout, and environmental conditions. The
following conditions are used in this measurement. This data is taken from a SOT-23-6 package data.
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind Velocity = m/s)
Board Material Glass Cloth Epoxy Plastic (Double-sided)
Board Dimensions 40 mm × 40 mm × 1.6 mm
Copper Ratio Top-side: Approx. 50%, Back-side: Approx. 50%
Through-holes
φ
0.5 mm × 44 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Standard Land Pattern Free Air
Power Dissip ati on 420 mW 250 mW
Thermal Resistance Θja = (125 − 25°C) / 0.42 W = 238°C/W 400°C/W
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
R5524x
NO.EA-188-161207
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PACKAGE DIMENSIONS (SOT-23-5)
2.9±0.2
1.9±0.2
(0.95) (0.95)
5
4
1
2
3
1.6
-
0.1
+0.2
2.8±0.3
0.4±0.1
0.8±0.1
1.1±0.1
0～0.1
0.15
-
0.05
+0.1
(Unit: mm)
0.2min.
SOT-23-5 Package Dimensions
MARK SPECIFICATION (SOT-23-5)
: Product Code … Refer to MARK SPECIFICATION TABLE (SOT-23-5)
: Lot Number … Alphanumeric Serial Number
5
4
1
2
3
SOT-23-5 Mark Specification
R5524x
NO.EA-188-161207
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MARK SPECIFI CATION TABLE (SOT-23-5)
Mark Specification Table
Product Name

R5524N001A M A A
R5524N001B M A B
R5524N002A M A C
R5524N002B M A D
R5524N004A M A F
R5524x
NO.EA-188-161207
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POWER DISSIPATION (DFN(PLP)1820-6)
Power Dissipation (PD) of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Double-sided)
Board Dimensions 40 mm × 40 mm × 1.6 mm
Copper Ratio Top-side: Approx. 50%, Back-side: Approx. 50%
Through-hole φ 0.54 mm × 30 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Standard Land Pattern
Power Dissip ati on 880 mW
Thermal Resistance Θja = (125 − 25°C) / 0.88 W = 114°C/W
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
IC Mount Area (Unit: mm)
40
40
Power D is s ipat io n PD (mW)
1200
1000
800
600
400
200
0
0 25 50 75 100 125 150
Ambient Temperature (°C)
85
880
Standard Land Pattern
R5524x
NO.EA-188-161207
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PACK AGE DIMENSIONS (DFN(PLP)1820-6)
2.00
1.80
0.25
±0.1
0.25
±0.1
0.1NOM.
0.3
±0.1
0.5
0.6MAX.
A
B
0.05
X4
0.05
M
AB
INDEX
S
0.05min
1
2
3
4
5
6
1.6
±0.1
1.0
±0.1
0.20
±0.1
*1
0.05
S
(Unit: mm)
Bottom View
*1
The tab on the bottom of the package enhances
thermal performance and is electrically connected
to GND (substrate level). It is recommended that
the tab be connected to the ground plane on the
board, or otherwise be left floating.
DFN(PLP)1820-6 Package Dimensions
MARK SPECIFICATION (DFN(PLP)1820-6)
: Product Code …Refer to MARK SPECIFICATION TABLE (DFN(PLP)1820-6
: Lot Number …Alphanumeric Serial Number
DFN(PLP)1820-6 Mark Specification


1
2 3
6 5
4
R5524x
NO.EA-188-161207
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MARK SPECIFI CATION TABLE (DFN(PLP)1820-6)
Mark Specification Table
Product Name

R5524K001A E J 0 0
R5524K001B E J 0 1
R5524K002A E J 0 2
R5524K002B E J 0 3
R5524x
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TEST CIRCUITS
Supply Current Test Circuit Switch ON Resistance Test Circuit
Output ON Time/Output OFF Time Test Circuit
UVLO Released Voltage Test Circuit
Over current Limit Test Circuit
Current Limit Threshold Test Circuit
Enable Input Voltage Test Ci rcuit Flag Output Delay Time Test Circuit
VIN
VOUT
EN
FLG
R5524x
GND
VIN
A
0.1µF
1
2
3
5
4
VEN
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
V
IOUT
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
V
56Ω
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
V
100kΩ
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
A
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
A
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
V
100kΩ
VIN
VOUT
EN
FLG
R5524x
GND
VIN
0.1µF
1
2
3
5
4
VEN
V
10kΩ
R5524x
NO.EA-188-161207
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TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Supply Current vs. Temperat ure
2) Supply Current vs. Input Voltage
3) Switch ON Resistance vs. Temperatur e
4) Switch ON Resistance vs. Input Voltage
5) Output ON Time vs. Temperature (RL = 56 Ω) 6) Output ON Time vs. Input Voltage (RL = 56 Ω)
60
70
80
90
100
110
120
-50 -25 025 50 75 100
Tem perature Topt (°C)
S uppl y Current I
DD1
(μA)
4.5V
5.0V
5.5V
60
70
80
90
100
110
120
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age V
IN
(V )
S uppl y Current I
DD1
(μA)
-40°C
25°C
85°C
40
60
80
100
120
140
160
-50 -25 025 50 75 100
Tem perature Topt (°C)
S wi t ch ON Res i st ance
RON (mΩ)
4.5V
5.0V
5.5V
IOUT=300mA
40
60
80
100
120
140
160
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age V
IN
(V )
S wi t ch ON Res i st ance
R
ON
(mΩ)
-40°C
25°C
85°C
IOUT=300mA
0
100
200
300
400
500
600
700
800
900
-50 -25 025 50 75 100
Tem perature Topt (°C)
Output ON Ti m e tON (μs)
4.5V
5.0V
5.5V
0
100
200
300
400
500
600
700
800
900
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age VIN (V)
Output ON Ti m e tON (μs)
-40°C
25°C
85°C
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7) UVLO Voltage vs. Temperature
8) Output Voltage vs. Input Voltage
9) Current Limit Threshold vs. Temperature 10) Current Limit Threshold vs. Temperature
(001x/ 002x) (004A)
11) Current Limit Threshold vs. Input Voltage 12) Current Limit Threshol d vs. Input Voltage
(001x/ 002x) (004A)
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
-50 -25 025 50 75 100
Tem perature Topt (°C)
UV LO V ol tage V UVLO (V)
UVLO Threshold Voltage
UVLO Released Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
012345
I nput Volt age V
IN
(V)
O utput Voltage V
OUT
(V)
800
810
820
830
840
850
860
870
-50 -25 025 50 75 100
Tem perature Topt (°C)
Current Lim i t Threshol d
I
TH
(m A)
4.5V
5.0V
5.5V
1.36
1.38
1.4
1.42
1.44
1.46
1.48
1.5
1.52
-50 -25 025 50 75 100
Tem perature Topt (℃)
Current Lim i t Treshol d
Ith (A)
4.5V
5.0V
5.5V
800
810
820
830
840
850
860
870
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age V
IN
(V )
Current Lim i t Threshol d
I
TH
(m A)
-40°C
25°C
85°C
1.36
1.38
1.40
1.42
1.44
1.46
1.48
1.50
1.52
2.5 33.5 44.5 55.5 6
Input V ol t age Vi n (V)
Current Lim i t Threshol d
Ith (A)
-40℃
25℃
85℃
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20
13) Overcur rent Limit vs. Temperature
14) Overcurrent Limit vs. Input Voltage
15) Flag Delay Tim e vs. Temperature
16) Flag Delay Tim e vs. Input Voltage
17) Enable Input Voltage vs. Temper at ur e
18) Enable Input Voltage vs. Input Voltage
500
550
600
650
700
750
800
-50 -25 025 50 75 100
Tem perature Topt (°C)
Over Current Li m i t
I
LIM
(m A)
4.5V
5.0V
5.5V
500
550
600
650
700
750
800
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age V
IN
(V )
Over Current Li m i t
I
LIM
(m A)
-40°C
25°C
85°C
0
5
10
15
20
25
30
-50 -25 025 50 75 100
Tem perature Topt (°C)
Fl ag Del ay T i m e tFD (m s)
4.5V
5.0V
5.5V
0
5
10
15
20
25
30
35
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age VIN (V)
Fl ag Del ay T i m e tFD (m s)
-40°C
25°C
85°C
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
-50 -25 025 50 75 100
Tem perature Topt (°C)
E nabl e P i n Input V ol tage
VEN1 / VEN2 (V )
VEN1
VEN2
VIN=5V
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input V ol t age V
IN
(V )
E nabl e P i n Input V ol tage
V
EN1
/ V
EN2
(V )
VEN1
VEN2
V
opt
=25°C
R5524x
NO.EA-188-161207
21
19) Overcurrent Response with Ramped Load
20) Overcurrent Response with Ramped Load
(R5524x001x) (R5524x002x)
21) Overcurrent Response with Ramped Load (R5524x004A)
22) Overcurrent Limit Transient Response
(Output short during enable "H") (Enable "H" during Output Short)
Time (5ms/div)
IOUT
(200mA/div)
VFLG
(5V/div)
VIN=5V
Time (5ms/div)
IOUT
(200mA/div)
(5V/div)
VFLG
EN=”L”
VIN=5V
IOUT
(200mA/div)
VFLG
(5V/div)
EN="L"
VIN=5.0V
Time (10μs/div)
(5V/div)
IOUT
(200mA/div)
VEN
VIN=5V
VOUT=GND short
Time (10μs/div)
IOUT
(2A/div)
VOUT
(5V/div)
VIN=5V
VEN=H
Tim e (5m d/div)
R5524x
NO.EA-188-161207
22
23) Thermal Shutdown Operation
24) Output Volta ge vs. Output Current
25) Output ON Time Response
26) Output OFF Time Response
27) Inrush current Characteristic
Time (50ms/div)
VFLG
(5V/div)
VEN
(5V/div)
IOUT
(500mA/div)
VIN=5V
Time (100μs/div)
I
OUT
(50mA/div)
(2V/div)
(5V/div)
VOUT
V
EN
V
IN
=5V
R
L=56Ω
Time (10μs/div)
VOUT
(2V/div)
IOUT
(50mA/div)
VEN
(5V/div)
VIN=5V
RL=56Ω
EN 10μF
100μF 300μF
300μF
Time (1ms/div)
V
EN
(5V/div)
I
OUT
(200mA/div)
V
IN
=5V
R
L
=10Ω
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
00.2 0.4 0.6 0.8 1
Output Current IOUT (A)
Output Voltage VOUT (V)
http://www.e-devices.ricoh.co.jp/en/
Sales&SupportOffices
RICOHELECTRONICDEVICESCO.,LTD.
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Phone:+86-21-5027-3200Fax:+86-21-5027-3299
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Taipeioffice
Room109,10F-1,No.51,HengyangRd.,TaipeiCity,Taiwan(R.O.C.)
Phone:+886-2-2313-1621/1622Fax:+886-2-2313-1623
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
Halogen Free
1.The products and theproductspecificationsdescribed in this documentaresubjectto change or discontinuationof
productionwithout notice forreasons
suchas improvement. Therefore,before deciding touse the products, please
refertoRicohsalesrepresentativesforthelatestinformationthereon.
2.The materials inthisdocument may notbecopied or otherwisereproducedin whole orinpart without priorwritten
consentofRicoh.
3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
takingoutofyourcountrytheproductsorthetechnicalinformationdescribedherein.
4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofandexampleapplicationcircuits
fortheproducts.Thereleaseofsuchinformationisnottobeconstruedasawarrantyoforagrantoflicenseunder
Ricoh'soranythirdparty'sintellectualpropertyrightsoranyotherrights.
5.Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectroniccomponentsinstandard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusementequipmentetc.).Those customers intending touseaproduct in an application requiringextremequality
andreliability,forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproductcouldresult
inhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,trafficcontrolsystem,automotiveand
transportationequipment,combustionequipment,safetydevices,lifesupportsystemetc.)shouldfirstcontactus.
6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,butsemiconductorproducts
arelikelytofailwithcertainprobability.Inordertopreventanyinjurytopersonsordamagestopropertyresultingfrom
suchfailure,customersshouldbecarefulenoughtoincorporatesafetymeasuresintheirdesign,suchasredundancy
feature,firecontainmentfeatureandfail-safefeature.Wedonotassumeanyliability
orresponsibilityforanylossor
damagearisingfrommisuseorinappropriateuseoftheproducts.
7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument.
8.The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristicsintheevaluationstage.
9.WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristicsoftheproductsunderoperationorstorage.
10.There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
caseofrecognizingthemarkingcharacteristicwithAOI,pleasecontactRicohsalesorourdistributorbeforeattempting
touseAOI.
11.
PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcommentsconcerningtheproductsor
thetechnicalinformation.